POSITIVE TEMPERATURE COEFFICIENT CERAMIC THERMISTOR ELEMENT HAVING STRONG REDUCING ATMOSPHERE RESISTANCE AND PREPARATION METHOD THEREFOR

Abstract

A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

Claims

1. A positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance, comprising a barium lead titanate-based and sintered thermal sensitive ceramic plate and metal ohmic electrodes located at two sides of the thermal sensitive ceramic plate, wherein the positive temperature coefficient ceramic thermistor element further comprises a microporous channel barrier layer, the microporous channel barrier layer comprises a glass scaling layer or an organic sealant, and, in the case that the microporous channel barrier layer is a glass scaling layer, the glass sealing layer is cladded on the outer surfaces of the thermal sensitive ceramic plate entirely, and the metal ohmic electrodes are bonded to the two sides of the glass scaling layer; whereas in the case that the microporous channel barrier layer is an organic sealant, the organic sealant is filled in micropores in the surfaces of the metal ohmic electrodes bonded to the two sides of the thermal sensitive ceramic plate, and the voids in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate where no metal ohmic electrode is arranged are sealed at the same time.

2. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the composition of raw material of the thermal sensitive ceramic plate is: (1-x-y) BaTiO.sub.3+xPbTiO.sub.3+yR+zS+wT, where R is CaO, SrO or (CaO+SrO), S is (BN+V.sub.2O.sub.3+Li.sub.2CO.sub.3+Al.sub.2O.sub.3), and T is one of trivalent rare earth oxide and pentavalent metal oxide or a combination thereof; and x<0.5, y<0.1, z<0.05 and w=0.001 to 0.005.

3. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 2, wherein the composition of raw material of the thermal sensitive ceramic plate further comprises 0.0001 to 0.0005 mol MnN.sub.2O.sub.6, NiN.sub.2O.sub.6 or FeN.sub.3O.sub.9.

4. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 2, wherein the trivalent rare earth oxide is one of La.sub.2O.sub.3, Y.sub.2O.sub.3 and Sm.sub.2O.sub.3 or a mixture thereof; and the pentavalent metal oxide is Nb.sub.2O.sub.5.

5. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the glass sealing layer is obtained from glass paste for cladding, the glass paste for cladding is prepared as follows: preparing glass micro-powder in particle size smaller than 500 nm through a melting and water quenching process, while an organic substance is added therein and mixed at the same time, so as to obtain the glass paste for cladding for the glass scaling layer that is used as the microporous channel barrier layer.

6. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 5, wherein a mass ratio of the glass micro-powder in particle size smaller than 500 nm to the organic substance is 1:1.2, and the organic substance consists of the following raw materials in parts by weight (pbw): 0.1 to 0.3 pbw adhesive, 0.001 to 0.01 pbw dispersant, and 1 pbw solvent; the adhesive is PVB, the dispersant is low molecular wax, and the solvent is acetone.

7. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 5, wherein after the glass paste for cladding is cladded on the surface of the thermal sensitive ceramic plate by either method of impregnation method or spraying method, the thermal sensitive ceramic plate is placed in a high-temperature heat treatment device and heat-treated at 500 to 600? C. for 8 to 12 minutes.

8. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the glass sealing layer is a glass sealing layer of a glass system, the glass system consists of the following raw materials at the following molar ratio: K.sub.2SiF.sub.6+ZnO+Al.sub.2O.sub.3+SiO.sub.2+?M+N+?P, where M is Na.sub.2O+K.sub.2O and ?=0.1 to 0.3; N is one of B.sub.2O.sub.3, Li.sub.2O and V.sub.2O.sub.5 or a combination thereof, and the total amount is one mole; P is MnO.sub.2, Fe.sub.3O.sub.4 or Co.sub.3O.sub.4, and ?=0.001 to 0.01.

9. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the filling and sealing method for filing the organic sealant in the micropores in the surfaces of the metal ohmic electrodes bonded to the two sides of the thermal sensitive ceramic plate and sealing the voids in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate where no metal ohmic electrode is arranged at the same time comprises either method of the following two methods: the first method: placing the thermal sensitive ceramic plate with the metal ohmic electrodes bonded on the two sides thereof into a hot isostatic press containing the organic sealant as a void sealing medium, applying pressure to the hot isostatic press, controlling the temperature of the void sealing medium as the pressure is applied, the applied pressure and the applied duration, and cleaning and drying the surfaces sequentially after the pressure application is finished; the second method: impregnating the thermal sensitive ceramic plate with the metal ohmic electrodes bonded on the two sides thereof in a container that contains the organic sealant, vacuumizing the container, controlling the degree of vacuum during vacuumizing and the impregnation duration, taking the ceramic plate out of the container after the bonding and vacuumizing, and cleaning and drying the surfaces sequentially.

10. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 9, wherein controlling the temperature of the void scaling medium during the application of pressure is that the temperature of the void sealing medium is controlled to be 100 to 200? C., controlling the applied pressure is that the pressure is controlled to be 1 to 10 MPa, and controlling the applied duration is that the applied duration is controlled to be 60 to 120 min.; controlling the degree of vacuum during the vacuumizing is that the degree of vacuum is controlled to be smaller than 10 KPa, and controlling the impregnation duration is that the impregnation duration is controlled to be 280 to 320 min.; and the surface cleaning is carried out with an ultrasonic cleaning machine.

11. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the composition of raw materials of the organic sealant comprises: polydimethylsiloxane, nano-powder of a transition metal oxide, a crosslinking agent, a catalyst, and an organic solvent; the nano-powder of the transition metal oxide added into the polydimethylsiloxane is in an amount equal to 0.001-0.01% of the weight of the polydimethylsiloxane; the crosslinking agent is added in an amount equal to 1-3% of the weight of the polydimethylsiloxane; and the catalyst is added in an amount equal to 0.05-0.1% of the weight of the polydimethylsiloxane.

12. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 11, wherein the nano-powder of the transition metal oxide is nano-powder of MnO.sub.2, Fe.sub.3O.sub.4 or Co.sub.3O.sub.4; the crosslinking agent is hydrogen silicone oil; the catalyst is a platinum ethylene complex; and the organic solvent is xylene.

13. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, wherein the glass sealing layer is in thickness of 2 to 5 ?m.

14. A method for preparing the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 1, comprising: first, cladding a glass sealing layer as a microporous channel barrier layer on the outer surfaces of a barium lead titanate-based and sintered thermal sensitive ceramic plate, and then bonding metal ohmic electrodes on the two sides of the glass scaling layer respectively; or, first bonding metal ohmic electrodes on the two sides of the barium lead titanate-based thermal sensitive ceramic plate, and then filling an organic sealant serving as a microporous channel barrier layer in the micropores in the surfaces of the metal ohmic electrodes, and sealing the voids in the surfaces of the peripheral edge regions of the thermal sensitive ceramic plate where no metal ohmic electrode is arranged at the same time, so as to obtain the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance.

15. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 9, wherein the composition of raw materials of the organic sealant comprises: polydimethylsiloxane, nano-powder of a transition metal oxide, a crosslinking agent, a catalyst, and an organic solvent; the nano-powder of the transition metal oxide added into the polydimethylsiloxane is in an amount equal to 0.001-0.01% of the weight of the polydimethylsiloxane; the crosslinking agent is added in an amount equal to 1-3% of the weight of the polydimethylsiloxane; and the catalyst is added in an amount equal to 0.05-0.1% of the weight of the polydimethylsiloxane.

16. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 15, wherein the nano-powder of the transition metal oxide is nano-powder of MnO.sub.2, Fe.sub.3O.sub.4 or Co.sub.3O.sub.4; the crosslinking agent is hydrogen silicone oil; the catalyst is a platinum ethylene complex; and the organic solvent is xylene.

17. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 5, wherein the glass sealing layer is in thickness of 2 to 5 ?m.

18. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance according to claim 8, wherein the glass sealing layer is in thickness of 2 to 5 ?m.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0021] FIG. 1 is a cross-sectional view of the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in Examples 1-3 of the present invention;

[0022] FIG. 2 is a cross-sectional view of the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in Examples 4-7 of the present invention;

[0023] FIG. 3 is an enlarged view of the portion A shown in FIG. 2; and

[0024] FIG. 4 is a schematic diagram of a reducing atmosphere testing device for the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in the present invention.

EMBODIMENTS

Example 1

[0025] Please see FIG. 1. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in FIG. 1 comprises a barium lead titanate-based and sintered thermal sensitive ceramic plate 1 in size of 24?15?2.4 mm (but not limited to the exemplary size) and metal ohmic electrodes 2 located at two sides of the thermal sensitive ceramic plate 1. As a technical key point of the technical solution provided by the present invention, the positive temperature coefficient ceramic thermistor element further comprises a microporous channel barrier layer 3, and, in this example, the microporous channel barrier layer 3 is a glass sealing layer entirely cladded in thickness of 5 ?m on the outer surfaces of the thermal sensitive ceramic plate 1; the metal ohmic electrodes 2 are preferably made of aluminum, copper, silver-zinc alloy or base metal, but are not absolutely limited to those materials; in addition, the metal ohmic electrodes 2 may be bonded to the two sides of the glass sealing layer that serves as the microporous channel barrier layer 3 by infiltration sintering, melt spraying, sputtering, plating or other similar equivalent methods.

[0026] In this example, the raw material composition of the above-mentioned thermal sensitive ceramic plate 1 comprises: 0.64 mol BaTiO.sub.3+0.3 mol PbTiO.sub.3+0.06 mol (Cao+SrO)+0.005 mol (BN+V.sub.2O.sub.3+Li.sub.2CO.sub.3+Al.sub.2O.sub.3)+0.003 mol La.sub.2O.sub.3+0.0003 mol MnN.sub.2O.sub.6.

[0027] In this example, the glass sealing layer is obtained (i.e., produced) from glass paste for cladding, the glass paste for cladding is prepared as follows: preparing glass micro-powder in particle size smaller than 500 nm through a melting and water quenching process, and an organic substance (may also be referred to as an adhesive or an organic adhesive) is added therein and mixed at the same time, so as to obtain the glass paste for cladding for the glass sealing layer that is used as the microporous channel barrier layer 3. The mass ratio of the glass micro-powder in particle size smaller than 500 nm to the organic substance is 1:1.2, and the organic substance consists of the following raw materials in parts by weight (pbw): 0.2 pbw PVB as an adhesive, 0.001 pbw low molecular wax as a dispersant, and acetone as a solvent; there is no restriction on the amount of the solvent, because the solvent may be added as required.

[0028] In this example, first, the glass paste for cladding is cladded on the surfaces of the thermal sensitive ceramic plate 1 by impregnation, then, the thermal sensitive ceramic plate 1 is placed in a high-temperature heat treatment device and heat-treated at 500? C. for 12 min.

[0029] In this example, the glass sealing layer is a glass sealing layer of a glass system, and the glass system consists of the following raw materials at the following molar ratio: K.sub.2SiF.sub.6+ZnO+Al.sub.2O.sub.3+SiO.sub.2+0.2 (Na.sub.2O+K.sub.2O)+0.5 (B.sub.2O.sub.3+Li.sub.2O)+0.005 Fe.sub.3O.sub.4, and the total amount is one mole.

Example 2

[0030] Please see FIG. 1. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in FIG. 1 comprises a barium lead titanate-based and sintered thermal sensitive ceramic plate 1 in size of 24?15?2.4 mm (but not limited to the exemplary size) and metal ohmic electrodes 2 located at two sides of the thermal sensitive ceramic plate 1. As a technical key point of the technical solution provided by the present invention, the positive temperature coefficient ceramic thermistor element further comprises a microporous channel barrier layer 3, and, in this example, the microporous channel barrier layer 3 is a glass sealing layer entirely cladded in thickness of 2 ?m on the outer surfaces of the thermal sensitive ceramic plate 1; the metal ohmic electrodes 2 are preferably made of aluminum, copper, silver-zinc alloy or base metal, but are not absolutely limited to those materials; in addition, the metal ohmic electrodes 2 may be bonded to the two sides of the glass sealing layer that serves as the microporous channel barrier layer 3 by infiltration sintering, melt spraying, sputtering, plating or other similar equivalent methods.

[0031] In this example, the raw material composition of the above-mentioned thermal sensitive ceramic plate 1 comprises: 0.897 mol BaTiO.sub.3+0.003 mol PbTiO.sub.3+0.1 mol CaO+0.05 mol (BN+V.sub.2O.sub.3+Li.sub.2CO.sub.3+Al.sub.2O.sub.3)+0.001 mol Y.sub.2O.sub.3+0.001 mol Nb.sub.2O.sub.5+0.0001 mol NiN.sub.2O.sub.6.

