Microfluidic pump and valve structures and fabrication methods
10119619 ยท 2018-11-06
Assignee
Inventors
Cpc classification
F16K99/0015
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K99/0055
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29K2033/08
PERFORMING OPERATIONS; TRANSPORTING
B01L3/50273
PERFORMING OPERATIONS; TRANSPORTING
B29C66/5412
PERFORMING OPERATIONS; TRANSPORTING
B29C65/4895
PERFORMING OPERATIONS; TRANSPORTING
F16K99/0059
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L2300/0867
PERFORMING OPERATIONS; TRANSPORTING
B29C66/54
PERFORMING OPERATIONS; TRANSPORTING
B01L2400/0487
PERFORMING OPERATIONS; TRANSPORTING
F04B43/028
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y10T137/2218
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T29/49405
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01L2400/084
PERFORMING OPERATIONS; TRANSPORTING
B01L2400/0638
PERFORMING OPERATIONS; TRANSPORTING
F15C1/08
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L2200/12
PERFORMING OPERATIONS; TRANSPORTING
F16K2099/0076
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C66/004
PERFORMING OPERATIONS; TRANSPORTING
B01L3/502707
PERFORMING OPERATIONS; TRANSPORTING
B29C66/71
PERFORMING OPERATIONS; TRANSPORTING
B81B3/0021
PERFORMING OPERATIONS; TRANSPORTING
B01F25/4521
PERFORMING OPERATIONS; TRANSPORTING
B29K2069/00
PERFORMING OPERATIONS; TRANSPORTING
F16K7/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y10T137/2202
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01L2300/0861
PERFORMING OPERATIONS; TRANSPORTING
B01L2400/0481
PERFORMING OPERATIONS; TRANSPORTING
B81B2203/0127
PERFORMING OPERATIONS; TRANSPORTING
B29K2033/08
PERFORMING OPERATIONS; TRANSPORTING
F16K99/0057
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B43/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y10T156/1002
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01L3/502738
PERFORMING OPERATIONS; TRANSPORTING
F16K2099/008
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01F25/451
PERFORMING OPERATIONS; TRANSPORTING
B01F31/65
PERFORMING OPERATIONS; TRANSPORTING
F16K2099/0084
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29L2031/756
PERFORMING OPERATIONS; TRANSPORTING
F16K2099/0094
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29K2033/12
PERFORMING OPERATIONS; TRANSPORTING
B29K2069/00
PERFORMING OPERATIONS; TRANSPORTING
F16K99/0021
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C66/71
PERFORMING OPERATIONS; TRANSPORTING
F16K99/0034
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B81C1/00103
PERFORMING OPERATIONS; TRANSPORTING
F16K2099/0074
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01F2101/2202
PERFORMING OPERATIONS; TRANSPORTING
Y10T137/85978
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
F16K99/0001
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29K2025/00
PERFORMING OPERATIONS; TRANSPORTING
Y10T156/1043
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
F16K2099/0078
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29K2033/12
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/0816
PERFORMING OPERATIONS; TRANSPORTING
Y10T137/212
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01L2400/06
PERFORMING OPERATIONS; TRANSPORTING
International classification
F15C3/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F15C1/08
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K99/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B81B3/00
PERFORMING OPERATIONS; TRANSPORTING
F04B43/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01L3/00
PERFORMING OPERATIONS; TRANSPORTING
F16K7/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B43/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F04B43/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B81C1/00
PERFORMING OPERATIONS; TRANSPORTING
B29C65/48
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.
Claims
1. A microfluidic pump, comprising: only a single, non-elastomeric polymer substrate layer having upper and lower surfaces, wherein the upper surface includes a membrane-bonded region, a first membrane bond-free region, and a second membrane bond-free region, further wherein the first and second bond-free regions are valves; a first inlet/outlet microfluidic channel disposed in the upper surface and having an end that fluidically intersects the first membrane bond-free region/valve; a microfluidic channel disposed in the upper surface and having one end that fluidically intersects the first membrane bond-free region/valve and another end that fluidically intersects the second membrane bond-free region/valve, thereby interconnecting the two valves; a second inlet/outlet microfluidic channel disposed in the upper surface and having an end that fluidically intersects the second membrane bond-free region/valve; and only a single, non-elastomeric polymer membrane layer having a continuous surface, bonded to the membrane-bonded region of the upper surface of the substrate and entirely covering the first and second membrane bond-free regions/valves including the microfluidic channel interconnecting the two valves, wherein at least one of the first and second inlet/outlet microfluidic channels is characterized by having a higher resistance to fluid flow than that of the microfluidic channel interconnecting the two valves, further wherein the microfluidic pump is characterized by an integrated, monolithic construction consisting of the substrate layer and the membrane layer.
