ANTENNA DEVICE AND COMMUNICATION DEVICE
20220368030 · 2022-11-17
Assignee
Inventors
Cpc classification
H01Q9/0407
ELECTRICITY
H01Q21/06
ELECTRICITY
International classification
Abstract
A ground plane is disposed on or in an inner layer of a dielectric substrate. Moreover, a feed line is disposed on or in the dielectric substrate. A first antenna element and a second antenna element are supported on the dielectric substrate. The first antenna element and the second antenna element include a first radiating element and a second radiating element connected to the feed line, respectively, and are disposed on a same side when seen from the ground plane. With a height of the ground plane being a reference, a top portion of the second antenna element is located higher than a top portion of the first antenna element. There is provided an antenna device of which the band can be expanded and of which the internal space of the casing can be effectively utilized.
Claims
1. An antenna device comprising: a dielectric substrate; a ground plane disposed on or in an inner layer of the dielectric substrate; a feed line disposed on or in the dielectric substrate; and a first antenna element and a second antenna element supported on the dielectric substrate, wherein the first antenna element and the second antenna element include a first radiating element and a second radiating element connected to the feed line, respectively, and are disposed on a same side of the dielectric substrate as viewed from the ground plane, with a height of the ground plane being a reference, a top portion of the second antenna element is located higher than a top portion of the first antenna element, the first antenna element and the second antenna element constitute an array antenna, the first feed element and the ground plane constitute a patch antenna, and the second feed element and the ground plane constitute a patch antenna.
2. The antenna device according to claim 1, wherein the second radiating element is disposed higher than the first radiating element.
3. The antenna device according to claim 1, wherein the dielectric substrate has an upper surface that is flat, on the upper surface of the dielectric substrate, an additional member that has a permittivity lower than a permittivity of the dielectric substrate is disposed, and the second antenna element is at least partially supported on the dielectric substrate with the additional member interposed therebetween.
4. The antenna device according to claim 2, wherein the dielectric substrate has an upper surface that is flat, on the upper surface of the dielectric substrate, an additional member that has a permittivity lower than a permittivity of the dielectric substrate is disposed, and the second antenna element is at least partially supported on the dielectric substrate with the additional member interposed therebetween.
5. The antenna device according to claim 1, wherein the second antenna element includes a parasitic element disposed higher, with respect to the ground plane, than the first radiating element, and the parasitic element is electromagnetically coupled to the second radiating element.
6. The antenna device according to claim 2, wherein the second antenna element includes a parasitic element disposed higher, with respect to the ground plane, than the first radiating element, and the parasitic element is electromagnetically coupled to the second radiating element.
7. The antenna device according to claim 3, wherein the second antenna element includes a parasitic element disposed higher, with respect to the ground plane, than the first radiating element, and the parasitic element is electromagnetically coupled to the second radiating element.
8. The antenna device according to claim 4, wherein the second antenna element includes a parasitic element disposed higher, with respect to the ground plane, than the first radiating element, and the parasitic element is electromagnetically coupled to the second radiating element.
9. The antenna device according to claim 1, wherein in plan view, between the first antenna element and the second antenna element, a riser surface that defines a region in which the second antenna element is disposed and is higher, with respect to the ground plane, than a region in which the first antenna element is disposed, and the riser surface has attached thereto a reflective member configured to reflect a radio wave.
10. The antenna device according to claim 2, wherein in plan view, between the first antenna element and the second antenna element, a riser surface that defines a region in which the second antenna element is disposed and is higher, with respect to the ground plane, than a region in which the first antenna element is disposed, and the riser surface has attached thereto a reflective member configured to reflect a radio wave.
11. The antenna device according to claim 3, wherein in plan view, between the first antenna element and the second antenna element, a riser surface that defines a region in which the second antenna element is disposed and is higher, with respect to the ground plane, than a region in which the first antenna element is disposed, and the riser surface has attached thereto a reflective member configured to reflect a radio wave.
