METHOD FOR TREATING MILLIMETRE AND/OR MICROMETRE AND/OR NANOMETRE STRUCTURES ON A SURFACE OF A SUBSTRATE

Abstract

A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

Claims

1-14. (canceled)

15. A method for treating a substrate, wherein the method comprises: providing a substrate having millimetre and/or micrometre and/or nanometre structures, wherein the structures are produced by an imprinting process, and applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent.

16. The method according to claim 15, wherein the method comprises arranging the at least one protective material as at least one protective layer on the structures, the at least one protective material fully covering the structures.

17. The method according to claim 15, wherein the at least one protective material is applied by centrifugal coating, spray coating, lamination and/or immersion.

18. The method according to claim 15, wherein the method further comprises: chemically and/or physically modifying the at least one protective material after applying the at least one protective material to the structures, the chemical and/or physical modification comprises a curing, an increase in viscosity and/or an increase in elasticity of the at least one protective material.

19. The method according to claim 15, wherein a first protective material and a second protective material are applied to the structures wherein the second protective material is different from the first applied protective material, said first protective material applied directly to the structures and the second protective material applied to the first protective material.

20. The method according to claim 15, wherein a plurality of protective layers materials are respectively applied to the structures as a plurality of protective layers, said plurality of protective layers arranged above one another, wherein each protective material is a different protective material.

21. The method according to claim 15, wherein the at least one protective material comprises one of the following substances or a mixture of the following substances: paraffins and polymers.

22. The method according to claim 21, wherein the polymers are selected from the group consisting of photoresists, poly (methyl methacrylates), poly (methyl glutarimides), phenol formaldehyde resins, epoxies, polyimides, polyamides, silanes, silicons, PDMS (protective film and removal material), PFPE, and acrylates.

23. The method according to claim 22, wherein the epoxy is SU-8.

24. The method according to claim 15, wherein the at least one protective material comprises one of the following substances or a mixture of the following substances: polyvinyl alcohol, polyethers, cellulose ethers, poly (2-ethyl-2-oxazolines), alcohols, sugar, carboxylic acid compounds in plastics, and benzotriazole.

25. The method according to claim 15, wherein the at least one protective material can be dissolved by one of the following solvents or by a solvent mixture of the following solvents: alkanes, alkenes, alkines, aromatics, carboxylic acid esters, ethers, tetramethylsilane, tetrahydrogen chloride, carbon disulfide, benzene, chloroform, and carbon monoxide.

26. The method according to claim 15, wherein the at least one protective material can be dissolved by one of the following solvents or by a solvent mixture of the following solvents: water, alcohols, ketones, amines, lactones, lactams, nitriles, nitro compounds, tertiary carboxylic acid amides, urea derivatives, sulfoxides, sulfones, carbonate esters, acids, formic acid, acetic acid, bases, hydrogen, oxygen, and nitrogen.

27. A facility for treating a substrate, said facility comprising: a) a fixing device for fixing a substrate having millimetre, micrometer, and/or nanometre structures, wherein the structures are produced by am imprinting process; and b) application means for applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent.

28. The facility according to claim 27, wherein the application means includes one or more nozzles and/or an immersion bath.

29. A method for processing a substrate, said method comprising: a) delivering a substrate by use of a delivery unit, the substrate having first and second sides; b) applying and/or arranging, millimetre and/or micrometre and/or nanometre structures on at least one side of the substrate, wherein the structures are produced by an imprinting process; c) applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent; and d) receiving the substrate at a storage unit.

30. The method according to claim 29, wherein the structures are applied to the first and second sides of the substrate.

Description

[0177] Further advantages, features and details of the invention will emerge from the following description of preferred exemplary embodiments and also on the basis of the drawings, in which:

[0178] FIG. 1 shows a first embodiment according to the invention of a product with a protective material on a substrate surface of a wafer,

[0179] FIG. 2 shows a second embodiment according to the invention of a product with a protective material on a substrate surface of a film,

[0180] FIG. 3 shows a first embodiment according to the invention of a product with two protective materials on a substrate surface of a wafer,

[0181] FIG. 4a shows a first process step of an exemplary process according to the invention,

[0182] FIG. 4b shows a second process step of an exemplary process according to the invention,

[0183] FIG. 4c shows a third, optional process step of an exemplary process according to the invention,

[0184] FIG. 4d shows a fourth process step of an exemplary process according to the invention,

[0185] FIG. 4e shows a fifth process step of an exemplary process according to the invention,

[0186] FIG. 4f shows a sixth process step of an exemplary process according to the invention,

[0187] FIG. 4g shows a seventh process step of an exemplary process according to the invention,

[0188] FIG. 5 shows a schematic illustration of a first exemplary roll-to-roll facility according to the invention, and

[0189] FIG. 6 shows a schematic illustration of a second exemplary roll-to-roll facility according to the invention.

[0190] In the drawings, like components or components having the same function are designated by like reference signs.

[0191] FIG. 1 shows a first embodiment according to the invention of a first product 1 according to the invention on a substrate 2, in particular a wafer.

