Thermal interface material, and preparation and application thereof

Abstract

This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material. The thermal interface material combines excellent thermal conductivity and compressibility; the preparation method has the characteristics of simple process, low costs, safety and environmental protection, and accordingly, the thermal interface material can effectively resolve the heat dissipation problem of electronic products.

Claims

1. A thermal interface material, which is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure, wherein two-dimensional nano-sheets on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure, and two-dimensional nano-sheets located in intermediate part between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure.

2. The thermal interface material of claim 1, wherein the thickness of the intermediate part of the thermal interface material is 60-99.8% of the thickness of the thermal interface material.

3. The thermal interface material of claim 1, wherein in the intermediate part of the thermal interface material, the volume ratio of vertical stack structure to curved stack structure is 1-9:1-9.

4. The thermal interface material of claim 1, wherein the longitudinal thermal conductivity rate of the thermal interface material is 10-600 W/mK; and/or the compression ratio of the thermal interface material is 5-80%.

5. A thermal interface material, which only comprises the intermediate part of the thermal interface material of claim 1.

6. A thermal interface material, which comprises: 1) a matrix, which is a thermal interface material of claim 1 or an intermediate part thereof; and 2) a filler, which is distributed on the surface and/or inside of the matrix.

7. A method of preparing the thermal interface material of claim 1, comprising the following steps: b-1) providing a laminated structure; b-2) processing the laminated structure based on modulus mismatch principle, thereby obtaining a folded laminated structure; and b-3) pressing the folded laminated structure at a first pressure in horizontal direction of the folded laminated structure, then optionally annealing for a first time period at a first temperature, thereby obtaining the thermal interface material.

8. The method of claim 7, wherein the expression “processing the laminated structure based on modulus mismatch principle” refers to a processing technology in which the laminated structure is bonded to pre-stretched elastic body fixed by external force with Van der Waals force, then the external force is removed, and the laminated structure is folded.

9. The method of claim 7, which further comprises the following steps: c-1) providing a first slurry and a matrix which is the thermal interface material obtained in step b-3) or an intermediate part thereof, wherein the first slurry comprises a polymeric material and an optional thermal-conductivity reinforcing material; and c-2) filling or coating the matrix with the first slurry, and curing, thereby obtaining the thermal interface material.

10. An article, which comprises one or more components selected from the group consisting of: 1) a thermal interface material of claim 1; 2) an intermediate part of the thermal interface material (1); and 3) a thermal interface material which comprises: (a) a matrix, which is a thermal interface material (1) or an intermediate part thereof; and (b) a filler, which is distributed on the surface and/or inside of the matrix.

Description

DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a scanning electron micrograph of side view of the internal structure of graphene paper obtained in the step (b) of Example 1.

(2) FIG. 2 is a physical diagram of the graphene thermal interface material 1 obtained in the step (d) of Example 1.

(3) FIG. 3 is a structural schematic diagram of the thermal interface material 1 obtained in Example 1.

(4) FIG. 4 is a scanning electron micrograph of structure global view of the pure carbon-based duplex structure graphene thermal interface material 1 obtained in Example 1, wherein the upper right corner is a partially enlarged view.

(5) FIG. 5 is a scanning electron micrograph of surface structure top view of the pure carbon-based duplex structure graphene thermal interface material 1 obtained in Example 1.

(6) FIG. 6 is a scanning electron micrograph of longitudinal sectional view of curved arrangement structure in intermediate part of pure carbon-based duplex structure graphene thermal interface material 2 obtained in Example 2.

(7) FIG. 7 is a scanning electron micrograph of top view of pure carbon-based duplex structure graphene thermal interface material 3 obtained in Example 3.

(8) FIG. 8 shows a comparison of the properties of thermal interface material 2 and commercial thermal interface material (Fujipoly XR-m, 17 W/mK), wherein FIG. 8a is schematic diagram of the test, FIG. 8b is the temperature-rising curve of heat source, and FIG. 8c is infrared thermogram of equilibrium temperature of heat source.

