APPARATUS FOR THERMAL REGULATION OF A HIGH TEMPERATURE PEM FUEL CELL STACK
20230056393 · 2023-02-23
Inventors
- Nikolaos G. THEODOROPOULOS (Patras, GR)
- Thomas J. PAVLIK (Stanwood, WA, US)
- Emory S. De Castro (Nahant, MA, US)
- Nora GOURDOUPI (Patras, GR)
- Vassilios GREGORIOU (Drosia, GR)
Cpc classification
H01M8/04074
ELECTRICITY
H01M8/04059
ELECTRICITY
Y02E60/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M8/04067
ELECTRICITY
International classification
Abstract
The present invention provides fuel cell stacks comprising effective means to maintain the fuel cell stacks at a constant temperature using plates mated to at least one face of the stack and in contact with the edges of the repeat and non-repeat layers while making use of the phase change of working-fluids such as water or water-organic species mixtures for heat transfer. Also provided are processes for maintaining said fuel cell stacks at a constant temperature by adjusting the flow rate and pressure of the cooling fluid so that both liquid and vapor are present at the same time.
Claims
1. A fuel cell stack comprised of Repeating bipolar plates and MEAs and non-repeating layers, of end plates One or more plates mated to the at least one face of the stack and in contact with the edges of the repeat layers, said one or more plates being adapted to act as a constant temperature thermal reservoir.
2. The stack of claim 1 wherein the said plate incorporates a working-fluid flowing within a fluidic-circuit
3. The stack of claim 2 wherein the working-fluid water, or mixtures of water and propylene glycol, water and ethylene glycol, water and methanol, or water and ethanol.
4. The stack of claim 1 wherein the operating temperature of the stack is between 120C and 260C.
5. The stack of claim 3 wherein the pressure within the fluidic-circuit is adjusted to be the saturated vapor pressure of the working-fluid at the stack operating temperature.
6. The stack according to claim 3, wherein the steam quality of the mixture is adjusted to be between 5 percent and 95 percent.
7. The stack of claim 5 in which excess flow is introduced into the fluidic circuit to ensure the presence of both liquid and vapor phases.
8. The stack of claim 1 in which a thermally-conductive dielectric layer is disposed between the constant temperature thermal reservoir plate and the face of the stack
9. The stack of claim 7 in which a lubricant is disposed on the at least one face of the thermally-conductive dielectric layer.
10. The stack of claim one in which a lubricant is disposed onto the at least one face of the at least one thermally conductive dielectric layer.
Description
IN THE DRAWINGS
[0017]
[0018]
[0019]
[0020]
[0021]
[0022]
DETAILED DESCRIPTION OF THE INVENTION
[0023] The term “thermal-mass” as used herein denotes a monolithic plate which may receive and release thermal energy. In the present disclosure, the thermal-mass may freely exchange thermal energy with a fuel cell stack to which it is intimately mated.
[0024] The present disclosure is generally directed to the use of a thermal-mass incorporating a fluidic-circuit adapted to provide a constant temperature reservoir with which a fuel cell stack may exchange thermal energy. The pressure in the fluidic-circuit is adjusted so that the temperature of the two-phase flow corresponds to a specified saturation temperature. The presence of two-phases ensures that the thermal-mass and the exterior of the stack that it is mated to, are each maintained at a constant temperature.
[0025] Depicted in
[0026] Referring to
[0027] At least one thermal-mass 2, incorporating a fluidic-circuit 3 is mated to the at least one face 9 of the fuel cell stack with the thermally-conductive dielectric layer 8 disposed between the thermal-mass 2 and the fuel cell stack, 1 for the purpose of routing thermal energy while preventing electrical contact. and a second thermal-mass 2 having a second fluidic-circuit 3 is mated to a second face of the fuel cell stack in like manner. In a related embodiment the fuel cell stack can have just one thermal-mass mated to just one face or multiple thermal-masses mated to multiple faces.
[0028] When thermal loads are present such as when heat is applied to the stack 1 during start-up or during other operation accompanied by a change in temperature such as shut-down, the stack 1 will expand or contract. Such thermal expansion or contraction varies among materials. During thermal expansion or contraction, when frictional forces are present between the thermally-conductive dielectric layer and an adjacent face of the stack 9 or between the thermally-conductive dielectric layer and the face of a thermal-mass 2 such forces and displacement can be great enough to deform, tear or otherwise damage the thermally-conductive dielectric layer. In one preferred embodiment a thermally-conductive dielectric grease is applied to the at least one face of the thermally-conductive dielectric layer 8 for the purpose of lubricating the interface between the thermally-conductive dielectric layer 8 and the face of the stack 9 or between the thermally-conductive dielectric layer 8 and the thermal-mass 2. In one preferred embodiment both faces of the thermally-conductive dielectric layer are coated with a lubricant. The purpose of the lubrication being to allow sliding to occur between the thermally-conductive layer and adjacent components so that it does not tear under the influence of frictional forces.
[0029] The fuel cell stack 1 produces thermal energy as a byproduct of its operation. This thermal energy must be removed if the stack is to continue to operate. The thermal energy may flow be removed by the thermal-mass 2 with said thermal energy elevating the temperature of a working-fluid 6 which enters the fluidic-circuit 3 in the thermal mass 2 through inlet 7 and which exits through outlet 10. The thermal energy is absorbed by the working-fluid 6 through the elevation of the temperature of the working-fluid 6 through a process called sensible heat transfer up until the working fluid 6 reaches to its boiling (vaporization) point. Thereafter additional thermal energy is absorbed by the working-fluid 6 which vaporizes and absorbs thermal energy from the stack 1 through a process termed latent heat transfer.
[0030] Referring to
[0031] A prescribed working-fluid 6 temperature is achieved through assurance of the presence of both the liquid and gas phases. So long as the two phases are each present, the temperature will be constant but if one of the phases is absent then the temperature may not be constant. For example, it is possible for a working-fluid 6 to be at a temperature below the saturation temperature of the working-fluid 6 if only liquid is present. Such a liquid is termed “supercooled”. Also, for example it is possible for a working-fluid 6 to be at a temperature above the saturation temperature of the working-fluid if only a vapor is present. Such a vapor it termed “superheated.”
[0032] Referring to
[0033] Pump 14 flow may be controlled via a signal from Mass flow meter 13 with the amount of flow supplied being a function of the output of thermocouples 19 which measures the temperature immediately downstream of thermal-mass 2 which is at a substantially identical temperature to working fluid 6 and (referring to
[0034] In one preferred embodiment a condensing heat exchanger 15 is introduced in the piping-circuit to change the phase of the working-fluid to 100 percent liquid and which may also reduce the temperature of the working-fluid to below its saturation temperature. The working fluid may thus be used in a continuous loop.
[0035] The piping circuit may have some of the elements shown in
[0036] The temperature of thermal-mass 2 may be maintained at a substantially uniform temperature throughout its volume by employing as the material of its construction one having a high thermal conductivity. For example 6063 aluminum alloy has a thermal conductivity of about 200 Watts*m.sup.−1*K.sup.−1 and copper 81100 alloy has a thermal conductivity of about 345 Watts*m.sup.−1*K.sup.−1.
[0037] Referring to
[0038] Referring to