Method for producing substrates

Abstract

Proposed herein is a method for producing substrates, particularly those of synthetic quartz glass, while saving the substrate surface from killer defects without resorting to any large-scale apparatus and precision polishing plate, thereby reducing defects and improving yields more than in production with conventional facilities. The method for producing substrates by polishing, includes steps of placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of the substrate stocks, with the surface of the substrate stocks being coated with an impact-absorbing liquid and the lower polishing plate being rotated, and rotating the upper and lower polishing plates, with the surface of the substrate stocks being accompanied by a polishing slurry.

Claims

1. A method for producing substrates, comprising the steps of: placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with each of surfaces of said substrate stocks, each of the surfaces of said substrate stocks coated with an impact-absorbing liquid, while rotating said lower polishing plate, and polishing each of the surfaces of said substrate stocks by a polishing slurry, while rotating said upper and lower polishing plates, wherein said impact-absorbing liquid is an aqueous solution containing at least one species selected from glycols, polyacrylic acid and derivatives thereof, poly(meth)acrylic acid and derivatives thereof, diethanolamine, and triethanolamine.

2. The method for producing substrates of claim 1, wherein said upper polishing plate is brought into contact with each of the surfaces of said substrate stocks, with said lower polishing plate rotating at 1 rpm to 4 rpm.

3. The method for producing substrates of claim 1, wherein said impact-absorbing liquid has a viscosity of 10 mPa.Math.s to 100 mPa.Math.s at 20 C.

4. The method for producing substrates of claim 1, wherein said upper polishing plate is moved to the surface of substrate stocks until said upper polishing plate comes into contact with the each of the surfaces of substrate stocks at speed of 5 mm/second or more and 20 mm/second or less.

5. The method for producing substrates of claim 1, wherein said polishing slurry is an aqueous dispersion containing at least one species of abrasive grains selected from the group consisting of alumina abrasive grains, silicon carbide abrasive grains, and zirconium oxide abrasive gains.

6. The method for producing substrates of claim 1, wherein said substrate stocks have a thickness of 0.1 mm to 7 mm before polishing.

7. The method for producing substrates of claim 1, wherein said substrate stocks are synthetic quartz glass.

8. The method for producing substrates of claim 1, wherein said polishing step corresponds to a lapping step.

9. A method for producing substrates, comprising the steps of: placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with each of surfaces of said substrate stocks, each of the surfaces of said substrate stocks coated with an impact-absorbing liquid, while rotating said lower polishing plate, and polishing each of the surfaces of said substrate stocks by a polishing slurry, while rotating said upper and lower polishing plates, wherein said impact-absorbing liquid has a viscosity of 10 mPa.Math.s to 100 mPa.Math.s at 20 C.

10. The method for producing substrates of claim 9, wherein said upper polishing plate is brought into contact with each of the surfaces of said substrate stocks, with said lower polishing plate rotating at 1 rpm to 4 rpm.

11. The method for producing substrates of claim 9, wherein said upper polishing plate is moved to the surface of substrate stocks until said upper polishing plate comes into contact with the each of the surfaces of substrate stocks at speed of 5 mm/second or more and 20 mm/second or less.

12. The method for producing substrates of claim 9, wherein said polishing slurry is an aqueous dispersion containing at least one species of abrasive grains selected from the group consisting of alumina abrasive grains, silicon carbide abrasive grains, and zirconium oxide abrasive gains.

13. The method for producing substrates of claim 9, wherein said substrate stocks have a thickness of 0.1 mm to 7 mm before polishing.

14. The method for producing substrates of claim 9, wherein said substrate stocks are synthetic quartz glass.

15. The method for producing substrates of claim 9, wherein said polishing step corresponds to a lapping step.

Description

BRIEF DESCRIPTION OF THE DRAWING

(1) FIG. 1 is a schematic diagram showing one example of a both sides polishing apparatus used in examples of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

(2) The present invention will be described below with reference to the accompanying drawing.

(3) According to the present invention, the method for producing substrates by polishing includes steps of placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of the substrate stocks, with the surface of the substrate stocks (in the work holes) being coated with an impact-absorbing liquid and the lower polishing plate being rotated, so that the upper polishing plate gently comes into contact with the surface of substrate stocks, with the amount of touching force reduced.