EMBODIMENTS FOR CARRYING OUT THE INVENTION

(9) Based on a long-term and intensive research, the inventors have unexpectedly prepared a thermal interface material with excellent thermal conductivity and compressibility. The thermal interface material has excellent thermal conductivity and compressibility, and the preparation method has the characteristics of simple process, low cost, safety and environmental protection, and therefore the thermal interface material can effectively solve the heat dissipation problem of electronic industrial product. On this basis, the inventors have completed the present invention.

Terms

(10) As used herein, the term “modulus mismatch principle” refers to a behavior that the high modulus objects are bent and folded due to shrinkage deformation of low modulus objects when two materials with different modulus closely adhere to each other due to Van Der Waals force. The present invention specifically refers to a behavior that high-thermal-conductivity paper (such as graphene paper, boron nitride paper, natural graphite paper, artificial graphene paper, etc.) adhered to low modulus pre-stretched elastomer (such as silica gel, latex, polyacrylic acid pressure sensitive adhesive, etc.) is bent and folded due to shrinkage of the elastomer.

(11) Thermal Interface Material

(12) The present invention provides a thermal interface material, which is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure, wherein the two-dimensional high-thermal-conductivity nano-sheets on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure, and the two-dimensional high-thermal-conductivity nano-sheets located in intermediate part between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure.

(13) It should be understood that the thermal interface material of the present invention is prepared by using a specific “modulus mismatch principle” with respect to the existing thermal interface material, so that the intermediate part of the thermal interface material has both a vertical arrangement structure and a curved arrangement structure (i.e., a non-vertical arrangement structure), wherein the vertical arrangement structure can effectively ensure high thermal conductivity of the thermal interface material, and the curved vertical arrangement structure can ensue excellent compressibility of the thermal interface material.

(14) Preferably, the thickness of the intermediate part of the thermal interface material is 60-99.8% of the thickness of the thermal interface material. When the ratio is <60%, the longitudinal thermal conductivity of the corresponding thermal interface material is less than 10 W/mK.

(15) Preferably, the volume content of the vertical arrangement structure (or vertical stack structure) is 10-90% in the intermediate part of the thermal interface material. When the ratio is <10%, the longitudinal thermal conductivity of the corresponding thermal interface material is less than 10 W/mK; when the ratio is >90%, the corresponding thermal interface material can not be compressed under a standard packaging pressure.

(16) Preferably, the volume content of the curved arrangement structure (or curved stack structure) is 10-90% in the intermediate part of the thermal interface material. When the ratio is <10%, the corresponding thermal interface material can not be compressed under a standard packaging pressure; when the ratio is >90%, the longitudinal thermal conductivity of the corresponding thermal interface material is less than 10 W/mK.

(17) In addition, based on the above thermal interface material, the present invention also provides the following two thermal interface materials:

(18) The first thermal interface material, which only comprises the intermediate part of the above thermal interface material.

(19) In another preferred embodiment, the thermal interface material is prepared as follows: after step a-3), removing the upper surface and lower surface of the above thermal interface material by mechanical processing, thereby obtaining the thermal interface material.

(20) In another preferred embodiment, the “mechanical processing” is selected from the group consisting of cutting, polishing, etching, and combinations thereof.

(21) The second thermal interface material, which comprises:

(22) 1) the above thermal interface material or the first thermal interface material which is used as a matrix;

(23) 2) a filler, which is distributed on the surface and/or inside of the matrix.

(24) In another preferred embodiment, the filler comprises polymeric material and optional thermal-conductivity reinforcing material.

(25) Preparation Method

(26) The present invention also provides a method of preparing the thermal interface material according to the first aspect of the invention, comprising the following steps:

(27) b-1) providing a laminated structure;

(28) b-2) processing the laminated structure based on a modulus mismatch principle, thereby obtaining a folded laminated structure;

(29) b-3) pressing the folded laminated structure at a first pressure in horizontal direction of the folded laminated structure, then optionally annealing for a first time period at a first temperature, thereby obtaining the thermal interface material.

