A Device Comprising Heat Producing Components with Liquid Submersion Cooling

Abstract

A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

Claims

1. A device comprising heat producing components, said device comprising a container wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

2. The device of claim 1, wherein said components are mounted on a multitude of plate shaped boards, said boards being vertically mounted in said container in a parallel manner between and perpendicular to said wall.

3. The device of claim 1, wherein a first space is provided between the lower edges of said walls and the bottom of the container and a second space is provided between the upper edges of said walls and the upper wall of the container, for allowing said liquid circulation to pass.

4. The device of claim 1, wherein said cooling liquid is a dielectric fluid.

5. The device of claim 1, wherein said heat exchangers are radiator type heat exchangers, having ducts through which a cooling fluid flows.

6. The device of claim 1, wherein said heat exchangers are radiating heat exchangers, comprising cooling fins extending on the other side of said surface being in contact with the liquid.

7. The device of claim 1, wherein, seen in a horizontal cross section of said device, said components are disposed between said heat exchangers and vertical walls in a symmetrical configuration.

8. The device of claim 1, wherein, seen in a horizontal cross section of said device, said components are disposed between said heat exchangers and vertical walls in a concentric configuration.

9. The device of claim 1, wherein a multitude of clusters of components are mounted horizontally spaced apart in said container, each cluster being disposed between at least two of said heat exchangers and vertical walls, and wherein at least one of said heat exchangers is disposed between at least two of said walls and clusters.

10. The device of claim 1, wherein said vertical walls are made of a heat insulating material.

11. The device of claim 1, wherein the inner volume of said container is more than 1000 l.

12. The device of claim 1, wherein the top wall of said container is a removable lid.

13. The device of claim 1, wherein said components are electronic components.

14. The device of claim 1, wherein, seen in a horizontal cross section of said device, said components are disposed between at least two of said heat exchangers and vertical walls.

15. The device of claim 1 wherein the heat producing components comprise at least one server memory board, hard disk, processor, and/or switch.

16. The device of claim 4 wherein the dielectric fluid is an oil.

17. The device of claim 5 wherein the cooling fluid is water or air.

Description

[0010] The invention will now be illustrated by means of a preferred embodiment, with reference to the drawings, wherein:

[0011] FIG. 1 is a perspective view of a device in accordance with the invention;

[0012] FIG. 2 is a further perspective view of the device of FIG. 1;

[0013] FIG. 3 is a schematic vertical cross section of the device of FIG. 1;

[0014] FIG. 4 is a schematic vertical cross section of another embodiment of a device in accordance with the invention;

[0015] FIG. 5 is a schematic horizontal cross section of another embodiment of a device in accordance with the invention; and

[0016] FIG. 6 is a schematic horizontal cross section of another embodiment of a device in accordance with the invention.

[0017] According to FIGS. 1, 2 and 3 the device comprises a liquid tight container 1 in which from the top side two arrays of parallel boards (PCBs) 2 with heat producing electronic components, such as memory chips, processors and switches, are suspended. In use the boards 2 are completely submerged in a suitable oil 3. The top side of the container 1 is closed of by one or more hingeable lids. The boards 2 are connected to the outer side of the container 1 by electrical connecting means 5. On two opposite sides of the two arrays of boards 2 vertical separation walls 6 are mounted in the container 1. The walls 6 extend perpendicular to the boards 2. On the other side of the walls 6 radiator type heat exchangers 7 are mounted in the container 1, which are also submerged in the oil 3. The walls 6 substantially separate the space in which the boards 2 with the electronic components extend and the spaces in which the heat exchanger 7 extend.

[0018] As can be seen in FIG. 3, when the electronic components heat up during use of the device, a double and symmetrical vertical circulation of the oil in the container is caused by the temperature difference in the oil 3, wherein the oil 3 rises in the centre of the container 1 between the heated components 2 and descends at the sides of the container 1, at the other side of the walls 6, along the cooling heat exchangers 7. Cooling water is pumped through the conduits of the heat exchangers 7, and supplied to the device through a supply pipe 8 and discharged form the device through a discharge pipe 9. The heat thus extracted may be re-used for other purposes.

[0019] FIG. 4 shows another embodiment of the device, wherein three clusters of electronic components 2 are mounted in the container 1, spaced apart from each other. Again on two opposite sides of each cluster the vertical separation walls 6 are mounted in the container 1. On the other side of the walls the submerged heat exchangers 7 extend, wherein the heat exchangers 7 between the clusters 2 are common thereto. In this manner three double and symmetrical vertical circulations of the cooling oil 3 occur in a very efficient manner.

[0020] FIG. 5 shows another embodiment of the device, wherein the heat generating components 2 are located in the centre of a circular container 1, the vertical separation wall 6 is also circular and extends around the electronic components 2, and the heat exchangers 7 extend in the circular space between the vertical separation wall 6 and the circular container wall 1, all in a concentric configuration. In this manner a concentric vertical circulation of the cooling oil occurs.

[0021] FIG. 6 shows a further embodiment wherein features of the embodiments of FIG. 4 and FIG. 5 are combined. Two cluster of electronic components 2 are mounted in the container 1, spaced apart from each other, in a concentric manner. Around the central cluster 2 a first circular vertical separation wall is mounted, and the heat exchangers 7 extend in the circular space between the first vertical separation wall 6 and a second separation wall 6. The second cluster 2 extends in the space around said second vertical separation wall 6 and inside a third vertical separation wall 6. The heat exchangers 7 between the first and second vertical separation walls 6 and between the clusters 2 are common thereto. In this manner two concentric vertical circulations of the cooling oil occur in a very efficient manner.

[0022] It will be readily understood that various combinations of the different configurations as shown in the above described embodiments and with different numbers of clusters can be made.

[0023] The invention has thus been described by means of preferred embodiments. It is to be understood, however, that this disclosure is merely illustrative. Various details of the structure and function were presented, but changes made therein, to the full extent extended by the general meaning of the terms in which the appended claims are expressed, are understood to be within the principle of the present invention. The description and drawings shall be used to interpret the claims. The claims should not be interpreted as meaning that the extent of the protection sought is to be understood as that defined by the strict, literal meaning of the wording used in the claims, the description and drawings being employed only for the purpose of resolving an ambiguity found in the claims. For the purpose of determining the extent of protection sought by the claims, due account shall be taken of any element which is equivalent to an element specified therein.