(4) According to the present invention, the method for producing substrates may be applied by employing a both sides polishing apparatus shown in FIG. 1. A polishing apparatus 1 includes an upper polishing plate 2 capable of vertical movement, a lower polishing plate 3 facing the upper polishing plate 2, and a plurality of carriers 5 arranged at equal intervals around a rotating shaft 4 of the lower polishing plate 3. Each carrier has a plurality of work holes 7 which hold substrate stocks (works) 6. Each work hole holds one substrate stock. The carrier is thinner than the substrate stocks, so that the substrate stocks 6 are polished as the upper polishing plate 2 moves downward to hold the substrate stocks between the upper polishing plate 2 and the lower polishing plate 3 and the upper polishing plate 2 is rotated in the direction of arrow a (at a prescribed speed) around a rotating shaft 8 thereof and the lower polishing plate 3 is rotated in the direction of arrow b around the rotating shaft 4 of the lower polishing plate 3 and the carrier 5 is rotated in the direction of arrow c or arrow d, with a polishing slurry (not shown) being supplied to the interface between the upper polishing plate 2 and the substrate stocks 6.

(5) If the upper polishing plate is brought downward vertically into contact with the substrate stocks held in the work holes in the carrier on the lower polishing plate which remains stationary, then the substrate stocks receive a force having only one vertical component. This force, if excessively large, will damage the surface of the substrate stocks when the upper polishing plate comes into contact with the surface of the substrate stocks.

(6) However, in the case where the lower polishing plate is rotating when the upper polishing plate comes into contact with the surface of the substrate stocks held in the work holes on the lower polishing plate, the surface of the substrate stocks receives a resultant force composed of vertical component (due to downward motion of the upper polishing plate) and horizontal component (due to the rotation of the lower polishing plate). In other words, the resultant vector applied to the substrate stocks at the time of contact with the upper polishing plate is inclined toward the horizontal direction from the vertical direction with respect to the substrate stocks. Thus, it is possible to reduce the vertical force largely responsible for serious damages to the substrate stocks.

(7) Moreover, application of an impact-absorbing liquid onto the surface of substrate stocks in advance protects the substrate stocks from impact in the vertical direction that occurs when the upper polishing plate comes into contact with the surface of substrate stocks. This step may be accomplished by placing substrate stocks in a vessel holding an impact-absorbing liquid or by spraying the substrate stocks (held in the working carrier) with an impact-absorbing liquid.

(8) The thus applied impact-absorbing liquid reduces various defects which would otherwise occur on the surface of substrate stocks. Such defects include crow's track, macroscratch, etc. defined in Japanese Industrial Standards (JIS) H 0614.

(9) The impact-absorbing liquid becomes irregular in coating thickness due to surface tension as time goes on after its application onto the surface of substrate stocks. However, the coating thickness remains uniform if the lower polishing plate is rotated so that a force in the horizontal direction is applied to the liquid coating on the surface of substrate stocks. Also, the rotation of the lower polishing plate protects the substrate stocks from irregular pressure which is applied by the upper polishing plate when the upper polishing plate comes into contact with the substrate stocks.

(10) The impact-absorbing liquid should preferably be an aqueous liquid containing at least one species selected from glycols such as ethylene glycol, propylene glycol, polyethylene glycol, and polypropylene glycol; polyacrylic acid and derivatives thereof such as polyacrylic acid and sodium polyacrylate: poly(meth)acrylic acid and derivatives thereof such as poly(meth)acrylic acid and sodium poly(meth)acrylate; diethanolamine, and triethanolamine.

(11) The impact-absorbing liquid should have a viscosity of 10 mPa.Math.s to 100 mPa.Math.s, preferably 10 mPa.Math.s to 70 mPa.Math.s, more preferably 20 mPa.Math.s to 50 mPa.Math.s, at 20 C. This requirement is set so that the impact-absorbing liquid freely flows and evenly spreads over the surface of substrate stocks, thereby effectively avoiding irregular pressure applied by the upper polishing plate. In the present invention, the above-mentioned viscosity may be measured by using a viscometer Model TVC-7, made by Toki Sangyo Co., Ltd.

(12) While the upper polishing plate is coming into contact with the surface of substrate stocks, the lower polishing plate should rotate at 1 rpm to 4 rpm, preferably 2 rpm to 4 rpm, so that damages to the substrate stocks are minimal. The direction of rotation is not specifically restricted. It is desirable that the upper and lower polishing plates should turn oppositely to each other, so that the upper polishing plate rotates at a high horizontal speed relative to the surface of substrate stocks and the surface of substrate stocks receives a force in the direction inclined toward the horizontal due to the combination of the vertical force applied by the upper polishing plate and the horizontal force applied by the rotating substrate stocks.