2. The microfluidic pump of claim 1, wherein the at least one of the first and second inlet/out microfluidic channels includes non-parallel channel walls.
3. The microfluidic pump of claim 1, wherein the at least one of the first and second inlet/out microfluidic channels includes at least one curved section.
4. The microfluidic pump of claim 1, wherein the at least one of the first and second inlet/out microfluidic channels includes at least a portion of which has a non-uniform channel width.
5. The microfluidic pump of claim 1, further comprising: at least a third membrane bond-free region; a respective at least a third inlet/out microfluidic channel disposed in the upper surface and having an end that fluidically intersects the at least the third membrane bond-free region/valve; and a respective at least a second microfluidic channel disposed in the upper surface and having one end that fluidically intersects the first membrane bond-free region/valve and another end that fluidically intersects the at least the third membrane bond-free region/valve, thereby interconnecting the two valves.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
(27)
DETAILED DESCRIPTION OF THE INVENTION
(28) As used herein, the word microstructure generally refers to structural features on a microfluidic substrate component with walls having at least one dimension in the range of about 0.1 micrometer to about 1000 micrometers. These features may be, but are not limited to, microchannels, microfluidic pathways, microreservoirs, microvalves or microfilters. The term polymeric refers generally to a macromolecular structure or material having a molecular weight that is substantially higher than the constituent monomers and, which may be, but does not have to be, produced by a polymerization reaction. All materials commonly and herein referred to as plastic materials include polymeric materials. The term acrylic refers to materials including Acrylite, Plexiglas, PMMA and other trade names of polymethylmethacrylate. Linear polymeric materials generally include polymeric materials in which molecules form long chains without branches or cross-linked structures. A two-dimensional microfluidic network refers to fluidic connectivity of at least two microfluidic pathways or channels that co-exist within the plane of the component. A three-dimensional microfluidic network refers to fluidic connectivity of at least three microfluidic pathways or channels arranged in such a way that at least one of the three channels is out of the plane of the component. The term of weak solvent as used herein refers to an organic solvent capable of forming a bonded interface between two mating surfaces under appropriate temperature (i.e. due to heat) and force (i.e., due to pressure, vacuum and/or mass) conditions but having little or substantially no bonding effect otherwise, such as in room temperature and ambient force conditions. The term inert solvent generally refers to a solvent that is miscible with the weak solvent but having no bonding capability alone. The term solvent bonding generally refers to a bonding process in which a solvent is used to physically bond two surfaces together. The term weak solvent bonding generally refers to a solvent bonding process in which a weak solvent is used.
(29) Some embodiments of the invention are based on the surprising discovery by the inventors that when a weak solvent bonding agent is used as a lamination solvent to join non-elastomeric polymers such as polystyrene, polycarbonate, acrylic or other linear polymers under mild conditions, microstructures disposed on the substrate are not adversely affected. This discovery enables practical and economical fabrication of prototype as well as production fabrication of laminated, polymeric microfluidic structures. A further realization, is that certain plastic materials, such as but not limited to polystyrene, are reasonably rigid but under certain applications, provide a deformable diaphragm that may be employed in a fluidic component, such as a pump or valve.
(30) According to an aspect, the weak solvent bonding agent may be chemically defined as:
(31) ##STR00001##
where, R1=H, OH or R, where R=alkyl, or is absent, R2=H, OH or R, where R=alkyl, or is absent, and R2=H, OH or R, where R=alkyl, or is absent.
(32) Alternatively, the weak solvent may have a chemical formula of:
(33) ##STR00002##
where R1=H, OH or R, where R=alkyl, or is absent, and R2=H, OH or R, where R=alkyl, or is absent.
(34) Alternatively, the weak solvent may have a chemical formula of:
(35) ##STR00003##
where R1=H, OH or R, where R=alkyl, or is absent.
