SENSOR ARRANGEMENT FOR ARRANGEMENT ON A MEASUREMENT CHAMBER, APPARATUS FOR QUALIFYING A MASK AND METHOD FOR QUALIFYING A MASK

Abstract

A sensor arrangement for arrangement on a measurement chamber, wherein the sensor arrangement comprises: a sensor; an intake opening; an outlet; and a fluid connection between the intake opening and the outlet.

Claims

1. A sensor arrangement, comprising: a sensor; an intake opening; an outlet; and a fluid connection between the intake opening and the outlet, wherein the sensor arrangement is configured to be arranged on a measurement chamber.

2. The sensor arrangement of claim 1, wherein the fluid connection is configured to extract a medium from the measurement chamber via suction.

3. The sensor arrangement of claim 1, further comprising an adhesive layer.

4. The sensor arrangement of claim 3, wherein the fluid connection is configured to extract outgassings of the adhesive layer via suction.

5. The sensor arrangement of claim 1, wherein: the sensor arrangement comprises first and second sections; the first section comprises the outlet; the second section comprises the intake opening and the sensor; and the fluid connection connects the first section to the second section.

6. The sensor arrangement of claim 5, further comprising an electronics unit, wherein the first section comprises the electronics unit.

7. The sensor arrangement of claim 5, further comprising a carrier plate and a sensor carrier, wherein the first section comprises the carrier plate, and the second section comprises the sensor carrier.

8. The sensor arrangement of claim 5, wherein the sensor arrangement is configured to generate a decreasing pressure gradient from the first section to the second section.

9. The sensor arrangement of claim 5, wherein: the first section comprises a first cavity; the second section comprises a second cavity; and the sensor arrangement is configured so that, during use of the sensor arrangement, a partial pressure in the first cavity is less than a partial pressure in the second cavity.

10. The sensor arrangement of claim 9, further comprising a third section, wherein: the third section comprises a third cavity; and the sensor arrangement is configured so that, during use of the sensor arrangement: a partial pressure in the third cavity is greater than the partial pressure in the first cavity; and the partial pressure in the third cavity is greater than the partial pressure in the second cavity.

11. The sensor arrangement of claim 1, comprising a plurality of sensors.

12. The sensor arrangement of claim 1, wherein the sensor is configured to detect EUV radiation.

13. The sensor arrangement of claim 1, further comprising a connecting element connectable to a vacuum source.

14. The sensor arrangement of claim 1, further comprising a vacuum source.

15. The sensor arrangement of claim 1, further comprising a connecting element connected to the measurement chamber to achieve ultra-high vacuum during use of the sensor arrangement.

16. The sensor arrangement of claim 1, further comprising a flushing device configured to flow of a flushing medium.

17. The sensor arrangement of claim 16, wherein the flushing medium comprises at least one gas selected from the group consisting of helium, hydrogen, nitrogen, neon, argon, krypton, xenon and oxygen.

18. The sensor arrangement of claim 1, wherein the fluid connection comprises a channel.

19. The sensor arrangement of claim 18, wherein the channel has a cross section of at least 0.1 mm.sup.2.

20. The sensor arrangement of claim 1, wherein the fluid connection comprises a valve.

21. The sensor arrangement of claim 1, further comprising a cooling device.

22. An apparatus, comprising: a measurement chamber; and a sensor arrangement arranged on the measurement chamber, the sensor arrangement comprising: a sensor; an intake opening; an outlet; and a fluid connection between the intake opening and the outlet, wherein the apparatus is configured to qualify a lithography mask.

23. The apparatus of claim 22, further comprising: an evaluation and control device; and an optical system, wherein the measurement chamber comprises the optical system.

24. A method of using an apparatus comprising a measurement chamber, a sensor arrangement arranged on the measurement chamber, and an evaluation and control device, the measurement chamber comprising an optical system, the sensor arrangement comprising a sensor, an intake opening, an outlet and a fluid connection between the intake opening and the outlet, the method comprising: using the sensor to detect an optical image of a lithography mask; and using the evaluation and control device to use suction to extract a medium from the measurement chamber via the fluid connection.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In the drawings:

[0036] FIG. 1 shows a schematic illustration of an exemplary embodiment of a sensor arrangement according to the disclosure;

[0037] FIG. 2 shows a schematic illustration of an exemplary embodiment of a sensor arrangement according to the disclosure;

[0038] FIG. 3 shows a schematic illustration of an exemplary embodiment of a sensor arrangement according to the disclosure;

[0039] FIG. 4 shows a schematic illustration of an exemplary embodiment of an apparatus according to the disclosure for qualifying a mask; and

[0040] FIG. 5 shows a schematic representation of a method according to the disclosure for qualifying a mask.

