TRANSPORT UNIT FOR TRANSPORTING PRINTED CIRCUIT BOARDS, AND SOLDERING SYSTEM
20220362893 · 2022-11-17
Assignee
Inventors
- Ruppert Elmar (Mespelbrunn, DE)
- Thomas Huhler (Neubrunn, DE)
- Benedict Fleischmann (Neubrunn, DE)
- Simon Hame (Kreuzwertheim, DE)
Cpc classification
B23K1/0016
PERFORMING OPERATIONS; TRANSPORTING
H05K13/0061
ELECTRICITY
International classification
B23K37/04
PERFORMING OPERATIONS; TRANSPORTING
B23K1/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.
Claims
1. A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, wherein a base part is provided with an output shaft that can be driven, characterized in that at least two output gears which are rotatably coupled to the output shaft are provided, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive gear in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive gear, and which act on the printed circuit board to transport the printed circuit board through the zone, in that, when the drive parts are fastened to the base part, each of the output gears is in engagement with the associated drive gear, and in that receiving parts which extend in the direction of transport are provided on the base part for receiving and for releasably fastening the drive parts, wherein the receiving parts each have the output gear which can be brought into engagement with the drive gear and which can be driven by the output shaft.
2. The transport unit according to claim 1, characterized in that the drive parts have a plurality of drive rollers arranged one behind the other in the direction of transport, wherein adjacent drive rollers are rotatably coupled to one another via gears, and wherein at least one gear is rotatably coupled to the drive gear.
3. The transport unit according to claim 1, characterized in that the base part is designed in the manner of a frame, with two side parts extending in the direction of transport, and with two struts extending in the transverse direction, running transverse to the direction of transport.
4. The transport unit according to claim 3, characterized in that the arrangement is such that the frame can be releasably and removably arranged in the soldering system.
5. The transport unit according to claim 3, characterized in that the output shaft extends in the transverse direction and is arranged in a rotatably mounted manner on the two side parts.
6. The transport unit according to claim 3, characterized in that at least one receiving part is arranged in a manner allowing movement and adjustment on the struts in the transverse direction.
7. The transport unit according to claim 6, characterized in that the receiving parts each provide a coupling gear which is rotatably coupled to the output gear and to the output shaft, and which is arranged on the output shaft in a manner allowing axial displacement.
8. The transport unit according to claim 6, characterized in that at least one adjusting shaft is provided, which extends in the transverse direction and which is coupled to at least one receiving part in such a manner that the receiving part can be displaced in the transverse direction by the rotation of the adjusting shaft.
9. The transport unit according to claim 1, characterized in that two edge receiving parts are provided, each for receiving one edge drive part, wherein the drive rollers of one edge drive part face the drive rollers of the other edge drive part, and are arranged in such a manner that, when the transport unit is in operation, the printed circuit board rests, in the region of its free longitudinal edges, on the drive rollers.
10. The transport unit according to claim 9, characterized in that longitudinal guides for guiding the printed circuit boards in the direction of transport are provided on the edge drive parts.
11. The transport unit according to claim 9, characterized in that at least one center receiving part for the purpose of receiving a center drive part is provided between the edge receiving parts.
12. The transport unit according to claim 11, characterized in that the transport unit has two transport tracks running in the direction of transport, wherein at least one of two edge receiving parts and one center receiving part is provided for each transport track.
13. A soldering system for continuous soldering of printed circuit boards in a process channel along a direction of transport, wherein at least one preheating zone at least one soldering zone, and at least one cooling zone are provided in the process channel, wherein a pressure chamber is provided in the soldering zone, which has a base part and has a cover part which can be lifted relative to the base part during operation of the reflow soldering system, characterized in that a transport unit for transporting the printed circuit boards along the direction of transport within the at least one zone of a soldering system is provided at least in one of the zones and/or in the pressure chamber, wherein the base part is provided with an output shaft that can be driven, characterized in that at least two output gears which are rotatably coupled to the output shaft are provided, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive gear in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive gear, and which act on the printed circuit board to transport the printed circuit board through the zone, in that, when the drive parts are fastened to the base part, each of the output gears is in engagement with the associated drive gear, and in that receiving parts which extend in the direction of transport are provided on the base part for receiving and for releasably fastening the drive parts, wherein the receiving parts each have the output gear which can be brought into engagement with the drive gear and which can be driven by the output shaft.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In the drawings:
[0025]
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
DETAILED DESCRIPTION
[0032]
[0033] A preheating zone 20, a soldering zone 22, and a cooling zone 24 are provided in the process channel 16. In the case of the reflow soldering system 10 shown in
[0034] As is clear from
[0035] The item to be soldered, that is, the printed circuit board configured with solder paste and fitted with electronic components, is first heated in the preheating zone 20 to a temperature which is below the melting temperature of the solder paste. In the soldering zone 22, the printed circuit board is heated for a specific period to a process temperature which is above the melting point of the solder paste, such that it melts in the soldering zone to solder the electronic components to the printed circuit board. The item being soldered is cooled in the cooling zone 24, such that the liquid solder solidifies before the item being soldered is removed at the exit 14 of the reflow soldering system 10.
[0036] A transport system 34 is provided within the reflow soldering system 10 for transporting the printed circuit boards along the direction of transport 18.
[0037] As is clear from the front view of
[0038] In the soldering zone 22, there is a pressure chamber in the form of a vacuum chamber 40, which is formed by a base part 42—shown in the top view according to
[0039] During operation of the reflow soldering system 10, the cover part can be lifted off the base part 42 by means of a lifting mechanism. It is necessary to lift the cover part in order to be able to move the printed circuit boards into the vacuum chamber 40. As soon as the printed circuit boards are situated in the vacuum chamber 40, the cover part is lowered so that it comes to rest on the base part 42. In a next step, the vacuum chamber 40 is evacuated with a vacuum pump (not shown), such that a suitable negative pressure is created in the vacuum chamber 40. Due to the negative pressure, air which is contained in the liquid solder, in particular, is expelled. After a brief application of negative pressure to the vacuum chamber 40, the cover part is raised via a corresponding activation of the lifting mechanism, such that the printed circuit boards can move out of the vacuum chamber 40. Advantageously, the printed circuit boards move through the vacuum chamber 40 within the described process at a constant speed or at a variable speed.
[0040] In the top view according to
[0041] The transport unit 50, which can be inserted into the pressure chamber 40 and/or into the base part 42 of the pressure chamber 40, is shown in
[0042] The transport unit 50 comprises a base part 66, which is designed like a frame and has two side parts 68 extending in the direction of transport 18, and two struts 70 running in the transverse direction. Also provided on the base part 66 is an output shaft 72 which is rotatably mounted on the side parts 68 and which can be driven at its free end 74 via a rotary drive, which is not shown in detail.
[0043] On the base part 66 between the side parts 68, there is a total of six receiving parts 76 to 81, on which drive parts 86 to 91 are provided which can be releasably fastened and removed.
[0044] Each of the drive parts 86 to 91 has a drive wheel 92, and each of these is in engagement with, in the assembled state, as can be seen in particular from
[0045] Each of the drive parts 86 to 91 also has drive rollers 96 rotatably coupled to the respective associated drive wheels 92, on which drive rollers the printed circuit boards come to rest during operation, and which transport the printed circuit boards through the given zone 18, 20, 22 and/or through the pressure chamber 40. As is also clear from
[0046] As explained in relation to
[0047] The receiving parts 76, 77, 78 and the drive parts 86, 87, 88 of only one transport track 60 are shown in
[0048] The receiving parts 79, 80 and 81 and the associated drive parts 89, 90 and 91, which form the second transport track 60, correspond in structure to the receiving parts 76, 77, 78 and drive parts 86, 87, 88 of the first transport track 60.
[0049] In order to be able to adjust the width of each of the transport tracks 60 and/or the position of the drive parts 86 to 91 in the transverse direction, the receiving parts 78 to 81 are arranged in a manner allowing movement on the struts 70 by means of guide rollers 100. To adjust the receiving parts 76 to 81, two spindle shafts 102 and 104 are provided which are rotatably mounted on the side parts 68 and which can be driven via rotary drives which are not shown in the figures. The spindle shaft 102 is coupled to the edge receiving parts 78 and 81 via spindle nuts 106 to allow movement, such that when the spindle shaft 102 rotates, the two receiving parts 78 and 81, and thus the drive parts 88 and 91, can be adjusted. The spindle shaft 104 is coupled to the center receiving parts 77 and 80 via spindle nuts to allow movement, such that when the spindle shaft 104 is rotated, the receiving parts 77 and 80 and thus the drive parts 87 and 90 can be adjusted in the transverse direction.
[0050] In order to enable the output wheels 94 to be rotatably coupled to the output shaft 72 even when the receiving parts 76 to 81 are being adjusted in the transverse direction, the receiving parts 76 to 81 have coupling wheels 108 rotatably coupled to the output wheels 94, which is particularly clear from
[0051] As is clear from
[0052] As is clear from
[0053] The reflow soldering system 10 described or the drive unit 50 described has the advantage that the individual drive parts 86 to 91 can be exchanged, inspected, serviced and cleaned in a simple manner. Furthermore, the entire transport unit 50 can also be exchanged. The drive parts 86 to 91 described are comparatively robust, since only gears, and no chains or belts, are used. Furthermore, intensive and/or automatic lubrication can also be dispensed with. The embodiment with gears is also significantly less sensitive to contamination in the form of condensate or solder residue. Furthermore, in comparison to conventional chain drives, no chain tensioning device is required.