(36) In a particular aspect, the weak solvent bonding agent is acetonitrile. Acetonitrile is a versatile solvent that is widely used in analytical chemistry and other applications. It is 100% miscible with water and exhibits excellent optical properties. Acetonitrile has a favorable dielectric constant, solubility parameters and low hydrogen bonding ability, which make it a useful solvent for protein and DNA sequencing. Acetonitrile, however, is not typically a solvent of choice for organic synthesis due to its limited solubility to many organic molecules. Compared to many ketones, halogenated hydrocarbons, ether or aromatic molecules, acetonitrile is understood to have very limited ability to swell polymeric materials. As such, acetonitrile is referred to herein as a weak solvent. Since it is used as a bonding agent in the various embodiments of the invention described in detail below, it represents an exemplary weak solvent bonding agent for laminating polymeric microfluidic structures. Thus, the weak ability of acetonitrile to dissolve a plastic surface makes it highly suitable for laminating polymeric materials such as polystyrene, polycarbonate, acrylic and other linear polymers. For example, microstructures disposed on a polystyrene substrate that was treated with acetonitrile at room temperature for at least several minutes did not exhibit any noticeable feature damage. Acrylic and polycarbonate have been observed to be more susceptible than polystyrene to acetonitrile, but this increased susceptibility can be controlled by applying the acetonitrile at a lower temperature or, alternatively, by using a combination of acetonitrile and other inert solvents.
(37) An apparently unique feature of acetonitrile lamination is that this weak solvent has remarkably different solubility strengths at different temperatures when used in relation to polymeric components of microfluidic structures according to embodiments of the invention. Although it is well known that the solubility of most inorganic or organic substances increases as the temperature of the applied solvent rises, utilizing this solubility variation at different temperature for controlled microfluidic structure solvent lamination requires a fine operating window. The substrate must be able to withstand solvent treatment at room temperature while increasing its solubility sufficiently at elevated temperature and pressure. Acetonitrile used as a laminated microfluidic structure bonding agent provides the required operating range in contrast to all currently known strong organic solvents that are generally used for solvent lamination.
(38) A beneficial aspect of acetonitrile-bonded lamination is that the process according to an embodiment of the invention allows substrate alignment for structures containing multi-component layers or fluid networks constructed utilizing both a cover plate and a base plate. Unlike conventional strong solvent lamination, which tends to penetrate the polymeric substrate surface aggressively and create a tacky bonding surface within seconds of solvent application, acetonitrile at room temperature exhibits a very weak power to soften the substrate upon application. When the acetonitrile is present between the mated surfaces, at lower temperature prior to thermal activation, it functions similar to a lubricant and allows the adjacently contacted surfaces to slide freely against each other. Upon thermal activation of the acetonitrile and application of pressure, the mated surfaces form a substantially irreversible bond.
(39) Formation of three-dimensional fluid networks is important for many microfluidic applications. Similar to the two-dimensional printed circuit board (PCB) case in which the printed wires cannot cross each other without electric connectivity, fluidic channels or pathways also cannot typically cross each other without fluidic connectivity. To build a simple crossover structure in a microfluidic chip, the fluid channels are typically located at different layers at the crossover section and joined by vertical fluid pathways to complete the fluid network. Solvent bonding provides a bond between the layers that does not impede fluid egress through the vertical connecting structures.
(40) In the case where the microstructure(s) in a component is small, e.g., having a depth on the order of about 5 m or less, and the planar width of the pattern is large, e.g., 1 mm or more, and in addition the enclosing component is a thin film having a thickness of about 200 m or less, the lamination force applied to the component pair may cause the upper component to impinge upon and bond to the lower component causing blockage of the pathway. One way to prevent this problem is to control the presence of bonding agent in the microstructure(s). If the applied bonding agent is not present in the pathway during thermal activation, the upper component will not bond to the pathway of the lower component. The upper component will lift back to its intended position when the assembly returns to room temperature.
(41) There are a number of ways in which the acetonitrile bonding agent can be manipulated to allow lamination of two components without deforming the enclosed microstructure(s). When the base component containing the microstructure(s) is brought into contact with the cover component, the space between the two components may typically be on the order of about 50 to 100 nm, which is much less than the depth of the microstructures, i.e., about 1 m or more. It is well known that the capillary force of a liquid is indirectly proportional to the width of the gap the liquid is filling. Thus there will be a higher capillary force in the area to be bonded than in the microstructure(s). This phenomenon can be exploited to contain the weak solvent only to the areas of the structure intended for bonding. As previously mentioned, the two substrates can be sprayed with solvent and then contacted. The solvent will generally completely fill the void between the substrates, including the microstructures. The solvent can subsequently be suctioned from the microstructures leaving the solvent to remain only in the areas between the substrates that are intended for bonding to occur. Alternatively, if the opposing surfaces of the substrates are contacted prior to solvent exposure, the solvent can then be introduced to the exposed edge of the contacted components. The solvent will wick into the area where the components are in contact while the microstructures remain solvent-free.