12. The antenna device according to claim 4, wherein in plan view, between the first antenna element and the second antenna element, a riser surface that defines a region in which the second antenna element is disposed and is higher, with respect to the ground plane, than a region in which the first antenna element is disposed, and the riser surface has attached thereto a reflective member configured to reflect a radio wave.
13. The antenna device according to claim 1, wherein an operating frequency of the first antenna element is the same as an operating frequency of the second antenna element.
14. A communication device comprising: an antenna device that includes a dielectric substrate, a ground plane disposed on or in an inner layer of the dielectric substrate, a feed line disposed on or in the dielectric substrate, and a first antenna element and a second antenna element supported on the dielectric substrate, wherein the first antenna element and the second antenna element include a first radiating element and a second radiating element connected to the feed line, respectively, and are disposed on a same side of the dielectric substrate as viewed from the ground plane, with a height of the ground plane being a reference, a top portion of the second antenna element is located higher than a top portion of the first antenna element, the first antenna element and the second antenna element constitute an array antenna, the first feed element and the ground plane constitute a patch antenna, and the second feed element and the ground plane constitute a patch antenna; a casing configured to accommodate the antenna device; and a radio-frequency integrated circuit element accommodated in the casing and configured to supply a radio-frequency signal to the first radiating element and the second radiating element through the feed line, wherein the first antenna element and the second antenna element face an inner surface of the casing.
15. The communication device according to claim 14, wherein the second radiating element is disposed higher than the first radiating element.
16. The communication device according to claim 14, wherein the dielectric substrate has an upper surface that is flat, on the upper surface of the dielectric substrate, an additional member that has a permittivity lower than a permittivity of the dielectric substrate is disposed, and the second antenna element is at least partially supported on the dielectric substrate with the additional member interposed therebetween.
17. The communication device according to claim 14, wherein the second antenna element includes a parasitic element disposed higher, with respect to the ground plane, than the first radiating element, and the parasitic element is electromagnetically coupled to the second radiating element.
18. The communication device according to claim 14, wherein an operating frequency of the first antenna element is the same as an operating frequency of the second antenna element.
19. The communication device according to claim 14, wherein with regard to a direction vertical to the ground plane, a distance from the ground plane to the inner surface of the casing through the second antenna element is longer than a distance from the ground plane to the inner surface of the casing through the first antenna element.
20. The communication device according to claim 19, wherein the inner surface of the casing includes, in part, a cylindrical surface curved to protrude outward with respect to the casing, and the first antenna element and the second antenna element face the cylindrical surface of the casing.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
First Embodiment
[0037] With reference to the drawings of
[0038]
[0039] A pair of first antenna elements 30 is disposed on or in the dielectric substrate 10 so as to flank the additional member 20 in plan view. The first antenna elements 30 each include a first radiating element 31 including a metal film disposed on the upper surface of the dielectric substrate 10. It should be noted generally, that although the present embodiment shows the antenna elements 30 on the surface of the dielectric substrate 10, the antenna elements may also be disposed “in” the dielectric substrate 10. In this context “in” should be construed to be below a plane that defines of upper surface of the dielectric substrate 10, regardless of whether the antenna elements 30 are exposed on top or covered with a film. Also, while the term “radiating element(s)” is used herein, it should be understood that the elements may also receive RF energy. A second antenna element 40 is disposed on (or “in”) the additional member 20. The second antenna element 40 includes a second radiating element 41 including a metal film disposed on the upper surface of the additional member 20.
[0040] A ground plane 11 is disposed on or in an inner layer of the dielectric substrate 10. Moreover, in the dielectric substrate 10, a plurality of feed lines 12 are disposed. The feed line 12 includes a microstrip line or a triplate strip line and a via conductor extending in the thickness direction of the dielectric substrate 10. The two first radiating elements 31 are connected to the respective feed lines 12. Radio-frequency signals are supplied to the first radiating elements 31 through the feed lines 12. Each of the two first radiating elements 31 and the ground plane 11 function as a patch antenna.
