Printed Inductors for Wireless Charging
20180301273 ยท 2018-10-18
Inventors
- Jason Larson (San Lorenzo, CA, US)
- Mudhafar Hassan-Ali (Menlo Park, CA, US)
- Michael A. Oar (San Francisco, CA, US)
- Miguel A. Morales (Fremont, CA, US)
- Leonard H. Radzilowski (Palo Alto, CA, US)
- Yiliang Wu (San Ramon, CA, US)
- Barry C. Mathews (Fremont, CA)
Cpc classification
International classification
Abstract
An inductor that includes an electrically conductive construct, wherein the electrically conductive construct includes a first layer having a predetermined geometry, wherein the first layer includes at least one conductive material such as a metal; and a second layer oriented parallel to the first layer, wherein the second layer includes at least one soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer.
Claims
1. An inductor, comprising: an electrically conductive construct, wherein the electrically conductive construct includes: (i) a first layer having a predetermined geometry, wherein the first layer includes at least one conductive material; and (ii) a second layer oriented parallel to the first layer, wherein the second layer includes at least one soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer.
2. The inductor of claim 1, further comprising a substrate onto which the first and second layers have been deposited.
3. The inductor of claim 2, wherein the first and second layers have been deposited on the substrate by screen printing, stencil printing, dispense jet printing, paste extrusion, 3D printing, or combinations thereof.
4. The inductor of claim 2, wherein the substrate has been coated with a continuous layer of ferrite ink prior to deposition of the first and second layers on the substrate.
5. The inductor of claim 2, wherein the substrate further includes polyesters, polyamides, polyimides, polycarbonates, polyketones, polyethylene terephthalate, polyethylene naphthalate, or combinations thereof.
6. The inductor of claim 1, wherein the at least one conductive material is silver, copper, or a silver-tin mixture and wherein the at least one soft ferrite includes MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4.
7. The inductor of claim 1, further comprising additional electrically conductive constructs stacked on top of one another.
8. An inductor, comprising: an electrically conductive construct, wherein the electrically conductive construct includes: (i) a first layer, wherein the first layer includes at least one ink that contains a conductive material; (ii) a second layer oriented parallel to the first layer, wherein the second layer includes at least one ink that contains soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer; and (iii) a substrate onto which the first and second layers have been deposited.
9. The inductor of claim 8, wherein the first and second layers have been deposited on the substrate by screen printing, stencil printing, dispense jet printing, paste extrusion, 3D printing, or combinations thereof.
10. The inductor of claim 8, wherein the substrate has been coated with a continuous layer of ferrite ink prior to deposition of the first and second layers on the substrate.
11. The inductor of claim 8, wherein the substrate further includes polyesters, polyamides, polyimides, polycarbonates, polyketones, polyethylene terephthalate, polyethylene naphthalate, or combinations thereof.
12. The inductor of claim 8, wherein the at least one ink that contains a conductive material further includes silver, copper, or a silver-tin mixture.
13. The inductor of claim 8, wherein the at least one ink that includes a soft ferrite further includes MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4.
14. The inductor of claim 13, wherein the MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4 has been dispersed in a polymer resin binder with an organic solvent.
15. The inductor of claim 8, further comprising additional electrically conductive constructs stacked on top of one another.
16. An inductor, comprising: at least one electrically conductive construct, wherein the at least one electrically conductive construct includes: (i) a first layer, wherein the first layer includes at least one ink that contains a conductive material; (ii) a second layer oriented parallel to the first layer, wherein the second layer includes at least one ink that contains soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer; and (iii) a substrate onto which the first and second layers have been deposited by screen printing, stencil printing, dispense jet printing, paste extrusion, 3D printing, or combinations thereof, wherein the substrate has been coated with a continuous layer of ink that contains soft ferrite prior to deposition of the first and second layers on the substrate.
17. The inductor of claim 16, wherein the substrate further includes polyesters, polyamides, polyimides, polycarbonates, polyketones, polyethylene terephthalate, polyethylene naphthalate, or combinations thereof.
18. The inductor of claim 16, wherein the at least one ink that contains a conductive material further includes silver, copper, or a silver-tin mixture.
19. The inductor of claim 16, wherein the at least one ink that includes a soft ferrite further includes MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4.
