MULTI-LAYERED PEROVSKITES, DEVICES, AND METHODS OF MAKING THE SAME
20180351019 ยท 2018-12-06
Inventors
- Kai Zhu (Littleton, CO)
- Yixin Zhao (Shanghai, CN)
- Mengjin Yang (Dallas, TX, US)
- Taiyang Zhang (Shanghai, CN)
Cpc classification
H10K85/00
ELECTRICITY
H01L31/055
ELECTRICITY
Y02E10/542
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
C01P2002/72
CHEMISTRY; METALLURGY
H10K85/50
ELECTRICITY
Y02E10/52
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10K30/151
ELECTRICITY
Y02E10/549
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H01L31/055
ELECTRICITY
Abstract
Methods are described that include contacting an alkyl ammonium metal halide film with an alkyl ammonium halide, where the alkyl ammonium metal halide film includes a first halogen and a metal, the alkyl ammonium halide includes a second halogen, such that the contacting forms an alkyl ammonium metal mixed-halide film that interfaces with the alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film includes the first halogen, the second halogen, and the metal.
Claims
1. A method comprising: contacting an alkyl ammonium metal halide film with an alkyl ammonium halide, wherein: the alkyl ammonium metal halide film comprises a first halogen and a metal, the alkyl ammonium halide comprises a second halogen, the contacting forms an alkyl ammonium metal mixed-halide film that interfaces with the alkyl ammonium metal halide film, and the alkyl ammonium metal mixed-halide film comprises the first halogen, the second halogen, and the metal.
2. The method of claim 1, wherein, during the contacting, the alkyl ammonium halide is in at least one of a liquid phase or a vapor phase.
3. The method of claim 1, wherein: the contacting is in the liquid phase, and the liquid phase is in a solution with a solvent.
4. The method of claim 1, wherein the metal comprises at least one of lead, tin, or germanium.
5. The method of claim 3, wherein: the alkyl ammonium metal halide film comprises at least one of CH.sub.3NH.sub.3PbI.sub.3 or CH(NH.sub.2).sub.2PbI.sub.3, the first halogen comprises iodine, and the metal comprises lead.
6. The method of claim 5, wherein: the alkyl ammonium halide comprises at least one of CH.sub.3NH.sub.3Br (MABr) or CH(NH.sub.2).sub.2Br (FABr), and the second halogen comprises bromine.
7. The method of claim 3, wherein: the alkyl ammonium metal halide film is substantially insoluble in the solvent, and the alkyl ammonium halide is substantially soluble in the solvent.
8. The method of claim 3, wherein the solvent comprises at least one of isopropanol or tert-butanol.
9. The method of claim 6, wherein: the alkyl ammonium metal mixed-halide film comprises at least one of CH.sub.3NH.sub.3PbI.sub.3-xBr.sub.x or CH(NH.sub.2).sub.2PbI.sub.3-xBr.sub.x, the first halogen comprises iodine, the second halogen comprises bromine, the metal comprises lead, and x is between greater than 0 and about 3.
10. The method of claim 1, wherein the alkyl ammonium metal mixed-halide film has a thickness between about 1 nanometer and about 1000 nanometers.
11. The method of claim 10, wherein the thickness is between about 3 nanometers and about 300 nanometers.
12. The method of claim 1, further comprising heating the alkyl ammonium metal halide film and the alkyl ammonium metal mixed-halide film.
13. The method of claim 12, wherein the heating comprises attaining an average bulk temperature for the alkyl ammonium metal halide film and the alkyl ammonium metal mixed-halide film between about 50? C. and about 300? C.
14. The method of claim 13, wherein the average bulk temperature is between about 100? C. and about 150? C.
15. The method of claim 1, further comprising, before the contacting, depositing the alkyl ammonium metal halide film onto a substrate.
16. The method of claim 6, wherein the at least one of the MABr or the FABr is in the solution at a concentration between greater than 0 mol (MABr+FABr)/L to about 0.07 mol (MABr+FABr)/L.