(13) The upper polishing plate should be lowered at a speed of 5 mm/second to 20 mm/second, preferably 5 mm/second to 15 mm/second, more preferably 5 mm/second to 10 mm/second, in consideration of damages to the substrate stocks and evaporation of the impact-absorbing liquid.

(14) After the upper polishing plate has come into contact with the surface of substrate stocks, polishing may be accomplished under ordinary conditions for the rotational speed and polishing pressure of the upper and lower polishing plates.

(15) The polishing slurry to be applied to the surface of substrate stocks at the time of polishing should contain abrasive grains selected from those of alumina, silicon carbide, and zirconium oxide. Such abrasive grains should have a primary particle diameter in the range of 0.5 m to 50 m, preferably 0.5 m to 30 m, more preferably 0.5 m to 10 m. This requirement is set in consideration of the vulnerability of the substrate surface to damages caused by polishing. Incidentally, the particle diameter of the abrasive grains may be determined by using the zeta potential and particle diameter measuring system, ELSZ-1000ZS, made by Otsuka Electronics Co., Ltd.

(16) The abrasive grain may be commercial one or may be used in the form of aqueous dispersion (in pure water) of solid abrasive grains. An example of alumina abrasive grain is that of FO series available from Fujimi Incorporated. An example of silicon carbide abrasive grain is that of GP series and GC series available from Shinano Electric Refining Co., Ltd. and Fujimi Incorporated, respectively. An example of zirconium oxide abrasive grain is that of MZ series, DK-3CH series, and FSD series available from Daiichi Kigenso Kagaku Kogyo Co., Ltd.

(17) The method of the present invention should preferably be applied to production of substrates from synthetic quartz glass. Such substrates may be obtained through the steps of ingoting synthetic quartz glass, annealing, slicing, edging, lapping, and polishing both sides for mirror finish. The method of the present invention may also be applied to production of substrates from soda lime glass, silicon wafer, sapphire, gallium nitride, lithium tantalite, etc. by the same steps as mentioned above.

(18) The method of the present invention may be applied to any substrate without specific restrictions on its size and thickness. It produces its maximum effect when applied to thin substrates with a thickness ranging from 0.1 mm to 7 mm, preferably 0.1 mm to 1 mm. Although thin substrates are usually vulnerable to damages to their surface during processing, especially due to impacts that occur when the upper polishing plate comes into contact with substrates, it is possible to avoid such damages, thereby remarkably reducing the level of defectiveness, with the method of the present invention.

(19) The substrate to be fabricated by the method of the present invention may be square or circular in shape. Square substrates measure 6-inch square and 6.35 mm in thickness (corresponding to 6025 substrate), 6-inch square and 2.3 mm in thickness (corresponding to 6009 substrate), 6-inch square and 0.35 mm in thickness, and 400 mm-square and 1.0 mm in thickness. Circular substrates (in the form of wafer) measure 6 inches, 8 inches, and 12 inches in diameter, with a thickness ranging from 0.1 mm to 0.5 mm. These substrate stocks are suitable for polishing by the method of the present invention.

(20) The method of the present invention may be applied usually to the batch-wise polishing of both sides. However, it may also be applied to the polishing of single side in the sheet-fed mode. Either way of polishing includes the step of bringing the polishing plate into contact with the substrate stocks.

EXAMPLES

(21) The present invention will be described below to demonstrate its effect with reference to Working Examples and Comparative Examples, which are not intended to restrict the scope thereof.

Working Examples 1 to 6

(22) Polishing was performed as follows on the substrate stocks of synthetic quartz glass (8 inches in diameter and 0.3 mm in thickness) which are held in the work hole shown in FIG. 1. The upper polishing plate was brought into contact with the substrate stocks, while the lower polishing plate was rotating, under the conditions shown in Table 1. The substrate stocks had their surface coated with an impact-absorbing liquid, which is an aqueous solution of ethylene glycol having a viscosity of 18 mPa.Math.s at 20 C. The upper polishing plate in contact with the surface of the substrate stocks was rotated, with the interface between the substrate surface and the upper polishing plate being supplied with a slurry composed of pure water and silicon carbide abrasive grains called Shinanorundum GP #4000, made by Shinano Electric Refining Co., Ltd. In each example, hundred pieces of substrate stocks underwent polishing. After polishing, the specimens were examined for flaws to count the percent defective. Any specimen was regarded as defective if it has on its surface one or more flaws (such as crow's track and macroscratch) defined in JIS H 0614.

