Integrated circuit including memory, and write method

Abstract

An integrated circuit according to an embodiment includes: first and second wiring lines; a memory device including a first and second terminals connected to the first and second wiring line respectively; a first transistor including a high-k metal gate; a first circuit applying a first write voltage between the first and the second terminals, and switch the resistance of the memory device from a high-resistance state to a low-resistance state; a second circuit reading the resistance of the memory device, and comparing a read value of the resistance with a predetermined value; a third circuit lowering a threshold voltage of the first transistor when the read value of the resistance is greater than the predetermined value; a fourth circuit applying a second write voltage between the first and second terminals after the threshold voltage is lowered; and a fifth circuit raising the threshold voltage of the first transistor.

Claims

1. An integrated circuit comprising: first and second wiring lines; a memory device including a first terminal connected to the first wiring line and a second terminal connected to the second wiring line, a resistance of the memory device being switchable between a high-resistance state and a low-resistance state; a first transistor including a high-k metal gate, one of a source and a drain of the first transistor being connected to the first wiring line and the memory device; a first circuit electrically coupled to the memory device to apply a first write voltage between the first terminal and the second terminal, and switch the resistance of the memory device from a high-resistance state to a low-resistance state; a second circuit electrically coupled to the memory device to read the resistance of the memory device, and compare a read value of the resistance with a predetermined value; a third circuit electrically coupled to the memory device to lower a threshold voltage of the first transistor when the read value of the resistance is greater than the predetermined value; a fourth circuit electrically coupled to the memory device to apply a second write voltage between the first terminal and the second terminal after the threshold voltage is lowered, the second write voltage being not lower than the first write voltage; and a fifth circuit electrically coupled to the memory device to raise the threshold voltage of the first transistor.

2. The integrated circuit according to claim 1, further comprising a second transistor including a source and a drain, one of the source and the drain being connected to the second wiring line.

3. The integrated circuit according to claim 1, further comprising a third transistor including a source and a drain, one of the source and the drain being connected to the first wiring line.

4. The integrated circuit according to claim 1, wherein the memory device is a transistor including a source, a drain, and a gate, the source and the drain being connected to the first wiring line, the gate being connected to the second wiring line.

5. The integrated circuit according to claim 3, wherein the memory device is a resistive change memory device including a first electrode connected to the first wiring line, a second electrode connected to the second wiring line, and a resistive change layer interposed between the first electrode and the second electrode.

6. The integrated circuit according to claim 1, wherein the third circuit lowers the threshold voltage of the first transistor by applying 0 V to the source and the drain of the first transistor, and applying a negative voltage to the high-k metal gate or applying a positive voltage to a substrate in which the first transistor is formed.

7. The integrated circuit according to claim 1, wherein the fifth circuit raises the threshold voltage of the first transistor by applying 0 V to the source and the drain of the first transistor, and applying a lower voltage than the first write voltage to the high-k metal gate.

8. A write method implemented in an integrated circuit including: first and second wiring lines; a memory device including a first terminal connected to the first wiring line and a second terminal connected to the second wiring line, a resistance of the memory device being switchable between a high-resistance state and a low-resistance state; and a first transistor including a high-k metal gate, one of a source and a drain of the first transistor being connected to the first wiring line, the write method comprising: applying a first write voltage between the first terminal and the second terminal, and switching the resistance of the memory device from a high-resistance state to a low-resistance state; reading the resistance of the memory device, and comparing a read value of the resistance with a predetermined value; lowering a threshold voltage of the first transistor when the read value of the resistance is greater than the predetermined value; applying a second write voltage between the first terminal and the second terminal after the threshold voltage is lowered, the second write voltage being not lower than the first write voltage; and raising the threshold voltage of the first transistor.

9. The write method according to claim 8, wherein the memory device is a transistor including a source, a drain, and a gate, the source and the drain being connected to the first wiring line, the gate being connected to the second wiring line.

10. The write method according to claim 8, wherein the memory device is a resistive change memory device including a first electrode connected to the first wiring line, a second electrode connected to the second wiring line, and a resistive change layer interposed between the first electrode and the second electrode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a circuit diagram showing an example of an integrated circuit including an OTP memory device array;

(2) FIG. 2A is a diagram showing the applied voltages in a case where writing is performed on a transistor having a high-k metal gate;

(3) FIG. 2B is a diagram showing the applied voltages in a case where erasing is performed;

(4) FIG. 2C is a graph showing I-V characteristics before and after writing;

(5) FIG. 3 is a block diagram showing an integrated circuit according to a first embodiment;

(6) FIG. 4 is a circuit diagram showing a memory array according to the first embodiment;

(7) FIG. 5 is a diagram showing the applied voltages in a case where writing is performed on a memory device in the initial state in the first embodiment;

(8) FIG. 6 is a circuit diagram showing the applied voltages in a case where an erasing operation is performed on a transistor in the first embodiment;

(9) FIG. 7 is a circuit diagram showing the applied voltages in a case where additional writing is performed on a memory device in the first embodiment;

(10) FIG. 8 is a circuit diagram showing the applied voltages in a case where a transistor is initialized in the first embodiment;

(11) FIG. 9 is a circuit diagram showing a memory array according to a second embodiment;

(12) FIG. 10 shows the applied voltages in a case where writing is performed on a transistor in the second embodiment;

(13) FIG. 11 is a diagram showing the applied voltages in a case where writing is performed on a memory device in the initial state in the second embodiment;

(14) FIG. 12 is a circuit diagram showing the applied voltages in a case where an erasing operation is performed on a transistor in the second embodiment;

(15) FIG. 13 is a circuit diagram showing the applied voltages in a case where additional writing is performed on a memory device in the second embodiment;

(16) FIG. 14 is a circuit diagram showing a memory array according to a third embodiment;

(17) FIG. 15 is a cross sectional view showing a resistive change memory device;

(18) FIG. 16 shows the applied voltages in a case where writing is performed on a transistor in the third embodiment;

(19) FIG. 17 is a circuit diagram showing the applied voltages in a case where an erasing operation is performed on a transistor in the third embodiment;

(20) FIG. 18 is a circuit diagram showing the applied voltages in a case where additional writing is performed on a memory device in the third embodiment; and

(21) FIG. 19 is a circuit diagram showing the applied voltages in a case where a transistor is initialized in the third embodiment.