17. The method of claim 16, wherein the concentration is between greater than mol (MABr+FABr)/L to about 0.02 mol (MABr+FABr)/L.
18. A device comprising, in order: an alkyl ammonium metal halide film comprising a first halogen; and an alkyl ammonium metal mixed-halide film comprising the first halogen and a second halogen, wherein: the alkyl ammonium metal halide film has a thickness of about 1 nanometer to about 1000 nanometers, and a thickness of the alkyl ammonium metal mixed-halide film is less than or equal to the thickness of the alkyl ammonium metal halide film.
19. The device of claim 18, wherein the thickness of the alkyl ammonium metal mixed-halide film is between about 1 nanometers to about 1000 nanometers.
20. The device of claim 18, wherein the metal comprises at least one of lead, tin, or germanium.
21. The device of claim 18, wherein: the alkyl ammonium metal halide film comprises CH.sub.3NH.sub.3PbI.sub.3, the first halogen comprises iodine, and the metal comprises lead.
22. The device of claim 18, wherein: the alkyl ammonium lead mixed-halide film comprises CH.sub.3NH.sub.3PbI.sub.3-xBr.sub.x, the first halogen comprises iodine, the second halogen comprises bromine, the metal comprises lead, and x is between greater than 0 and about 3.
23. The method of claim 3, wherein the contacting is performed for a period of time between 2 seconds and 300 seconds.
24. The method of claim 1, wherein the alkyl ammonium metal mixed-halide film has improved structural properties compared to the alkyl ammonium metal halide film.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Exemplary embodiments are illustrated in referenced figures of the drawings. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than limiting.
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REFERENCE NUMBERS
[0026] 100 . . . perovskite [0027] 110 . . . cation [0028] 120 . . . cation [0029] 130 . . . anion [0030] 200 . . . method [0031] 210 . . . substrate [0032] 215 . . . raw materials [0033] 220 . . . depositing [0034] 230 . . . alkyl ammonium halide solution [0035] 235 . . . contacting [0036] 245 . . . heating [0037] 250 . . . volatiles [0038] 255 . . . multi-layered perovskite device [0039] 310 . . . alkyl ammonium metal halide film [0040] 320 . . . alkyl ammonium metal mixed-halide film [0041] 325 . . . perovskite intermediate device [0042] 330 . . . secondary alkyl ammonium metal mixed-halide film [0043] 355 . . . final perovskite device
DETAILED DESCRIPTION
[0044] Some embodiments of the present disclosure relate to contacting the surface of a perovskite material, e.g. an alkyl ammonium metal halide film such as a methyl ammonium lead iodide (MAPbI.sub.3) film with a solution of a solvent (e.g. isopropanol (IPA) and/or tert-butanol) containing an alkyl ammonium halide, e.g. methyl ammonium bromide (MABr), methylammonium iodide (MAI), methyl ammonium chloride (MACl), and/or formamidinium chloride (FACl). The contacting may be followed by heating (e.g., between about 50? to about 300? C. or between about 100? C. to about 150? C.), such that the contacting and/or the heating result in the formation of an alkyl ammonium metal mixed-halide film (for example a mixed halide perovskite film such as MAPbI.sub.3-xBr.sub.x, MAPbI.sub.3-xCl.sub.x, and/or MA.sub.1-yFA.sub.yPbI.sub.3-xCl.sub.x), positioned on the alkyl ammonium metal halide film and/or at least partially infiltrating into the alkyl ammonium metal halide film, where x may be any value between greater than 0 and about 3. In some embodiments of the present disclosure, such a film of MAPbI.sub.3-xBr.sub.x, or some other alkyl ammonium metal mixed-halide films, may extend from a few nanometers to a few hundred nanometers below the top surface of the alkyl ammonium metal halide film, or may extend from about one nanometer to about 1000 nanometers below the top surface of the alkyl ammonium metal halide film. In some embodiments of the present disclosure, an alkyl ammonium metal mixed-halide film may be positioned substantially on the alkyl ammonium metal halide film and have a thickness between about a few nanometers and about 1000 nanometers. For the example of bromine, the incorporation of bromine into the starting MAPbI.sub.3 film (the starting alky ammonium metal halide film) and/or the creation of a separate MAPbI.sub.3-xBr.sub.x film (the resultant alkyl ammonium metal mixed-halide film) on the starting MAPbI.sub.3 film as a result of the MABr contacting and/or heating is evidenced by several elecro-optical and structural characterizations (see below). It will be shown herein that the MABr-treated perovskite device has much improved stability at elevated temperature (?100? C.) under light illumination. Moreover, it will be shown that device performance using MABr-treated perovskite films is much improved relative to the device performance of untreated MAPbI.sub.3 films.