DETAILED DESCRIPTION

[0041] FIG. 1 shows a first exemplary embodiment of a sensor arrangement 100 according to the disclosure for arrangement on a measurement chamber. The sensor arrangement 100 has a sensor 124, an intake opening 131 and an outlet 132. The sensor arrangement 100 has a fluid connection 133 between the intake opening 131 and the outlet 132. The fluid connection 133 is designed to extract a medium from the measurement chamber by suction during operation of the sensor arrangement 100. The sensor 124 can be designed to detect radiation in the EUV range. The sensor arrangement 100 can have a plurality of sensors 124, such as a plurality of imaging sensors 124, for example a plurality of sensors 124 which can be designed to detect radiation in the EUV range.

[0042] The sensor arrangement 100 has an adhesive layer 123. The fluid connection 133 can be designed to extract outgassings 126 of the adhesive layer 123 by suction during operation of the sensor arrangement 100.

[0043] The sensor arrangement 100 has a first section 190 and a second section 110. In the embodiment illustrated in FIG. 1, the dashed line 141 marks a plane as the border between the first section 190 and the second section 110. The first section 190 comprises the outlet 132. The second section 110 has the intake opening 131 and the sensor 124. The fluid connection 133 connects the first section 190 to the second section 110.

[0044] The sensor arrangement 100 comprises an electronics unit 120. The first section 190 comprises the electronics unit 120. The first section 190 further comprises a carrier plate 121. The second section 110 comprises a sensor carrier 122. The sensor arrangement 100 can be designed to generate a decreasing pressure gradient from the first section 190 to the second section 110.

[0045] The first section 190 has a first cavity 134. The first cavity 134 can be comprised, for example, of the electronics unit 120. The second section 110 has a second cavity 135. The second cavity 135 can be the intake opening 131. A partial pressure in the first cavity 134 can be lower than in the second cavity 135, for example during operation of the sensor arrangement 100 on a measurement chamber under ultra-high vacuum.

[0046] The sensor arrangement 100 can have a first housing 143. The outlet 132 and/or the carrier plate 121 and/or the electronics unit 120 can be at least partially integrated in the first housing 143. As an alternative or in addition, the sensor arrangement 100 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 122 and/or the sensor 124 and/or a flushing device. In this way, extraction of contaminants and/or outgassings, for example from the electronics unit 120 and/or from an adhesive layer 123 of the sensor arrangement 100, by suction can be simplified. A cavity of the first housing 143 can be the first cavity, for example. A cavity of the second housing can be the second cavity, for example.

[0047] The sensor arrangement 100 has a first connecting element 137. The first connecting element 137 can be connectable to a vacuum source. As an alternative to this, the sensor arrangement 100 can have a vacuum source, for example a pump. The sensor arrangement 100 has a second connecting element 139. In the exemplary embodiment according to FIG. 1, the second connecting element 139 is the carrier plate 121. The second connecting element 139 can be connectable to the measurement chamber for operation under ultra-high vacuum.

[0048] The fluid connection 133 has a channel 141. The channel 141 according to FIG. 1 is designed substantially as an annular gap. The annular gap can have, for example, interruptions, such as by elements for mechanical stabilization of the sensor arrangement 100 and/or by electrical connections. The channel 141 is formed from a gap between the electronics unit 120 and the carrier plate 121. The channel 141 can have a cross section of at least 0.1 mm.sup.2, such as at least 1 mm.sup.2, for example at least 5 mm.sup.2. The fluid connection 133 can have one or more valves. The sensor arrangement 100 can have a cooling device.

