MANUFACTURING PROCESS OF A SOLID THERMAL BALANCING COMPOSITE MATERIAL WITH LIGHTWEIGHT
20180281244 ยท 2018-10-04
Inventors
Cpc classification
B29C43/146
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/18
PERFORMING OPERATIONS; TRANSPORTING
B29C43/021
PERFORMING OPERATIONS; TRANSPORTING
B29C43/006
PERFORMING OPERATIONS; TRANSPORTING
B29C2043/023
PERFORMING OPERATIONS; TRANSPORTING
B29K2505/00
PERFORMING OPERATIONS; TRANSPORTING
B29C43/003
PERFORMING OPERATIONS; TRANSPORTING
B29B9/16
PERFORMING OPERATIONS; TRANSPORTING
B29K2105/251
PERFORMING OPERATIONS; TRANSPORTING
B29K2105/0097
PERFORMING OPERATIONS; TRANSPORTING
B29K2105/12
PERFORMING OPERATIONS; TRANSPORTING
B29C2043/147
PERFORMING OPERATIONS; TRANSPORTING
B29B7/90
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C43/02
PERFORMING OPERATIONS; TRANSPORTING
B29C43/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications in heat dissipation.
Claims
1. A manufacturing process of a solid thermal balancing composite material with lightweight, comprising: a. providing a reinforced composite material formed by mixture of inorganic filler powders and polymer adhesives after granulation, said inorganic filler powders mixed with carbon fibers or polymer fibers having a length ranging from 10 nm to 10 um for reinforcement, forming a reinforced material to be reinforced composite material with a diameter from 300 um to 3.5 mm after granulation, said inorganic filler powders selected from a group consisting of graphite, graphene, carbon materials, and inorganic materials with high thermal conductivity; b. providing a powder filling equipment and pouring said reinforced composite material therein; c. providing a molding machine including an upper half and a lower half, said reinforced composite material poured in said molding machine and performed pressure process for at least once, said pressure process including preliminary pressure and secondary pressure, among which each remaining a constant pressure for at least 3 seconds for solidification, forming a solid thermal balancing composite material with a heat dissipation structure; and d. ejecting said solid thermal balancing composite material from said molding machine, said solid thermal balancing composite material having a specific gravity no greater than 2.0.
2. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 1, further comprising step e. providing a plurality of metal particles formed by metal powders with a value of thermal conductivity greater than 90 W/mk and a diameter ranging from 1 nm to 1 mm, and step f. mixing said metal particles with high thermal conductivity with said reinforced composite material before poured into said powder filling equipment.
3. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 1, wherein a weight percentage of said inorganic filler powders ranges from 80%-95% and a weight percentage of said polymer adhesive ranges from 5%-20% correspondingly.
4. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 2, wherein a weight percentage of said metal particles ranges from 10%-25% and a weight percentage of said reinforced composite material ranges from 75%-90% correspondingly.
5. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 1, wherein said polymer adhesive is asphalt, polyvinyl alcohol, polyvinyl acetate, polyimide, polyurethane, polyethylene glycol, polyethylene, polyvinyl chloride, phenolic resin, epoxide, polymethyl methacrylate, or fusible polymer materials, and said inorganic materials with high thermal conductivity are made of layered inorganic materials of silica, boron nitride, aluminum nitride, silicon carbide, diamonds, or mica.
6. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 1, wherein said solid thermal balancing composite material further includes a protection layer of polymer adhesives formed by dipping, molding or spraying thereon.
7. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 1, wherein said solid thermal balancing composite material is molded into a flat piece or a shape according to contours of a pre-determined product to be applied on.
8. The manufacturing process of a solid thermal balancing composite material with lightweight as claimed in claim 7, wherein a protection frame further engages around periphery of said solid thermal balancing composite material, said protection frame having an outer frame engaging an engaging frame.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0030] Referring to
[0031] Step a: providing a reinforced composite material 14 formed by mixture of inorganic filler powders 11 and polymer adhesives 12 after granulation. The inorganic filler powders 11 are mixed with carbon fibers or polymer fibers 13 having a length ranging from 10 nm to 10 um for reinforcement, forming a reinforced material to be reinforced composite material 14 with a diameter from 300 um to 3.5 mm after granulation. The inorganic filler powders 11 are selected from a group consisting of graphite, graphene, carbon materials, and inorganic materials with high thermal conductivity, and the inorganic materials with high thermal conductivity are made of layered inorganic materials of silica, boron nitride, aluminum nitride, silicon carbide, diamonds, or mica.
[0032] The graphite and carbon materials conduct thermal energy efficiently, but structural strength of these materials is not strong enough. Therefore, the carbon fibers or polymer fibers 13 with a length from 10 nm to 10 um are added for reinforcement of the inorganic filler powders, so as to form a reinforced composite material 14 with a diameter from 300 um to 3.5 mm after granulation.
[0033] In this embodiment, the granulation process has a liquid solution dissolving the polymer adhesives 12 and then mixing with the inorganic powders 11, or has the polymer adhesives 12 and the inorganic powders 11 heated for producing the reinforced composite material 14. The weight percentage of the inorganic filler powders 11 ranges from 80%-95% and the weight percentage of the polymer adhesive 12 ranges from 5%-20% correspondingly. In a preferred embodiment, a proportion between the inorganic filler powders 11 and the polymer adhesive 12 is 85%:15%. The polymer adhesive 12 is soluble materials such as asphalt, polyvinyl alcohol, polyvinyl acetate, polyimide, polyurethane, polyethylene glycol, polyethylene, polyvinyl chloride, phenolic resin, epoxide, polymethyl methacrylate, or fusible polymer materials.
[0034] Step b. providing a powder filling equipment 20 and pouring the reinforced composite material 11 therein for transportation.
