DEVICE FOR REMOVING A TEST CONTACT OF A TEST CONTACT ARRANGEMENT

Abstract

The invention relates to a device for the placing and contacting of a test contact (15) of a test contact arrangement arranged on a contact carrier (19), wherein the device features a contact head (10) having at least one transmission channel for transmitting thermal energy and transferring a vacuum, wherein the contact head is provided with a test contact receptacle (11) at its contact end in the area of a channel mouth, wherein the test contact receptacle has a receiving gap (14) formed between two parallel receiving cheeks (12, 13) for receiving the test contact and connected with the transmission channel, wherein the receiving cheeks have contact surfaces (21) at their contact ends for contacting a solder deposit arranged (20) on the contact carrier, in order to produce a heat conducting contact with the solder material of the solder deposit.

Claims

1. A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier, wherein the device features a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum, wherein the contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, wherein the test contact receptacle has a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel, wherein the receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier, in order to produce a heat conducting contact with the solder material of the solder deposit.

2. The device according to claim 1, wherein the transmission channel, in the channel mouth in the transition to an opening rim of the receiving gap comprises an absorption surface in a channel wall, said absorption surface having a larger angle of inclination in relation to a channel axis than a wall section of the channel wall adjacent to the absorption surface.

3. The device according to claim 2, wherein the absorption surface is formed by a step in the channel wall.

4. The device according to claim 2, wherein the absorption surface is formed by a parabolic surface.

5. The device according to claim 1, wherein the receiving cheeks are composed of a material different from the material of the channel wall.

6. The device according to claim 1, wherein the contact surfaces of the receiving cheeks exhibit a surface profile.

7. The device according to claim 1, wherein the receiving cheeks are arranged on the test contact receptacle so as to be exchangeable.

8. The device according to claim 1, comprising a connecting device for connection to a laser device, a connection device for connection to a vacuum source, an infrared sensor device having an infrared sensor for detecting infrared radiation reflected by the receiving cheeks, and a control device for controlling the laser device subject to the sensor signal of the infrared sensor.

Description

[0020] In the figures

[0021] FIG. 1 shows a contact head of the device with a test contact received in the test contact receptacle during a contacting process;

[0022] FIG. 2 shows a longitudinal sectional view of the contact head;

[0023] FIG. 3 shows an enlarged view of a test contact receptacle of the contact head.

[0024] FIG. 1 shows a contact head 10 having a test contact receptacle 11, which receives a test contact 15 in a receiving gap 14 formed between two parallel receiving cheeks 12, 13 during a contacting process.

[0025] In the application case illustrated in FIG. 1, the test contact 15 is placed in a flaw of a test contact arrangement 30 between test contacts 16, 17 adjacent to the flaw. Thereby a parallel alignment of the test contact 15 to the neighboring test contacts 16, 17 is carried out via the contact head 10, wherein the test contact 15 is positioned with a contact edge 18 on a solder deposit 20 arranged on a contact carrier 19, and subsequently a fusing of the solder deposit 20 is carried out via a physical contact formed between the contact surfaces 21 of the receiving cheeks 12, 13 and the solder deposit 20.

[0026] As shown in FIGS. 2 and 3, an application of laser energy 22 to the receiving cheeks 12, 13 is carried out in order to introduce the thermal energy required for fusing the solder material deposit 20, said laser energy 22 being introduced into the receiving cheeks 12, 13 as laser radiation via a transmission channel 23 formed in the contact head 10.

[0027] As FIG. 3 in particular shows, an absorption surface 26 is formed in a channel mouth 24 in the transition to an opening rim 25 of the receiving gap 14, said absorption surface 26 being formed as a step in the present case.

[0028] Thereby, the absorption surface 26 features an angle of inclination =90 in relation to the channel axis 27, the angle of inclination being larger than an angle of inclination 1=45 with which a wall section 28 of a channel wall 29 adjacent to the absorption surface 26 is inclined in relation to the channel axis 27.

[0029] As shown in FIG. 1, the receiving cheeks 12, 13 are dimensioned in their width b in such a way that the width of a receiving cheek 12, 13 is smaller than a pitch p formed regularly between the test contacts 15, 16, 17 of the test contact arrangement 30.

[0030] As illustrated by the arrows used as direction indicators in FIG. 2, the transmission channel 23 not only serves for the application of laser energy 22 to the receiving cheeks 12, 13 but also for the application of a vacuum 31 to the receiving gap formed between the receiving cheeks 12, 13 as well as for transferring an infrared reflection radiation 32 transmitted by the receiving cheeks 12, 13 to a sensor device not illustrated here, said infrared reflection radiation 32 serving as an input variable for a control device, also not illustrated here, for controlling a laser device emitting the laser energy 22 via a corresponding sensor output signal of an infrared sensor of the sensor device.