Power supply module

Abstract

A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.

Claims

1. A power supply module, comprising: an integrated circuit chip; a single lead frame integrally formed with and electrically connected to the integrated circuit chip as a single circuit design for connecting other electronic components; a coil electrically connected to the lead frame, the coil including a coil body and a connecting terminal; an electronic component mounted directly on and electrically connected to the lead frame; and a magnetic conductor enclosing the coil body, the integrated circuit chip, and the electronic component.

2. The power supply module of claim 1, wherein the coil is a hollow coil.

3. The power supply module of claim 1, wherein the electronic component includes a resistance and/or a capacitance.

4. The power supply module of claim 1, wherein the lead frame includes a terminal configured to be electrically connected to an external circuit.

5. The power supply module of claim 1, wherein the magnetic conductor is formed from magnetic powder by an encapsulating approach.

6. The power supply module of claim 5, wherein the encapsulating approach is molding or potting.

7. A method for manufacturing a power supply module, comprising: integrally forming one lead frame with an integrated circuit chip as a single circuit design for connecting other electronic components during manufacturing of the integrated circuit chip; electrically connecting a coil to the lead frame, wherein the coil includes a coil body and a connecting terminal; mounting an electronic component directly on the lead frame; and enclosing the coil body, the integrated circuit chip, and the electronic component with a magnetic conductor.

8. The method of claim 7, wherein the method further comprises: cutting out an outer peripheral portion of the lead frame forming a terminal.

9. The power supply module of claim 1, wherein a terminal of the single lead frame integrally formed with and extending from the integrated circuit chip bends around the integrated circuit chip to connect to the connecting terminal of the coil.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a sectional view for illustrating an electronic circuit module formation in the prior art.

(2) FIG. 2 is a structural diagram for illustrating a power supply module according to one embodiment of the present disclosure.

(3) FIG. 3 is a flow diagram or illustrating a method for manufacturing the power supply module according to one embodiment of the present disclosure.

(4) FIG. 4 is a sectional view for illustrating a manufactured power supply module according to one embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

(5) The present disclosure may be best understood by reference to the following description taken in conjunction with embodiments and reference to the accompanying drawings.

(6) According to an aspect of the present disclosure, a power supply module is provided. As shown in FIG. 2, in one embodiment of the present disclosure, the power supply module includes a coil, electronic components, a connector and a magnetic conductor.

(7) The coil includes a coil body and a connecting terminal, and preferably, the coil is a hollow coil.

(8) The coil is preferably made of a flat copper wire, a round copper wire or a wound wire of other shapes and is wound according to a certain number of turns and shape in advance.

(9) The electronic components include at least an integrated circuit chip which is a unit module preferably integrated a MOSFET, a drive circuit, a pulse width modulator and a controller. In another embodiment of the present disclosure, the electronic components also include a resistor, a capacitor or other electronic components.

(10) One or more integrated circuit chips can be provided upon the demands in use.

(11) The connector is electrically connected with the coil and the electronic components, for example, each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector.

(12) Wherein, the connector is integrally formed with the integrated circuit chip when manufacturing the latter.

(13) In one embodiment of the present disclosure, the connector is a lead frame, all the electronic components are electrically connected to the lead frame, and preferably, a part of the outer periphery of the lead frame corresponding to the connecting terminal of the coil, which is bent upward, is electrically connected with the connecting terminal of the coil. In this way, only one circuit design is needed in the present disclosure, one circuit design is saved compared with the prior art, so as to reduce material consumption.

(14) In addition, the setting of the connector can reduce damage to the integrated circuit chip that the integrated circuit chip is not easily affected by external electromagnetic interference, so as to improve the electromagnetic interference performance with the proposed structure, effectively resolve the electromagnetic interference problem in an integrated circuit chip. In addition, the integrated circuit will contact with the magnetic core and therefore, the heat from the integrated circuit can be transferred through the magnetic core to ambient. Therefore, the heat transfer characteristics can be improved.

(15) In another embodiment of the present disclosure, the connector includes a terminal configured to be electrically connected to an external device.

(16) The magnetic conductor encloses in and around the coil body and the electronic components. The magnetic conductor is generally designed in a cuboid or cube shape, and also can be designed in a cylinder shape or other shapes upon the demands in use.

(17) In one embodiment of the present disclosure, the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches.

(18) According to another aspect of the present disclosure, a manufacturing method for the power supply module is provided. As shown in FIG. 3 in one embodiment of the present disclosure, the method includes the following steps:

(19) Step S1, integrally forming a connector when manufacturing an integrated circuit chip.

(20) Preferably, the connector is a lead frame.

(21) Step S2, electrically connecting the connector with a coil and electronic components at least including an integrated circuit chip, where the coil includes a coil body and a connecting terminal.

(22) The integrated circuit chip is a unit module integrating a MOSFET, a drive circuit, a pulse width modulator and a controller. In another embodiment of the present disclosure, the electronic components also include a resistor, a capacitor or other electronic components.

(23) In one embodiment of the present disclosure, each connecting terminal of the coil can be respectively electrically connected with a corresponding terminal of the connector that the coil and other electronic components can be connected into a whole circuit by the lead frame.

(24) Step S3, encapsulating the coil body and the electronic component with a magnetic conductor so that the magnetic conductor encloses in and around the coil.

(25) In one embodiment of the present disclosure, the magnetic conductor is formed from magnetic powder by molding, potting or other encapsulating approaches, namely the whole circuit is covered by the magnetic powder in the way of molding or other encapsulating approaches to form an entirety.

(26) If the connector is a lead frame, the method also includes:

(27) cutting out the outer peripheral portion of the lead frame to make a terminal that can be used by a user.

(28) FIG. 4 is a sectional view illustrating a manufactured power supply module according to one embodiment of the present disclosure. It can be observed from FIG. 4 that, the integrated circuit chip is electrically connected with the lead frame, two connecting terminals (pins) of the coil are respectively electrically connected to the corresponding terminals of the lead frame, the whole circuit connected by the coil and the integrated circuit chip is covered by the magnetic powder in the way of molding or other encapsulating approaches, and the peripheral portion of the lead frame is cut off to form coils pin and IC pins that can be used by a user.

(29) Therefore, compared with the power supply module in the prior art as shown in FIG. 1, the power supply module of the present disclosure has the following advantages:

(30) 1. making the structure more compact to better meet the needs of the miniaturization design; and

(31) 2. reducing material consumption and simplifying procedure and therefore reducing production costs.

(32) The embodiments are chosen and described in order to explain the basic idea of the disclosure and their practical application so as to activate others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.