Method of specimen processing in an apparatus with two or more particle beams and apparatus for this processing
10109457 ยท 2018-10-23
Assignee
Inventors
Cpc classification
H01J37/3005
ELECTRICITY
H01J2237/31745
ELECTRICITY
International classification
G01N1/28
PHYSICS
H01J37/30
ELECTRICITY
Abstract
A method and apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.
Claims
1. Method of processing a specimen in an apparatus with two or more particle beams passing through columns, comprising the steps of: a) processing a milled side of a specimen by scanning the specimen with the first particle beam, the processing step comprising the steps of: i) milling the specimen a first time by scanning the specimen with the first particle beam in a first position of the specimen, in which an axis of the first particle beam forms an angle with a plane of the milled side for a whole duration of scanning, while the angle has a magnitude in an interval from 0 to 30, and after milling the specimen the first time, ii) tilting the milled side into a second position around an axis of tilt of the specimen and in the second position, wherein the axis of tilt of the specimen intersects the milled side, and iii) milling the specimen a second time by re-scanning the same milled side again with the first particle beam, which is still directed to this milled side in a way that the axis of the first particle beam forms an angle with the milled side for the whole duration of the scanning, and wherein the angle has a magnitude in an interval from 0 to 30, and b) observing the milled side of the specimen by scanning the specimen with a second particle beam, wherein the axis of the first particle beam in a middle scanning position and an axis of the second particle beam in a middle scanning position are skew or intersecting when impinging on the specimen in, and wherein during at least part of the processing step, the milled side is impinged by the second particle beam, which scans over a selected area of the milled side in a way that the axis of the second particle beam for the whole time of the scanning by the second particle beam forms an angle less than 90 with a line normal to a plane through the milled side, and wherein, as a consequence, the processing step is either continuously or in selected intervals controlled by the observing step using the second particle beam, while the observing step is performed with the second particle beam at the same position of the specimen and the same position of the first particle beam of the processing step.
2. Method according to claim 1, wherein the axis of tilt of the specimen intersecting the milled side of the specimen is perpendicular to the plane through the milled side.
3. Method according to claim 1, wherein the axis of the second particle beam in the middle scanning position forms an angle which is normal to the plane of the milled side of the specimen, the angle being the same for both tilts of the specimen around the axis of tilt of the specimen.
4. Method according to claim 1, wherein the tilt around the axis of tilt of the specimen is executed continuously during concurrent scanning with the first particle beam, while during change of tilt, the milled side of the specimen remains in a field of view of the first particle beam and of the second particle beam and absolute values of angles of tilt are arbitrarily adjustable in the interval from 0 to 30.
5. Method according to claim 1, wherein before the first milling step i), the specimen tilts around the axis of tilt of the specimen by a first angle and before the second milling step iii), the specimen tilts around the axis of tilt of the specimen by a second angle, while these angles are inversely oriented.
6. Method according to claim 5, wherein the first and second angles are identical at an absolute value.
7. Method according to claim 6, wherein the absolute value of the first and second angles is 10.
8. Method according to claim 1, wherein during continuous change of tilt of the specimen around the axis of tilt of the specimen under concurrent milling, or after milling in the first position of the specimen which is followed by milling in the second position of the specimen, which is tilted with respect to the first position of the specimen around the axis of tilt of the specimen, the milled side of the specimen is polished and curtaining effect is thus reduced.
9. Method according to claim 1, wherein to compensate for impact of tapering angle created by processing of the specimen by the first particle beam, the angle is at its absolute value identical to the absolute value of the tapering angle, which guarantees specimen processing in a required direction of the milled side.
10. Method according to claim 1, wherein depending on an image of the milled side of the specimen observed by the second particle beam, the milling by the first particle beam stops in an exactly selected area of specimen being processed.
11. Method according to claim 1, wherein, if it is necessary to get an idea of a 3D structure of the specimen or about a structure located deeper under a surface of the specimen, the method of tilting to two positions around the axis of the tilt of specimen and milling in each of these positions with the first particle beam while the second particle beam is used for observation either concurrently or at selected intervals, periodically repeats, or the milling steps i) and iii) periodically while the tilt of the specimen changes continuously around the axis of the tilt of the specimen and the observing by the second particle beam is done either concurrently or at selected intervals, and during each repetition of this cycle the axis of the first particle beam shifts by a selected value deeper in the specimen being processed either by moving the axis and/or by moving the specimen.
12. Method according to claim 1, wherein the second particle beam impinges on the milled side of the specimen so that the axis of the second particle beam in the middle scanning position forms an angle ranging from 20 to 50, with the line normal to the plane through the milled side.
