Organic light-emitting diode with scattering layer of aluminum-cobalt-copper nano-quasicrystal and manufacturing method thereof
11588136 · 2023-02-21
Assignee
Inventors
- Sinn-Wen Chen (Hsinchu, TW)
- Anbalagan Ramakrishnan (Hsinchu, TW)
- Sudam Chavhan (Hsinchu, TW)
- Kiran Kishore Kesavan (Hsinchu, TW)
- Mangey Ram Nagar (Hsinchu, TW)
- Jwo-Huei Jou (Hsinchu, TW)
Cpc classification
H10K71/00
ELECTRICITY
International classification
Abstract
A manufacturing method of an organic light-emitting diode is provided in the present disclosure. The manufacturing method of the organic light-emitting diode includes steps as follows. A substrate is provided and a layered structure forming step is performed. In the layered structure forming step, an anode layer, a scattering layer, an emissive layer and a cathode layer are sequentially formed on the substrate, so as to obtain an organic light-emitting diode. A material of the scattering layer is a quasicrystalline material.
Claims
1. A manufacturing method of an organic light-emitting diode, comprising: providing a substrate; and performing a layered structure forming step to sequentially form an anode layer, a scattering layer, an emissive layer and a cathode layer on the substrate, so as to obtain an organic light-emitting diode; wherein a material of the scattering layer is an aluminum-cobalt-copper nano-quasicrystal.
2. The manufacturing method of the organic light-emitting diode of claim 1, wherein the aluminum-cobalt-copper nano-quasicrystal is manufactured by a synthesis method, the synthesis method comprises: providing a raw material comprising an aluminum metal, a cobalt metal and a copper metal; performing an annealing step to anneal the raw material after the raw material is melted, so as to obtain an aluminum-cobalt-copper quasicrystal; and performing an exfoliating step, wherein the aluminum-cobalt-copper quasicrystal is mixed with a solvent to form a quasicrystalline solution, and the quasicrystalline solution is sonicated, so as to make the aluminum-cobalt-copper quasicrystal exfoliate into the aluminum-cobalt-copper nano-quasicrystal.
3. The manufacturing method of the organic light-emitting diode of claim 2, wherein in the annealing step, the raw material, which is melted, is annealed under 900° C. in the vacuum for 15 days.
4. The manufacturing method of the organic light-emitting diode of claim 2, wherein the solvent is an N,N-dimethylformamide solvent, and in the exfoliating step, the quasicrystalline solution is sonicated for 60 hours.
5. The manufacturing method of the organic light-emitting diode of claim 1, wherein the scattering layer is spin-coated on the anode layer.
6. The manufacturing method of the organic light-emitting diode of claim 1, wherein a hole transport layer is formed between the scattering layer and the emissive layer in the layered structure forming step.
7. The manufacturing method of the organic light-emitting diode of claim 1, wherein an electron transport layer is formed between the emissive layer and the cathode layer in the layered structure forming step.
8. An organic light-emitting diode, wherein the organic light-emitting diode is manufactured by the manufacturing method of the organic light-emitting diode of claim 1.
9. A manufacturing method of an organic light-emitting diode, comprising: providing a substrate, wherein the substrate comprises an upper surface and a bottom surface opposite to the upper surface; performing a scattering layer forming step to form a scattering layer on the bottom surface of the substrate; and performing a layered structure forming step to sequentially form an anode layer, an emissive layer and a cathode layer on the upper surface of the substrate, so as to obtain an organic light-emitting diode; wherein a material of the scattering layer is an aluminum-cobalt-copper nano-quasicrystal.
10. The manufacturing method of the organic light-emitting diode of claim 9, wherein the aluminum-cobalt-copper nano-quasicrystal is manufactured by a synthesis method, the synthesis method comprises: providing a raw material comprising an aluminum metal, a cobalt metal and a copper metal; performing an annealing step to anneal the raw material after the raw material is melted, so as to obtain an aluminum-cobalt-copper quasicrystal; and performing an exfoliating step, wherein the aluminum-cobalt-copper quasicrystal is mixed with a solvent to form a quasicrystalline solution, and the quasicrystalline solution is sonicated, so as to make the aluminum-cobalt-copper quasicrystal exfoliate into the aluminum-cobalt-copper nano-quasicrystal.
