HIGH DEFINITION STENCIL
20180345712 ยท 2018-12-06
Inventors
Cpc classification
B41C1/14
PERFORMING OPERATIONS; TRANSPORTING
B44D3/00
PERFORMING OPERATIONS; TRANSPORTING
B41N1/24
PERFORMING OPERATIONS; TRANSPORTING
B44D2/007
PERFORMING OPERATIONS; TRANSPORTING
B43L13/201
PERFORMING OPERATIONS; TRANSPORTING
B41M1/12
PERFORMING OPERATIONS; TRANSPORTING
B41F15/34
PERFORMING OPERATIONS; TRANSPORTING
B41N1/248
PERFORMING OPERATIONS; TRANSPORTING
International classification
B41N1/24
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A stencil for use in stenciling complex symbols incorporates a stencil substrate employing a flexible material, having a plurality of symbols arranged thereon. A plurality of folding stiffeners are incorporated in the substrate, each stiffener being positioned to split symbols having stencil cutouts forming isolated elements within an interior of the symbol. The stiffeners are foldable about a vertex, to collapse into a raised position and bring together the split symbol, with the stiffeners supporting the isolated elements created by the cutouts and portions of the stencil cutouts forming the symbols that extend into coincident channels in the folding stiffeners, to bridge adjoining portions of said split characters.
Claims
1. A stencil for use in stenciling complex symbols, comprising: a stencil substrate comprising a flexible material, having a plurality of symbols arranged thereon; a plurality of folding stiffeners in the substrate, each stiffener region being positioned to split symbols having stencil cutouts forming isolated elements within an interior of the symbol, wherein the stiffeners are foldable about a vertex, to collapse into a raised position and bring together the split symbol, with the stiffeners supporting the isolated elements created by the cutouts, and wherein portions of the stencil cutouts forming the symbols extend into coincident channels in the folding stiffeners, to bridge adjoining portions of said split characters.
2. The stencil as defined in claim 1 wherein the stencil substrate is vinyl combined with card stock or paperboard.
3. The stencil as defined in claim 1 wherein the folding stiffeners are paperboard combined with vinyl.
4. The stencil as defined in claim 1 wherein the folding stiffeners are polyetherimide alloy.
5. The stencil as defined in claim 1 wherein substrate is split on selected separation lines extending through or adjacent to the isolated elements and the folding stiffeners are engaged to the substrate at the separation lines.
6. A method for forming a stencil to apply a painted marker on a surface comprising: defining separation lines determined to accommodate isolated elements in symbols in a marker to form stencil elements; inserting stiffener strips between the stencil elements; dividing a CAD model providing a representation of the marker symbols spaced at the separation lines according to the widths of the stiffener strips; adding aligned channels to separated symbol cutouts in the CAD model to create a numerically controlled (NC) template for cutting of the joined stencil substrate and stiffeners; cutting the separated character cutouts in a substrate of the stencil elements and adjoining channels in the stiffener strips; and, folding the stiffeners at crease lines to merge the symbol cutouts with the stiffeners bridging the cutouts with the channels to support the stencil substrate.
7. The method as defined in claim 6 wherein the stiffener strips are paper board and further comprising: scoring masking on the stencil substrate on the separation lines; removing the masking between the separation lines and, bonding the stiffener strips when folded with the unmasked stencil subsrate.
8. The method as defined in claim 6 wherein the stiffener strips are polyetherimide alloy and further comprising: determining an added width of the stencil substrate to accommodate the stiffener strips; and, depositing the stiffener strips on the substrate centered on the separation lines.
9. The method of claim 6 further comprising: applying the stencil to a surface on which the marker is to be applied; applying paint the symbol cutouts with communication through the channels for continuity of the painted symbols; and, removing the stencil from the surface.
10. A stencil for use in stenciling complex characters, comprising: a stencil substrate having a plurality of symbol cutouts arranged thereon; a plurality of raised stiffeners vertically oriented and arranged to bridge across specific cutouts with isolated elements, the stiffeners supporting the isolated elements, wherein portions of said specific cutouts are coincident with channels through a part of the raised stiffeners, and wherein the substrate and the plurality of raised stiffeners are formed by an additive manufacturing process.
11. The stencil as defined in claim 10 wherein the stencil substrate is polyetherimide.
12. The stencil as defined in claim 10 wherein the raised stiffeners are polyetherimide alloy.
13. The stencil as defined in claim 12 wherein channels in the raised stiffeners are supported in the additive manufacturing process by polysulfone.
14. A method for forming a stencil to apply a painted marker on a surface comprising: introducing symbols desired on a stencil into a substrate to form cutouts for paint transmission to a surface; introducing a removable filler into the cutouts at locations spanning the cutouts at isolated elements for placement of desired ribs; applying vertical ribs spanning the symbol in a manner to overlap the filler; and removing the filler.
