Electrical Debonding of PU Hot Melt Adhesives By Use of Conductive Inks

Abstract

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

Claims

1. A method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: a) coating the surface of the electrically non-conductive substrate(s) with a conductive ink; b) applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; c) contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; d) allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and e) optionally applying a voltage to the bonded substrates whereby adhesion between the electrically debondable hot melt adhesive composition and the substrate surface is substantially weakened.

2. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition is an electrically debondable hot melt polyurethane adhesive composition comprising at least one polyurethane polymer and at least one organic or inorganic salt.

3. The method according to claim 1, wherein the voltage applied ranges from 0.1 to 240 V; and/or the voltage is applied for an interval of <1 second to >20 minutes.

4. The method according to claim 1, wherein step e) is present and further includes heating the bonded substrates to a temperature from 35? C. to 80? C.

5. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition is an electrically debondable hot melt polyurethane adhesive composition comprising 20 to 90% by weight of the adhesive composition of at least one polyurethane polymer.

6. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition is an electrically debondable hot melt polyurethane adhesive composition comprising 1 to 30% by weight of the adhesive composition of at least one organic or inorganic salt.

7. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises at least one polar compound.

8. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises at least one polar compound selected from the group consisting of polyphosphazenes, polymethylenesulfides, polyoxyalkylene glycols, polyethylene imines, low molecular weight polyols, polyethers and cyclic carbonates, preferably propylene carbonate and poly(ethylene glycol)bis(2-ethylhexanoate).

9. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises at least one polar compound, the polar compound being present in an amount of 1 to 30% by weight of the adhesive composition.

10. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises a trifluoromethanesulfonate salt.

11. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises lithium trifluoromethanesulfonate.

12. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises an NCO-terminated polyurethane polymer.

13. The method according to claim 1, wherein the electrically debondable hot melt adhesive composition comprises an NCO-terminated polyurethane polymer having a free NCO content of from 0.1 to 5%.

14. The method according to claim 1, wherein the conductive ink: a) comprises an element selected from the group consisting of Ag, Cu, Al, W, Fe, Pt, Mn, Pb, Hg, Ni, Cr, C, Ge, Si or a combination thereof; and/or b) is coated onto the substrate surface with a thickness of between 0.001 ?m and 10000 ?m.

15. The method according to claim 14, wherein the conductive ink is coated onto the substrate surface with a thickness of between 0.01 ?m and 1000 ?m.

16. Bonded first and second substrates obtained by the method of claim 1, wherein the bonded first and second substrates can be debonded upon application of an electric current and, optionally heat.

Description

EXAMPLES

Example 1

[0085] A polyurethane hot melt comprising an isocyanate-functional polyurethane polymer with a free NCO content of ca. 1.8% containing 15 wt. % additive 1, as defined below, was applied between one glass substrate and a stainless steel substrate to form a composite. One side of the glass substrate was either (i) coated with a silver (Ag)-containing ink (Loctite ECI 1006 E&C from Henkel) at a thickness of about 7 ?m, or (ii) uncoated.

Additive 1=

[0086] 30 wt % lithium trifluoromethanesulfonate (CF.sub.3SO.sub.3Li)
70 wt % 4-Methyl-1,3-dioxolan-2-one (propylene carbonate) (C.sub.4H.sub.6O.sub.3)

[0087] Upon introduction of 48 V current at 25? C. and 1 atm for 5 minutes, adhesive failure was observed with bond strengths of 0.24 MPa (control (average of 3 measurements without application of electrical current)=2.80 MPa) for the silver ink coated glass substrate. For the uncoated glass substrate adhesive failure was observed with bond strengths of 5.14 MPa (average of 3 measurements without application of electrical current).