[0049] The electronics unit 120 is substantially cylindrical. As an alternative to this, the electronics unit 120 can be substantially cuboidal. The electronics unit 120 is received into a circular opening in the carrier plate 121. The electronics unit 120 is connected to a sensor carrier 122, such as via electrical connections. The sensor carrier 122 is connected to the sensor 124 via an adhesive layer 123. The sensor 124 can be a TDI sensor. The sensor 124 can comprise a plurality of TDI sensors, for example. When a pump is connected to the outlet 132, a vacuum can be generated in the first section 190, which comprises the electronics unit 120, the outlet 132 and the carrier plate 121 and also at least parts of the first housing 143 of the sensor arrangement 100, the vacuum being able to generate a fluid flow from the second section 110, which comprises the sensor carrier 122, the adhesive layer 123 and the sensor 124, into the first section 190. This allows outgassings 126 of the adhesive layer 123 to be directed out of the second section 110 into the first section 190.

[0050] The exemplary embodiment of the sensor arrangement 200 according to FIG. 2 can be configured substantially like the exemplary embodiment according to FIG. 1. The exemplary embodiment according to FIG. 2 comprises a flushing device 227 for conducting a flushing flow 228 of a flushing medium. The flushing medium can contain one or more gases, selected from the group comprising helium, hydrogen, nitrogen, neon, argon, krypton, xenon and oxygen. The flushing device 227 can be configured, for example, as a ring-shaped nozzle arrangement. The flushing device 227 can be designed to enhance extraction of outgassings 226 from the adhesive layer 223 by suction. The flushing device 227 can be designed to direct the flushing flow 228 to edges of the sensor 224 and/or to an edge zone of the adhesive layer 223. This can intensify extraction of outgassings 226 from the adhesive layer 223 and/or of soiling of the sensor 224 by suction.

[0051] The sensor arrangement 200 can have a first housing 243. The outlet 232 and/or the carrier plate 221 and/or the electronics unit 220 can be at least partially integrated in the first housing 243.

[0052] The sensor arrangement 200 according to FIG. 2 comprises a second housing 244 of the sensor arrangement 200. The second housing 244 of the sensor arrangement 200 can, for example, at least partially enclose the sensor carrier 222 and/or the sensor 224 and/or the flushing device 227 and/or the adhesive layer 223. In this way, extraction of contaminants and/or outgassings 226, for example from the electronics unit 220 and/or from an adhesive layer 223 of the sensor arrangement 200, by suction can be simplified. A cavity of the first housing 243 can be the first cavity 234, for example. A cavity of the second housing 244 can be the second cavity 235, for example. During operation of the sensor device 200, a partial pressure in the first cavity 234, such as in the first housing 243, can be lower than in the second cavity 235, such as in the second housing 244.

[0053] The exemplary embodiment of the sensor arrangement 300 according to FIG. 3 can be configured substantially like the sensor arrangements according to FIG. 1 and/or FIG. 2 and can, for example, also have components which are not illustrated in FIG. 3. The first section 390 comprises the carrier plate 321. The second section 310 comprises the sensor 324, the sensor carrier 322 and also the adhesive layer 323 which connects the sensor 324 to the sensor carrier 322.

[0054] The sensor arrangement 300 comprises a further adhesive layer 323a which can be designed to fluidically seal off a housing 321a of the electronics unit 320 with respect to the first section 390 and the second section 310, such as with respect to the sensor carrier 322. The sensor arrangement 300 has a third section 340. The third section 340 comprises the electronics unit 320. The sensor arrangement 300 has a first cavity 334 in a first section 390 and a second cavity 335 in a second section 310. The third section 340 can have a third cavity 345 which, during operation of the sensor arrangement 300, has a higher partial pressure than the first section 390 and the second section 310. The third cavity 345 can be at atmospheric pressure, such as during operation the sensor arrangement 300. The sensor arrangement 300 comprises a cooling device 342.

[0055] The sensor arrangement 300 can have a first housing 343. The outlet 332 and/or the carrier plate 321 and/or the electronics unit 320 can be at least partially integrated in the first housing 343. As an alternative or in addition, the sensor arrangement 300 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 322 and/or the sensor 324 and/or the flushing device 327 and/or the adhesive layer 323. In this way, extraction of contaminants and/or outgassings, for example from the electronics unit 320 and/or from an adhesive layer 323 of the sensor arrangement 300, by suction can be simplified. A cavity of the first housing 343 can be the first cavity 334, for example. A cavity of the second housing can be the second cavity, for example. During operation of the sensor device 300, a partial pressure in the first cavity 334, such as in the first housing 343, can be lower than in the second cavity, such as in the second housing.