[0192] FIG. 2 shows a second embodiment according to the invention of a second product 1 according to the invention on a substrate 2, in particular a film. A structure 3 worthy of protection, in particular a structured structure, is disposed on the substrate surface 2o of the substrate 2.

[0193] The structure 3 can be constituted by microchips, MEMs, cavities, LEDs, stores, but in particular embossed structures. The structures 3 are coated with a protective material 4 according to the invention.

[0194] FIG. 3 shows a third embodiment according to the invention of a third product 1 according to the invention on a substrate 2, in particular a wafer. A structure 3 worthy of protection, in particular a structured structure, is disposed on the substrate surface 2o of the substrate 2. The structure 3 can be constituted by microchips, MEMs, cavities, LEDs, stores, but in particular embossed structures. The structures 3 are coated with a first protective material 4 according to the invention. A second protective material 4, which in particular is different from the first protective material 4, is disposed above the first protective material 4 according to the invention.

[0195] FIG. 4a shows a substrate 2, in particular a wafer, having a structure 3 worthy of protection, in particular a structured structure, on a first substrate surface 2o1 in a first process step according to the invention. Here, the substrate 2 is preferably fixed on a sample holder 5 via its second substrate surface 2o2 opposite the first substrate surface 2o1. Here, the fixing is provided with the aid of fixing means 6. The fixing means are preferably constituted by a vacuum fixing. Mechanical fixings, electrostatic fixings, magnetic fixings, or fixings by means of adhesive surfaces, which in particular are switchable, are also conceivable. The structures 3, in particular embossed structures, worthy of protection could in particular be processed and produced directly after the fixing of the substrate 2 on the sample holder 5.

[0196] FIG. 4h shows a second process step according to the invention in which a protective material 4 according to the invention is deposited on the structures 3, in particular embossed structures, worthy of protection. The preferred application methods according to the invention are centrifugal coating and/or spray coating.

[0197] FIG. 4c shows a third process step, that is a chemical and/or physical modification of the protective material according to the invention. The chemical and/or physical modification is in particular a curing process.

[0198] After the chemical and/or physical modification, the substrate 2 can be fixed via its cured protective material 4 on the sample holder so that the second substrate surface 2o2 can be processed, if necessary and/or desired.

[0199] As a result of the protection according to the invention of the structures 3 with the aid of the protective material 4, a fixing of the protective material surface 4o to a sample holder 5, in particular the same sample holder as in the previous process steps is therefore possible in accordance with FIG. 4d. The protective material 4 protects the structures 3 against all types of loading which occur on the substrate surface 2o2. These include, for example, etching processes, grinding processes, polishing processes, structuring processes, in particular imprinting processes. In a very specific embodiment according to the invention, structures 3 are in turn embossed on the second substrate surface, such that a substrate embossed on two sides is obtained.

[0200] After the processing of the structures 3 of the second substrate surface 2o2, a coating according to the invention for protection of the structures can in turn be provided in accordance with FIG. 4e if necessary. A need exists particularly in the case of transport over long, in particular contaminated distances. The protective material 4 according to the invention therefore serves not only as a mechanical stabiliser, but also as a protective layer for media, in particular fluids, even more specifically liquids or gases, occurring in the atmosphere and/or surrounding environment.

[0201] The resultant product 1 according to FIG. 4f, which product is in particular processed on two sides, can then be transported.

[0202] FIG. 0.5 shows a first embodiment of a roll-to-roll facility 8, which produces a product according to the invention. The substrate 2 is unwound from a first roll 9 and is processed at least on one side at the surface 2o. The processing can be carried out for example by an embossing roll 9, which embosses a structure 3 on the substrate surface 2o. The embossing roll 9 can be set against a counter pressing roll 9. The structures 3 of the substrate 2 processed on one side are protected in accordance with the invention in a further process step by an application means 7. Further optional process steps and lastly a storage of the substrate 2 on a storage roll/winding roll 9 are then performed.

[0203] FIG. 6 shows a second embodiment of a roll-to-roll facility 8, which produces a product according to the invention. The substrate 2 is unwound from a roll 9 and passes via processing units, in particular embossing rolls 9, into an application means 7. The application means 7 is preferably a bath with transport rolls 9.sup.IV However, a two-sided coating with the aid of application means 7, in particular nozzle devices, is also conceivable. The substrate 2, coated in particular on both sides, is then wound up again and stored on a roll 9.

LIST OF REFERENCE SIGNS

[0204] 1, 1, 1, 1 product according to the invention [0205] 2, 2 substrate [0206] 2o, 2o substrate surfaces [0207] 2o1, 2o2 substrate surfaces [0208] 3 structure [0209] 4, 4 protective material [0210] 4o protective material surface [0211] 5 sample holder [0212] 5o sample holder surface [0213] 6 fixing means [0214] 7, 7 application means [0215] 8, 8 roll-to-roll facility [0216] 9, 9, 9, 9, 9.sup.IV roll