(42) As disclosed above, the acetonitrile bonding agent may require thermal activation to create a bond between the polymeric components. The heating can be provided in a number of ways. When the heat is applied to the components by positioning them on a heat source, the heat must be conducted through the components to the bonding interface. This method, while simple, may not be amenable for applications where the substrate is bulky or there are fine structures sensitive to the solvent treatment under thermally activated conditions. Another method that provides the necessary energy at the bonding interface without significantly heating the substrate components is referred to herein as solvent-assisted microwave bonding. In this method the substrate components are prepared for bonding as previously disclosed. However, instead of conventional heating the bulk structure by contacting a high temperature source, the assembled component pair is exposed to microwave energy. The microwaves energy is predominately absorbed by the polar solvent molecules without affecting the bulk plastic component structure, thus heating the bonding interface without bulk heating of the substrates. This method is particularly useful in situations where the heating area needs to be surface restricted. Alternatively, the structure to be bonded or laminated by the weak solvent bonding agent may be cooled prior to weak solvent application. Specifically, acetonitrile solvent lamination and bonding can be used to fabricate diaphragms that can be used as valve and pump structures.
(43) Turning now to
(44) The membrane 50 may be substantially rigid, in that it is substantially inelastic but may be deformed under appropriate pressure or force. By way of example, the membrane may have a Young's modulus of between about 2 Gpa and about 4 Gpa, although in other applications the Young's modulus may be different. In particular, the material may be selected or fabricated to have a Young's modulus that is suitable for the particular application and/or device being developed. For example, a material may be chosen to have an appropriate Young's modulus, which may depend on the size of microfeatures that exist under the membrane 50 or other device properties. The membrane 50 may have a thickness suitable for allowing deformation upon application of a mechanical force or pressure. The mechanical pressure/force may be applied by physically contacting the membrane 50 and pushing it towards the substrate 52 or pulling it away from the substrate 52. Alternately, the mechanical pressure may be applied by a pneumatic pressure or hydraulic pressure pushing the membrane towards the substrate 52 or pulling it away from the substrate 52. The amount of force or pressure used may depend on the particular application and device being developed. Deformation includes changing the shape of the membrane 50 from a substantially planar configuration to any substantially non-planar configuration. The membrane 50 may have a thickness of between about 10 m and about 150 m. In preferred embodiments, the membrane 50 has a thickness of between about 15 m and about 75 m. The substrate may have a thickness greater than the thickness of the membrane. Alternately, the substrate may have a thickness substantially similar to the thickness of the membrane. The membrane 50 may be sized such that it can be deformed upon application of a pressure between 14 and 50 psi, a negative pressure of between about 3 psi and about 14 psi, or a positive pressure of between about 3 psi and about 25 psi. In the depicted embodiment, a negative pressure is applied above the membrane to deform the membrane away from the substrate, but a positive pressure may also be applied above the membrane to deform or push the membrane towards the substrate.
(45) The structure is fabricated by selectively bonding specific areas 20 of an interface between two sheets of material leaving an unbonded region of the membrane, or diaphragm, 15, as shown in
(46) As illustrated in
(47)
(48) A membrane 66 is selectively bonded to the substrate 60 in substantially all areas 74 outside the unbonded diaphragm area 68. When pressure or force is applied to the membrane 66 normal to the substrate 60 surface to push the membrane towards the substrate, the membrane 66 makes conformal contact with the valve seat area 72 effectively closing communication between the two microchannels 62 and 64, thereby sealing microchannels 62 and 64. Alternately, the membrane does not need to be pushed to form the seal. Instead, when the membrane is in a relaxed state, its weight and rigidity may be sufficient to form an effective seal between the two microchannels 62 and 64. As shown in
(49) If the membrane 66 is actuated away from the substrate 60 over the valve seat area 72, the membrane may deform into an actuated state, forming a blister 70 over the unbonded diaphragm area 68 and thus forming an open volume between the two microchannels 62 and 64 and allowing fluid to pass from one to the other. As illustrated in
(50) This valve structure is described as planar because the valve seat area 72 is substantially coplanar with the bonded interface 74 that defines the unbonded diaphragm area 68. This process yields a valve structure that is very simple to produce and integrate into more complex microfluidic systems. However, it is very difficult to produce using other lamination practices. For example, if an adhesive lamination procedure were attempted, there are two difficulties with the structure. The adhesive would have some thickness. If it was interposed between the membrane layer 66 and the substrate 60 it will adhere the membrane 66 to the valve seat 72 resulting in an inoperable valve. If the adhesive is selectively removed from the valve seat area 72, a gap results causing leakage. The only option is to replace the adhesive in the valve seat 72 area with another material matching (or slightly exceeding) the adhesive's thickness. This is an extremely difficult process to complete.