[0041] In the additional member 20, a feed line 22 including a via conductor connected to the second radiating element 41 is disposed. The feed line 22 is connected to the feed line 12 disposed on or in the dielectric substrate 10 with solder 21 interposed therebetween. A radio-frequency signal is supplied to the second radiating element 41 through the feed line 12, the solder 21, and the feed line 22. The second radiating element 41 and the ground plane 11 function collectively as a patch antenna.
[0042] The two first antenna elements 30 are directly supported on the dielectric substrate 10, and the second antenna element 40 is supported on the dielectric substrate 10 with the additional member 20 interposed therebetween. The first antenna elements 30 and the second antenna element 40 are disposed on the same side (the upper surface side of the dielectric substrate 10) when seen from the ground plane 11. With the height of the ground plane 11 being a reference, the top portion of the second antenna element 40 is located higher than the top portions of the first antenna elements 30. That is, the second radiating element 41 is disposed higher than the first radiating elements 31. Thus, the interval from the ground plane 11 to the second radiating element 41 is wider than the interval from the ground plane 11 to the first radiating element 31.
[0043]
[0044] The BBIC 52 performs baseband signal processing. A baseband signal or an intermediate-frequency signal is input from the BBIC 52 to the RFIC 51. The RFIC 51 up-converts a baseband signal or an intermediate-frequency signal to RF and then supplies the radio-frequency signal to the first radiating elements 31 and the second radiating element 41 through the feed lines 12 or the feed line 22 (
[0045] Next, the excellent effects of the first embodiment are described.
[0046] In the first embodiment, the second radiating element 41 is disposed higher than the upper surface of the dielectric substrate 10 when seen from the ground plane 11. That is, the interval from the ground plane 11 to the second radiating element 41 is wider than the interval from the ground plane 11 to the upper surface of the dielectric substrate 10. Thus, as compared to a configuration in which the second radiating element 41 and the first radiating elements 31 are disposed at the same height, the operating bandwidth of the second antenna element 40 can be extended.
[0047] Further, the distance L2 from the ground plane 11 to the cylindrical surface 61 through the second antenna element 40 is longer than the distance L1 from the ground plane 11 to the cylindrical surface 61 through the first antenna element 30. Even when the second radiating element 41 is disposed on the upper surface of the dielectric substrate 10, it is difficult to use the space between the second antenna element 40 and the cylindrical surface 61 for other purposes. Since it is difficult to use the space occupied by the additional member 20 and the second antenna element 40 for other purposes, even when the additional member 20 and the second antenna element 40 are disposed in the casing 60, the space for accommodating other components is not narrowed. In this way, the band of the antenna device 50 can be expanded without the excessive occupation of the internal space of the casing 60.
[0048] Next, with reference to the drawings of
[0049]
[0050] The first radiating elements 31 and the second radiating element 41 each have a square shape in plan view. The centers of one of the first radiating elements 31, the second radiating element 41, and the other of the first radiating elements 31 are located on a single straight line in this order in plan view. An xyz rectangular coordinate system in which the direction of the straight line is the y-axis direction and the normal direction of the upper surface of the dielectric substrate 10 is the z-axis direction is defined. The edges of the first radiating elements 31 and the second radiating element 41 are in parallel with the x-axis direction or the y-axis direction.
[0051] A length L of the side of each of the first radiating elements 31 and the second radiating element 41 was 1.9 mm and an interval G between the first radiating element 31 and the second radiating element 41 in the y-axis direction was 5 mm. The interval from the ground plane 11 to the first radiating element 31 was 0.172 mm and the interval from the ground plane 11 to the second radiating element 41 was 0.39 mm. Feed points 32y and 42y are located in the slightly inner side portions of the middle points on the edges on the positive side in the y axis of the first radiating elements 31 and the second radiating element 41, respectively. Feed points 32x and 42x are located in the slightly inner side portions of the middle points on the edges on the positive side in the x axis of the first radiating elements 31 and the second radiating element 41, respectively.