DETAILED DESCRIPTION

(22) An integrated circuit according to an embodiment includes: first and second wiring lines; a memory device including a first terminal connected to the first wiring line and a second terminal connected to the second wiring line, a resistance of the memory device being switchable between a high-resistance state and a low-resistance state; a first transistor including a high-k metal gate, one of a source and a drain of the first transistor being connected to the first wiring line; a first circuit configured to apply a first write voltage between the first terminal and the second terminal, and switch the resistance of the memory device from a high-resistance state to a low-resistance state; a second circuit configured to read the resistance of the memory device, and compare a read value of the resistance with a predetermined value; a third circuit configured to lower a threshold voltage of the first transistor when the read value of the resistance is greater than the predetermined value; a fourth circuit configured to apply a second write voltage between the first terminal and the second terminal after the threshold voltage is lowered, the second write voltage being not lower than the first write voltage; and a fifth circuit configured to raise the threshold voltage of the first transistor.

(23) Before embodiments of the present invention are described, the course events before the present inventors achieved the present invention will be described below.

(24) FIG. 1 shows an integrated circuit including a memory that uses one-time programmable (OTP) memory devices as the memory devices. This memory includes memory devices 10.sub.11 through 10.sub.22 arranged in a (22) array. The source and the drain of each memory device 10.sub.ij (i, j=1, 2) are connected to a wiring line 20; extending in the column direction, and the gate of each memory device 10.sub.ij is connected to a wiring line 30.sub.j extending in the row direction. That is, this OTP device has two terminals, one of the terminals being the gate, the other one of the terminals being the source and the drain.

(25) Each wiring line 20.sub.j (j=1, 2) is connected to the output terminal of an inverter 22.sub.j via a transistor 24.sub.j, and the input terminal of the inverter 22.sub.j is connected a word line WL.sub.j. The gate of each transistor 24.sub.j (j=1, 2) is connected to a control wiring line 25.

(26) One end of each wiring line 30.sub.i (i=1, 2) is connected to the drain of a p-channel MOS transistor 32.sub.i with a high withstand voltage, and the other end is connected to the input terminal of an inverter 38.sub.i via a transistor 36.sub.i. The source of each transistor 32.sub.i (i=1, 2) is connected to a bit line BL.sub.i, and the gate of each transistor 32.sub.i is connected to a control wiring line 33. The gate of each transistor 36.sub.i (i=1, 2) is connected to a control wiring line 37.

(27) Writing to be performed on the memory device 10.sub.11 will be described below as an example of a write method implemented for this memory.

(28) First, a voltage is applied to the control wiring line 25 so that the transistors 24.sub.1 and 24.sub.2 are put into an on-state, and a potential is applied to the word lines WL.sub.1, and WL.sub.2 so that the potential of the wiring lines 20.sub.1 and 20.sub.2 becomes 0 V. Meanwhile, a voltage is applied to the control wiring line 33 so that the transistors 32.sub.1 and 32.sub.2 are put into an on-state, and a write voltage Vprg is applied to the bit line BL.sub.1 so that a write inhibition voltage Vinh, which is half the write voltage Vprg, for example, is applied to the bit line BL.sub.2. As a result, in the memory device 10.sub.11, the write voltage Vprg is applied between the gate and the source/drain, and thus, writing is performed. In the other memory devices 10.sub.12, 10.sub.21, and 10.sub.22, however, a lower voltage than the write voltage Vprg is applied between the gate and the source/drain, and writing is not performed.

(29) The resistance of an OTP memory device after writing depends on the write voltage and the amount of the current flowing between the gate and the source or between the gate and the drain. If the oxide film destruction in an OTP memory device after a write operation is insufficient, the resistance of the OTP memory device becomes higher than expected.

(30) In a case where high-resistance writing is performed on an OTP memory device as above, the voltage to be applied to the oxide film is lower than that in the initial state even if writing is repeatedly performed thereafter under the same write conditions. Therefore, to perform additional writing, it is necessary to increase the voltage or the amount of current to that under the initial write conditions.

(31) If the voltage is increased in the case where writing is performed on the memory device 10.sub.11, for example, the value (level) of the pulse of the write gate voltage to be applied to the memory device 10.sub.11 is increased, and the pulse time is also adjusted as necessary. If the amount of current is increased, the gate voltage of the transistor 32.sub.1 is lowered, or the gate voltage of the transistor 24.sub.1 is raised. Normally, the transistors 32.sub.1 and 32.sub.2, and the transistors 24.sub.1 and 24.sub.2 are designed to have such device sizes that a voltage and a current sufficient for writing can be applied, with additional writing being taken into account. In a large-sized memory array, however, the sizes of the transistors 24.sub.1, 24.sub.2, 32.sub.1, and 32.sub.2 of the above two types that increase in number with array size should be made as small as possible.

(32) In view of the above, the inventors have made intensive studies, and managed to solve the above problem through the concepts described below.

