CONNECTOR AND METHOD FOR PRODUCING A CONNECTOR
20180345552 ยท 2018-12-06
Inventors
Cpc classification
H01R43/005
ELECTRICITY
B29C45/1657
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/36
PERFORMING OPERATIONS; TRANSPORTING
H01R13/521
ELECTRICITY
B29C45/1676
PERFORMING OPERATIONS; TRANSPORTING
B29C2045/1678
PERFORMING OPERATIONS; TRANSPORTING
H01R13/405
ELECTRICITY
B29C45/14639
PERFORMING OPERATIONS; TRANSPORTING
B29K2063/00
PERFORMING OPERATIONS; TRANSPORTING
B29C2071/027
PERFORMING OPERATIONS; TRANSPORTING
B29K2067/006
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/26
PERFORMING OPERATIONS; TRANSPORTING
B29K2077/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C45/16
PERFORMING OPERATIONS; TRANSPORTING
H01R43/00
ELECTRICITY
Abstract
An aspect of the invention is directed to a method for producing a connector using injection-molding by providing at least one conductor and at least one contact pin which are electrically connected at a contact point, producing a thermoset premold from a thermoset using injection-molding, wherein the thermoset is injection-molded around at least a first section of the at least one conductor and/or around at least a second section of the at least one contact pin, and injection-molding of a thermoplast on the thermoset premold, wherein the step of injection-molding takes place before the thermoset premold has obtained a degree of curing of 90%. Another aspect of the invention is a connector comprising at least one conductor and at least one contact pin is disclosed.
Claims
1.-11. (canceled)
12. A connector, comprising: at least one conductor; at least one contact pin, wherein the at least one conductor and the at least one contact pin are electrically connected at a contact point; a thermoset material, wherein at least one of a section of the at least one conductor and a section of the at least one contact pin is surrounded by the thermoset material applied via injection-molding; and a thermoplastic material, wherein the thermoplast material is injection-molded onto the thermoset material.
13. The connector of claim 12, wherein a degree of curing of the thermoset material is less than about 95% when the thermoplastic material is injection molded.
14. The connector of claim 12, wherein a first amount of curing of the thermoset material at a joint face between the thermoset material and the thermoplast material is at least substantially equal to a second amount of curing of the thermoset material at a location which is internal to the thermoset material.
15. The connector of claim 12, wherein the conductor comprises a plurality of wires.
16. The connector of claim 12, wherein the conductor is a stranded wire.
17.-20. (canceled)
21. A connector comprising: at least one conductor; at least one contact pin, wherein the at least one conductor and the at least one contact pin are electrically connected at a contact point; a thermoset material, wherein at least one of a section of the at least one conductor and a section of the at least one contact pin is surrounded by the thermoset material applied via injection-molding; a thermoset premold, the thermoset premold produced from the thermoset material by injection molding; and a thermoplastic material, wherein the thermoplastic material is injection-molded onto the thermoset premold before the thermoset premold is 90% cured.
22. The connector of claim 21, wherein the thermoset premold is produced in a first injection-molding tool and the thermoplastic material is injection-molded around the thermoset premold in a second injection-molding tool, wherein the thermoset premold is removed from the first injection-molding tool.
23. The connector of claim 21, wherein the injection-molding of the thermoplastic material is performed before the thermoset premold is 80% cured.
24. The connector of claim 21, wherein the injection-molding of the thermoplastic material is performed after the thermoset premold is 40% cured.
25. The connector of claim 21, wherein the injection-molding of the thermoplastic material is performed after the thermoset premold is cured between 57.5% and 63.5%.
26. The connector of claim 21, wherein the thermoset material is an epoxy resin.
27. The connector of claim 21, wherein the thermoplastic material is selected from the group consisting of a filled PA66, a PBT, a PA66 GF35, and a PBT GF30.
28. The connector of claim 21, wherein the thermoplastic material is tempered or malleablized after injection-molding.
29. A connector comprising: a plurality of conductors; at least one contact pin, wherein the plurality of conductors and the at least one contact pin are electrically connected at a contact point; an injection molded thermoset material, wherein at least a portion of the at least one conductor and a portion of the at least one contact pin are surrounded by the injection molded thermoset material; a thermoset premold, the thermoset premold produced from the injection molded thermoset material; and a thermoplastic material, wherein the thermoplastic material is injection-molded onto the thermoset premold before the thermoset premold is 90% cured.
30. The connector of claim 29, wherein the connector is environmentally sealed.
31. The connector of claim 29, wherein the injection-molding of the thermoplastic material is performed before the thermoset premold is 80% cured.
32. The connector of claim 29, wherein the injection-molding of the thermoplastic material is performed after the thermoset premold is 40% cured.