(23) Incidentally, polishing was performed by using a polishing machine, 16BF for two-side polishing available from Hamai Co., Ltd.

(24) TABLE-US-00001 TABLE 1 Descending speed Rotating speed Working of upper of lower Percent defective Example polishing plate polishing plate after polishing No. (mm/second) (rpm) (%) 1 5.0 1 0 2 5.0 4 0 3 7.0 1 2 4 7.0 4 0 5 10.0 1 3 6 10.0 4 0

Comparative Examples 1 to 3

(25) Polishing was performed under the conditions shown in Table 2 in the same way as in Working Examples 1 to 6 except that the lower polishing plate remained stationary. The results of examination are shown in Table 2.

(26) TABLE-US-00002 TABLE 2 Descending speed Rotating speed Comparative of upper of lower Percent defective Example polishing plate polishing plate after polishing No. (mm/second) (rpm) (%) 1 5.0 0 22 2 7.0 0 25 3 10.0 0 37

Comparative Examples 4 and 5

(27) Polishing was performed under the conditions shown in Table 3 in the same way as in Working Examples 1 to 6 except that the impact-absorbing liquid was not applied to the surface of the substrate stocks. The results of examination are shown in Table 3.

(28) TABLE-US-00003 TABLE 3 Descending speed Rotating speed Comparative of upper of lower Percent defective Example polishing plate polishing plate after polishing No. (mm/second) (rpm) (%) 4 7.0 1 35 5 7.0 4 15

Working Examples 7 to 9

(29) Polishing was performed as follows on the substrate stocks of synthetic quartz glass (6-inch square and 6.35 mm in thickness) which are held in the work hole shown in FIG. 1. The upper polishing plate was brought into contact with the substrate stocks, while the lower polishing plate was rotating, under the conditions shown in Table 4. The substrate stocks had their surface coated with an impact-absorbing liquid, which is an aqueous solution containing propylene glycol and diethanolamine in a ratio of 10:1 (by weight) such that it has a viscosity of 40 mPa.Math.s at 20 C. The upper polishing plate in contact with the surface of the substrate stocks was rotated, with the interface between the substrate surface and the upper polishing plate being supplied with a slurry composed of pure water and alumina abrasive grains called FO #2000, made by Fujimi Incorporated Co., Ltd. The substrate stocks underwent polishing in the same way as in Working Examples 1 to 6. The finished specimens were examined for flaws. The results of examination are shown in Table 4.

(30) TABLE-US-00004 TABLE 4 Descending speed Rotating speed Working of upper of lower Percent defective Example polishing plate polishing plate after polishing No. (mm/second) (rpm) (%) 7 5.0 1 0 8 5.0 4 0 9 10.0 4 0

Working Examples 10 and 11

(31) Polishing was performed as follows on the substrate stocks of soda-lime glass (7-inch square and 3.0 mm in thickness) which are held in the work hole shown in FIG. 1. The upper polishing plate was brought into contact with the substrate stocks, while the lower polishing plate was rotating, under the conditions shown in Table 5. The substrate stocks had their surface coated with an impact-absorbing liquid, which is an aqueous solution containing ethylene glycol and triethanolamine in a ratio of 20:1 (by weight) such that it has a viscosity of 37 mPa.Math.s at 20 C. The upper polishing plate in contact with the surface of the substrate stocks was rotated, with the interface between the substrate surface and the upper polishing plate being supplied with a slurry composed of pure water and zirconium oxide abrasive grains called MZ-1000B, made by Daiichi Kigenso Kagaku Kogyo Co., Ltd. The substrate stocks underwent polishing in the same way as in Working Examples 1 to 6. The finished specimens were examined for flaws. The results of examination are shown in Table 5.

(32) TABLE-US-00005 TABLE 5 Descending speed Rotating speed Working of upper of lower Percent defective Example polishing plate polishing plate after polishing No. (mm/second) (rpm) (%) 10 7.0 1 0 11 7.0 4 0

(33) Japanese Patent Application Nos. 2015-098267 and 2015-114759 are incorporated herein by reference.

(34) Although some preferred embodiments have been described, many modifications and variations may be made thereto in light of the above teachings. It is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims.