HAMR media structure having an anisotropic thermal barrier layer

10115428 ยท 2018-10-30

Assignee

Inventors

Cpc classification

International classification

Abstract

A heat assisted magnetic recording (HAMR) media structure is disclosed. The HAMR media structure includes a magnetic recording layer comprising an array of magnetic grains for storing information; a heat sink layer disposed below the magnetic recording layer and having a first thermal conductivity; and an anisotropic thermal barrier layer disposed between the magnetic recording layer and the heat sink layer and having a vertical thermal conductivity and an in-plane thermal conductivity, wherein the vertical thermal conductivity is substantially higher than the in-plane thermal conductivity.

Claims

1. A heat assisted magnetic recording (HAMR) media structure comprising: a magnetic recording layer comprising an array of magnetic grains for storing information; a heat sink layer disposed below the magnetic recording layer and having a first thermal conductivity; an anisotropic thermal barrier layer disposed between the magnetic recording layer and the heat sink layer and having a vertical thermal conductivity and an in-plane thermal conductivity, wherein the anisotropic thermal barrier layer consists of a single material selected from the group consisting of graphite and mica compounds and the ratio of the vertical thermal conductivity to the in-plane thermal conductivity is greater than 3; and a nucleation layer disposed between the magnetic recording layer and the anisotropic thermal barrier layer, wherein the nucleation layer is selected from the group consisting of SiC, TiN, TiC and RuAl.

2. The HAMR media structure of claim 1, wherein the magnetic recording layer has a thickness between about 5 and 15 nm.

3. The HAMR media structure of claim 1, wherein the magnetic grains comprises a soft magnetic material selected from the group consisting of FePt, Mn.sub.3Al, FePd, CoPt, CoPd, CoPtIr, FePtIr, FePtRh, CoRhPt, FePdRh, FePtNi, CoPtNi, and FePtCu.

4. The HAMR media structure of claim 1, wherein each of the magnetic grains is separated from an adjacent magnetic grain by a segregant.

5. The HAMR media structure of claim 4, wherein the segregant comprises silicon oxide, tantalum oxide, magnesium oxide, silver, carbon, titanium oxide, or a combination thereof.

6. The HAMR media structure of claim 1, wherein the nucleation layer has a thickness between about 2 and 10 nm.

7. The HAMR media structure of claim 1, wherein the heat sink layer has a thickness between about 20 and 200 nm.

8. The HAMR media structure of claim 1, wherein the heat sink layer comprises copper, silver, ruthenium, nickel, aluminum, tungsten, gold, or a combination thereof.

9. The HAMR media structure of claim 1, wherein the first thermal conductivity is higher than 40 W.Math.m.sup.?1.Math.K.sup.?1.

10. The HAMR media structure of claim 1, wherein the anisotropic thermal barrier layer has a thickness between about 5 and 50 nm.

11. The HAMR media structure of claim 1, wherein the ratio of the vertical thermal conductivity to the in-plane thermal conductivity is greater than 10.

12. The HAMR media structure of claim 1, wherein the anisotropic thermal barrier layer has a thickness between about 35 and 50 nm.

Description

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

(1) FIG. 1 is a functional block diagram illustrating a heat assisted magnetic recording (HAMR) system.

(2) FIG. 2 is a diagram depicting a cross-sectional view of a conventional HAMR media structure.

(3) FIG. 3 is a diagram depicting a cross-sectional view of an exemplary HAMR media structure having an anisotropic thermal barrier layer according to certain aspects of the subject disclosure.

(4) FIG. 4 compares temperatures as a function of downtrack distance.

(5) FIG. 5 compares thermal gradients (dT/dX) at different levels of laser power.

(6) FIG. 6 compares thermal gradients for the peak temperature range of interest (750-850K).

DETAILED DESCRIPTION

(7) FIG. 1 is a functional block diagram illustrating a heat assisted magnetic recording (HAMR) system 100. In the illustrated example, light energy generated by a light source 110 (e.g., laser diode) is coupled to a waveguide 130 via a coupler 120. The coupler 120 can be a grating or simple butt coupling. Some of the light energy is lost in the coupler 120 due to scattering. The waveguide 130 guides and directs the light energy to a near field transducer (NFT) 140. While in the waveguide 130, some of the light energy is lost by scattering in the waveguide due to process imperfections and also to the surrounding pole as pole absorption. The NFT 140 focuses the light energy received from the waveguide 130 into a nano-sized light beam and delivers the beam to HAMR media 150 so as to heat up a specific recording region in the media. Some of the light energy received by the NFT 140 is also lost due to absorption by the NFT.

