HEAT DISSIPATION UNIT WITH FLOATING SECTION
20220369511 ยท 2022-11-17
Inventors
Cpc classification
F28D15/0241
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
Abstract
A heat dissipation unit with floating section includes an upper plate and a lower plate, which are closed together to define a chamber in between them, and the chamber has a working fluid filled therein. The upper and the lower plate respectively include a front section, a read section, and a middle section located between the front and the rear section. The front section and the rear section of one or both of the upper and the lower plate have a plate thickness larger than that of the middle section, such that the middle sections form flexible floating sections that allow for a floating adjustment thereat, making the front and the rear sections of the heat dissipation unit to be located at two positions having a height difference between them.
Claims
1. A heat dissipation unit with floating section comprising: an upper plate having a front section, a rear section, and a middle section integrally formed and located between the front and the rear sections; a lower plate having a front section, a rear section, and a middle section integrally formed and located between the front and the rear sections and wherein the lower plate is sealed to the upper plate to together define a chamber in between them, where a portion of the chamber corresponding to the middle sections is configured to be free of support structure; and a working fluid filled in the chamber, the front section and the rear section of one or both of the upper and the lower plate having a plate thickness greater than that of the respective middle section, such that one or both of the middle sections form a flexible floating section that allows for a floating adjustment thereat.
2. The heat dissipation unit with floating section as claimed in claim 1, wherein the chamber is provided on an inner side of the lower plate or on inner sides of both of the upper and of the lower plate with a wick structure.
3. The heat dissipation unit with floating section as claimed in claim 1, wherein the front and the rear sections have a plate thickness greater than or equal to 0.5 mm; and the middle section of at least one of the upper and the lower plate has a plate thickness of at least 0.08 mm and less than 0.5 mm.
4. The heat dissipation unit with floating section as claimed in claim 1, wherein the middle section of at least one of the upper and the lower plate is provided with a reinforcing rib; the reinforcing rib being connected to the front and the middle section, or being connected to the middle and the rear section, or being extended from the front section through the middle section to the rear section; and the front sections and the rear sections being the same or different in their plate thickness.
5. The heat dissipation unit with floating section as claimed in claim 1, wherein the upper plate is assembled from a front plate member forming the front section, a middle plate member forming the middle section, and a rear plate member forming the rear section; and the front plate member and the rear plate member respectively having a plate thickness greater than that of the middle plate member.
6. The heat dissipation unit with floating section as claimed in claim 5, wherein the lower plate is assembled from a front plate member forming the front section, a middle plate member forming the middle section, and a rear plate member forming the rear section; and the front plate member and the rear plate member of the lower plate respectively having a plate thickness greater than that of the middle plate member of the lower plate.
7. The heat dissipation unit with floating section as claimed in claim 1, wherein the upper and the lower plate are made of a material selected from the group consisting of an aluminum material, a stainless steel material, a copper material, a titanium material, and an alloy material.
8. The heat dissipation unit with floating section as claimed in claim 1, wherein the heat dissipation unit is selected from the group consisting of a vapor chamber, a heat spreader and a flat heat pipe.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
[0015]
[0016]
[0017]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] The present invention will now be described with some preferred embodiments thereof and by referring to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
[0019] Please refer to
[0020] The upper plate and the lower plate 11, 12 respectively have a front section 151, a rear section 152, and a middle section 153 located between and connected at two opposite ends to the front and the rear section 151, 152. The front sections 151 and the rear sections 152 respectively have a plate thickness larger than or equal to 0.5 mm, while the middle sections 153 respectively have a plate thickness of 0.08 mm and smaller than 0.5 mm. In the illustrated first embodiment of the present invention, the heat dissipation unit with floating section 1 is a flat heat pipe, of which the upper plate 11 and the lower plate 12 respectively have a front section 151 and a rear section 152 preferably having a plate thickness of 0.2 mm, and a middle section 153 having a plate thickness equal to 0.08 mm. It is understood the first embodiment is only illustrative and non-restrictive. In practical implementation of the present invention, the heat dissipation unit with floating section 1 can be otherwise a vapor chamber or a heat spreader, and the front and rear sections of its upper and lower plate 11, 12 preferably respectively have a plate thickness of 0.5 mm, while the middle sections 153 thereof preferably respectively have a plate thickness of 0.08 mm.