(30) It should be understood that in the process of processing the laminated structure based on the “modulus mismatch principle”, the laminated structure is bonded to the pre-stretched elastomer (such as silica gel, latex, polyacrylate pressure sensitive adhesive, etc.) by Van Der Waals force, wherein the elastomer is pre-stretched (the stretching amount is about 100-500% of the unstretched elastomer) before bonding the laminate structure, the (elastic) modulus is about 0.01-0.5 MPa, and the (elastic) modulus of the laminated structure (or high thermal-conductivity paper) is about 1 to 30 MPa. In the above processing, since the elastomer is pre-stretched, the pre-stretched elastomer always requires external force fixation during bonding the laminated structure. After the laminated structure is bonded with the pre-stretched elastomer, the external force is removed, then the laminated structure is folded. Correspondingly, the present invention also provides a second method of preparing the above thermal interface material accordingly, which comprises the following steps:

(31) b-1) providing a first slurry and a matrix which is the above thermal interface material or the second thermal interface material, wherein the first slurry comprises a polymeric material and an optional thermal-conductivity reinforcing material;

(32) b-2) filling or coating the matrix with the first slurry, and curing, thereby obtaining the thermal interface material.

(33) Application

(34) The present invention also provides an article, which comprises one or more components selected from the group consisting of:

(35) 1) the above thermal interface material;

(36) 2) the first thermal interface material;

(37) 3) the second thermal interface material.

(38) In another preferred embodiment, the article comprises (but is not limited to) thermal-conductivity pad, uniform heat sheet, and Joule heating sheet.

(39) Compared with the Prior Art, the Main Advantages of the Present Invention Include:

(40) 1. The thermal interface material has both excellent thermal conductivity and compressibility. Specifically, the longitudinal thermal conductivity of the thermal interface material is 10-600 W/mK and the compression ratio of the thermal interface material is 5-80%;

(41) (2) The pure carbon-based thermal interface material in the thermal interface material can be used at a high temperature, wherein the highest temperature in the air can be up to 400° C., and the highest temperature in the vacuum can be up to 3000° C.;

(42) (3) The pure carbon-based thermal interface material in the thermal interface material can be used in a strong corrosive environment;

(43) (4) The preparation method has the characteristics of simple process, low cost, safety and environmentally friendly;

(44) (5) The preparation method is easy to enlarge and industrialize.

(45) The present invention will be further illustrated below with reference to the specific examples. It should be understood that these examples are only to illustrate the invention but not to limit the scope of the invention. The experimental methods with no specific conditions described in the following examples are generally performed under the conventional conditions, or according to the manufacturer's instructions. Unless indicated otherwise, parts and percentage are calculated by weigh.

(46) Unless indicated otherwise, all professional and scientific terms used herein have the same meaning as those familiar to the skilled in the art. In addition, any methods and materials similar or equivalent to those described can be used in the method of the present invention. The preferred embodiments and materials described herein are for illustrative purposes only.

(47) General Raw Materials

(48) Graphene powder: in the preparation method of the present invention, the graphene powder used is not particularly limited. Preferably, the number of graphene layers of the graphene powder is 5-50 layers. Preferably, the graphene plane size of graphene powder is 5-30 μm.

(49) Graphene oxide powder: in the preparation method of the present invention, the graphene oxide of the graphene oxide powder used is not particularly limited. Preferably, the number of graphene oxide layers is 1-5 layers. Preferably, the graphene oxide plane size is 5-30 μm.

(50) Silica gel: in the preparation method of the present invention, the silica gel used is not particularly limited. Preferably, the silica gel is Dow Corning 184 silica gel.

(51) Boron Nitride: in the preparation method of the present invention, boron nitride used is not particularly limited. Preferably, the boron nitride is hexagonal boron nitride with a size of 1-10 μm.

(52) Polyimide: in the preparation method of the present invention, the polyimide used is not particularly limited. Preferably, the polyimide is a fully aromatic polyimide.

(53) Aluminum nitride: in the preparation method of the present invention, the aluminum nitride used is not particularly limited. Preferably, the aluminum nitride size is 1-10 μm.

(54) Boron nitride nano-sheet: in the preparation method of the present invention, the boron nitride nano-sheet used is peeled from hexagonal boron nitride. Preferably, the number of layers is 1-30 layers and the size is 0.1-10 μm.

(55) Artificial graphite paper: in the preparation method of the present invention, the artificial graphite paper used is made of polyimide film through carbonization-graphitization. preferably, the thickness of artificial graphite paper is 12-100 μm.

(56) Natural graphite paper: in the preparation method of the present invention, the natural graphite paper used is made of expanded graphite sheet by calenderation or rolling. Preferably, the thickness of natural graphite paper is 12-100 μm.