(8) One significant problem in HAMR recording is a low NFT delivery efficiencydefined as the percentage ratio of the light energy delivered to the HAMR media 150 from the NFT divided by the light energy received by the NFT. The NFT delivery efficiency is typically less than 15% in practical HAMR systems. One factor contributing to the low efficiency is the fact that the intended thermal spot size on the HAMR media is much smaller than the wavelength of the light from the laser source. This means that a good deal of energy is dissipated in the head itself and particularly, at the near field transducer (NFT).

(9) Because the NFT delivery efficiency is low, power requirement for the light source 110 is quite high. For example, heat dissipation by a laser diode needs special care with consideration of the 30?40% of lasering efficiency and the light absorption by the adjacent magnetic elements due to the interaction of scattering light from waveguide resultant from taper, bend and process imperfections. Furthermore, besides the portion of energy delivered to the HAMR media 150, the absorption by the NFT 140 itself together with the pole absorption can heat up the NFT 140 to a very high temperature at which the NFT 140 can melt, deform or recrystallize and lose its function.

(10) From a recording capability point of view, a higher thermal gradient (typically measured in Kelvin per nanometer, K/nm) in the HAMR recording media is preferred as it translates into sharper transitions resulting in lower media noise (lower transition jitter) and higher linear density capability. One way to increase the thermal gradient is to increase the heat-sinking properties of the HAMR media 150 to remove or dissipate the thermal energy as fast as possible. However, since a minimum peak temperature on the HAMR media 150 is a requirement (typically it must exceed the Curie point of the magnetic alloy used in the magnetic recording layer), the laser power also need to be increased. A higher laser power in turn increases the power dissipation in the head including at the NFT 140 and reduces the reliability of the HAMR system 100.

(11) In this regard, a HAMR media structure with heat dissipation characteristics that achieves a sizable reduction in the power requirement for the light source 110 while maintaining an equivalent thermal spot size on the recording media 150 can significantly improve the reliability of the HAMR system 100 as a whole.

(12) FIG. 2 is a diagram depicting a cross-sectional view of a typical HAMR media structure 200. The HAMR media structure 200 includes a heat link layer 210, a thermal barrier layer 220 disposed over the heat sink layer 210, a nucleation and/or seed (nucleation/seed) layer 230 disposed over the thermal barrier layer 220, a magnetic recording layer 240 disposed over the nucleation/seed layer 230, and a protective coat 250 over the magnetic recording layer 240. The magnetic recording layer 240 includes an array of magnetic grains 242 for recording information and segregants 244 for providing magnetic separations between adjacent magnetic grains 242. In certain embodiments, the magnetic recording layer 240 has a thickness between about 5 and 15 nm. The magnetic grain 242 comprises a soft magnetic material, non-limiting examples of which are FePt, Mn.sub.3Al, FePd, CoPt, CoPd, CoPtIr, FePtIr, FePtRh, CoRhPt, FePdRh, FePtNi, CoPtNi, FePtCu, or a combination thereof. The segregant 244 comprises a non-magnetic material, non-limiting examples of which are silicon oxide, tantalum oxide, magnesium oxide, silver, carbon, titanium oxide, or a combination thereof. Magnetic recording layers having such magnetic grains and segregants and various methods of producing the same are known in the art.

(13) The protective overcoat 250 (e.g., carbon overcoat) provides a protection for the magnetic recording layer 240. The nucleation/seed layer 230 promotes a growth of the magnetic grains 242 and also creates a desired magnetic orientation for the grains. The nucleation/seed layer 230 comprises MgO, SiC, TiN, TiC, NiAl, RuAl, or a combination thereof. In certain embodiments, the nucleation layer has a thickness between about 2 and 10 nm.

(14) The heat sink layer 210 is responsible for dissipating or removing the light-generated heat from the magnetic recording layer 240. For fast and efficient heat dissipation, the heat sink layer 210 is typically made of a material (e.g., a metal) having a high thermal conductivity (typically greater than 40 W.Math.m.sup.?1.Math.K.sup.?1). Non-limiting examples include copper, silver, ruthenium, nickel, aluminum, tungsten, gold, or a combination thereof. In certain embodiments, the heat sink layer 210 has a thickness between about 20 and 200 nm.