[0021] The front sections 151 and the rear sections 152 of any one or both of the upper and the lower plate 11, 12 have a plate thickness larger than that of the middle sections 153, such that the middle sections 153 respectively form a flexible floating section, which allow for a floating adjustment to different height levels relative to the front and/or the rear sections 151. 152. That is, when the flexible floating middle sections 153 are flexed or bent, their height levels relative to the front sections 151 and the rear sections 152 can be adjusted in a floating manner. In the illustrated first embodiment, the front sections 151 and the rear sections 152 of the upper plate 11 and the lower plate 12 are the same in their plate thickness, and are thicker than the middle sections 153. In other words, the front sections 151 and the rear sections 152 of the upper and lower plates 11, 12 all have a plate thickness of, for example, 0.2 mm, while the middle sections 153 of the upper and lower plates 11, 12 all have a plate thickness of, for example, 0.08 mm, which is thinner than 0.2 mm. With this arrangement, i.e. giving the middle sections 153 a plate thickness smaller than that of the front and rear sections 151, 152, it is possible for the thinner middle sections 153 of the upper and lower plates 11, 12 to form flexible floating sections, which can be flexed or bent upward, downward, leftward or rightward to allow a user to adjust two opposite ends of the heat dissipation unit 1 to different height levels in a floating manner, so that the heat dissipation unit 1 is adapted for mounting on between elements having a height difference, such as a heat-producing electronic element and another heat dissipation unit. Wherein, different numbers of the heat dissipation unit with floating section 1 according to the present invention, for example, two, can be used depending on the quantity of heat sources (not shown), such as two, that require heat dissipation.
[0022] In another operable embodiment of the present invention, the upper plate 11 (or the lower plate 12) includes a front section 151 and a rear section 152 that are different in their plate thickness, and the front and rear sections 151, 152 respectively have a plate thickness, e.g. 0.15 mm, larger than that of a middle section 153, e.g. 0.09 mm; while the lower plate 12 (or the upper plate 11) includes a front, a rear and a middle section 151, 152, 153 having the same plate thickness and accordingly, the middle section 153 thereof is not a flexible floating section. In the above illustrated example, only the middle section 153 of the upper plate 11 being thinner than the front and the rear section 151, 152 can form the flexible floating section to allow some slight floating adjustments only at one side of the heat dissipation unit 1.
[0023] Please refer to
[0024] According to the present invention, the lower plate 12 and the upper plate 11 closed to each other together define a chamber 13 in between them. In the chamber 13, vapor-liquid phase-change processes occur. A working fluid, such as pure water, is filled in the chamber 13, and a wick structure 18 is also provided in the chamber 13. The wick structure 18 can be a sintered powder structure, a plurality of grooves, a mesh structure, a fibrous structure, a braided strip structure or any combination thereof. The wick structure 18 can be provided on an inner side of the lower plate 12 or on inner sides of both of the upper and the lower plate 11, 12. An outer side of the front section 151 of the lower plate 12 is in contact with a heat source. The chamber 13 of the heat dissipation unit with floating section 1, such as a flat heat pipe, is internally divided into an evaporator area 131, a transport area 132 and a condenser area 133. The evaporator area 131 and the condenser area 133 are located in and corresponding to the front sections 151 and the rear sections 152 of the heat dissipation unit 1, respectively; and the transport area 132 is located in and corresponding to the middle sections 153 of the heat dissipation unit 1 and between the evaporator area 131 and the condenser area 133.
[0025] In practical application of the present invention, the heat dissipation unit 1 can be used in combination with other different or similar heat dissipation units and mounted on a plurality of heat sources, such as a central processing unit or a graphics processing unit on a mother board in an electronic device (not shown). In the case there is a height difference between two locations at where the front sections 151 and the rear sections 152 of the heat dissipation unit 1 are to be mounted, the flexible floating middle sections 153 can be flexed or bent upward, downward, leftward or rightward to compensate the height difference between the front and the rear sections 151, 152 and effectively reduce the bridging force that causes pull and push between the front and the rear sections 151, 152 that are located at different height levels, and further avoid a structural deformation of the heat dissipation unit 1. With the provision of the flexible floating middle sections 153, the heat dissipation unit 1 of the present invention can be adjusted in a floating manner and is therefore usable with various types of heat dissipation units located at different height positions.
[0026] With the above design, the heat dissipation unit with floating section 1 according to the present invention is allowed for a floating adjustment at the flexible floating middle sections thereof to thereby cover the height difference between different heat sources without causing a structural deformation of the heat dissipation unit 1 by a bridging force generated due to the height difference, which will lead to inward compression or outward pull of the heat dissipation unit 1 and accordingly, poor heat dissipation efficiency and even malfunction of the heat dissipation unit 1.
[0027] Further, the present invention can also be used on various electronic devices, such as servers, computers or communication chassis that include heat-producing elements having a height difference in location, such as a single chip and other heat-producing electronic elements on their mother boards. Any height difference between two ends, i.e. the front sections 151 and the rear sections 152, of the heat dissipation unit 1 correspondingly mounted on the heat-producing elements can be covered by a floating adjustment at the flexible floating middle sections 153, so that the two ends of the heat dissipation unit 1 can be always in flat contact with the corresponding heat sources or other similar or different types of heat dissipation units that have a height difference between them.
[0028] In an alternative embodiment of the present invention, the upper plate 11 and the lower plate 12 of the heat dissipation unit 1 are respectively assembled from the front section 151, the middle section 153 and the rear section 152. In this case, the front, middle and rear sections 151, 153, 152 are respectively in the form of a plate member, i.e. a front plate member, a middle plate member, and a rear plate member. Wherein, the front and the rear plate members of the upper plate 11 have a plate thickness larger than that of the middle plate member thereof; and the front and the rear plate members of the lower plate 12 have a plate thickness larger than that of the middle plate member thereof.
[0029] The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.