[0032] In this example, the glass sealing layer is obtained (i.e., produced) from glass paste for cladding, the glass paste for cladding is prepared as follows: preparing glass micro-powder in particle size smaller than 500 nm through a melting and water quenching process, and an organic substance (may also be referred to as an adhesive or an organic adhesive) is added therein and mixed at the same time, so as to obtain the glass paste for cladding for the glass sealing layer that is used as the microporous channel barrier layer 3. The mass ratio of the glass micro-powder in particle size smaller than 500 nm to the organic substance is 1:1.2, and the organic substance consists of the following raw materials in parts by weight (pbw): 0.1 pbw PVB as an adhesive, 0.006 pbw low molecular wax as a dispersant, and acetone as a solvent; there is no restriction on the amount of the solvent, because the solvent may be added as required.

[0033] In this example, the glass paste for cladding is cladded on the surfaces of the thermal sensitive ceramic plate 1 by impregnation, and then, the thermal sensitive ceramic plate 1 is placed in a high-temperature heat treatment device and heat-treated at 600? C. for 8 min.

[0034] In this example, the glass sealing layer is a glass sealing layer of a glass system, the glass system consists of the following raw materials at the following molar ratio: K.sub.2SiF.sub.6+ZnO+Al.sub.2O.sub.3+SiO.sub.2+0.1 (Na.sub.2O+K.sub.2O)+0.5 Li.sub.2O+0.01 MnO.sub.2, and the total amount is one mole.

Example 3

[0035] Please see FIG. 1. The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance in FIG. 1 comprises a barium lead titanate-based and sintered thermal sensitive ceramic plate 1 in size of 24?15?2.4 mm (but not limited to the exemplary size) and metal ohmic electrodes 2 located at two sides of the thermal sensitive ceramic plate 1. As a technical key point of the technical solution provided by the present invention, the positive temperature coefficient ceramic thermistor element further comprises a microporous channel barrier layer 3, and, in this example, the microporous channel barrier layer 3 is a glass sealing layer entirely cladded in thickness of 3.5 ?m on the outer surfaces of the thermal sensitive ceramic plate 1; the metal ohmic electrodes 2 are preferably made of aluminum, copper, silver-zinc alloy or base metal, but are not absolutely limited to those materials; in addition, the metal ohmic electrodes 2 may be bonded to the two sides of the glass sealing layer that serves as the microporous channel barrier layer 3 by infiltration sintering, melt spraying, sputtering, plating or other similar equivalent methods.

[0036] In this example, the raw material composition of the above-mentioned thermal sensitive ceramic plate 1 comprises: 0.498 BaTiO.sub.3+0.5 PbTiO.sub.3+0.002 SrO+0.01 (BN+V.sub.2O.sub.3+Li.sub.2CO.sub.3+Al.sub.2O.sub.3)+0.0025 Y.sub.2O.sub.3+0.0025 Sm.sub.2O.sub.3+0.0003 mol FeN.sub.3O.sub.9.

[0037] In this example, the glass sealing layer is obtained (i.e., produced) from glass paste for cladding, the glass paste for cladding is prepared as follows: preparing glass micro-powder in particle size smaller than 500 nm through a melting and water quenching process, and an organic substance (may also be referred to as an adhesive or an organic adhesive) is added therein and mixed at the same time, so as to obtain the glass paste for cladding for the glass sealing layer that is used as the microporous channel barrier layer 3. The mass ratio of the glass micro-powder in particle size smaller than 500 nm to the organic substance is 1:1.2, and the organic substance consists of the following raw materials in parts by weight (pbw): 0.3 pbw PVB as an adhesive, 0.01 pbw low molecular wax as a dispersant, and acetone as a solvent; there is no restriction on the amount of the solvent, because the solvent may be added as required.

[0038] In this example, the glass paste for cladding is cladded on the surfaces of the thermal sensitive ceramic plate 1 by spraying, and then the thermal sensitive ceramic plate 1 is placed in a high-temperature heat treatment device and heat-treated at 550? C. for 10 min.