33. The connector of claim 29, wherein the injection-molding of the thermoplastic material is performed after the thermoset premold is cured between 57.5% and 63.5%.
34. The connector of claim 29, wherein the thermoset material is an epoxy resin.
35. The connector of claim 29, wherein the thermoplastic material is selected from the group consisting of a filled PA66, a PBT, a PA66 GF35, and a PBT GF30.
36. The connector of claim 29, wherein the thermoplastic material is tempered or malleablized after injection-molding.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0049] Exemplary embodiments are shown in the drawings and will be further explained in the following. The figures show:
[0050]
[0051]
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0052]
[0053] The conductor 12 is electrically connected to the contact pin 14 at a contact point 20. The contact point 20 is provided as a soldering point or welding point. Other preferred embodiments can use a crimp-connection. The contact point 20 can also be obtained in other ways.
[0054] A first section of the conductor 12 and a second section of the contact pin 14 are embedded in a thermoset 22 via injection-molding. In this preferred embodiment all exposed single wires 16, a section of the single wires 16 within the conductor sheath 18, a section of the conductor sheath 18 and the contact point 20 are also surrounded by thermoset. The shape of the thermoset which results from injection-molding the thermoset around a section of the at least one conductor 12 and/or the section of the at least one contact pin 14 is called thermoset premold 24.
[0055] It is further noted that thermoset premold 24 can comprise a plurality of separate individual parts. Also, there are embodiments where the thermoset premold 24 does not surround the contact pin 14, the contact point 20 nor the exposed sections of the single wires 16. However, it is believed to be advantageous, for certain exemplary embodiments, from a process perspective, if the thermoset is injection-molded around the multiple elements as shown.
[0056] The thermoset 22 or the thermoset premold 24 receives a thermoplast 26 cover via injection-molding. While the thermoset 22 is very hard and stiff without any flexible properties when the production of the connector 10 is finished, the thermoplast 26 allows to provide flexible elements, for example a spring hook (not shown).
[0057]
[0058] The joint faces 1 and 2 will typically not provide a good sealing, since neither the neither thermoset 22 nor the thermoplast 26 have a fully tight bonding to the conductor sheath 18. However, a good sealing is provided at the joint face 3, since the thermoset 22 has a low viscosity during injection-molding and also has good adhesion or attachment characteristics on metal. In addition, the thermoset 22 can also be pulled into very small cavities due to capillary action.
[0059] At the joint face 4 a good sealing is given, because the thermoset 22 has good adhesion or attachment characteristics on metal. A good bonding between the thermoset 22 and the thermoplast 26 is present at joint face 5, because the thermoplast 26 is applied to the thermoset premold 24 before the thermoset premold 24 is fully cured. Furthermore, a degree of curing of the thermoset at a joint face between the thermoset and the thermoplast is at least substantially equal to the degree of curing of the thermoset at a location which is internal to the thermoset. The internal location of the thermoset can be at a distance from the joint face, that can depend on the configuration of the connector.
[0060] Therefore, there is substantially no possibility for humidity or liquids, indicated with big arrows 28, to enter the connector 10, advance within the connector 10 and reach the connector side 29. Therefore, electric components which are electrically connected to the connector 10 are protected, even if the connector 10 is subjected to environmental conditions.
[0061] For the shown embodiment of the connector 10 a first degree of curing of the thermoset 22 at the joint face 10, an exemplary location is indicated with reference numeral 30, between the thermoset 22 and the thermoplast 26 is at least substantially the same as a second degree of curing of the thermoset 22 at a location 32 which is at a distance from the joint face 5. Here, the location 32 is at a maximum distance from the joint face 5, because the joint face 5 surrounds the elements enclosed therein in the manner of a cylinder.
[0062]
[0063] A step of injection-molding S14 of a thermoplast 26 on the thermoset premold 24 follows. The step of injection-molding S14 takes place before the thermoset premold 24 has reached a degree of curing of 90%. Optionally, the step of injection-molding S14 can be followed by a step of annealing S16. Further preferred embodiments of the method 40 can be derived from the above explanations.
[0064] Ranges have been discussed and used within the forgoing description. One skilled in the art would understand that any sub-range within the stated range would be suitable, as would any number within the broad range, without deviating from the invention.
[0065] The foregoing description of the present invention has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit the invention to the form disclosed herein. Consequently, variations and modifications commensurate with the above teachings, and the skill or knowledge of the relevant art, are within the scope of the present invention. The embodiment described hereinabove is further intended to explain the best mode known for practicing the invention and to enable others skilled in the art to utilize the invention in such, or other, embodiments and with various modifications required by the particular applications or uses of the present invention. It is intended that the appended claims be construed to include alternative embodiments to the extent permitted by the prior art.