11. The manufacturing method of the organic light-emitting diode of claim 10, wherein in the annealing step, the raw material, which is melted, is annealed under 900° C. in the vacuum for 15 days.
12. The manufacturing method of the organic light-emitting diode of claim 10, wherein the solvent is an N,N-dimethylformamide solvent, and in the exfoliating step, the quasicrystalline solution is sonicated for 60 hours.
13. The manufacturing method of the organic light-emitting diode of claim 9, wherein the scattering layer is drop-cast on the bottom surface of the substrate.
14. The manufacturing method of the organic light-emitting diode of claim 9, wherein a hole transport layer is formed between the anode layer and the emissive layer in the layered structure forming step.
15. The manufacturing method of the organic light-emitting diode of claim 14, wherein a hole injection layer is formed between the anode layer and the hole transport layer in the layered structure forming step.
16. The manufacturing method of the organic light-emitting diode of claim 9, wherein an electron transport layer is formed between the emissive layer and the cathode layer in the layered structure forming step.
17. An organic light-emitting diode, wherein the organic light-emitting diode is manufactured by the manufacturing method of the organic light-emitting diode of claim 9.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The present disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
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DETAILED DESCRIPTION
(19) Please refer to
(20) In Step 110, a substrate 210 is provided. A material of the substrate 210 can be a transparent material with high transmittance, such as glass, polyimide (PI) or polyethylene naphthalate (PEN).
(21) In Step 120, a layered structure forming step is performed to sequentially form an anode layer 220, a scattering layer 230, an emissive layer 250 and a cathode layer 270 on the substrate 210, so as to obtain the organic light-emitting diode 200. Furthermore, a hole transport layer 240 can be formed between the scattering layer 230 and the emissive layer 250, or an electron transport layer 260 can be formed between the emissive layer 250 and the cathode layer 270. The hole transport layer 240 and the electron transport layer 260 are configured to improve the transport of holes and electrons. Thus, the hole transport layer 240 and the electron transport layer 260 can be arranged according to the transport properties of the materials of other layers.
(22) Please note that the scattering layer 230 can be spin-coated on the anode layer 220 to obtain better coating results. A material of the scattering layer 230 is a quasicrystalline material, and the quasicrystalline material can be an aluminum-cobalt-copper nano-quasicrystal. Please refer to
(23) In detail, a raw material is provided in Step 310. The raw material includes an aluminum metal, a cobalt metal and a copper metal.
(24) In Step 320, an annealing step is performed to anneal the raw material after the raw material is melted, so as to obtain an aluminum-cobalt-copper quasicrystal. The raw material, which is melted, can be annealed under 900° C. in the vacuum for 15 days.
(25) In Step 330, an exfoliating step is performed. The aluminum-cobalt-copper quasicrystal is mixed with a solvent to form a quasicrystalline solution. The quasicrystalline solution is sonicated, so as to make the aluminum-cobalt-copper quasicrystal exfoliate into the aluminum-cobalt-copper nano-quasicrystal. The solvent can be an N,N-dimethylformamide solvent, and the quasicrystalline solution can be sonicated for 60 hours.
(26) Please refer to
(27) In Step 410, a substrate 510 is provided. A material of the substrate 510 can be the aforementioned materials, and the substrate 510 includes an upper surface 511 and a bottom surface 512 opposite to the upper surface 511.
(28) In Step 420, a scattering layer forming step is performed to form a scattering layer 530 on the bottom surface 512 of the substrate 510. The scattering layer 530 can be drop-cast on the bottom surface 512 of the substrate 510 to obtain better coating results. Similarly, a material of the scattering layer 530 is a quasicrystalline material, which can be an aluminum-cobalt-copper nano-quasicrystal. The synthesis method for manufacturing the aluminum-cobalt-copper nano-quasicrystal has been introduced above, and the details will not be given herein.