15. The method as defined in claim 14 wherein the filler has a depth creating a channel coincident with the cutout.
16. The method as defined in claim 14 wherein the filler is applied in one or more layers by fused deposition.
17. The method as defined in claim 14 wherein the vertical ribs are applied in one or more layers by fused deposition .
18. The method as defined in claim 15 further comprising: applying the stencil to a surface on which the marker is to be applied; applying paint to the symbol cutouts with communication through the channels for continuity of the painted characters; and removing the stencil from the surface.
19. The method as defined in claim 18 further comprising applying an adhesive to the stencil to adhere to the surface.
20. The method of claim 14 wherein the substrate and symbols are formed by printing in an additive manufacturing process.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The features, functions, and advantages that have been discussed can be achieved independently in various embodiments of the present disclosure or may be combined in yet other embodiments, further details of which can be seen with reference to the following description and drawings.
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DETAILED DESCRIPTION
[0026] The embodiments and methods described herein provide stencils formed by arranging stiffener portions positioned to split complex symbols such as characters or figures having isolated stencil elements surrounded by cutouts within an interior of the symbol, where the stiffener portions bridge and support the isolated stencil elements with coextensive channels for paint entrance.
[0027] Referring to the drawings,
[0028] As seen in
[0029] As seen in
[0030] As seen in
[0031] When completely folded as seen in
[0032] Fabrication of the stencil with integral stiffeners may be accomplished using various techniques. An exemplary approach is shown in
[0033] The separation line edges 14a, 14b and the crease lines 28 at the vertices 29 for each stiffener 22 are then scored into the paperboard and the masking, step 708. The scores should be deep enough to crease the paperboard and cut the masking but not penetrate the vinyl of the stencil. The purpose of the scores is to make the stiffeners foldable. Alternatively an additive material (such as polyetherimide alloy) with greater rigidity than the stencil substrate is used to form the stiffener strips between the stencil elements. The additive material is bonded, printed or otherwise adhered to the stencil substrate at the desired locations, step 706a. Numerically controlled (NC) cutting of the joined stencil substrate and stiffeners employing the CAD model is then used to produce the characters 16 in the substrate of the stencil elements and cutouts for the adjoining channels 26 in the stiffeners, step 710. The cut vinyl material is then removed forming the cutouts 12 and channels 26, step 711. The masking on the vinyl stencil is removed between the edges 14a and 14b, step 712, and the stiffeners 22 are then folded on the crease lines 28, step 713, to merge the character cutouts 12 with the stiffeners 22 bridging the cutouts 12 with the channels 26 to support the stencil substrate with care being taken that the cutouts align correctly to form the graphics and text with unmasked surface adhered to unmasked surface, at every stiffener location. The remaining masking is then removed and stencil is applied to a surface on which the marker is to appear, step 714. Paint is then applied to the character cutouts 12 with communication through the channels 26 for continuity of the painted characters, step 716. The stencil is then removed, step 718.
[0034] Materials for the substrate of the stencil in the exemplary embodiment may be:
Vinyl such as AVIATION GRADE STENCIL MASK/YELLOW available from Summa, Inc. Seattle, Wash. glued in combination with paperboard such as VersaFile Manila produced by Westrock, Norcross, Ga. Stiffeners in the alternative embodiment may be polyetherimide alloy or similar material printed or bonded on the substrate.
[0035] As an alternative to folding stiffeners to support the stencil substrate in which symbol cutouts have already been created for characters or figures, individual vertical ribs may be fabricated onto the stencil substrate as raised stiffeners, by using additive material manufacturing techniques. An embodiment employing this technique is shown in
[0036] As seen in
[0037] Formation of the ribs 38 with the associated channels 26 spanning the cutouts 12 is accomplished by an additive manufacturing process described with respect to
[0038] For the described embodiments, an exemplary stencil material is vinyl identified as AVIATION GRADE STENCIL MASK/YELLOW available from Summa, Inc. Seattle, Wash. The thickness of this vinyl is preferably under 4 mil. Exemplary additive materials used for the fabrication of substrate and ribs are polyetherimide alloy such as Ultem 9085 available from Stratasys Inc. Eden Prairie, Minn. for the rib material and Polysulfone such as Ultem 9085 Support for the filler. An exemplary adhesive for applying the stencil to an aircraft surface is Krylon Easy-Tack Re-positional Adhesive 7020.
[0039] Having now described various embodiments of the disclosure in detail as required by the patent statutes, those skilled in the art will recognize modifications and substitutions to the specific embodiments disclosed herein. Such modifications are within the scope and intent of the present disclosure as defined in the following claims.