13. Method according to claim 1, wherein the axis of the first particle beam, the axis of the second particle beam and the axis of the tilt of specimen lie in the same plane.
14. Method according to claim 1, wherein the first and the second particle beams are any combination selected from the following group: electron beam, ion beam, ion beam with metal ions, or ion beam with a plasma source.
15. Method according to claim 1, wherein both the first and the second particle beams are focused.
16. Method according to claim 1, wherein the specimen tilts and/or turns also around a first other axis and/or around a second other axis, while these axes are different from the axis of the of the specimen and also different from each other.
17. Method according to claim 16, wherein the first other axis, the second other axis and the axis of tilt of the specimen are mutually intersecting or skew.
18. Method according to claim 16, wherein the first other axis and/or the second other axis deviate from the axis of tilt of the specimen by an angle of 90 or near 90.
19. Method according to claim 16, wherein the first other axis deviates from the axis of the first particle beam in the middle scanning position by an angle from 0 to 30 and/or the axis of the first particle beam and/or the axis of the second particle beam deviate from the second other axis by an angle of 90 or near 90.
20. Method according to claim 1, wherein the specimen is movable in three directions perpendicular to one another.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The method of the specimen processing in the apparatus with two of more particle beams and the apparatus for its execution will be further explained using the attached drawings.
(2)
(3) The principle of the curtaining effect removal within the presented invention is schematically illustrated in
(4)
(5) In
(6)
EXAMPLES OF PREFERRED EMBODIMENTS
(7) The method of specimen processing in the apparatus with two or more particle beams may be realized, for example, in the embodiment the complete illustration of which is shown in
(8) In
(9) In the configuration according to
(10) Localisation and declination of the milled side 4.1 inside the specimen 4 depends on what structures are inside the specimen and which of these are to be examined. It is convenient, if the side 4.1 is parallel with the plane where the examined structure is located. The position of the specimen 4 shall be set based on the above mentioned, either fixed or using other axes of tilt and/or rotation, as described in the commentary to
(11) The second particle beam is also directed to the milled side 4.1 of the specimen 4, where the axis 2 of the second particle beam forms the angle , which is different from 90, during the whole time of scanning by this beam, with the normal line 4.1.1 to the plane laid through the milled side 4.1 of the specimen 4, which means that this side can be imaged for the whole period of time using the second particle beam. The second particle beam scans the area, selected by the operator, of the milled side 4.1 of the specimen 4. The imaging is performed in a manner known in apparatuses with particle beams, i. e. due to the interaction of the second particle beam with the surface area of the specimen there occurs an emission of secondary particles or radiation, which can be further detected by relevant detectors, while the signal of these detectors is synchronized with the scanning using the second particle beam.
(12) In one example embodiment, the magnitude of the angle is from 20 to 50, while the typical magnitude is 35. After the first scanning of the first particle beam, the milling of the surface layer from the milled side 4.1 of the specimen 4 is executed, but due to various material and milling parameters the resulting effect is an uneven surface with grooves in the direction of the beam, the so called curtaining effect appears. With regard to this unevenness of the surface of the milled side 4.1 it is necessary to consider the normal line 4.1.1 as a normal line towards the plane laid through the milled side 4.1. To eliminate the curtaining effect, it is necessary to perform at least one more scanning, leading to further milling by the first particle beam across the specimen surface, which is covered by grooves appearing in connection with the first scanning. This additional scanning of the milled side 4.1 by the first scanning, which will be marked by the same number for clarity's sake, must be done in such a way that the grooves caused by first milling are reduced as much as possible.
(13) The principle of these grooves reduction, and thus the reduction of the curtaining effect, is demonstrated in one example embodiment in
(14) The efficiency of this process is well illustrated in
(15) The first particle beam or the second particle beam do not have to impinge on the specimen nor do they have to scan permanently. Apart from the simultaneous impingement of the first and second particle beam on the milled side 4.1 of the specimen 4, it is also possible to alternate the simultaneous or individual use of these beams in selected time intervals. This means, among other, that milling by the first particle beam may be observed by the second particle beam either directly in real time, which requires both beams to be simultaneously turned on and not blanked, or in chosen time intervals, while in this second case there is an alternation in the simultaneous and/or individual switching on and/or blanking of both beams. It is possible to apply a method, where the first beam mills the specimen surface, then it is blanked, the observation is performed by the second particle beam, then the first beam is unblanked, after what another milling is executed, the first beam is then blanked again and another observation by the second particle beam is performed. The second particle beam may be turned on/unblanked either permanently or only in time intervals, which follow each milling. When the first particle beam is not scanning over the milled side permanently and the beam is blanked after one phase of milling and/or for example in the moment when a more thorough examination of the created surface by the second particle beam is necessary, the redundant destruction of the milled side by the first particle beam is eliminated.