[0052] In the comparative example illustrated in
[0053]
[0054] The range with a return loss of −10 dB or less (i.e., more negative on a decibel scale such as −20 dB) is defined as the operating frequency band and the respective operating frequency bandwidths of the second radiating element 41 when power is supplied to the feed points 42x and 42y are denoted by FBx and FBy. The operating frequency bandwidths FBx and FBy of the simulation model according to the first embodiment are wider than the operating frequency bandwidths FBx and FBy of the simulation model according to the comparative example, respectively. From this simulation result, it has been confirmed that band expansion can be achieved by employing the structure according to the first embodiment. Note that, in the simulation, power is supplied to the first radiating elements 31 and the second radiating element 41 individually, but also in a case where power is supplied to the two first radiating elements 31 and the single second radiating element 41 at the same time to make the first radiating elements 31 and the second radiating element 41 operate as an array antenna, band expansion can be achieved by employing the configuration according to the first embodiment.
[0055]
[0056] In the simulation model according to the embodiment (
[0057]
[0058] In the simulation model according to the embodiment (
[0059] From the simulation results illustrated in the drawings of
[0060] Next, modifications of the first embodiment are described.
[0061] In the first embodiment, the RFIC 51 (
[0062] Next, with reference to the drawings of
[0063]
[0064]
[0065]
[0066] In all the modifications, with the ground plane 11 being a reference, the second radiating elements 41 are disposed higher than the first radiating elements 31. In the modification illustrated in
[0067] In the first embodiment, the surface of the casing 60 that the antenna device 50 faces is the cylindrical surface 61 (
Second Embodiment
[0068] Next, with reference to
[0069]
[0070] Next, the excellent effects of the second embodiment are described.
[0071] With the low permittivity of the additional member 20, the wavelength shortening effect is reduced and the dimensions of the second radiating element 41 under the same resonant frequency conditions are thus increased. As a result, the antenna gain is increased. Moreover, with the large dimensions of the second radiating element 41, the Q of the resonator drops, with the result that there is an effect that the operating frequency band is expanded.
Third Embodiment
[0072] Next, with reference to
[0073]
[0074] In the third embodiment, with the height of the ground plane 11 being a reference, the first radiating elements 31 and the second radiating element 41 are disposed at the same position in terms of the height direction. However, as in the case of the first embodiment, the top portion of the second antenna element 40, that is, the upper surface of the parasitic element 43 disposed on the upper surface of the additional member 20 is located higher than the top portions of the first antenna elements 30.
[0075] Next, the excellent effects of the third embodiment are described. In the third embodiment, since the parasitic element 43 is provided above the second radiating element 41, band expansion can be achieved. Moreover, the coverage area can be extended.
Fourth Embodiment
[0076] Next, with reference to
[0077]
[0078] Next, the excellent effects of the fourth embodiment are described.
[0079] A radio wave radiated from the first radiating element 31 is partially reflected by the reflective member 23. With this, the coverage area can be extended in a direction that the reflective member 23 faces.
[0080] Next, a modification of the fourth embodiment is described.
[0081] In the fourth embodiment, the metal is used for the reflective member 23, but the reflective member 23 may be formed of another material that reflects radio waves in the operating frequency band of the antenna device 50.
Fifth Embodiment
[0082] Next, with reference to
[0083]
[0084] Next, the excellent effects of the fifth embodiment are described.
[0085] Also in the antenna device according to the fifth embodiment, as in the first embodiment, with the height of the ground plane 11 being a reference, the second radiating elements 41 are disposed higher than the upper surface of the dielectric substrate 10. Thus, as compared to a case where all radiating elements are disposed on the upper surface of the dielectric substrate 10, the operating bandwidth can be extended. Further, in a case where a protrusion is formed on the inner surface of a casing, the antenna device can be disposed with the first radiating element 31 facing the protrusion so that the second radiating elements 41 can be located near the region around the protrusion on the inner surface of the casing. With this, the internal space of the casing can be effectively utilized. Moreover, in the fifth embodiment, the wall surface made of the dielectric material is located on each side of the first radiating element 31 at the center. Due to the effect of the wall surfaces, there is an effect that the directivity is sharpened.