[0045] These findings support the concept that both solution (e.g. liquid) phase and/or vapor phase treatments of alkyl ammonium metal halide perovskite films, utilizing liquid- and/or vapor-phase alkyl ammonium halides may provide more stable and better performing perovskite devices. For example, a device having a first film of an alkyl ammonium metal halide may be contacted with an alkyl ammonium halide, where the alkyl ammonium metal halide has at least one halogen, and the alkyl ammonium halide has at least one halogen that is different from the halogen of the alkyl ammonium metal halide. The contacting may then result in the creation of a second film, an alkyl ammonium metal mixed-halide film, positioned on and/or incorporated into a top surface of the first film, where the second film includes at least one halogen from the first film and at least one halogen from the alkyl ammonium halide. Thus, the alkyl ammonium metal mixed-halide film may include two or more halogens, a mixed halide perovskite material, where the second film may be positioned on the first film and/or may be partially incorporated into a top surface of the first film.
[0046] Thus, the contacting may be achieved in some cases using solution methods. As used herein film and layer are interchangeable terms. In other examples, a bi-layer and/or multi-layer perovskite device may be achieved by a physical vapor deposition technique using different source materials. The resultant devices may have a relatively thin, bromine-rich outer film characterized by a wide band gap, such that the thin outer film may serve as a moisture-resistant film as well as an open-circuit voltage enhancer. In addition, the resultant device may have a thicker, bulk tri-iodide perovskite film/layer positioned below an outer film, which may possess excellent light absorber characteristics (e.g. narrow band gap). This gradient, bi-layer, and/or multi-layer structure may be implemented in a sandwiched and/or laminar structure (wide band gap films as top and bottom films), which may find applications in quantum wells for light-emitting diodes and other optoelectronic devices.
[0047] As described herein, an alkyl ammonium metal halide film and/or an alkyl ammonium metal mixed-halide film may be constructed from one more organo-metal halide perovskite materials.
[0048] Additional examples for cation A (110) include organic cations and/or inorganic cations. Organic cations of A (110) may be an alkyl ammonium cation, for example a C.sub.1-20 alkyl ammonium cation, a C.sub.1-6 alkyl ammonium cation, a C.sub.2-6 alkyl ammonium cation, a C.sub.1-5 alkyl ammonium cation, a C.sub.1-4 alkyl ammonium cation, a C.sub.1-3 alkyl ammonium cation, a C.sub.1-2 alkyl ammonium cation, and/or a C.sub.1 alkyl ammonium cation. Further examples of organic cations of A (110) include methylammonium (CH.sub.3NH.sup.3+), ethylammonium (CH.sub.3CH.sub.2NH.sup.3+), propylammonium (CH.sub.3CH.sub.2CH.sub.2NH.sup.3+), butylammonium (CH.sub.3CH.sub.2CH.sub.2CH.sub.2NH.sup.3+), formamidinium (NH.sub.2CH?NH.sup.2+), and/or any other suitable nitrogen-containing organic compound. In other examples, a cation A (110) may include an alkylamine. Thus, a cation A (110) may include an organic component with one or more amine groups. For example, cation A (110) may be an alkyl diamine halide such as formamidinium (CH(NH.sub.2).sub.2).