[0039] In this example, the glass sealing layer is a glass sealing layer of a glass system, the glass system consists of the following raw materials at the following molar ratio: K.sub.2SiF.sub.6+ZnO+Al.sub.2O.sub.3+SiO.sub.2+0.3 (Na.sub.2O+K.sub.2O)+0.5 V.sub.2O.sub.5+0.055 CO.sub.3O.sub.4, and the total amount is one mole.

Preparation Example (i.e., Preparation Method 1)

[0040] First, a glass sealing layer that serves as a microporous channel barrier layer 3 is cladded on the outer surfaces of the barium lead titanate-based and sintered thermal sensitive ceramic plate 1 described in any of the Examples 1-3 entirely, and then metal ohmic electrodes 2 are bonded to the two sides of the glass sealing layer respectively, so as to obtain the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance as shown in FIG. 1.

Example 4

[0041] Please see FIGS. 2 and 3. Compared with the example 1, 2 or 3, in the example 4, the microporous channel barrier layer 3 is an organic sealant, and the organic sealant is filled in micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and the voids 11 (shown in FIG. 3) in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate 1, where no metal ohmic electrode 2 is arranged, are sealed (that is, filled and sealed) at the same time. In this example, the filling and sealing method for filling organic sealant in the micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and sealing the voids 11 in the surfaces of the peripheral edge regions of the thermal sensitive ceramic plate 1 where no metal ohmic electrode 2 is arranged at the same time is as follows: placing the thermal sensitive ceramic plate 1 with the metal ohmic electrodes 2 bonded on the two sides thereof into a hot isostatic press that contains the organic sealant as a void sealing medium, and applying pressure to the hot isostatic press, with the following process parameters: the temperature of the void sealing medium is controlled to be 200? C., the applied pressure is controlled to be 10 MPa, and the applied duration is controlled to be 60 min.; then cleaning and drying the surfaces sequentially after the pressure application is finished. In this example, the raw materials of the organic sealant include: polydimethylsiloxane, nano-powder of a transition metal oxide (i.e., MnO.sub.2 nano-powder), a crosslinking agent (i.e., hydrogen silicone oil), a catalyst (i.e., a platinum ethylene complex) and an organic solvent (i.e., xylene), wherein the MnO.sub.2 nano-powder added to the polydimethylsiloxane is in an amount equal to 0.001% of the weight of the polydimethylsiloxane, the hydrogen silicone oil is added in an amount equal to 2% of the weight of the polydimethylsiloxane, and the platinum ethylene complex is added in an amount equal to 0.08% of the weight of the polydimethylsiloxane. The rest are the same as those in the examples 1-3.

Example 5

[0042] Please see FIGS. 2 and 3. Compared with the example 1, 2 or 3, in the example 5, the microporous channel barrier layer 3 is an organic sealant, and the organic sealant is filled in micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and the voids 11 (shown in FIG. 3) in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate 1, where no metal ohmic electrode 2 is arranged, are sealed (that is, filled and sealed) at the same time. In this example, the filling and sealing method for filling organic sealant in the micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and sealing the voids 11 in the surfaces of the peripheral edge regions of the thermal sensitive ceramic plate 1, where no metal ohmic electrode 2 is arranged at the same time is as follows: placing the thermal sensitive ceramic plate 1 with the metal ohmic electrodes 2 bonded on the two sides thereof into a hot isostatic press that contains the organic sealant as a void sealing medium, and applying pressure to the hot isostatic press, with the following process parameters: the temperature of the void sealing medium is controlled to be 150? C., the applied pressure is controlled to be 6 MPa, and the applied duration is controlled to be 90 min.; then cleaning and drying the surfaces sequentially after the pressure application is finished. In this example, the raw materials of the organic sealant include: polydimethylsiloxane, nano-powder of a transition metal oxide (i.e., Fe.sub.3O.sub.4 nano-powder), a crosslinking agent (i.e., hydrogen silicone oil), a catalyst (i.e., a platinum ethylene complex) and an organic solvent (i.e., xylene), wherein the Fe.sub.3O.sub.4 nano-powder added to the polydimethylsiloxane is in an amount equal to 0.01% of the weight of the polydimethylsiloxane, the hydrogen silicone oil is added in an amount equal to 1% of the weight of the polydimethylsiloxane, and the platinum ethylene complex is added in an amount equal to 0.05% of the weight of the polydimethylsiloxane. The rest are the same as those in the examples 1-3.