(33) In the above described memory array, each transistor is formed with a general-purpose CMOS, and, depending on the process technology, a high-k metal gate is used as a general-purpose CMOS. Therefore, each transistor is a transistor having a high-k metal gate. A transistor having a high-k metal gate includes a source and a drain, a gate formed with a metal, and a gate insulating film formed with a high-k material (this film is also called a high-k insulating film). A high-k material is a material with a higher relative dielectric constant than that of a silicon oxide. In a transistor having a high-k metal gate, electric charge is trapped in the high-k insulating film. Therefore, a report says that such a transistor functions as a memory device on which writing and erasing can be repeatedly performed. An example of the applied voltages in a case where writing is performed on a memory device having a high-k metal gate is shown in FIG. 2A, and an example of the applied voltages in a case where erasing is performed is shown in FIG. 2B. At the time of writing, a gate voltage Vg is applied to the gate, a stress voltage Vstress is applied to the drain, 0 V is applied to the source, and 0 V is applied to the substrate. At the time of erasing, 0 V is applied to the gate, the source, and the drain, and an erase voltage Ve (>0 V) is applied to the substrate.

(34) As writing and erasing operations are performed on a memory device having a high-k metal gate in the above manner, the threshold voltage of this memory device increases and decreases, as can be seen from FIG. 2C. In FIG. 2C, the abscissa axis indicates the voltage V.sub.GS between the gate and the source, and the ordinate axis indicates the current I.sub.DS between the drain and the source. A change in the threshold voltage leads to an increase or decrease in the amount of current under the same I-V operating conditions. In view of this, the inventors presumed that the above problem could be solved if transistors each having a high-k metal gate were used as the transistors 24.sub.1 and 24.sub.2. Such configurations will be described below as embodiments.

(35) The following is a description of embodiments of the present invention, with reference to the accompanying drawings.

First Embodiment

(36) FIG. 3 shows an integrated circuit according to a first embodiment. The integrated circuit of the first embodiment includes a memory array 100, a driver 110, a verification circuit 120, and a control circuit 130. The memory array 100 includes memory devices arranged in an array, and is connected to the driver 110. The control circuit 130 supplies the driver 110 with a control signal such as a program instruction signal or a memory device address signal. In accordance with the control signal, the driver 110 applies a program voltage to the selected memory device. Also, in accordance with the control signal, the driver 110 may apply a predetermined voltage to the unselected memory devices, or put the potential of an electrode of a certain memory device into a floating state. The verification circuit 120 determines whether the resistance value of the memory device is a desired value (whether the programming has been completed), and supplies the control circuit 130 with information indicating the result of the determination. In accordance with the information from the verification circuit 120, the control circuit 130 transmits a control signal to the driver 110 if necessary.

(37) FIG. 4 shows an example of the memory array 100 of the first embodiment. This memory array 100 is used for a logic switch of a field programmable gate array (FPGA), for example. In the memory array 100, OTP memory devices as the memory devices are arranged in a (22) array. This memory array 100 is not necessarily an array in which memory devices are arranged in a (22) array, but may be an array in which memory devices are arranged in a (mn) array, where m and n are integers. This memory array 100 includes OTP memory devices 10.sub.11 through 10.sub.22. The source and the drain of each memory device 10.sub.ij (i, j=1, 2) are connected to a wiring line 20.sub.1 extending in the column direction, and the gate of each memory device 10.sub.ij is connected to a wiring line 30.sub.j extending in the row direction.

(38) Each wiring line 20.sub.j (j=1, 2) is connected to the output terminal of an inverter 22.sub.j via a cutoff transistor 23.sub.j, and the input terminal of the inverter 22.sub.j is connected a word line WL.sub.j.

(39) Each cutoff transistor 23.sub.j (j=1, 2) is a transistor having a high-k metal gate, and the gate of each cutoff transistor 23.sub.j is connected to a control wiring line 25.

(40) One end of each wiring line 30.sub.i (i=1, 2) is connected to the drain of a p-channel MOS transistor 32.sub.i with a high withstand voltage, and the other end is connected to the input terminal of an inverter 38.sub.i via a transistor 36.sub.i. The source of each transistor 32.sub.i (i=1, 2) is connected to a bit line BL.sub.i, and the gate of each transistor 32.sub.i is connected to a wiring line 33. The gate of each transistor 36.sub.i (i=1, 2) is connected to a wiring line 37. That is, the memory array 100 of the first embodiment is the same as the memory array shown in FIG. 1, except that the transistors 24.sub.1 and 24.sub.2 are replaced with the transistors 23.sub.1 and 23.sub.2 each having a high-k metal gate. Normal writing in the memory array 100 of the first embodiment is performed in the same manner as in the memory array shown in FIG. 1.

(41) This normal writing is performed by the control circuit 130 (the first circuit) via the driver 110.

(42) Reading is performed by the control circuit 130. After writing is performed on the memory array 100, input signals In.sub.1 and In.sub.2 (not shown) are applied to the word lines WL.sub.1 and WL.sub.2, respectively, and output signals are output from the output terminals of the inverters 38.sub.1 and 38.sub.2. As is apparent from this read method, in the memory array 100 of the first embodiment, writing is performed on at most one memory device among the memory devices arranged in the same row.

(43) In this memory array, if writing on a memory device is not sufficient, additional writing is performed. It is the verification circuit 120 (the second circuit) that determines whether writing on a memory device is sufficient. Specifically, after writing is performed on the memory device to be subjected to writing, which is the memory device 10.sub.11, for example, the control circuit 130 applies a read current to the corresponding word lines WL.sub.1 from the driver 110, and the verification circuit 120 detects the read current output from the corresponding bit line BL.sub.1. The verification circuit 120 then determines whether the writing on the memory device 10.sub.11 is sufficient.