(16) It is often necessary to study structures, which are deep under the surface of the specimen 4. In this case, there is a shift in the scanning of the first particle beam in the direction of the depth of the specimen 4, which can be achieved either by shifting the axis of the beam by means of a scanning device, or by the shift of the specimen 4 itself. Due to repeating the process of milling, polishing and shifting of the milled area into the depth of the specimen, a 3D image of the examined specimen 4 can be acquired in high quality, because the milled areas do not suffer from the curtaining effect. Due to the fact that the presented invention allows for controlled milling and polishing during the simultaneous observation by the second particle beam or when the observation by the second particle beam is performed at chosen intervals, it is possible to stop the milling timely, when it gets to the point which should be thoroughly examined, which is a common case in the study of TSV structures. The destruction of the structure to be studied is thus eliminated, and it is possible to study in detail the high-quality, polished and grooves free surface of this structure.
(17) In the presented invention, the first and the second particle beams are any combination selected from the group of electron beam, ion beam with metal ions or ion beam with plasma source. The most advantageous is the configuration where the first particle beam, performing the milling, is an ion beam an ion beam with plasma source being suitable for fast milling. The observation is the most advantageous when the second particle beam is an electron beam, as it does not cause destruction of the examined surface when adjusted properly. However, other methods of observation are not excluded. The first and the second beams are advantageously focused; therefore it is possible to focus them on the area of the specimen 4.
(18) The invention, however, is not limited to two beams only, there can be any number of other beams according to the type of necessary analysis, there can be a beam of a different type then the aforementioned ones, for example, a laser beam. It is, of course, convenient if, besides the mentioned tilt of the specimen 4 around the axis 3, it is possible to manipulate the specimen 4 in another way; the best way is without the need to open the apparatus chamber. Therefore it is convenient to shift and/or rotate the specimen inside the chamber so that the milled and/or observed area was selected and moved into the field of view of both particle beams so that the declination of milled side 4.1 could be chosen, and the working distance could be changed, so that different specimens placed in the chamber could be observed, etc. For this purpose, it is convenient to expand the invention by other options of tilt and/or rotation and/or shift of the specimen.
(19) One of the possible configurations of auxiliary axes of the tilt and/or rotation of the specimen 4 is shown in
(20) The first other axis 5 is shown, around which it is possible to rotate the specimen 4 or to rotate the stage with several specimens in a way that the desired one reaches the field of view of the particle beams. It is advantageous, if the first other axis 5 forms an angle of approximately 90 with the axis 3 of the tilt of the specimen 4 used for the reduction of curtaining effect. The axis deviation or deviation of any other lines is in the text defined as follows: if they are intersecting lines in a plane, their deviation should be the magnitude of each acute or right angle, which is created by the lines. The deviation of two parallel lines is 0. The deviation of two skew lines is the deviation of two intersecting lines passing through a chosen point in space in parallel with the given skew lines. In
(21) In one example embodiment, to which however the invention should not be limited, the first other axis 5 and/or the second another axis 6 deviate from the axis 3 of the tilt of the specimen 4 by an angle of 90 or near 90. It is also advantageous, when the first other axis 5 deviates from the axis 1 of the first particle beam in the middle position of scanning by an angle of 0-30 and/or the axis 1 of the first particle beam and/or the axis 2 of the second particle beam deviate from the second other axis 6 by an angle of 90 or near 90. Evidently, there can be more axes of tilt and/or rotation than illustrated by
(22) The invention can be further expanded by the shift of specimen 4, usually in three reciprocally perpendicular directions X, Y, and Z, but shifts in directions forming other angles are also possible if required by the application.
(23) The above mentioned options of other rotations and/or tilts of the specimen around the axes 5 and 6 along with the shift of the specimen, for example, in three reciprocally perpendicular directions allow for greater comfort during the carrying out of the above mentioned invention.
(24)
(25) The case which is illustrated in
(26) For the functioning of the invention it is also advantageous when the first set 7 of the manipulators allows for the tilt to around the axis 3.1 of the tilt at least in the interval of +10, 10 and when this tilt is smoothly adjustable.