(57) General Test Method

(58) Density

(59) Weighing method: the density is obtained by dividing the mass of the weighed sample by the volume of the measured sheet sample.

(60) Longitudinal Thermal Conductivity Measuring device: LFA467, NETZSCH, Germany; Measuring standard: ASTM E 1461.

(61) Compression Ratio

(62) Measuring device: UTM, 5567A, Instron, USA; Measurement standard: GB1040-92.

Example 1. Pure Carbon-Based Duplex Structure Graphene Thermal Interface Material 1

(63) (a) For a concentration of 3 mg/ml, 300 mg of graphene powder was weighed, and the above powder was dispersed in 300 ml of ethanol solution. The mixture was stirred thoroughly, and then ultrasonically treated to obtain a uniformly dispersed graphene dispersion;

(64) (b) the graphene dispersion obtained in the step (a) was subjected to suction filtration to obtain graphene paper;

(65) (c) the graphene paper obtained in the step (b) was pasted on a pre-stretched (400%×400%) polyacrylate pressure sensitive adhesive, and then the pressure sensitive adhesive was recovered to obtain a folded graphene paper;

(66) (d) the folded graphene paper obtained in the step (c) was subjected to a pressure of 10 MPa in the horizontal direction and then annealed at 3000° C. for 3 hours to obtain a graphene matrix 1, i.e., a pure carbon-based duplex structure graphene thermal interface material 1. After testing, the density of the graphene matrix 1 was 1.62 g/cm.sup.3, the longitudinal thermal conductivity was 300 W/mK, and the compression ratio was 12%.

(67) FIG. 1 was a scanning electron micrograph of side view of the internal structure of graphene paper obtained in the step (b) of Example 1.

(68) It could be seen from FIG. 1 that the graphene nano-sheets in the prepared graphene paper had a horizontal stack structure.

(69) FIG. 2 was a physical diagram of the graphene thermal interface material 1 obtained in the step (d) of Example 1.

(70) It could be seen from FIG. 2 that the prepared graphene thermal interface material had certain flexibility.

(71) In order to better understand the prepared pure carbon-based duplex structure graphene thermal interface material 1, the structural schematic diagram of the composite structure was drawn. As shown in FIG. 3, the graphene tended to be vertically arranged in the interior of pure carbon-based duplex structure graphene thermal interface material 1, while the graphene nano-sheets on the upper and lower surfaces tended to be arranged horizontally.

(72) FIG. 4 was a scanning electron micrograph of structure global view of the pure carbon-based duplex structure graphene thermal interface material 1 obtained in Example 1, wherein the upper right corner was a partially enlarged view.

(73) It could be seen from FIG. 4 that the graphene tended to be vertically arranged in the interior of prepared pure carbon-based duplex structure graphene thermal interface material 1, while the upper surface and lower surface had a thin layer of approximately horizontally arranged graphene nano-sheets. Further, after testing, the upper surface (i.e., the portion arranged approximately horizontally) thickness of the thermal interface material 1 was 20 μm, and the thickness of intermediate part (i.e., the inner vertical arrangement portion) was 260 μm, and the thickness of lower surface (i.e., the portion arranged approximately horizontally) was 20 μm. Further, it could be seen from the partial enlarged view that the intermediate part of the thermal interface material 1 had both vertical arrangement structure and curved arrangement structure, and the volume content of the vertical arrangement structure and the curved arrangement structure was 75-85% and 15-25%, respectively.

(74) FIG. 5 was a scanning electron micrograph of surface structure top view of the pure carbon-based composite structure graphene thermal interface material 1 obtained in Example 1.

(75) It could be seen from FIG. 5 that the surface of the prepared pure carbon-based composite structure graphene thermal interface material 1 was of horizontal arrangement structure.

Example 2. Pure Carbon Based Composite Structure Graphene Thermal Interface Material 2

(76) The pure carbon-based duplex structure graphene thermal interface material 2 was prepared by the same method of Example 1, except that the mechanical pressure in the step (d) was 2 MPa.

(77) After testing, the density of the pure carbon-based duplex structure graphene thermal interface material 2 was 1.32 g/cm.sup.3, the longitudinal thermal conductivity was 115 W/mK, and the compression ratio was 27%.