(44) (Write Method)

(45) In a case where writing is determined to be insufficient by the verification circuit 120, additional writing is performed. Referring now to FIGS. 5 through 8, writing to be performed on the memory device 10.sub.11 will be described below as an example of a write method involving the additional writing. In FIGS. 5 through 8 for explaining the write method, the inverters 22.sub.1, 22.sub.2, 38.sub.1, and 38.sub.2 are omitted from the memory array 100 shown in FIG. 4, for ease of explanation.

(46) In the first embodiment, after normal writing is performed on a memory device, reading is performed. If the resistance value of the memory device becomes equal to or greater than a predetermined resistance value, additional writing is performed on the memory device. For example, in a case where writing on the memory device 10.sub.11 is insufficient, an erasing operation is performed on the transistor 23.sub.1, so as to apply the same gate current as that for the writing to the transistor 23.sub.1 connected to the path on which the additional writing is to be performed. Here, the path is formed with the word line WL.sub.1 and the wiring line 20.sub.1. After that, writing is again performed on the memory device 10.sub.11 of the memory array 100, and writing is performed on the transistor 23.sub.1, to return the transistor 23.sub.1 to the initial state.

(47) FIG. 5 is a diagram showing the applied voltages in a case where writing is performed on the memory device 10.sub.11 in the initial state.

(48) As a write voltage Vprg is applied to the gate of the memory device 10.sub.11 to be subjected to writing, the gate voltage of the transistor 32.sub.1 is set at 0V, for example, via the wiring line 33, and the write voltage Vprg is applied to the bit line BL.sub.1 connected to the source end of the transistor 32.sub.1, so that the transistor 32.sub.1 is put into an on-state. At this point, the transistor 32.sub.2 is also put into an on-state, and therefore, the bit line BL.sub.2 is put into an open state, or a write inhibition voltage Vinh is applied to the bit line BL.sub.2, so that any voltage equal to or higher than the write voltage Vprg is not applied to the wiring line 30.sub.2. A voltage Von is then applied to the gate of the transistor 23.sub.1 via the wiring line 25 to put the transistor 23.sub.1 into an on-state, and 0 V is applied to the word line WL.sub.1, so that the source and the drain of the memory device 10.sub.11 are set at 0 V, or the potential of the wiring line 20.sub.1 becomes 0 V.

(49) Meanwhile, the write inhibition voltage Vinh is applied via the transistor 23.sub.2 so that no writing is performed on the memory device 10.sub.12. As a result of this, the write voltage Vprg is also applied to the gate of the memory device 10.sub.12, but the source and the drain are raised to the write inhibition voltage Vinh via the wiring line 20.sub.2. Thus, writing on the memory device 10.sub.12 can be prevented. In this writing, the voltage Von is applied to the wiring line 37, so that the transistors 36.sub.1 and 36.sub.2 are put into an on-state, and the sources of the transistors 36.sub.1 and 36.sub.2 are put into an open state. The bit line BL.sub.2 is also put into an open state.

(50) In a case where the memory device 10.sub.11 on which writing has been performed has a higher resistance than a predetermined resistance though the writing has been performed in the above described manner, additional writing is performed. This additional writing is performed by the control circuit 130 (the third circuit and the fourth circuit) via the driver 110. When the additional writing is performed, not only the write voltage is adjusted, but also an erasing operation is performed on the transistor 23.sub.1 having a high-k oxide film as the gate insulating film, so that the amount of the current between the gate and the source or between the gate and the drain of the memory device 10.sub.11 is increased. As a result of this, the threshold voltage of the transistor 23.sub.1 is changed toward the negative direction, or the threshold voltage is lowered, and the amount of the current in the wiring line 20.sub.1 is made larger than that prior to the erasing operation. Referring now to FIG. 6, a method of performing an erasing operation on the transistor 23.sub.1 is described. To perform an erasing operation on the transistor 23.sub.1, 0 V is applied to the source and the drain of the transistor 23.sub.1. When the voltage is applied to the drain of the transistor 23.sub.1, 0 V is applied to the source of the transistor 32.sub.1, so that 0 V is applied to the drain of the transistor 23.sub.1 via the path between the gate and the source or between the gate and the drain of the memory device 10.sub.11. Further, a voltage Vg1 (<0 V) is applied to the gate of the transistor 23.sub.1 via the wiring line 25. Alternatively, the transistor 23.sub.1 may be formed in a different well from that for the memory devices 10.sub.11 through 10.sub.22 and the transistors 36.sub.1 and 36.sub.2, the gate voltage of the transistor 23.sub.1 may be set at 0 V, and a negative voltage Vg1 may be applied to the substrate. In this manner, an erasing operation can be performed on the transistor 23.sub.1.

(51) During the erasing operation on the transistor 23.sub.1, the word line WL.sub.2, the bit line BL.sub.2, and the source of the transistor 36.sub.2 are in an open state, as shown in FIG. 6.

(52) Referring now to FIG. 7, a method of performing additional writing on the memory device 10.sub.11 is described.

(53) The additional writing is performed in the same manner as the writing in the initial state, except for a write voltage Vprg2 to be applied to the bit line BL.sub.1 and a voltage Von2 to be applied to the wiring line 25. The write voltage Vprg2 (Vprg) that is used in this additional writing and is applied to the bit line BL.sub.1, and the voltage Von2 (Von) that is used in this additional writing and is applied to the gate of the transistor 23.sub.1 via the wiring line 25 may be changed depending on the resistance of the memory device 10.sub.11 on which the additional writing is to be performed.