(27) Advantageous configuration shown in
(28) Apart from the axes 8.1 and 9.1 of the columns,
(29) It is further advantageous when the lines of force of the first force field 8.2.1 of the first electromagnetic or electric scanning device 8.2 deviate from the axis 3 of the tilt of the first set 7 of manipulators by an angle of 90 or in the interval from 70 to 90. Due to this fact, the scanning connected to milling is performed in the same or nearly the same plane as the tilting of the milled surface around the axis 3.1 of the tilt of the first set 7 of manipulators. Scanning by the second force field 8.2.2 then serves to deviate the axis of the first particle beam in the direction towards the inside of the specimen 4, along the axis 3.1 of the tilt of the first set 7 of manipulators. Thanks to this, it is possible to examine the structures placed deeper under the surface. Similar effect, i.e. the shift of milling into the depth of the specimen, can also be achieved if the specimen 4 itself is shifted with respect to the column 8. The shift is possible by virtue of the auxiliary second set 10 of manipulators, which is described hereinafter. A combination of both methods is possible, i.e. the shift of the first particle beam and the shift of the specimen in the directions opposite to each other.
(30) It is also advantageous when the lines of force of the first force field 9.2.1 of the second electromagnetic or electric scanning device 9.2 deviate from the axis 3.1 of the tilt of the first set 7 of manipulators by an angle lying in the interval from 40 to 70, typically 55.
(31) Geometric parameters of the columns with particle beams usually lead to a convenient configuration, where the axis 3.1 of the tilt of the first set 7 of manipulators deviates from the axis 9.1 of the second column 9 by an angle lying in the interval from 20 to 50, typically 35. This position of the axis 3.1 of the tilt may be either fixed, or the axis 3.1 can be tilted into this position using the second set 10 of manipulators consisting of at least one manipulator, which is described in detail hereinafter. This position is advantageous with respect to the common configuration of columns, which is usually as follows: the axis 8.1 of the first column 8 deviates from the axis 9.1 of the second column 9 by an angle lying in the interval from 40-70, typically 55. In this position it is possible to mill with ease the surface which forms an angle in the interval from 0-30 with the axis 8.1 of the first column 8 and, at the same time even when tilting around the axis 3.1 of the tilt of the first set 7 of manipulators, to observe this surface by the particle beam passing through the column 9.
(32)
(33) In advantageous embodiments, the axis 3.1 of the tilt of the first set 7 of manipulators deviates from the third axis 5.1 and/or from the fourth axis 6.1 by an angle of 90 or the deviation lies in the interval from 70 to 90. In advantageous configurations, the axis 8.1 of the first column 8 deviates from the third axis 5.1 by an angle of 0-30 and/or the axis 9.1 of the second column 9 deviates from the fourth axis 6.1 by an angle of 90 or lying the interval from 70 to 90.
(34) For the sake of simplicity,
(35) Sources of the first and the second particle beam are any combinations selected from the group of sources: electrons, ions, metal ions, or plasma source. At the same time, it is convenient, if the source of the first column 8 is an ion one and the ion plasma source for faster milling, and if the source in the second column 9 is the electron one to avoid the surface destruction during the observation.
(36) The first column 8 and the second column 9 are equipped with components for beam focusing, usually with electromagnetic or electrostatic lenses. The image provided by the second particle beam uses the method which is applied in apparatuses with particle beams, which means that in consequence to the interaction of the second particle beam with the surface area of the specimen there is an emission of secondary particles or radiation, which can be further detected by relevant detectors, while the signal of these detectors is synchronized with scanning by the second particle beam.
(37) The apparatus based on the presented invention may, of course, also contain series of other components, additional columns with beams, detectors, measuring apparatuses and many others, which are not explicitly described herein.
INDUSTRIAL APPLICABILITY
(38) The presented method and apparatus are utilizable for milling and polishing of structures and for observation of these polished structures using apparatuses with particle beams. Thanks to this invention, it is possible to tilt the specimen in a way that a smooth, curtaining effect free surface of the specimen during the milling by one particle beam can be achieved. At the same time the specimen remains in the field of view of the first and the second particle beams. Due to the use of the second particle beam, it is possible to permanently or in selected intervals monitor and/or observe the milled surface without the need of further manipulation with the specimen and/or particle beam columns. Due to this possibility to observe the process of milling in the real time, there is no danger of destructing the observed structure, the process is fast and without inaccuracies which would otherwise be caused by the necessity of further manipulation with the specimen. This method and apparatus can be applied easily in all areas, where there is a need to examine a really smooth surface of the specimen without the artefacts of the curtaining effect type, while also enabling the real time control of the milling process. The presented invention may be, among other, used for the TSV structures and other semiconductor specimens examination, for the examination of polycrystalline specimens, to acquire the 3D image of the specimen structure, etc.