[0049] Examples of metal cations 120 include, for example, lead, tin, germanium, and or any other 2+ valence state metal that can charge-balance the organo-metal halide perovskite 100. Examples for the anion X (130) include halides: e.g. fluorine, chlorine, bromine, iodine and/or astatine. In some cases, the organo-metal halide perovskite may include more than one anion X (130), for example pairs of halides; chlorine and iodine, bromine and iodine, and/or any other suitable pairing of halides. In other cases, the organo-metal halide perovskite 100 may include two or more halides of fluorine, chlorine, bromine, iodine, and/or astatine.
[0050] Thus, cation A (110), cation B (120), and anion X (130) may be selected within the general formula of ABX.sub.3 to produce a wide variety of organo-metal halide perovskite 100, including, for example, methylammonium lead triiodide (CH.sub.3NH.sub.3PbI.sub.3), and mixed halogen perovskites such as CH.sub.3NH.sub.3PbI.sub.3-xCl.sub.x and CH.sub.3NH.sub.3PbI.sub.3-xBr.sub.x. Thus, an organo-metal halide perovskite 100 may have more than one halogen element, where the various halogen elements are present in non-integer quantities; e.g. x is not equal to 1, 2, or 3. In addition, organo-metal halide perovskite, like other perovskites, can form three-dimensional (3-D), two-dimensional (2-D), one-dimensional (1-D) or zero-dimensional (0-D) networks, possessing the same unit structure.
[0051] As stated above, the anion A (110) may include an organic constituent in combination with a nitrogen constituent. In some cases, the organic constituent may be an alkyl group such as straight-chain or branched saturated hydrocarbon group having from 1 to 20 carbon atoms. In some embodiments, an alkyl group may have from 1 to 6 carbon atoms. Examples of alkyl groups include methyl (C.sub.1), ethyl (C.sub.2), n-propyl (C.sub.3), isopropyl (C.sub.3), n-butyl (C.sub.4), tert-butyl (C.sub.4), sec-butyl (C.sub.4), iso-butyl (C.sub.4), n-pentyl (C.sub.5), 3-pentanyl (C.sub.5), amyl (C.sub.5), neopentyl (C.sub.5), 3-methyl-2-butanyl (C.sub.5), tertiary amyl (C.sub.5), and n-hexyl (C.sub.6). Additional examples of alkyl groups include n-heptyl (C.sub.7), n-octyl (C.sub.8) and the like.
[0052]
[0053] The deposited alkyl ammonium metal halide film may be modified by contacting 235 the alkyl ammonium metal halide film with an alkyl ammonium halide in a liquid solution 230. For example, the alkyl ammonium halide solution 230 may include an alkyl ammonium halide at least partially dissolved in a solvent. The alkyl ammonium halide in the solution may be a compound that contains a different halogen from the halogen present in the alkyl ammonium metal halide film formed by the depositing 220. The solvent used to formulate the alkyl ammonium halide solution 230 may be any solvent with a high solubility for the alkyl ammonium halide, while also having a low solubility for the alkyl ammonium metal halide film. The contacting 235 may modify a top portion of the alkyl ammonium metal halide film, such that an alkyl ammonium metal mixed-halide film forms within a top portion of the alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film includes a first halogen from the alkyl ammonium metal halide film, and a second halogen from the alkyl ammonium halide solution 230. Alternatively, the contacting 235 may deposit an alkyl ammonium metal mixed-halide film on top of the alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film may include the first halogen from the first alkyl ammonium metal halide film, and the second halogen from the alkyl ammonium halide solution 230. Alternatively, the contacting 235 may both modify a top portion of the alkyl ammonium metal halide film and deposit a thin alkyl ammonium metal mixed-halide film on top of the alkyl ammonium metal halide film. The modifying and depositing may together create a composite film of an alkyl ammonium metal mixed-halide film positioned on top of an alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film also penetrates into a portion of the top surface of the alkyl ammonium metal halide film, and where the composite film includes the first halogen from the alkyl ammonium metal halide film, and the second halogen from the alkyl ammonium halide solution 230. The contacting 235 may be by a solution method such as dip coating, spin coating, curtain coating, curtain coating, spraying, microgravure, and/or slot-die coating. Alternatively or in addition to, the contacting 235 may be accomplished by one or more vapor deposition methods.