(54) At the time of this additional writing, the bit line BL.sub.2 and the sources of the transistor 36.sub.1 and 36.sub.2 are in an open state, as shown in FIG. 7.

(55) Lastly, the transistor 23.sub.1 is initialized. This initializing operation is performed by the control circuit 130 (the fifth circuit) via the driver 110. Referring now to FIG. 8, a method of applying the voltage for this initialization is described. The reason that the initialization is performed at this stage is to prevent a difference in the threshold voltages of the transistors 23.sub.1 and 23.sub.2 between the column to which the memory device subjected to the additional writing is connected and the column to which the memory device subjected to the additional writing is not connected, and thus, prevent wrong reading of read data. To initialize the transistor 23.sub.1, writing should be performed on the transistor 23.sub.1 on which an erasing operation has been performed. To perform writing on the transistor 23.sub.1, a voltage Vd2 is applied to the word line WL.sub.1 connected to the source of the transistor 23.sub.1, and a voltage Vg2 is applied to the gate. Also, 0 V is applied to the bit line BL.sub.1 connected to the source of the transistor 32.sub.1, so that 0 V is applied to the drain of the transistor 23.sub.1 via the path between the gate and the source or between the gate and the drain of the memory device 10.sub.11. Here, the voltage Vd2 is a positive voltage that is lower than the write voltage Vprg, or Vd2<Vprg. This voltage Vd2 does not cause writing on the memory device 10.sub.11. With this, the threshold voltage of the transistor 23.sub.1 is changed toward the positive direction, or the threshold voltage is increased, so that the threshold voltages of the transistors 23.sub.1 and 23.sub.2 are prevented from varying. During the initialization of the transistor 23.sub.1, the word line WL.sub.2, the bit line BL.sub.2, and the source of the transistor 36.sub.2 are in an open state, as shown in FIG. 8.

(56) As described above, according to the first embodiment, transistors each having a high-k metal gate are used as the transistors 23.sub.1 and 23.sub.2. Thus, it is possible to provide an integrated circuit including a memory that can avoid having a complicated circuit configuration even if additional writing is to be performed. It is also possible to provide a write method.

Second Embodiment

(57) Referring now to FIGS. 9 through 13, an integrated circuit according to a second embodiment is described. The integrated circuit of the second embodiment has the same configuration as the integrated circuit of the first embodiment shown in FIG. 3. That is, the integrated circuit of the second embodiment includes a memory array 100, a driver 110, a verification circuit 120, and a control circuit 130. The memory array 100 includes memory devices arranged in an array, and is connected to the driver 110. The control circuit 130 supplies the driver 110 with a control signal such as a program instruction signal or a memory device address signal. In accordance with the control signal, the driver 110 applies a program voltage to the selected memory device. Also, in accordance with the control signal, the driver 110 may apply a predetermined voltage to the unselected memory devices, or put the potential of an electrode of a certain memory device into a floating state. The verification circuit 120 determines whether the resistance value of the memory device is a desired value (whether the programming has been completed), and supplies the control circuit 130 with information indicating the result of the determination. In accordance with the information from the verification circuit 120, the control circuit 130 transmits a control signal to the driver 110 if necessary.

(58) FIG. 9 shows the memory array 100 of the second embodiment. The memory array 100 of the second embodiment has the same configuration as the memory array 100 of the first embodiment shown in FIG. 4, except that transistors 27.sub.1 and 27.sub.2 are newly added. The source or the drain of each transistor 27.sub.j (j=1, 2) is connected to a wiring line 20.sub.j, and the gate of each transistor 27.sub.j is connected to a wiring line 28.

(59) The transistors 27.sub.1 and 27.sub.2 play an auxiliary role in increasing the amount of current at a time of writing.

(60) In the second embodiment, before normal memory writing and reading are performed, writing is performed on the transistor 23.sub.1 connected to the source and the drain of the memory device 10.sub.11, which is the memory device on which writing is to be performed.

(61) (Write Method)

(62) Referring now to FIGS. 10 through 13, an example case where writing is performed on the memory device 10.sub.11 is described. In FIGS. 10 through 13 for explaining the write method, the inverters 22.sub.1, 22.sub.2, 38.sub.1, and 38.sub.2 are omitted from the memory array 100 shown in FIG. 9, for ease of explanation.

(63) First, FIG. 10 shows the applied voltages in a case where writing is performed on the transistor 23.sub.1. To perform writing on the transistor 23.sub.1, a voltage Vd2 is applied to the word line WL.sub.1 connected to the source of the transistor 23.sub.1, and a voltage Vg2 is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1. Also, 0 V is applied to the source of the transistor 27.sub.1, and a voltage Von to switch on the transistor 27.sub.1 is applied to the gate of the transistor 27.sub.1 via the wiring line 28, so that 0 V is applied to the drain of the transistor 23.sub.1 via the transistor 27.sub.1. As a result of this, writing is performed on the transistor 23.sub.1, and the threshold voltage changes toward the positive direction. Accordingly, as the amount of current flowing via the transistor 23.sub.1 is restricted in advance, the amount of current can be increased through initialization if the value of the resistance of the memory device 10.sub.11 after writing is greater than a predetermined value. At the time of this initialization, the voltage Von is applied to a wiring line 37, to switch on the transistors 36.sub.1 and 36.sub.2. Meanwhile, the bit lines BL.sub.1 and BL.sub.2, a wiring line 33, the drain of the transistor 27.sub.2, and the drain of the transistor 36.sub.2 are put into an open state, and 0 V is applied to the drain of the transistor 36.sub.1.