(15) The thermal barrier layer 220 is provided between the magnetic recording layer 240 and the heat sink layer 210 to control the heat management characteristics (e.g., magnitude and rate of heat containment and/or dissipation, thermal gradients). The thermal barrier layer 220 is made of a material having a thermal conductivity (typically about 10 W.Math.m.sup.?1.Math.K.sup.?1) that is substantially lower than that of the heat sink layer 210. In the HAMR media structure shown in FIG. 2, the thermal barrier layer 220 is thermally isotropic in the sense that its in-plane or lateral (e.g., in the x-y plane) thermal conductivity is substantially the same (e.g., within +/?5%) as its out-of-plane or vertical (e.g., in the z direction) thermal conductivity. As such, heat generated in the magnetic recording layer 340 flows equally well along the lateral direction as along the vertical direction.

(16) According to certain aspects of the subject disclosure, a HAMR media structure having an anisotropic thermal barrier layer is proposed for superior heat management characteristics. In some embodiments, such an anisotropic thermal barrier is achieved using a columnar array of grains made of essentially the same material as used in the isotropic thermal barrier layer 220 with a thermally insulating boundary separating each grain from its adjacent grain. The composite arrangement reduces the effective in-plane thermal conductivity. In this manner, the vertical thermal conductivity would be comparable to that of the conventional isotropic thermal barrier layer but the in-plane conductivity is made substantially less.

(17) FIG. 3 is a diagram depicting a cross-sectional view of an exemplary HAMR media structure 300 having an anisotropic thermal barrier layer according to certain aspects of the subject disclosure. The HAMR media structure 300 includes a heat sink layer 310, an anisotropic thermal barrier layer 320 disposed over the heat sink layer 310, a nucleation/seed layer 330 disposed over the anisotropic thermal barrier layer 320, a magnetic recording layer 340 disposed over the nucleation/seed layer 330, and a protective coat 350 disposed over the magnetic recording layer 340. As with the magnetic recording layer 240 in the HAMR media structure 200 of FIG. 2, the magnetic recording layer 340 includes an array of magnetic grains 342 where adjacent grains 342 are separated by segregants 344. Respective functions of and exemplary materials for the heat sink layer 310, the nucleation/seed layer 330, the magnetic recording layer 340, and the protective coat 350 are substantially the same as the corresponding layers in the HAMR media structure 200 of FIG. 2 and are not repeated here for the sake of brevity.

(18) In certain embodiments, the anisotropic thermal barrier layer 320 has a thickness between about 5 and 50 nm. Unlike the isotropic thermal barrier layer 220 of FIG. 2, the vertical thermal conductivity of the anisotropic thermal barrier layer 320, is substantially (e.g., at least 10%) greater than the in-plane thermal conductivity. In certain embodiments, the ratio of the vertical thermal conductivity to the in-plane thermal conductivity is greater than 3. In other embodiments, the ratio is greater than 10.

(19) In some exemplary embodiments, the thermal barrier layer 320 is a composite of two different materials. For example, in the illustrated example of FIG. 3, the anisotropic thermal barrier layer 320 comprises an array of columnar grains 322 and insulating boundaries 324. Each insulating boundary 324 separates two adjacent columnar grains 322. The columnar grain 322 has a thermal conductivity that is equal to or less than the thermal conductivity of the heat sink layer 310. In certain embodiments, the thermal conductivity of the columnar grain 322 is between about 5 and 70 W.Math.m.sup.?1.Math.K.sup.?1. In some embodiments, the thermal conductivity of the columnar grain 322 is between about 5 and 20 W.Math.m.sup.?1.Math.K.sup.?1. In certain embodiments, the columnar grain 322 comprises Co, Fe, B, Zr, Cr, Ta, Mo or a combination thereof. In some embodiments, each columnar grain 322 has a diameter in the range of between about 5 and 30 nm.

(20) The insulating boundary 324 has a thermal conductivity that is lower than the thermal conductivity of the columnar grain 322. In certain embodiments, the insulating boundary 324 comprises SiO.sub.2, TiO.sub.2, MgO, TiC, TiN, Ta.sub.3O.sub.5, CoO, C, B, or a combination thereof. In certain embodiments, the thermal conductivity of the insulating boundary 324 is between about 0.1 and 20 W.Math.m.sup.?1.Math.K.sup.?1 and, in some embodiments, between about 0.1 and 5 W.Math.m.sup.?1.Math.K.sup.?1. In certain embodiments, each insulating boundary 324 has a width in the range of between about 0.5 and 3 nm.

(21) Various methods of growing a composite thin-film structure having an array of columnar grains and insulating boundaries such as the thermal barrier layer 320 shown in FIG. 3 are known in the art. One method is disclosed, for example, in J. A. Thornton, J. Vac. Sci. Technol. 11, 666 (1974). Columnar grain growth morphologies in thin-film are typically achieved by growing material systems where one constituent is immiscible or has low solubility in the other. For instance, metallic systems co-sputtered with oxide phases typically result in columnar grains of metallic core, separated by grain boundaries containing the oxide phase.