[0054] The contacting 235 may be conducted at a temperature between about room temperature to about 200? C. The concentration of the alkyl ammonium halide solution 230 may be between about 3 mM and about 300 mM. The contacting 235 may be conducted in air or in an inert atmosphere for a duration between about 2 seconds and about 300 seconds. The contacting 235 may be conducted in air or in an inert atmosphere for a duration between about 2 seconds and about 30 seconds.
[0055] The first multi-layered perovskite device, as described above, may be further processed by heating 245. The heating 245 may remove volatiles 250, resulting in a second multi-layered perovskite device 255. In some embodiments, the contacting 235 and the heating 245 may be performed simultaneously. The heating 245 may allow for more complete formation/growth of the alkyl ammonium metal mixed-halide film on and/or within a top portion of the underlying alkyl ammonium metal halide film. In addition, the heating 245 may provide control over the thickness of the alkyl ammonium metal mixed-halide film. In some embodiments of the present disclosure, the first multi-layered perovskite device and/or the second multi-layered perovskite device 255 may have an alkyl ammonium metal halide film with a thickness between about 1 nm to about 1000 nm, and an alkyl ammonium metal mixed-halide film positioned with a thickness between about 1 nm to about 1000 nm, or in some embodiments between about 3 nm to about 300 nm, where the alkyl ammonium metal mixed-halide film is positioned on the alkyl ammonium metal halide film. The heating 245 may be conducted at or slightly above room temperature up to about 200? C., for a duration between about a few minutes (e.g., 5 minutes) and about several hours (e.g., 5 hours).
[0056]
[0057] In some embodiments of the present disclosure, an alkyl ammonium metal mixed-halide film 320 may result substantially entirely from the conversion of a top thickness and the top surface of the originally deposited alkyl ammonium metal halide film 310. Thus, most if not all of the alkyl ammonium metal mixed-halide film 320 may not result from the deposition of a new film on top of the originally deposited alkyl ammonium metal halide film 310. Instead, substantially all of the alkyl ammonium metal mixed-halide film 320 may originate from the originally deposited alkyl ammonium metal halide film 310. Without wishing to be bound by theory, there may be a strong driving force to mix at least a portion of an alkyl ammonium metal mixed-halide film 320 with at least a portion of an alkyl ammonium metal halide film 310; e.g. due to concentration gradients and/or thermal stimulus.
Examples
[0058] Experimental: Fluorine-doped tin oxide (FTO, TEC15, Hartford, Ind.) was patterned through a wet-etching method (H.sub.2 evolution reaction between zinc powder and hydrochloric acid), followed by an overnight base bath soaking (5 wt % NaOH in ethanol). A compact TiO.sub.2 (c-TiO.sub.2) layer was deposited by a spray pyrolysis of 0.2 M titanium diisopropoxide bis(acetylacetonate) in 1-butanol solution at 450? C. CH.sub.3NH.sub.3PbI.sub.3 (or MAPbI.sub.3) film was fabricated on top of c-TiO.sub.2/FTO using a modified solvent engineering method. Precursor was made of 44 wt % of equimolar ratio of methyl ammonium iodide (MAI) and PbI.sub.2 in ?-butyrolactone (GBL, Sigma-Aldrich)/dimethyl sulfoxide (DMSO, Sigma-Aldrich) (7/3 v/v). Substrate was span at 3500 rpm for 50 seconds, and a stream of toluene was injected during the spinning. The CH.sub.3NH.sub.3PbI.sub.3 perovskite film (e.g. the alkyl ammonium metal halide film) was fully crystalized by annealing at 85? C. for 10 minutes. For MABr treatment (e.g. the alkyl ammonium halide solution), 160 ul MABr in 2-propanol solution (2 mg/ml) was dispersed on top of the first perovskite film during 4000 rpm spinning. A thermal annealing of 150? C. for 10 minutes was processed to remove the solvent and incorporate MABr into and/or onto the first perovskite film. Hole transport material (HTM) was deposited on top of perovskite film by 4000 rpm for 30 seconds using 2,2,7,7-tetrakis(N,N-dip-methoxyphenylamine)-9,9-spirobifluorene (Spiro-OMeTAD, Merck) solution, which includes of 80 mg Spiro-OMeTAD, 30 ?l bis(trifluoromethane) sulfonimide lithium salt (Li-TFSI) stock solution (500 mg Li-TFSI in 1 ml acetonitrile), 30 ?l 4-tert-butylpyridine (TBP), and 1 ml chlorobenzene. Finally 150 nm Ag film was evaporated as a counter electrode using a shadow mask.