Example 6

[0043] Please see FIGS. 2 and 3. Compared with the example 1, 2 or 3, in the example 6, the microporous channel barrier layer 3 is an organic sealant, and the organic sealant is filled in micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and the voids 11 (shown in FIG. 3) in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate 1, where no metal ohmic electrode 2 is arranged, are sealed (that is, filled and sealed) at the same time. In this example, the filling and sealing method for filling organic sealant in the micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and sealing the voids 11 in the surfaces of the peripheral edge regions of the thermal sensitive ceramic plate 1 where no metal ohmic electrode 2 is arranged at the same time is as follows: placing the thermal sensitive ceramic plate 1 with the metal ohmic electrodes 2 bonded on the two sides thereof into a hot isostatic press that contains the organic sealant as a void sealing medium, and applying pressure to the hot isostatic press, with the following process parameters: the temperature of the void sealing medium is controlled to be 100? C., the applied pressure is controlled to be 1 MPa, and the applied duration is controlled to be 120 min.; then cleaning and drying the surfaces sequentially after the pressure application is finished. In this example, the raw materials of the organic sealant include: polydimethylsiloxane, nano-powder of a transition metal oxide (i.e., Co.sub.3O.sub.4 nano-powder), a crosslinking agent (i.e., hydrogen silicone oil), a catalyst (i.e., a platinum ethylene complex) and an organic solvent (i.e., xylene), wherein the Co.sub.3O.sub.4 nano-powder added to the polydimethylsiloxane in an amount equal to 0.006% of the weight of the polydimethylsiloxane, the hydrogen silicone oil is added in an amount equal to 3% of the weight of the polydimethylsiloxane, and the platinum ethylene complex is added in an amount equal to 0.1% of the weight of the polydimethylsiloxane. The rest are the same as those described in the examples 1-3.

Example 7

[0044] In this example, only the filling and sealing method for filling the organic sealant in the micropores in the surfaces of the metal ohmic electrodes 2 bonded to the two sides of the thermal sensitive ceramic plate 1, and sealing the voids 11 in the surfaces of the peripheral edge regions of the thermal sensitive ceramic plate 1 where no metal ohmic electrode 2 is arranged at the same time is achieved with the following alternative method: placing the thermal sensitive ceramic plate 1 with the metal ohmic electrodes 2 bonded on the two sides thereof into a container that contains the organic sealant as described in the examples 4-6 for impregnation, with the following process parameters: the degree of vacuum is lower than 10 KPa, and the impregnation duration is preferably controlled to be 280 to 320 min., more preferably 290 to 310 min., optimally 300 min. (300 min. is selected in this example); after the impregnation, the surface is ultrasonically cleaned with an ultrasonic cleaner. The rest are the same as those described in the example 4, 5 or 6.

Preparation Example 2 (i.e., Preparation Method 2)

[0045] First, metal ohmic electrodes 2 are bonded to the two sides of the barium lead titanate-based and sintered thermal sensitive ceramic plate 1 described in any of the examples 4-7, and then an organic sealant that serves as the microporous channel barrier layer 3 is filled in the micropores in the surfaces of the metal ohmic electrodes 2, and the voids in the peripheral regions of the thermal sensitive ceramic plate 1 where no metal ohmic electrode 2 is arranged are sealed at the same time, so as to obtain the positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance as shown in FIG. 2.

[0046] While the present invention is further detailed above in some preferred embodiments, the implementation of the present invention is not limited to the above description. Various simple derivations or replacements may be made by those having ordinary skills in the art without departing from the concept of the present invention, but all such simple derivations or replacements shall be deemed as falling in the technical scope of the present invention.

Performance Test

[0047] The following performance test is only for the positive temperature coefficient ceramic thermistor elements having strong reducing atmosphere resistance obtained in the examples 1 and 4-5, excluding the positive temperature coefficient ceramic thermistor elements having strong reducing atmosphere resistance obtained in the other examples, because, on one hand, testing the products obtained in the examples 1 and 4-5 is enough to reflect and prove the expected technical effects; on the other hand, the products obtained in the other examples also have technical effects not inferior to those of the products obtained in the examples 1 and 4-5; thus, unnecessary repetitive description is omitted to avoid a lengthy specification. In addition, the product structure in the state of test (i.e., the tested state) shown in FIG. 4 is essentially the product structure obtained in the examples 4-5, and the testing method for the product obtained in the example 1 is also the same and what need to do is just to replace the products obtained from different examples.