(78) FIG. 6 was a scanning electron micrograph of longitudinal sectional view of curved arrangement structure in intermediate part of pure carbon-based duplex structure graphene thermal interface material 2 obtained in Example 2.

(79) It could be seen from FIG. 6 that some graphenes in the pure carbon-based duplex structure graphene thermal interface material 2 were S-shape non-vertical arrangement, which was a necessary condition for the prepared graphene matrix to maintain compressibility with high thermal conductivity

Example 3. Pure Carbon-Based Duplex Structure Graphene Thermal Interface Material 3

(80) The pure carbon based duplex structure graphene thermal interface material 3 was prepared by the same method of Example 2, except that after step (d), the upper surface and lower surface of the graphene matrix 1 were removed (the removal could be achieved by cutting and/or polishing the graphene matrix 1), and only the internal graphene structure was retained (i.e., only the non-horizontal arrangement portion of the graphene matrix 1 was retained).

(81) After testing, the density of the obtained pure carbon-based duplex structure graphene thermal interface material 3 was 1.30 g/cm.sup.3, the longitudinal thermal conductivity was 158 W/mK, and the compression ratio was 23%.

(82) FIG. 7 was a scanning electron micrograph of top view of pure carbon-based duplex structure graphene thermal interface material 3 obtained in Example 3.

(83) It could be seen from FIG. 7 that the interior of the prepared pure carbon-based duplex structure graphene thermal interface material 3 tended to be vertically arrangement structure, which was a necessary condition for the graphene matrix to have high thermal conductivity.

Example 4. Pure Carbon-Based Duplex Structure Graphene Thermal Interface Material 4

(84) The pure carbon based duplex structure graphene thermal interface material 4 was prepared by the same method of Example 1, except that the mechanical pressure was 0.1 MPa and the annealing temperature was 800° C. in the step (d).

(85) After testing, the density of the obtained pure carbon-based duplex structure graphene thermal interface material 4 was 0.7 g/cm.sup.3, the longitudinal thermal conductivity was 10 W/mK, and the compression ratio was 80%.

Example 5 Pure Carbon-Based Duplex Structure Graphene Thermal Interface Material 5

(86) (a) For a concentration of 3 mg/ml, 300 mg of graphene oxide powder was weighed, and the above powder was dispersed in 300 ml of deionized water solution. The mixture was stirred thoroughly, and then ultrasonically treated to obtain a uniformly dispersed graphene oxide dispersion;

(87) (b) the graphene oxide dispersion obtained in the step (a) was subjected to suction filtration to obtain graphene oxide paper;

(88) (c) the graphene oxide paper obtained in the step (b) was processed by modulus mismatch principle to obtain a folded graphene oxide paper;

(89) (d) the folded graphene oxide paper obtained in the step (c) was subjected to a pressure of 10 MPa in the horizontal direction and then annealed at 3000° C. for 3 hours to obtain the pure carbon-based duplex structure graphene thermal interface material 5.

(90) The obtained pure carbon-based duplex structure graphene thermal interface material 5 was a pure carbon-based material prepared from graphene oxide as raw material and assisted by high temperature graphitization.

(91) After testing, the density of the pure carbon-based duplex structure graphene thermal interface material 5 was 1.85 g/cm.sup.3, the longitudinal thermal conductivity was 600 W/mK, and the compression ratio was 7%.

Example 6. Duplex Structure Graphene-Based Thermal Interface Material 6

(92) The duplex structure graphene-based thermal interface material 6 was prepared by the same method of Example 1, except that after Example 1, silica gel was mixed with 60 wt % of boron nitride (boron nitride particle size was 5 μm) to obtain a silica gel/boron nitride slurry. The slurry was then filled in the graphene matrix 1 obtained in the step (d) and then cured (the curing was carried out by processing at 100° C. for 2 h) to obtain the duplex structure graphene-based thermal interface material 6.

(93) The duplex structure graphene-based thermal interface material 6 was a composite material of graphene matrix 1 and elastic silica gel/boron nitride, wherein the addition of silica gel was to improve the mechanical properties of the material.