(51) Acetonitrile lamination does not suffer from this limitation. One need only assure that the membrane 66 does not bond to the valve seat 72. With an active valve this can be accomplished by physically separating the membrane out of the bonding plane. Alternatively, the surface of the membrane 66 or the valve seat 72 could be treated to prevent bonding. Pretreatments of this type may prevent the valve structure from sealing closed during lamination.
(52)
(53)
(54) In the embodiment of
(55) We now discuss microfluidic pump structures consistent with the described system and methods. A microfluidic pump generally refers to any structure or group of structures capable of applying pressure to a fluid, and/or facilitating the flow of fluid in one or more desired directions in a microfluidic device. A number of the valve structures 202 can be placed in series and interconnected by microchannels to form a micro diaphragm pump 200 as shown in
(56)
(57) In
(58) Those skilled in the art will recognize that alternate sequences of states may produce a pumping effect. An alternate exemplary pumping sequence, sometimes referred to as a peristaltic sequence, is as follows: Inlet valve 302 is opened, drive valve 304 is opened, outlet valve 306 is opened, inlet valve 302 is closed, drive valve 304 is closed, outlet valve 306 is closed. Drive valve 306 may be opened at substantially the same time as inlet valve 302 is closed.
(59) In the embodiment of
(60)
(61) Not all of the pump structures need to have independently defined inlet valve, drive valve, and outlet valve structures. A number of pumps can share one or more valves. A shared valve refers to a valve configured such that it may be used in pumping processes by more than one pump structure.
(62)
(63)
(64) Turning to
(65) If the reservoir features are large enough, for example having a height, length, and width each greater than about 0.5 mm, then the force of gravity may play a substantial role in the fluid mechanics of the system.
(66) Alternately, the particles 908 may be buoyant and have a tendency to rise or float in the reservoir 902. The fluid may be circulated in a clockwise 911 direction by pump 909 to depress the particles 908 from the top of the reservoir 902.
(67) In other embodiments consistent with the invention, the reservoir 902 may be coupled to fluid extraction means for extracting fluid at different vertical locations along the longitudinal axis 904. By way of example, the fluid extraction means may include a plurality of microchannels, each at a different vertical location along the longitudinal axis 904. The microchannels can connect to microfluidic extraction reservoirs or extraction ports from which the fluid may be extracted. Optionally, each of the microchannels may interconnect with a pump structure to facilitate fluid flow from the reservoir 902 to the extraction reservoirs. If a plurality of immiscible fluids are stored in reservoir 902, a gradient may develop within the reservoir with different concentrations of each of the plurality of fluids at different vertical locations along the longitudinal axis 904. A plurality of fluid extraction means at varying vertical locations coupled to the reservoir may provide a means to extract fluid samples of desired concentration levels from within the stratified layers in reservoir 902.
(68)
(69)
(70) The mixer may be coupled to a controller capable of sequentially activating the reservoir pump chambers/valve structures 1104 and 1106. The controller may include means to individually or collectively actuate any specified combination of the pump chambers while leaving the other pump chambers in a closed or unactuated position. The controller may physically contact, be positioned above, or be positioned below the mixer device. It may actuate the pump chambers/valve structures by applying mechanical force or pressure by means already discussed herein.
(71)
(72) The active valves described above have many advantages. The user is able to independently control the state of each of the valves in a microfluidic system and thus can easily direct fluids through a network or change the direction of flow in a pump system. Another possibility is the use of passive valves. Passive valves require a force from the fluid for actuation.
(73)
(74)
(75) The active valves described have been shown as simple round diaphragms with round valve seats. However, the systems and methods described herein are not so limited.
(76)
(77)
(78)
(79) Membrane layer 1910 includes two independent and actuatable diaphragm structures 1916 and 1920. Membrane layer 1911 includes independent and actuatable diaphragm structure 1911. Other embodiments may include two or more actuatable diaphragm structures. Notably, the pump structure need not include microchannels interconnecting the three actuatable diaphragm structures. Each diaphragm 1916b, 1918b, and 1920b can be actuated via a respective drive chamber 1916a, 1918a, and 1920a. In
(80) The foregoing description of the preferred embodiment of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be limited not by this detailed description but rather by the claims appended hereto.