Arrangement of a heatsink in a headlamp

Abstract

An arrangement of a heatsink for insertion in a headlamp, and a holder being provided in the headlamp, in which the heatsink is held. At least one semiconductor light source is provided, which can be cooled with the heatsink (10). A clamping element is provided, with which the heatsink is arranged in a holding manner on the holder and by means of which one or more semiconductor light sources are directly or indirectly held on the heatsink.

Claims

1. A heatsink arrangement for a headlamp, the heatsink arrangement comprising: a heatsink associated with one or more semiconductor light sources for cooling thereof, the heatsink including each of an upper portion facing the one or more semiconductor light sources and a lower portion and a proximal end portion and a distal end portion; a holder provided in the headlamp, said holder extending outwardly from a surface within the headlamp; a clamping element comprising each of a first end portion and a second end portion, said clamping element supporting the heatsink at the upper portion of the heatsink such that the first end portion of the clamping element supports the distal end portion of the heatsink and the second end portion of the clamping element supports the proximal end portion of the heat sink and the distal end portion and the proximal end portion of the heatsink are supported between the first end portion and the second end portion of the clamping element, and supporting the one or more semiconductor light sources, both the heatsink and the one or more semiconductor light sources being supported outwardly from the surface within the headlamp; wherein the clamping element and the holder are directly fastened to one another only at the second end portion of the clamping element; and wherein the first end portion of the clamping element and the holder are not directly fastened to one another, and thereby the heatsink and the one or more semiconductor light sources are cantilevered such that a gap is provided between the lower portion of the heatsink and the surface within the headlamp at the first end portion of the clamping element, such that the lower portion of the heatsink is exposed to ambient air.

2. The heatsink arrangement according to claim 1, wherein the clamping element holds, in an elastic manner, at least one of the heatsink on the holder and one or more semiconductor light sources on the heatsink.

3. The heatsink arrangement according to claim 1 wherein the heatsink is at least one of the following: embodied free from machined surfaces; manufactured by means of an impact extrusion process, an extrusion process or a pressure die-casting process; at least partially embodied by means of a sheet metal part.

4. The heatsink arrangement according to claim 1 wherein a carrier PCB is provided, on which the one or more semiconductor light sources is supported, wherein the carrier PCB is arranged between the clamping element and a cooling side of the heatsink.

5. The heatsink arrangement according to claim 4 wherein the clamping element has centering bosses by means of which the carrier PCB is held in a position on the heatsink.

6. The heatsink arrangement according to claim 5 wherein the heatsink has recesses into which the centering bosses extend.

7. The heatsink arrangement according to claim 1 wherein a light guide element is provided, which is held in a position above the at least one semiconductor light source by the clamping element.

8. The heatsink arrangement according to claim 1 wherein the clamping element has a two-dimensional extension and is fastened to the holder by means of at least one fastening element.

9. The heatsink arrangement according to claim 1 wherein the clamping element is made from a metal material or from a plastic material, and has at least one snap-fastening hook with which the heatsink is at least partially held.

10. The heatsink arrangement according to claim 9, wherein the heatsink is braced against a clamping edge on the holder.

11. A heatsink arrangement for a headlamp, the heatsink arrangement comprising: a heatsink associated with one or more semiconductor light sources for cooling thereof, the heatsink including each of an upper portion facing the one or more semiconductor light sources and a lower portion and a proximal end portion and a distal end portion; a holder provided in the headlamp, said holder extending outwardly from a surface within the headlamp; a clamping element comprising each of a first end portion and a second end portion, said clamping element supporting the heatsink at the upper portion of the heatsink such that the first end portion of the clamping element supports the distal end portion of the heatsink and the second end portion of the clamping element supports the proximal end portion of the heat sink and the distal end portion and the proximal end portion of the heatsink are supported between the first end portion and the second end portion of the clamping element, and supporting the one or more semiconductor light sources, both the heatsink and the one or more semiconductor light sources being supported outwardly from the surface within the headlamp and located entirely between the first end portion and the second end portion of the clamping element; wherein the clamping element and the holder are directly fastened to one another only at the second end portion of the clamping element; and wherein the first end portion of the clamping element and the holder are not directly fastened to one another, and thereby the heatsink and the one or more semiconductor light sources are cantilevered such that a gap is provided between the lower portion of the heatsink and the surface within the headlamp at the first end portion of the clamping element, such that the lower portion of the heatsink is exposed to ambient air.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

(2) FIG. 1 is a cross-sectional lateral view of the arrangement of a heatsink according to the present invention.

DETAILED DESCRIPTION OF THE DRAWINGS

(3) The FIGURE shows an arrangement of a heatsink 10, as it can for example be inserted in a headlamp, while forming a light module. The arrangement is shown arranged on a holder 11, wherein the holder 11 can for example form the housing of the headlamp, which does not have to be encompassed by the arrangement.