(94) After testing, the density of the duplex structure graphene-based thermal interface material 6 was 1.74 g/cm.sup.3, the longitudinal thermal conductivity was 320 W/mK, and the compression ratio was 150%.

(95) Furthermore, the mass ratio of graphene matrix 1 to filler (silica gel+boron nitride) was about 1.62:0.12 in thermal interface material 6.

Example 7. Duplex Structure Graphene-Based Thermal Interface Material 7

(96) The duplex structure graphene-based thermal interface material 7 was prepared by the same method of Example 1, except was that after Example 1, silica gel was mixed with 60 wt % boron nitride nano-plates to obtain a silica/boron nitride nano-sheets slurry. The slurry was then coated on the surface of the graphene matrix 1 obtained in the step (d) with a coating thickness of 2 μm, and then cured (the curing was carried out by processing at 100° C. for 2 h) to obtain the duplex structure graphene-based thermal interface material. 7.

(97) The duplex structure graphene-based thermal interface material 7 was a silica gel composite material/graphene matrix 1/silica gel composite material sandwich structure material (silica gel composite material referred to silica gel/boron nitride), wherein the surface coating of silica gel composite material was to improve the insulation properties of the thermal interface material, so the material could be used for heat conductive insulation.

(98) After testing, the density of the duplex structure graphene-based thermal interface material 7 was 1.61 g/cm.sup.3, the longitudinal thermal conductivity was 280 W/mK, and the compression ratio was 12%.

(99) Furthermore, the volume ratio of graphene matrix 1 to filler (silica gel+boron nitride) was about 500 in thermal interface material 7.

Example 8. Duplex Structure Graphene-Based Thermal Interface Material 8

(100) The duplex structure graphene-based thermal interface material 8 was prepared by the same method of Example 5, except that after Example 5, polyimide was filled in the pure carbon-based duplex structure graphene thermal interface material 5 obtained in the step (d), and then cured (the curing was carried out by processing at 100, 200, and 300° C. for 1 h, respectively) to obtain the duplex structure graphene-based thermal interface material 8.

(101) The obtained duplex structure graphene-based thermal interface material 8 was a composite material of pure carbon-based duplex structure graphene thermal interface material 5 and non-elastic polyimide.

(102) After testing, the density of the duplex structure graphene-based thermal interface material 8 was 1.92 g/cm.sup.3, the longitudinal thermal conductivity was 520 W/mK, and the compression ratio was 5%.

(103) Furthermore, the mass ratio of thermal interface material 5 to filler (polyimide) was about 1.62:0.30 in thermal interface material 8.

Example 9 Duplex Structure Graphene-Based Thermal Interface Material 9

(104) The duplex structure graphene-based thermal interface material 9 was prepared by the same method of Example 5, except that after Example 5, polyimide was mixed with 96 wt % of aluminum nitride (aluminum nitride particle size was 5 μm) to obtain a polyimide/aluminum nitride slurry, the slurry was then filled in the pure carbon-based duplex structure graphene thermal interface material 5 obtained in the step (d), and then cured (the curing was carried out by processing at 100, 200, and 300° C. for 1 h, respectively) to obtain the duplex structure graphene-based thermal interface material 9.

(105) The obtained duplex structure graphene-based thermal interface material 9 was a composite material of pure carbon-based duplex structure graphene thermal interface material 5 and thermal-conductivity insulating slurry.

(106) After testing, the density of the duplex structure graphene-based thermal interface material 9 was 2.2 g/cm.sup.3, the longitudinal thermal conductivity was 540 W/mK, and the compression ratio was 5%.

(107) Furthermore, the mass ratio of thermal interface material 5 to filler (polyimide+aluminum nitride) was about 1.62:0.58 in thermal interface material 9.

Example 10. Duplex Structure Graphene-Based Thermal Interface Material 10

(108) The duplex structure graphene-based thermal interface material 10 was prepared by the same method of Example 8, except was that elastic silica gel matrix was replaced with non-elastic polyimide.

(109) The obtained duplex structure graphene-based thermal interface material 10 was a composite material of pure carbon-based duplex structure graphene thermal interface material 5 and elastic silica gel.

(110) After testing, the density of the duplex structure graphene-based thermal interface material 10 was 1.91 g/cm.sup.3, the longitudinal thermal conductivity was 480 W/mK, and the compression ratio was 11%.