20. The inductor of claim 19, wherein the MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4 has been dispersed in a polymer resin binder with an organic solvent.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The accompanying drawings, which are incorporated into and form a part of the specification, schematically illustrate one or more exemplary embodiments of the invention and, together with the general description given above and detailed description given below, serve to explain the principles of the invention, and wherein:
[0011]
DETAILED DESCRIPTION OF THE INVENTION
[0012] Exemplary embodiments of the present invention are now described with reference to the Figures. Reference numerals are used throughout the detailed description to refer to the various elements and structures. Although the following detailed description contains many specifics for the purposes of illustration, a person of ordinary skill in the art will appreciate that many variations and alterations to the following details are within the scope of the invention. Accordingly, the following embodiments of the invention are set forth without any loss of generality to, and without imposing limitations upon, the claimed invention.
[0013] With reference to the Figure,
[0014] With regard to the ferrite-containing materials used with the inductors of the present invention, in certain embodiments, the ferrites used are soft ferrites. Such ferrites typically contain nickel, zinc, and/or manganese compounds and exhibit low coercivity. Low coercivity indicates that magnetization of the ferrite material can easily reverse direction without significant energy dissipation (hysteresis losses), while the high resistivity of the material prevents eddy currents in its core, which are another source of energy loss. Because of their comparatively low losses at high frequencies, soft ferrites are used extensively in the cores of RF transformers and inductors. The most common soft ferrites are manganese-zinc ferrite (MnZn Fe.sub.2O.sub.4) and nickel-zinc ferrite (NiZn Fe.sub.2O.sub.4). MnZn ferrite typically exhibits higher permeability and saturation induction than NiZn ferrite, and NiZn ferrite typically exhibits higher resistivity than MnZn ferrite, and is therefore more suitable for frequencies above 1 MHz.
[0015] Prior art inductors are typically fabricated directly on printed circuit boards and then layered with sheets of ferrite material. This type of construction results in greater thickness and weight than a printed coil or layers and lacks the benefit of parallel metal and ferrite coils or layers. The printable inductors of the present invention may be created by screen printing the metallic and ferrite materials onto flexible plastic film. The ferrite inks used with this invention are formulated using particles of MnZn Fe.sub.2O.sub.4 or NiZn Fe.sub.2O.sub.4 dispersed in a polymer resin binder with an organic solvent. Table 1, below, provides three examples of the ferrite inks of the present invention. In these embodiments, the metallic (e.g., silver) layer was printed and dried, then the soft ferrite layer was printed on the same substrate and again dried. The concentration of the solvent component (e.g., diethylene glycol monoethyl ether) may be varied to optimize printability. Table 2 provides the inductance of the ferrite inks of this invention. With regard to the data presented in Table2, the ink was coated onto polyethylene terephthalate (PET) film with draw-down coater and cured at 120 C. for 30 minutes. A test coil in air demonstrated an inductance of 13.42 H. With regard to net increases shown in Table 2, the data represents the net increase over he inductance of the test coil in air (13.42 H).
TABLE-US-00001 TABLE 1 Ferrite Ink Formulations Example 1 Example 2 Example 3 Ingredient % Ingredient % Ingredient % PPT FP350 Ferrite 75 Steward 73321-B Ferrite 75 Steward 73321-B Ferrite 78.95 (NiZn Fe.sub.2O.sub.4) (MnZn Fe.sub.2O.sub.4) (MnZn Fe.sub.2O.sub.4) PKHH, phenoxy resin 8 PKHH, phenoxy resin 8 EpoTek 323-LP epoxy resin 10.18 Diethylene glycol 17 Diethylene glycol 17 EpoTek 323-LP 0.35 monoethyl ether monoethyl ether epoxy hardener (BP 202 C.)* Dow D.E.R. 723 10.52 reactive diluent 100 100 100
TABLE-US-00002 TABLE 2 Inductance of Ferrite Ink Formulations Example 1 Example 2 Example 3 Thickness Inductance Thickness Inductance Thickness Inductance 30.0 m 13.64 H 25.0 m 13.65 H 30 m 13.90 H 37.5 m 13.70 H 37.5 m 13.73 H 62 m 14.30 H 43.7 m 13.70 H 50.0 m 13.82 H 87 m 14.60 H 56.3 m 13.90 H 56.3 m 14.05 H 125 m 14.90 H Net 3.6% Net 4.7% 150 m 15.10 H Slope 0.009 H/m Slope 0.011 H/m Net 12.5% Slope 0.011 H/m