(64) Next, writing is performed on the memory device. FIG. 11 shows the applied voltages in a case where writing is performed on the memory device in the initial state. The transistors 27.sub.1 and 27.sub.2 are not used in the write method described below with reference to FIGS. 11 through 13, and therefore, the transistors 27.sub.1 and 27.sub.2 are not shown in FIGS. 11 through 13.

(65) As a write voltage Vprg is applied to the gate of the memory device 10.sub.11 to be subjected to writing, a voltage of 0 V is applied to the wiring line 33 connected to the gate of the transistor 32.sub.1, for example, so that the transistor 32.sub.1 is put into an on-state, and the write voltage Vprg is applied to the bit line BL.sub.1 connected to the source of the transistor 32.sub.1. Meanwhile, the voltage Von to switch on the transistor 23.sub.1 is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1, and a voltage of 0 V is further applied to the word line WL.sub.1 connected to the source of the transistor 23.sub.1, so that the potential of the wiring line 20.sub.1 to which the source and the drain of the memory device 10.sub.11 are connected becomes 0 V.

(66) Meanwhile, a write inhibition voltage Vinh is applied to the word line WL.sub.2 via the transistor 23.sub.2 so that no writing is performed on the memory device 10.sub.12. As a result of this, the potentials of the source and the drain of the memory device 10.sub.12 are raised. Thus, writing on the memory device 10.sub.12 can be prevented even if the write voltage is also applied to the gate of the memory device 10.sub.12. In a case where writing is performed on the memory device 10.sub.11, Von is applied to the wiring line 37 to switch on the transistors 36.sub.1 and 36.sub.2, and 0 V is applied to the source of the transistor 36.sub.1. Meanwhile, the bit line BL.sub.2 and the source of the transistor 36.sub.2 are put into an open state.

(67) In a case where the memory device 10.sub.11 on which writing has been performed has a higher resistance than a predetermined resistance though the writing has been performed in the above described manner, additional writing is performed. At the time of additional writing, not only the write voltage is adjusted, but also the amount of the current between the gate and source or between the gate and the drain of the memory device 10.sub.11, which is the memory device to be subjected to writing, is increased. Therefore, initialization is performed on the transistor 23.sub.1 on which writing has been performed, so that the threshold voltage is changed toward the negative direction, and the value of the current in the wiring line 20.sub.1 is made greater than that prior to the initialization. Referring now to FIG. 12, a method of performing erasing on the transistor 23.sub.1 is described. FIG. 12 is a diagram showing the applied voltages in a case where erasing is performed on the transistor 23.sub.1.

(68) To perform erasing on the transistor 23.sub.1, 0 V is applied to the source and the drain of the transistor 23.sub.1. Here, 0 V is applied to the bit line BL.sub.1 connected to the source of the transistor 32.sub.1, so that 0 V is applied to the drain of the transistor 23.sub.1 via the path between the gate and the source or between the gate and the drain of the memory device 10.sub.11. Further, a voltage Vg1 (<0 V) is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1, as shown in FIG. 12. Alternatively, the transistors 23.sub.1 and 23.sub.2 may be formed in a different well from that for the memory devices 10.sub.11 through 10.sub.22 and the transistors 36.sub.1 and 36.sub.2, the gate voltage of the transistor 23.sub.1 may be set at 0 V, and a negative voltage Vg1 may be applied to the substrate. In this manner, erasing (initialization) can be performed on the transistor 23.sub.1. In the erasing operation illustrated in FIG. 12, 0 V is applied to the wiring line 33, so that the transistors 32.sub.1 and 32.sub.2 are switched on. Further, the voltage Von is applied to the wiring line 37, so that the transistors 36.sub.1 and 36.sub.2 are switched on. The voltage of 0V is applied to the bit line BL.sub.1 and the drain of the transistor 36.sub.1, and the bit line BL.sub.2 and the drain of the transistor 36.sub.2 are in an open state.

(69) Lastly, additional writing is performed on the memory device 10.sub.11. Referring now to FIG. 13, a method of performing the additional writing is described. FIG. 13 is a diagram showing the applied voltages in a case where additional writing is performed on the memory device 10.sub.11. The additional writing is performed in the same manner as the writing in the initial state, except for a write voltage Vprg2 to be applied to the bit line BL.sub.1 and a voltage Von2 to be applied to the wiring line 25. The write voltage Vprg2 Vprg) that is used in this additional writing and is applied to the bit line BL.sub.1, and the voltage Von2 (Von) that is used in this additional writing and is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1 may be changed depending on the resistance of the memory device 10.sub.11 on which the additional writing is to be performed.

(70) At the time of this additional writing, the bit line BL.sub.2 and the sources of the transistor 36.sub.1 and 36.sub.2 are in an open state, as shown in FIG. 13.

(71) In a case where the decrease in the resistance of the memory device on the memory device 10.sub.11, which is the memory device on which writing has been performed, is insufficient though the additional writing has been performed, the erasing operation of the first embodiment shown in FIG. 6 may be additionally performed to further increase the amount of current.

(72) As described above, according to the second embodiment, transistors each having a high-k metal gate are used as the transistors 23.sub.1 and 23.sub.2. Thus, it is possible to provide an integrated circuit including a memory that can avoid having a complicated circuit configuration even if additional writing is to be performed. It is also possible to provide a write method.

Third Embodiment

(73) In both the first embodiment and the second embodiment, the memory devices are OTP memory devices as described above. However, the same effects as above can be achieved even if the memory devices are replaced with resistive change memory devices.

