HEAT TREATING FURNACE

Abstract

A heat treating furnace of the type used in semiconductor manufacturing having a housing with a tubular and cylindrical inner layer constructed of ceramic fiber. Electrical heating elements are supported by the inner layer while a microporous silica layer surrounds and is in contact with the ceramic fiber layer. A rigid cover surrounds the microporous silica layer.

Claims

1. A heat treating furnace comprising a tubular and cylindrical inner layer constructed of ceramic fiber; heating elements supported by radially inner portion of said inner layer; microporous silica layer surrounding said ceramic fiber layer, the silica layer including solid particles having a spacing between particles less than the mean free path of movement of air particles; a rigid cover in contact with and surrounding said silica layer.

2. The invention as defined by claim 1 wherein said microporous silica layer comprises a pair of radially spaced apart and parallel mats constructed of heat resistant material and microporous silica contained between said mats.

3. The invention as defined by claim 2 wherein said mats are sewn together.

4. The invention as defined by claim 1 wherein said cover is constructed of metal.

5. The invention as defined by claim 4 wherein said cover comprises stainless steel.

6. (canceled)

7. The invention as defined by claim 6 wherein the particle size of said silica solid particles is in the range of 1-65 nanometers.

8. The invention as defined by claim 7 wherein said particle size of said silica solid particles is in the range of 10-20 nanometers.

9. The invention as defined by claim 8 wherein said particle size of said silica solid particles is about 10 nanometers.

Description

BRIEF DESCRIPTION OF THE DRAWING

[0011] A better understanding of the present invention will be had upon reference to the following detailed description when read in conjunction with the accompanying drawing, wherein like reference characters refer to like parts throughout the several views, and in which:

[0012] FIG. 1 is an elevational view illustrating a furnace of a preferred embodiment of the present invention;

[0013] FIG. 2 is an elevational sectional view;

[0014] FIG. 3 is a fragmentary view of the heating coils; and

[0015] FIG. 4 is a cross-sectional view with parts removed for clarity.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT OF THE PRESENT INVENTION

[0016] With reference first to FIGS. 1 and 4, an electrical furnace 10 of the type used for the manufacturing of semiconductor materials is shown. The furnace 10 includes an elongated cylindrical chamber 14 surrounded by an insulation tube 15, typically made of quartz, dimensioned to receive one or more trays or boats of semiconductor wafers so that all of the wafers are positioned within the interior of the furnace 10.

[0017] As best shown in FIGS. 2-4, a ceramic fiber inner layer 16 surrounds the furnace chamber 14. The ceramic fiber 16 is rigid in construction and supports a plurality of electrical heating elements 18 which are open to the chamber 14. Consequently, once the electrical heating elements 18 are connected to a source of electrical power, the heating elements heat the interior chamber 14 of the furnace 10 to the desired temperature necessary to process semiconductor wafers positioned within the furnace chamber 14. Furthermore, the ceramic fiber layer 16 and the electrical heating elements 18 are conventional in construction. As such, further description thereof is unnecessary.

[0018] With reference now particularly to FIGS. 2 and 4, the ceramic fiber layer 16 is surrounded by an insulation layer 20. As used herein, the terms microporous insulation includes insulation materials comprising compacted powder or fibers with an average interconnecting pore size comparable to or below the mean free path of air molecules at standard atmospheric pressure. Microporous insulation may contain opacifiers to reduce the amount of radiant heat transmitted. Microporous insulation describes insulation materials having pores which are generally less than 100 nm in size. The insulation layer 20 is constructed from fumed silica so that the silica particles are solid in cross section. The fumed silica, furthermore, has a mean particle size of approximately 10 nanometers. Consequently, close spacing between adjacent particles results in particle spacing less than the mean free path of air molecules. This, in turn, greatly reduces air-to-air conduction of heat through the insulating layer 20.

[0019] With reference to FIG. 4, the fumed particles which form the insulation layer 20 are weakly bonded together and friable in nature and do not adhere to each other. Consequently, in order to maintain the fumed silica particles within the layer 20, the fumed silica particles are sandwiched between two mats 22 and 24 constructed of a heat insulating material. Preferably, the two insulation retaining layers 22 and 24 are stitched together in a quilted pattern thus maintaining a substantially even distribution of the fumed silica particles within the mat 20 around the entire circumfery of the furnace chamber 14.

[0020] The layer 20 of fumed silica particles is then covered by a thin, rigid metal cover 26 which extends entirely around the furnace. The heating coils 18 are then connected to electrical power through electrical connections formed through the furnace in any conventional fashion.

[0021] In practice, the fine solid particles formed from fumed silica forming the outer layer 20 of insulation for the furnace effectively reduce the air-to-air heat conduction through the insulating layer 20. This, in turn, retains more heat within the interior of the furnace thus reducing power consumption of the furnace in use. Furthermore, since the transfer of heat radially outwardly from the treatment chamber 14 is reduced, the outer temperature of the outer metal housing for the furnace 10 is cooler than the previously known furnaces of the same size. This, in turn, reduces the energy consumption and equipment necessary to remove heat from the outside of the furnace during operation of the furnace and, particularly, when multiple furnaces are contained within the same building portion.

[0022] From the foregoing, it can be seen that the present invention provides a simple yet effective furnace for manufacturing semiconductor components. Having described my invention, however, many modifications thereto will become apparent to those skilled in the art to which it pertains without deviation from the spirit of the invention as defined by the scope of the appended claims.