[0016] In some embodiments of this invention, silver and ferrite coils are printed onto a substrate. In some embodiments, the substrate includes polyesters, polyamides, polyimides, polycarbonates, polyketones, or combinations thereof. In other embodiments, the substrate includes polyethylene naphthalate or is configured as a flexible polyethylene terephthalate (PET) film carrier. In other embodiments, the coils are printed onto a continuous layer of ferrite ink that is first coated on the PET film carrier. The ferrite layer may also be printed on the opposite side of the PET film carrier without appreciable loss of the inductance increase, provided the thickness of the film carrier is not substantially greater than 50 micrometers. With reference to Table 3, below, inductance measurements taken on these printed structures demonstrated increased inductance compared to a printed silver coil that lacked a corresponding parallel ferrite layer. Even greater gains were observed when the coils or layers were printed on the ferrite layer. With regard to the data presented below, the test structures were screen printed on a PET film beginning with either the metal coil layer (Coils 1 and 2) or the continuous ferrite layer (Coils 3 and 4). The structures tested were 45 mm in diameter, although other diameters are possible with this invention, as are various numbers of turns in the coils and trace widths. Specific values for these parameters are determined based on particular applications for printed inductor 10. With regard to the thickness of the metal and ferrite layers or regions, various thicknesses are possible; however, the metal regions should typically not be equal to or less than the ferrite regions in thickness.
TABLE-US-00003 TABLE 3 Performance of Screen Printed Ag/Ferrite Inductors Coil 1 Coil 2 Coil 3 Coil 4 Substrate PET film PET film PET film PET film Printed ESL 1908 Ag Ink ESL 1908 Ag ink Ferrite layer Ferrite layer layer 1 200 mesh screen, 200 mesh screen, (draw down (draw down 50 m thick 50 m thick coater, 65 m coater, 65 m emulsion (30 m emulsion (30 m thick print) thick print) thick print) thick print) Printed MnZn ferrite ink ESL 1908 Ag ESL 1908 Ag ink layer 2 200 mesh screen, ink 200 mesh screen, 75 m thick 200 mesh screen, 50 m thick emulsion 50 m thick emulsion (30 m (60 m thick print emulsion (30 m thick print) after two passes) thick print) Printed MnZn ferrite ink layer 3 200 mesh screen, 75 m thick emulsion (60 m thick print after two passes) Inductance 1.53 H 1.55 H 1.68 H 1.74 H Net 1.3% 9.8% 13.7% increase* Coil 7.9 ohms 8.4 ohms 9.9 ohms 9.9 ohms resistance *Increase in inductance over metal coil (i.e., Coil 1) at 100 kHz.
[0017] In summary, the materials included in various exemplary embodiments of this invention include silver flake ink; MnZn Fe.sub.2O.sub.4 and NiZn Fe.sub.2O.sub.4 powder; binder and solvent; and a PET film carrier. An exemplary method or process of this invention involves screen printing a layer of silver ink in the shape of a coil, and then screen printing ink containing a soft ferrite in a second layer that is in between and parallel to the turns of the coil. The inductance of the silver coil with and without a ferrite layer and substrate layer was measured to demonstrate effectiveness and functionality (see Tables above). The soft ferrite layer was demonstrated to increase inductance by at least 4% when combined with a ferrite bottom layer. Increasing the packing density of ferrite particles in printed ink may be used to increase the enhancement effect. Screen printing was demonstrated to give good spatial registration between coils. A dispensing system (e.g., screen printing, dispense jet printing, paste extrusion, or 3D printing) may also be utilized for printing conformally over 3D surfaces or to give thicker prints. Alternate embodiments include formulating ferrite inks with improved packing density and printing ferrite ink in open areas inside and outside of the silver coil.
[0018] In some embodiments of the present invention, multiple printed metal-ferrite inductors are stacked on top of one another and the endpoints of the metal layers included therein are electrically interconnected to form a three-dimensional inductor. The ferrite layers included therein may form a continuous phase in the stacking direction with the ferrite remaining substantially parallel to the metal. The metallic layers of each inductor do not touch each other between the individual inductors and a thin dielectric is typically included to isolate the individual inductors from one another.
[0019] While the present invention has been illustrated by the description of exemplary embodiments thereof, and while the embodiments have been described in certain detail, there is no intention to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. Therefore, the invention in its broader aspects is not limited to any of the specific details, representative devices and methods, and/or illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the spirit or scope of the general inventive concept.