[0059] The J-V characteristics of the cells were obtained using a 2400 SourceMeter (Keithley) under simulated one-sun AM 1.5G illumination (100 mW cm.sup.?2) (Oriel Sol3A Class AAA Solar Simulator, Newport Corporation). A 0.12-cm.sup.2 non-reflective mask was used to define the active area. External quantum efficiency was measured using a solar cell quantum efficiency measurement system (QEX10, PV Measurements). Stabilized power output was monitored by a potentiostat (VersaSTAT MC, Princeton Applied Research) near a maximum power output point. X-ray diffraction of the perovskite thin films was performed using a X-ray diffractometer (Rigaku D/Max 2200) with Cu K? radiation. Absorption spectra were carried out by a ultraviolet-visible (UV/vis) spectrometer (Cary-6000i).
[0060] X-ray photoemission spectroscopy measurements were performed on a Kratos NOVA spectrometer calibrated to the Fermi edge and core-level positions of sputter-cleaned metal (Au, Ag, Cu, Mo) surfaces. XPS spectra were taken using monochromated Al K? radiation (1486.7 eV) at a resolution of 400 meV and fit using Pseudo-Voigt profiles.
[0061] Results:
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[0069] MABr Concentration Effect.
[0070] To further explore the importance of the MABr solution and its concentration for this observed film and device improvement the effect of varying MABr solution concentration on the properties of the final treated MAPbI.sub.3-xBr.sub.x films was studied. The average or low-quality MAPbI.sub.3 films prepared with standard solvent techniques can vary significantly from batch-to-batch and/or within different areas of the same sample. Therefore, for the studies described in this section, the high-quality MAPbI.sub.3 films were cut from a large-area sample to insure good quality and reliable material properties.
[0071] With increasing MABr concentration, the UV-vis absorption data (see
[0072] Although the compositional change of the MAPbI.sub.3 film caused by the mild 2 mg/mL MABr treatment is very minimum as reflected by the small absorption edge shift (<5 nm) and almost identical XRD peak positions (shifted by ?0.01?-0.02?), the morphology change and XRD peak intensity increase are very dramatic, and more importantly, such changes have very little dependence on initial MAPbI.sub.3 film quality (see
[0073] In contrast to the much-improved device performance with 2 mg/mL MABr treatment, the PSCs based on 8 and 4 mg/mL treated MAPbI.sub.3-xBr.sub.x films exhibit lower device performance, especially the one with 8 mg/mL MABr treatment (see Table 1 below). This concentration dependence is consistent with the structure/morphology changes discussed in connection with
TABLE-US-00001 TABLE 1 MABr concentration effect on the typical photovoltaic parameters. Standard deviations from 8-12 cells for each type of devices are given. For these devices, high-quality MAPbI.sub.3 films (FIG. 3a) were used as the initial films prior to MABr treatment. MABr Concentration J.sub.sc V.sub.oc PCE (mg/mL) (mA/cm.sup.2) (V) FF (%) 0 20.54 ? 0.07 1.052 ? 0.027 0.724 ? 0.012 15.64 ? 0.63 2 21.86 ? 0.12 1.120 ? 0.010 0.754 ? 0.020 18.50 ? 0.39 4 21.48 ? 0.28 1.056 ? 0.005 0.734 ? 0.014 16.66 ? 0.48 8 21.27 ? 0.16 1.049 ? 0.011 0.665 ? 0.031 14.83 ? 0.47
[0074]
[0075] The abovementioned results clearly demonstrate that the MABr treatment methods described herein, when utilizing the proper concentrations, are effective at converting an average or sub-average MAPbI.sub.3 perovskite film into a high-quality MAPbI.sub.3-xBr.sub.x film with larger crystal size and higher crystalline order. It appears that the MABr solution with low concentration such as 2 mg/mL may induce the recrystallization of the small-sized MAPbI.sub.3 into perovskite films with much larger final grain sizes. In contrast, the higher-concentration MABr treatments may only induce a Br/I halide exchange reaction in the MAPbI.sub.3 film without significantly affecting the grain growth. The most interesting finding from this two-step perovskite crystal growth process is that it is largely invariant to the initial MAPbI.sub.3 film quality (see