[0035] Step c. providing a molding machine 30 including an upper half 40 and a lower half 50. The reinforced composite material 11 is then poured in the molding machine 30 and performed pressure process for a number of times N, where N1. The pressure process includes preliminary pressure and secondary pressure, each of which remains a constant pressure for at least 3 seconds for solidification, so as to form a solid thermal balancing composite material 10 with a heat dissipation structure.
[0036] In this embodiment, the powder filling machine 20 either regularly or continuously adds the reinforced composite material 11 into the molding machine 30, and then the molding machine 30 perform a constant pressure force between 30 MPa to 300 MPa for at least 3 seconds before ejection of the molded material.
[0037] Step d. ejecting the solid thermal balancing composite material 10 from the molding machine 30. The solid thermal balancing composite material 10 has a specific gravity equals to or less than 2.0. The thickness of the solid thermal balancing composite material 10 in a direction of Z-axis is greater than 0.5 mm.
[0038] A bottom surface 101 of the solid thermal balancing composite material 10 is a flat surface or arranged in a shape according to contours of a heat source it is to be disposed on. A top surface 102 of the solid thermal balancing composite material 10 is wavy or in shapes of fins to enhance the dissipation in the Z-axis direction. With the reinforced composite material 14 and the molding process, the solid thermal balancing composite material 10 does not have a problem of interlaminar peeling because unlike materials made of graphite sheets, it is not formed by van der Waals forces; but still, it remains its thermal dissipation characteristics. Also, graphite sheets cannot be made into different shapes but only flat pieces. Metal radiators can be made into shapes of fins but it requires multiple steps in manufacturing process and spaces for placement.
[0039] In this embodiment, the solid thermal balancing composite material 10 further includes a protection layer 103 of polymer adhesives formed by dipping, molding or spraying thereon, preventing the powders from falling and thereby enhancing its stability. In addition, the solid thermal balancing composite material 10 is molded into a flat piece or a shape according to contours of a pre-determined product to be applied on. A protection frame 16 further engages around periphery of the solid thermal balancing composite material 10 for holding the structure firm as shown in
[0040] In a preferred embodiment, the present invention further includes step e. providing a plurality of metal particles 15 formed by metal powders with a value of thermal conductivity greater than 90 W/mk and a diameter ranging from 1 nm to 1 mm, and step f. mixing the metal particles 15 with the reinforced composite material 14 before poured into the powder filling equipment 20. In this embodiment, the metal particles 15 with high thermal conductivity is selected from a group consisting of gold, silver, copper, iron, aluminum, titanium, and alloy of any two of them. A proportion between the metal particles 15 and the reinforced composite material 14 ranges from 10%:90% to 25%:75%. The metal particles 15 enhance thermal dissipation in the Z-axis direction, and with such combination, the thermal dissipation is performed evenly within a comparatively short period than products in the prior art.
[0041] The molding machine 30 in Step c. can be vertical or rotational for operation. In an applicable embodiment, the molding machine 30 is vertical and a molding process thereby is shown in
[0042]
[0043] With the flexible characteristics of the materials, the compression process is performed by a preliminary pressure and then a secondary pressure, each remaining a constant pressure for at least 3 seconds for solidification to form the solid thermal balancing composite material 14. Otherwise upon the upper mold core 42 leaving the lower mold core 52, the reinforced composite material 14 would inflate, failing to form the solid composite material. Therefore, the constant pressure is a necessity in the present invention.
[0044] Further with reference to
[0045] The following chart is a recordation of a heat dissipation experiment. It is a comparison of a solid thermal balancing composite material 10 without metal particles 15, a solid thermal balancing composite material 10 with metal particles 15, and a conventional heat sink made of copper or aluminum. The pieces have a length of 58 mm, a width of 29 mm, and a thickness of 2.4 mm. There are 4 sensors arranged on each piece as shown in
TABLE-US-00001 Heat Source Temperature: 105 C./ Environment Temperature: 23.8 C. Solid thermal Solid thermal balancing balancing composite composite Conventional material without material without heat sink metal particles metal particles (Specific gravity (Specific gravity (Specific gravity 2.7) 1.9) 2.0) Temperature 64.6 C. 48.5 C. 48.1 C. at Sensor 1 Temperature 40.4 C. 31.5 C. 32.1 C. at Sensor 2 Temperature 40.2 C. 31.4 C. 31.6 C. at Sensor 3 Temperature 38.7 C. 30.9 C. 31.2 C. at Sensor 4
[0046] We can learn from the chart that the temperature detected on the solid thermal balancing composite material without metal particles at Sensor 1 and Sensor 2 are lower than the ones detected on the conventional heat sink, and the temperature detected on the solid thermal balancing composite material with metal particles at Sensor 1 is even lower than the previous degrees but the temperature at Sensor 2 is only slightly higher than the composite material without metal particles, indicating that the heat energy is dissipated effectively. A similar result is shown by the degrees detected by Sensor 3 and 4.
[0047] In short, the present invention is able to provide a solid thermal balancing composite material 14 formed by pressure molding with enhanced structure and a specific gravity no more than 2.0. Comparing to conventional heat sinks made of metals such as copper and aluminum, it has a lighter weight than the specific gravity of copper 8.9 and aluminum 2.7. In addition, the graphite materials or layered inorganic materials in the present invention have high thermal conductivity in a direction of XY-plane, further conducting the heat effectively. With mixture of the metal particles with high thermal conductivity 15 and reinforced composite material 14, the solid thermal balancing composite material 10 can further dissipate the heat in the direction along Z-axis as well, so as to achieve a rapid and even dissipation. Also, the solid thermal balancing composite material 10 can be produced in a great quantity within a short period with the molding process.
[0048] Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.