(74) Such a configuration is described below as a third embodiment.

(75) Referring now to FIGS. 14 through 19, an integrated circuit according to a third embodiment is described. The integrated circuit of the third embodiment has the same configuration as the integrated circuit of the second embodiment, except that the memory devices constituting a memory array are resistive change memory devices.

(76) FIG. 14 shows the memory array of the third embodiment. The memory array 100A of the third embodiment has the same configuration as the memory array 100 of the second embodiment shown in FIG. 9, except that the memory devices 10.sub.11 through 10.sub.22 are replaced with memory devices 10A.sub.11 through 10A.sub.22. Each memory device 10A.sub.ij (i, j=1, 2) is a resistive change memory device shown in FIG. 15, and this resistive change memory device 10A includes an electrode 11, an electrode 12, and a resistive change layer 13 interposed between the electrode 11 and the electrode 12. The electrodes 11 and 12 function as terminals of the resistive change memory device 10A.

(77) Writing in the resistive change memory device 10A is switching the resistance between the electrode 11 and the electrode 12 from a high-resistance state to a low-resistance state by applying a write voltage between the electrode 11 and the electrode 12, and is also called a setting operation. On the other hand, switching the resistance between the electrode 11 and the electrode 12 from a low-resistance state to a high-resistance state by applying a reset voltage between the electrode 11 and the electrode 12 is called a resetting operation. Each memory device 10A.sub.ij (i, j=1, 2) is the resistive change memory device shown in FIG. 15. One terminal between the electrode 11 and the electrode 12 of the resistive change memory device 10A.sub.ij (i, j=1, 2) is connected to a wiring line 20.sub.j, and the other terminal is connected to a wiring line 30.sub.i.

(78) In the third embodiment, after writing is performed on the memory device to be subjected to writing, which is the memory device 10A.sub.11, information is read from the memory device 10A.sub.11. If the resistance value of the memory device 10A.sub.11 becomes equal to or greater than a predetermined resistance value, additional writing is performed on the memory device 10A.sub.11. An erasing operation is then performed on the transistor 23.sub.1, which serves as a path through which the additional writing is to be performed. Through this erasing operation, the threshold voltage of the transistor 23.sub.1 changes toward the negative direction.

(79) This erasing operation is performed on the transistor 23.sub.1 to apply the same gate current as that at the time of writing. After that, writing is again performed on the memory device 10A.sub.11, and writing is performed on the transistor 23.sub.1, to return the transistor 23.sub.1 to the initial state. As the writing is performed on the transistor 23.sub.1, the threshold voltage of the transistor 23.sub.1 changes toward the positive direction.

(80) Referring now to FIGS. 16 through 19, a series of procedures from writing to additional writing to be performed on a memory device are described in detail. In FIGS. 16 through 19, the inverters 22.sub.1, 22.sub.2, 38.sub.1, and 38.sub.2 shown in FIG. 14 are not shown.

(81) FIG. 16 illustrates writing on the memory device 10A.sub.11 in the initial state.

(82) As a write voltage Vprg is applied to the gate of the memory device 10A.sub.11 to be subjected to writing, a voltage, such as 0 V, is applied to the wiring line 33 connected to the gate of the transistor 32.sub.1 so that the transistor 32.sub.1 is put into an on-state, and the write voltage Vprg is also applied to the bit line BL.sub.1 connected to the source of the transistor 32.sub.1. As a result of this, the write voltage Vprg is applied to the electrode of the memory device 10A.sub.11 at the side connected to the wiring line 30.sub.1. Further, a voltage Von is applied to a wiring line 25 to switch on the transistor 23.sub.1, and 0 V is applied to the word line W1.sub.4, so that 0 V is applied to the electrode of the memory device 10A.sub.11 at the side connected to the wiring line 20.sub.1.

(83) Meanwhile, a write inhibition voltage Vinh is applied to the word line WL.sub.2, and the voltage Vinh is applied to the wiring line 20.sub.2 via the transistor 23.sub.2 so that no writing is performed on the memory device 10A.sub.12. As a result of this, the potential of the wiring line 20.sub.2 is raised. Thus, writing on the memory device 10A.sub.12 can be prevented even if the write voltage Vprg is applied to the electrode of the memory device 10A.sub.12 at the side connected to the wiring line 30.sub.1. When writing is performed on the memory device 10A.sub.11, a voltage Voff (0 V, for example) is applied to a wiring line 28 to which the gates of the transistor 27.sub.1 and the transistor 27.sub.2 are connected, so that the transistor 27.sub.1 and the transistor 27.sub.2 connected to the drain of the transistor 23.sub.1 via the wiring line 20.sub.1 are both switched off. At the time of the writing, the transistors 36.sub.1 and 36.sub.2 are switched on as the voltage Von is applied to a wiring line 37. However, the sources of the transistors 36.sub.1 and 36.sub.2 are in an open state, and the bit line BL.sub.2 is also in an open state. Also, the voltage Voff is applied to the wiring line 28, so that the transistors 27.sub.1 and 27.sub.2 are put into an off-state.

(84) In a case where the verification circuit 120 shown in FIG. 3 determines that the resistance read from the memory device 10A.sub.11 on which the above writing has been performed is higher than a predetermined resistance, additional writing is performed. At the time of this additional writing, not only the write voltage is adjusted, but also the amount of current between the electrode connected to the wiring line 30.sub.1 and the electrode connected to the wiring line 20.sub.1 is increased in the memory device 10A.sub.11 on which the additional writing is to be performed. To achieve this, an erasing operation is performed on the transistor 23.sub.1 having an insulating film formed with a high-k oxide film, so that the threshold voltage of the transistor 23.sub.1 is changed toward the negative direction. In this manner, the value of the current in the wiring line 20.sub.1 is made greater than that prior to the erasing operation.