(4) The arrangement has a semiconductor light source 12, which is represented exemplarily as a SMD-LED. The semiconductor light source 12 can radiate into a light guide element 17 during operation, to fulfil, for example, a light signal function in a vehicle headlamp. Herein, the semiconductor light source 12 is cooled via the heatsink 10, the cooling being achieved by means of and/or through a carrier PCB 14, on which the semiconductor light source 12 is held. The carrier PCB 14 can for example comprise a respective metal portion or provide a high thermal conductivity by another means.

(5) The heatsink 10 is held by a clamping element 13, and the clamping element 13 is made from a plastic material, for example by means of an injection molding process. The clamping element 13 has a plane extension and covers essentially a cooling side 10a of the heatsink 10. In the position of the semiconductor light source 12 on the cooling side 10a of the heatsink 10, the clamping element 13 has an opening in which a light guide element 17 is received, so that during operation of the semiconductor light source 12, emitted light is radiated into the light guide element 17.

(6) The clamping element 13 is held on the holder 11 via a fastening element 18, which is for example executed as a screw-fastening element 19. On the side opposite the fastening element 18 on the holder, the clamping element 13 has a snap-fastening hook 20 which clasps a longitudinal edge of the heatsink. On the side of the fastening element 18, the heatsink 10 sits on a clamping edge 21 on the holder 11, and by tensing the clamping element 13 by means of the fastening element 18 a tension is created in the clamping element 13. This tensioning results in the pressing of the carrier PCB 14 with the semiconductor light source 12 onto the cooling side 10a of the heatsink 10. At the same time, the heatsink 10 is held on the holder 11 by the clamping element and the heatsink 10 is pressed against the clamping edge 21. Therefore, the clamping element fulfils the function of a seat for the heatsink 10 on the holder 11, and the clamping element fulfils the function of the arrangement of the semiconductor light source 12 on the cooling side 10a of the heatsink.

(7) In order to position the light guide element 17 above the semiconductor light source 12 in a holding manner according to a further function of the clamping element 13, the clamping element 13 has molded-on holding shapes 22, between which the light guide element 17 is held, and the molded-on holding shapes 22 limit for example the opening in the clamping element 13. In a manner not shown in detail, the light guide element 17 can for example be snap-fastened to the clamping element 13 and particularly to the molded-on holding shapes 22.

(8) Furthermore, the clamping element 13 has centering bosses 15, which are positioned on the side of the clamping elements 13 on which the carrier PCB 14 is arranged and which faces in the direction of the cooling side 10a of the heatsink 10. The centering bosses 15 penetrate the carrier PCB 14 through the added bores, so that the carrier PCB 14 is held in its position and the semiconductor light source 12, which is for example fastened on the carrier PCB 14 in a conventional manner, is held in the opening in the clamping element 13.

(9) According to the shown embodiment, the heatsink 10 can be embodied free from surfaces which have been machined with chip-producing processes. Except from this embodiment of the heatsink 10 is a surface of the heatsink 10, which is formed by means of a saw cut, for example to cut the heatsink 10 from an extruded profile.

(10) In an exemplary embodiment, the heat sink 10 has not screw bores or other surfaces machined with chip-producing processes, particularly due to the fastening method with the clamping element 13, and also in the position, in which the carrier PCB 14 is arranged on the cooling side 10a of the heatsink 10, there are no surface treatments with chip-producing processes necessary. The surface which can be produced by means of an extrusion process or an impact extrusion process, for example when the heatsink 10 is made from aluminum, can be sufficient to achieve a face-to-face cooling contact for example with the carrier PCB 14. In order for the centering bosses 15 not to sit on the cooling side 10a of the heatsink 10 and weaken the tensioning of the carrier PCB 14, the cooling side 10a has recesses 16 which can also be already produced by means of an extrusion process or impact extrusion process. The recesses 16 merely show in an exemplary embodiment, that the heatsink 10a can have respective contours which are for example necessary for a carrier PCB 14, despite missing chip-producing processes.

(11) The clasping of the clamping element 13 around the outer edge of the heatsink 10 is merely shown in an exemplary embodiment with the snap-fastening hook 20. Exemplarily, the lateral side of the heatsink 10 can be profiled accordingly, and achieve a form-fit also in a different manner, particularly with the clamping element 13, but also with the holder 11.

(12) In its execution, the invention does not relate solely to the preferred design example described above. On the contrary, a number of variants that use the solution as represented above are conceivable, even on designs that are fundamentally different. All characteristics resulting from the claims, the description or the drawings and/or advantages, including design details, arrangements in space and process steps can be essential for the invention on their own as well as in any combination.

LIST OF REFERENCE SIGNS

(13) 10 Heat sink 10a Cooling side of heatsink 11 Holder 12 Semiconductor light source 13 Clamping element 14 Carrier PCB 15 Centering boss 16 Recess 17 light guide element 18 Fastening element 19 Screw-fastening element 20 Snap-fastening hook 21 Clamping edge 22 molded-on holding shape