(22) The deposition conditions of substrate temperature and pressure for promoting columnar growth depend on materials properties and materials systems. For single materials, a Thornton diagram disclosed in the above-identified article by J. A. Thornton provides a good direction on how to obtain columnar structures but, again, for systems where an impurity or a second phase segregates as the film grows, a columnar structure is a common outcome of such growth. These materials are most commonly grown by DC sputtering methods although other deposition methods such as RF sputtering and evaporation may be used.

(23) In some exemplary embodiments, the anisotropic thermal barrier layer 320 may be realized using a single material having an intrinsic thermal anisotropy. Materials such as graphite, WSe (tungsten selenide) or various Micas compounds such as MoS2, WS2 and WSe2 are highly and naturally highly anisotropic in terms of their thermal conductivities along main symmetry axes of the crystal structures. For instance, graphite, in the plane of the sheet atoms are bonded through strong chemical bonds while in between sheets, the bonding is mostly electrostatic in nature and much weaker than the atomic bonds within the sheets. Graphite has a layered, planar structure. In each layer, the carbon atoms are arranged in a honeycomb lattice with separation of 0.142 nm, and the distance between planes is 0.335 nm. The acoustic and thermal properties of graphite are highly anisotropic, since phonons propagate very quickly along the tightly-bound planes, but are slower to travel from one plane to another.

(24) A thermomagnetic modeling was performed to verify and quantify (i.e., estimate) the benefits of a HAMR structure having an anisotropic thermal barrier layer over a HAMR media structure having an isotropic thermal barrier layer. Various physical parameters used for the modeling are shown in Table 1 below:

(25) TABLE-US-00001 TABLE 1 In-Plane Out-of-Plane Thermal Thermal Thickness Conductivity Conductivity (nm) (W .Math. m.sup.?1 .Math. K.sup.?1) (W .Math. m.sup.?1 .Math. K.sup.?1) Magnetic recording layer 10 1 5.7 (FePt + SiO2) Isotropic thermal barrier 35 10.5 10.5 layer Anisotropic thermal 35 1 10.5 barrier layer Heat sink layer (Ru) 200 70 70 Substrate (Glass) Infinite 1.1 1.1 (>10.sup.5)

(26) FIGS. 4-6 provide comparisons of various thermal properties associated with the isotropic and anisotropic thermal barrier layers. FIG. 4 compares temperatures as a function of downtrack distance at the same level of laser power. Due to a lower effective thermal conductivity, the temperature profile for the anisotropic thermal barrier layer is higher than that for the isotropic thermal barrier layer. FIG. 5 compares thermal gradients (dT/dX) at different levels of laser power. At all laser power levels, the thermal gradient is higher for the anisotropic thermal barrier layer than for the isotropic thermal barrier layer. FIG. 6 compares thermal gradients for the peak temperature range of interest (750-850K). This comparison shows that the thermal gradient is not significantly affected by the use of an anisotropic thermal barrier layer compared to an isotropic one at the same peak temperature. This observation leads to the conclusion that a less laser power is needed for the anisotropic thermal barrier layer to reach the same peak temperature and the same thermal gradient, the two key HAMR parameters of interest. The magnitude of the laser power reduction in our modeling was of ?16-21%. A higher reduction can be achieved by the use of materials with more optimized thermal conductivity values and layer structure designs.

(27) Accordingly, a HAMR media structure with an anisotropic thermal barrier layer can achieve a reduction in the power requirement for the light source while maintaining an equivalent thermal spot size on the recording media. A reduction in laser power requirement, in turn, can significantly improve the reliability of the HAMR system as a whole.

(28) The description of the invention is provided to enable any person skilled in the art to practice the various embodiments described herein. While the present invention has been particularly described with reference to the various figures and embodiments, it should be understood that these are for illustration purposes only and should not be taken as limiting the scope of the invention.

(29) There may be many other ways to implement the invention. Various functions and elements described herein may be partitioned differently from those shown without departing from the spirit and scope of the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and generic principles defined herein may be applied to other embodiments. Thus, many changes and modifications may be made to the invention, by one having ordinary skill in the art, without departing from the spirit and scope of the invention.

(30) A reference to an element in the singular is not intended to mean one and only one unless specifically stated, but rather one or more. The term some refers to one or more. Underlined and/or italicized headings and subheadings are used for convenience only, do not limit the invention, and are not referred to in connection with the interpretation of the description of the invention. All structural and functional equivalents to the elements of the various embodiments of the invention described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and intended to be encompassed by the invention. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the above description.