(111) Furthermore, the mass ratio of thermal interface material 5 to filler (silica gel matrix) was about 1.62:0.29 in thermal interface material 10.

Example 11 Thermal Interface Material 11

(112) (a) For a concentration of 3 mg/ml, 300 mg of boron nitride nano-sheets powder was weighed, and the above powder was dispersed in 300 ml of deionized water solution. The mixture was stirred thoroughly, and then ultrasonically treated to obtain a uniformly dispersed boron nitride nano-sheets dispersion;

(113) (b) the boron nitride nano-sheets dispersion obtained in the step (a) was subjected to suction filtration to obtain boron nitride nano-sheets paper;

(114) (c) the boron nitride obtained in the step (b) was pasted on a pre-stretched (400%×400%) polyacrylate pressure sensitive adhesive, and then the pressure sensitive adhesive was recovered to obtain a folded boron nitride paper;

(115) (d) the folded boron nitride paper obtained in the step (c) was subjected to a pressure of 10 MPa in the horizontal direction to obtain the boron nitride matrix 1;

(116) (e) the silica gel was filled in the boron nitride matrix 1 obtained in the step (d) to obtain the thermal interface material 11.

(117) After testing, the density of the thermal interface material 11 was 3.12 g/cm.sup.3, longitudinal thermal conductivity was 30 W/mK, and compression ratio was 8%.

Example 12. Thermal Interface Material 12

(118) The thermal interface material 12 was prepared by the same method of Example 1, except that the graphene paper prepared in the steps (a) and (b) was replaced with commercial natural graphite paper (commercial natural graphite paper was formed by calenderation of expanded graphite sheets).

(119) After testing, the density of the thermal interface material 12 was 1.13 g/cm.sup.3, longitudinal thermal conductivity was 160 W/mK, and compression ratio was 13%.

Example 13 Thermal Interface Material 13

(120) The thermal interface material 13 was prepared by the same method of Example 1, except that the graphene paper prepared in the steps (a) and (b) was replaced with commercial artificial graphite paper (commercial artificial graphite paper was formed by carbonization/graphitization of polyimide).

(121) After testing, the density of the thermal interface material 13 was 1.37 g/cm.sup.3, longitudinal thermal conductivity was 310 W/mK, and compression ratio was 14%.

Example 14

(122) FIG. 8 was a comparison of the properties of thermal interface material 2 and commercial thermal interface material (Fujipoly XR-m, 17 W/mK), wherein FIG. 8a was schematic diagram of the test, FIG. 8b was the temperature-rising curve of heat source, and FIG. 8c was infrared thermogram of equilibrium temperature of heat source.

(123) It could be seen from FIG. 8b that the final equilibrium temperature of the heat source using the thermal interface material 2 was far lower than the heat source temperature using the commercial thermal interface material.

(124) It could be seen from FIG. 8c, the thermal interface material 2 had significant advantages in thermal management over commercial thermal interface materials.

(125) The performance parameters of the thermal interface materials obtained in Examples 1-13 are summarized in Table 1 below.

(126) TABLE-US-00001 TABLE 1 Volume Volume content content of vertical of curved arrange- arrange- Longitudinal ment ment thermal compres- structure structure Density conductivity sion (%) (%) (g/cm.sup.3) (W/mK) ratio Example1 75-85 15-25 1.62 300 12% Example2 60-70 30-40 1.32 115 27% Example3 80-90 10-20 1.30 158 23% Example4 10-30 70-90 0.7 10 80% Example5 75-85 15-25 1.85 600  7% Example6 75-85 15-25 1.74 320 15% Example7 75-85 15-25 1.61 280 12% Example8 75-85 15-25 1.92 520  5% Example9 75-85 15-25 2.2 540  5% Example10 75-85 15-25 1.91 480 11% Example11 75-85 15-25 3.12 30  8% Example12 75-85 15-25 1.13 160 13% Example13 75-85 15-25 1.37 310 14%

(127) All literatures mentioned in the present application are incorporated herein by reference, as though each one is individually incorporated by reference. Additionally, it should be understood that after reading the above teachings, those skilled in the art can make various changes and modifications to the present invention. These equivalents also fall within the scope defined by the appended claims.