[0086] Next, with reference to
[0087] In the modification illustrated in
[0088] On the three respective upper surfaces different from each other in height, the first radiating element 31 forming the first antenna element 30, the second radiating element 41 forming the second antenna element 40, and the third radiating element 72 forming the third antenna element 71 are disposed. In plan view, the first radiating element 31, the second radiating element 41, and the third radiating element 72 are disposed on a line. In the present modification, due to the effect of the wall surface, which is made of the dielectric material, located on one side of each of the first radiating element 31 and the second radiating element 41, the direction of the main beam can be inclined with respect to the normal direction of the upper surface of the dielectric substrate 10.
[0089] In the modification illustrated in
[0090] In the modification illustrated in
[0091] In the first embodiment illustrated in
Sixth Embodiment
[0092] Next, with reference to the drawings of
[0093] In the antenna device 50 according to the sixth embodiment (
[0094] In the antenna device 50 according to the modification illustrated in
[0095] In the antenna device 50 according to the modification illustrated in
[0096] On the upper surfaces of the dielectric substrate 10, the additional member 20 serving as the first layer, the additional member 70 serving as the second layer, and the additional member 80 serving as the third layer, the plurality of first radiating elements 31, the plurality of second radiating elements 41, the plurality of third radiating elements 72, and a plurality of fourth radiating elements 82 are disposed, respectively. The first radiating elements 31, the second radiating elements 41, the third radiating elements 72, and the fourth radiating elements 82 form the first antenna elements 30, the second antenna elements 40, the third antenna elements 71, and fourth antenna elements 81, respectively. With the height of the ground plane 11 being a reference, in plan view, the heights of the radiating elements are increased toward a direction in parallel with one of the edges of the dielectric substrate 10.
[0097] In the antenna device 50 according to the modification illustrated in
[0098] Next, the excellent effects of the sixth embodiment and the modifications thereof are described.
[0099] As described above, in the sixth embodiment and the modifications thereof, the plurality of radiating elements different from each other in height from the ground plane 11 are two-dimensionally disposed. The shapes of the regions different from each other in height are adjusted depending on the unevenness of the inner surface of a casing to make it possible to flexibly support various casings. Further, there is also an effect that the directivity of the antenna device 50 is changed depending on the aspect of the two-dimensional distribution of the plurality of radiating elements different from each other in height.
[0100] In the sixth embodiment and the modification thereof illustrated in
[0101] Each embodiment described above is exemplary, and it goes without saying that the configurations described in the different embodiments can be partially replaced or combined. The similar actions and effects provided by the similar configurations of the plurality of embodiments are not stated one by one in each embodiment. Moreover, the present invention is not limited to the embodiments described above. For example, it will be apparent to those skilled in the art that various changes, improvements, combinations, and the like can be made.
REFERENCE SIGNS LIST
[0102] 10 dielectric substrate
[0103] 11 ground plane
[0104] 12 feed line
[0105] 20 additional member
[0106] 20S riser surface
[0107] 21 feed line
[0108] 22 solder
[0109] 23 reflective member
[0110] 30 first antenna element
[0111] 31 first feed conductor
[0112] 32x, 32y feed point
[0113] 40 second antenna element
[0114] 41 second radiating element
[0115] 42x, 42y feed point
[0116] 43 parasitic element
[0117] 50 antenna device
[0118] 51 radio-frequency integrated circuit element (RFIC)
[0119] 52 baseband integrated circuit element (BBIC)
[0120] 60 casing
[0121] 61 cylindrical surface
[0122] 70 additional member
[0123] 71 third antenna element
[0124] 72 third radiating element
[0125] 80 additional member
[0126] 81 fourth antenna element
[0127] 82 fourth radiating element