(85) Referring now to FIG. 17, a method of performing an erasing operation on the transistor 23.sub.1 is described. FIG. 17 is a diagram showing the applied voltages in a case where an erasing operation is performed on the transistor 23.sub.1.

(86) To perform an erasing operation on the transistor 23.sub.1, 0 V is applied to the wiring line 20.sub.1 and the wiring line 30.sub.1 connected to the transistor 23.sub.1. In the voltage application to the wiring line 30.sub.1, 0 V is applied to the bit line BL.sub.1 connected to the source of the transistor 32.sub.1, the voltage Von is further applied to the wiring line 28 to switch on the transistor 27.sub.1, and 0 V is applied to the source of the transistor 27.sub.1. As a result of this, in the memory device 10A.sub.11 on which writing has been performed, the potentials of the two electrodes are maintained at 0 V, and 0 V can be applied to the word line WL.sub.1 connected to the source of the transistor 23.sub.1 while the written information is kept. In addition to that, a voltage Vg1 (<0 V) is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1. Alternatively, the transistor 23.sub.1 may be formed in a different well from that for the transistors 36.sub.1 and 36.sub.2, the gate voltage of the transistor 23.sub.1 may be set at 0 V, and a negative voltage Vg1 may be applied to the substrate. In this manner, an erasing operation on the transistor 23.sub.1 can be performed. Even if a potential difference is generated between the two electrodes of the memory device 10A.sub.11, and the memory information is reset, writing can be performed at the time of additional writing, with the amount of current being larger than that at the first writing. Thus, the written information is not modified, and wrong writing is not performed. Even if the memory device 10A.sub.11 is reset, 0 V is applied to the wiring line 20.sub.1 connected to the drain of the transistor 23.sub.1 via the transistor 27.sub.1, so that an erasing operation can be performed on the transistor 23.sub.1. During the erasing operation, the voltage Von is applied to the wiring line 37, so that the transistors 36.sub.1 and 36.sub.2 are switched on. The sources of the transistors 36.sub.1 and 36.sub.2, the source of the transistor 27.sub.2, the word line WL.sub.2, and the bit line BL.sub.2 are put into in an open state.

(87) Referring now to FIG. 18, a method of performing additional writing on the memory device 10A.sub.11 is described. FIG. 18 is a diagram showing the applied voltages in a case where additional writing is performed on the memory device 10A.sub.11. The additional writing is performed in the same manner as the writing in the initial state, except for a write voltage Vprg2 to be applied to the bit line BL.sub.1 and a voltage Von2 to be applied to the wiring line 25. The write voltage Vprg2 (Vprg) that is used in this additional writing and is applied to the bit line BL.sub.1, and the voltage Von2 (Von) that is used in this additional writing and is applied to the wiring line 25 connected to the gate of the transistor 23.sub.1 may be changed depending on the resistance of the memory device 10A.sub.11 on which the additional writing is to be performed. At the time of this additional writing, the bit line BL.sub.2 and the sources of the transistor 36.sub.1 and 36.sub.2 are in an open state, as shown in FIG. 18.

(88) Lastly, the transistor 23.sub.1 is initialized, and the applied voltages at this stage are shown in FIG. 19. The reason that the initialization is performed at this stage is to prevent a difference in the threshold voltages of the transistors 23.sub.1 and 23.sub.2 between the column to which the memory device subjected to the additional writing belongs and the column to which the memory device subjected to the additional writing does not belong, and thus, prevent wrong reading of read data. In the initialization of the transistor 23.sub.1, an erasing operation has been performed on the transistor 23.sub.1, and writing should be performed on the transistor 23.sub.1 subjected to the erasing operation.

(89) To perform writing on the transistor 23.sub.1, a voltage Vd2 is applied to the word line WL.sub.1 connected to the source of the transistor 23.sub.1, and a voltage Vg2 is applied to the wiring line 25 connected to the gate. In the voltage application to the wiring line 20.sub.1 connected to the drain, 0 V is applied to the wiring line 33 to switch on the transistor 32.sub.1, and 0 V is also applied to the bit line BL.sub.1 connected to the source. Further, the voltage Von is applied to the wiring line 28 to switch on the transistor 27.sub.1, and 0 V is applied to the source of the transistor 27.sub.1, so that the potentials of the two electrodes of the memory device 10A.sub.11 on which writing is to be performed are maintained at 0 V, and 0 V can be applied to the wiring line 20.sub.1 connected to the source of the transistor 23.sub.1 while the written information is kept. Here, the voltage Vd2 is a positive voltage that is lower than the write voltage Vprg for the memory device, or Vd2<Vprg. With the voltage Vd2, no writing is performed on the memory device 10A.sub.11. At the time of the initialization of the transistor 23.sub.1, the voltage Von is applied to the wiring line 37, to switch on the transistors 36.sub.1 and 36.sub.2. A voltage of 0 V is applied to the source of the transistor 36.sub.1, while the source of the transistor 36.sub.2 is put into an open state. The word line WL.sub.2, the bit line BL.sub.2, and the source of the transistor 27.sub.2 are put into in an open state.

(90) As described above, according to the third embodiment, transistors each having a high-k metal gate are used as the transistors 23.sub.1 and 23.sub.2. Thus, it is possible to provide an integrated circuit including a memory that can avoid having a complicated circuit configuration even if additional writing is to be performed. It is also possible to provide a write method.

(91) While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.