[0076] Thus, a process for fabricating high-quality MAPbI.sub.3-xBr.sub.x may be divided into two steps. The first step may include the formation of MAPbI.sub.3 precursor nanocrystals by standard solvent and/or vapor-phase deposition methods to form a relatively compact thin film. The second step may then include conversion of the first-formed MAPbI.sub.3 precursor nanocrystals into higher quality MAPbI.sub.3-xBr.sub.x perovskite films with larger crystal sizes by contacting the first-formed MAPbI.sub.3 precursor nanocrystals with a MABr-containing solution. Thus, such a two-step process, with a second MABr treatment step, may convert both high quality and low quality MAPbI.sub.3 perovskite films into final MAPbI.sub.3-xBr.sub.x thin films with high quality. However, the process is MABr concentration dependent. For high-concentration (e.g., 8 mg/mL) MABr solutions, the dissolution of small-size MAPbI.sub.3 may be inhibited by the intercalation of MABr or the I/Br cation exchange reaction, which could account for less morphology change or grain-size growth found with the high-concentration MABr treatment. For low-concentration (e.g., 2 mg/mL) MABr treatments, the small-sized MAPbI.sub.3 crystals may be quickly dissolved and regrown into larger crystals.
[0077] To further test whether the observed perovskite reconstruction is not simply resulting from excess organic salt, the effect of using a similar MAI treatment on the morphology changes of MAPbI.sub.3 film was studied.
[0078] As used herein, the term substantially refers to the inherent variability present in attempts to attain an exact design parameter. For example, when describing solubility as substantially soluble or substantially insoluble it is clear of to one of ordinary skill in the art that there for substantially soluble Component A, there may still be small concentrations of insoluble Component A in the solution. Similarly, for substantially insoluble Component B, there may be small concentrations of soluble Component B in the solution. Similarly, substantially separate and distinct films that share an interface indicate that the films may be essentially layered and/or laminated with a distinct interface between them. However, the films may also have less areas at the interface that are less defined, due at least to a portion of one layer being transformed into part of the second layer. Thus, the interface between a first layer and a second layer may include a third transition layer between the first layer and the second layer.
[0079] The foregoing discussion and examples have been presented for purposes of illustration and description. The foregoing is not intended to limit the aspects, embodiments, or configurations to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the aspects, embodiments, or configurations are grouped together in one or more embodiments, configurations, or aspects for the purpose of streamlining the disclosure. The features of the aspects, embodiments, or configurations, may be combined in alternate aspects, embodiments, or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the aspects, embodiments, or configurations require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment, configuration, or aspect. While certain aspects of conventional technology have been discussed to facilitate disclosure of some embodiments of the present invention, the Applicants in no way disclaim these technical aspects, and it is contemplated that the claimed invention may encompass one or more of the conventional technical aspects discussed herein. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate aspect, embodiment, or configuration.