[0048] Please see FIG. 4. The performance test system for a PTC ceramic thermistor element in reducing atmosphere includes a vacuum container 4, a vacuum pump 5, a volatile reducing solvent 6 and a stabilized power supply 7.

[0049] Preferably, the volume of the vacuum container 4 is about 10,000 cm.sup.3, and 50 g 100% acetone reagent is contained in the vacuum container 4.

[0050] The positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance obtained in the examples in the present invention is placed into the performance test system, and the vacuum container 4 is vacuumized to 20 kPa (negative pressure) with the vacuum pump 5. More specifically, for the element, 270V power frequency voltage is continuously applied to the metal ohmic electrodes 2 on the two sides, till the element is damaged and fails, and the failure time is recorded.

[0051] The specific implementation method is as follows: Among the PTC ceramic thermistor elements prepared in the same batch, elements having similar zero power resistance at room temperature are selected, a half of selected elements are sealed, while the other half of the selected elements are not sealed; then, a reducing resistance test is carried out on the selected elements in the performance test system at the same time. A result of comparison is shown in the following tables.

[0052] The result demonstrates that the PTC ceramic thermistor element provided by the present invention has a strong reducing resistance property.

TABLE-US-00001 Table of Performance Test on the Product Obtained in Example 1 Resistance Breakdown Sample No. Type of Sample Value (k?) Time (min.) 1 Example of the present 1.1 >2880 invention Conventional product 1.3 6 2 Example of the present 1.8 >2880 invention Conventional product 1.7 9 3 Example of the present 3.1 >2880 invention Conventional product 3.1 11 4 Example of the present 2.8 >2880 invention Conventional product 2.9 15 5 Example of the present 1.6 >2880 invention Conventional product 1.5 8 6 Example of the present 1.2 >2880 invention Conventional product 1.3 8 7 Example of the present 2.6 >2880 invention Conventional product 2.6 12 8 Example of the present 3.2 >2880 invention Conventional product 3.3 18 9 Example of the present 2.3 >2880 invention Conventional product 2.2 12 10 Example of the present 2.5 >2880 invention Conventional product 2.5 9

TABLE-US-00002 Table of Performance Test on the Product Obtained in Example 4 Resistance Breakdown Sample No. Type of Sample Value (k?) Time (min.) 1 Example of the present 1.3 >2880 invention Conventional product 1.3 5 2 Example of the present 1.6 >2880 invention Conventional product 1.7 9 3 Example of the present 2.2 >2880 invention Conventional product 2.3 10 4 Example of the present 2.8 >2880 invention Conventional product 2.7 13 5 Example of the present 1.5 >2880 invention Conventional product 1.6 7 6 Example of the present 3.3 >2880 invention Conventional product 3.3 16 7 Example of the present 2.6 >2880 invention Conventional product 2.5 11 8 Example of the present 2.2 >2880 invention Conventional product 2.3 14 9 Example of the present 3.3 >2880 invention Conventional product 3.2 18 10 Example of the present 2.6 >2880 invention Conventional product 2.5 7

TABLE-US-00003 Table of Performance Test on the Product Obtained in Example 5 Resistance Breakdown Sample No. Type of Sample Value (k?) Time (min.) 1 Example of the present 2.1 >2880 invention Conventional product 2.3 9 2 Example of the present 1.7 >2880 invention Conventional product 1.6 8 3 Example of the present 3.3 >2880 invention Conventional product 3.3 18 4 Example of the present 2.8 >2880 invention Conventional product 2.7 14 5 Example of the present 1.6 >2880 invention Conventional product 1.7 8 6 Example of the present 1.5 >2880 invention Conventional product 1.6 9 7 Example of the present 2.6 >2880 invention Conventional product 2.7 12 8 Example of the present 3.2 >2880 invention Conventional product 3.1 21 9 Example of the present 1.3 >2880 invention Conventional product 1.2 11 10 Example of the present 2.2 >2880 invention Conventional product 2.3 9