[0056] FIG. 4 shows an exemplary embodiment of an apparatus 550 according to the disclosure for qualifying a mask 530 for use in lithography, wherein the apparatus 550 comprises a sensor arrangement 500 according to the disclosure. The sensor arrangement 500 can be configured like a sensor arrangement described above. FIG. 4 shows a sensor arrangement 500 which for example comprises a sensor 524 and an outlet 532. The sensor 524 can be designed to detect radiation in the EUV range 536. The outlet 532 is the first connecting element 537. The outlet 532 is connected to a vacuum source 538. The vacuum source 538 is integrated into the sensor arrangement 500, such as into a first housing 543 of the sensor arrangement 500. The apparatus 550 comprises an EUV source 510.

[0057] The device 550 comprises an evaluation and control device 543 and also a measurement chamber 540 comprising an optical system 520. The evaluation and control device 543 can be connected to the sensor arrangement 500 and/or to the EUV source 510 and/or to the optical system 520 via interfaces. The apparatus 550 has a housing 590. The housing 590 can delimit the measurement chamber 540, for example. The apparatus 550 can be designed to perform a method according to the disclosure for qualifying a mask 530.

[0058] FIG. 5 shows an exemplary embodiment of the method according to the disclosure for qualifying a mask for use in lithography. The method comprises providing 1010 an apparatus for qualifying a mask. The apparatus may be, for example, an apparatus 550 as illustrated in FIG. 4. The apparatus comprises, for example, a sensor arrangement according to the disclosure, as illustrated in FIG. 1, FIG. 2, FIG. 3 or FIG. 4 for example. The apparatus can have an evaluation and control device and also a measurement chamber comprising an optical system. The sensor arrangement comprises a sensor, an intake opening and an outlet. The sensor arrangement comprises a fluid connection between the intake opening and the outlet. The apparatus can have a vacuum source. In a further step 1020, at least one optical image of at least part of the mask is detected via the sensor. A plurality of images can be recorded, for example. In a further step 1030, a medium is extracted from the measurement chamber by suction via the fluid connection via the evaluation and control device. In a further step, an evaluation can be carried out via the evaluation and control device, for example defect detection can be carried out to identify defects or soiling of the mask.

LIST OF REFERENCE SIGNS

[0059] 100, 200, 300, 500 Sensor arrangement [0060] 540 Measurement chamber [0061] 124, 224, 324, 524 Sensor [0062] 131, 231, 331 Intake opening [0063] 132, 232, 332, 532 Outlet [0064] 133, 233, 333 Fluid connection [0065] 123, 223, 323 Adhesive layer [0066] 126, 226, 326 Outgassings [0067] 190, 290, 390 First section [0068] 110, 210, 310 Second section [0069] 1010 Providing [0070] 1020 Detecting [0071] 1030 Extracting by suction [0072] 120, 220, 320 Electronics unit [0073] 121, 221, 321 Carrier plate [0074] 122, 222, 322 Sensor carrier [0075] 134, 234, 334, 534 First cavity [0076] 135, 235, 335, 535 Second cavity [0077] 536 Radiation in the EUV range [0078] 137, 337, 537 First connecting element [0079] 538 Vacuum source [0080] 139, 239, 339 Second connecting element [0081] 227, 327 Flushing device [0082] 228, 328 Flushing flow [0083] 141, 241, 341 Channel [0084] 342 Cooling device [0085] 530 Mask [0086] 543 Evaluation and control device [0087] 520 Optical system [0088] 550 Apparatus for qualifying a mask [0089] 142, 242, 342 Plane [0090] 323a Further adhesive layer [0091] 321a Housing of the electronics unit [0092] 340 Third section [0093] 510 EUV source [0094] 590 Housing of the apparatus for qualifying the mask [0095] 143, 243, 343, 543 First housing of the sensor arrangement [0096] 244 Second housing of the sensor arrangement [0097] 345 Third cavity