(29) In Step 430, a layered structure forming step is performed to sequentially form an anode layer 520, an emissive layer 550 and a cathode layer 570 on the upper surface 511 of the substrate 510, so as to obtain the organic light-emitting diode 500. In the layered structure forming step, it can choose to arrange the hole transport layer 540 and the electron transport layer 560, and the details are described above and will not be given herein.
(30) Please refer to
(31) The luminescence properties of the organic light-emitting diodes manufactured by different manufacturing method are tested as below. In the following tests, the current-voltage-luminance characterization of each example and comparison was carried out. The emission area of each example and comparison is 0.09 cm.sup.2, and the tests are done in an ambient atmosphere without encapsulation.
(32) The organic light-emitting diodes of Example 1 and Comparison 1 are both manufactured by the manufacturing method of
(33) Please refer to
(34) Furthermore, please refer to
(35) The organic light-emitting diodes of Example 2 and Comparison 2 are both manufactured by the manufacturing method of
(36) Please refer to
(37) TABLE-US-00001 TABLE 1 Luminescence Properties of Example 2 and Comparison 2 Increased Example 2 Comparison 2 Ratio (%) Operation Voltage (V) 3.2 3.0 — Power Luminance of 47.9 32.1 49 Efficiency 10.sup.2 cd/m.sup.2 (Im/W) Luminance of 31.4 22.9 37 10.sup.3 cd/m.sup.2 Luminance of 10.2 7.1 44 10.sup.4 cd/m.sup.2 Current Luminance of 47.0 30.5 50.1 Efficiency 10.sup.2 cd/m.sup.2 (cd/A) Luminance of 31.1 26.4 17.6 10.sup.3 cd/m.sup.2 Luminance of 10.1 8.98 13 10.sup.4 cd/m.sup.2 External Luminance of 15.2 11.0 38 Quantum 10.sup.2 cd/m.sup.2 Efficiency Luminance of 13.1 10.0 31 (%) 10.sup.3 cd/m.sup.2 Luminance of 6.9 4.9 41 10.sup.4 cd/m.sup.2 Maximum Luminance (cd/m.sup.2) 18800 16430 —
(38) From
(39) The organic light-emitting diodes of Example 3 and Comparison 3 are both manufactured by the manufacturing method of
(40) Please refer to
(41) TABLE-US-00002 TABLE 2 Luminescence Properties of Example 3 and Comparison 3 Increased Example 3 Comparison 3 Ratio (%) Operation Voltage (V) 2.8 3.0 — Power Luminance of 58.3 50.1 16 Efficiency 10.sup.2 cd/m.sup.2 (Im/W) Luminance of 66.4 31.8 108 10.sup.3 cd/m.sup.2 Luminance of 32.5 11.4 41 10.sup.4 cd/m.sup.2 Current Luminance of 53.2 56.8 — Efficiency 10.sup.2 cd/m.sup.2 (cd/A) Luminance of 70.8 47.3 50 10.sup.3 cd/m.sup.2 Luminance of 55.0 26.4 108 10.sup.4 cd/m.sup.2 External Luminance of 14.6 15.4 — Quantum 10.sup.2 cd/m.sup.2 Efficiency Luminance of 19.5 12.0 63 (%) 10.sup.3 cd/m.sup.2 Luminance of 15.2 7.1 114 10.sup.4 cd/m.sup.2 Maximum Luminance (cd/m.sup.2) 37000 18740 —
(42) From
(43) Furthermore, please refer to
(44) In this regard, according to the manufacturing method of the organic light-emitting diode of the present disclosure, the material of the scattering layer is chosen to be the quasicrystalline material. Therefore, the luminous efficiency and luminance of the organic light-emitting diode are enhanced. The complexity of forming the scattering layer is also reduced, which facilitates the large-scale production.
(45) Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
(46) It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims.