CONTROLLED SEPARATION OF LASER PROCESSED BRITTLE MATERIAL
20180257170 · 2018-09-13
Inventors
Cpc classification
Y02P40/57
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B23K26/53
PERFORMING OPERATIONS; TRANSPORTING
B23K26/359
PERFORMING OPERATIONS; TRANSPORTING
C03B33/0222
CHEMISTRY; METALLURGY
C03B33/091
CHEMISTRY; METALLURGY
International classification
Abstract
A method for cutting and separating an item from a workpiece made of a brittle material is disclosed. The method uses straight and circular release features that are arranged to cause controlled cracking in scrap material close to each inside curve in the outline of the item. A first pulsed laser-beam weakens material along the outline of the item and along the release features. A second laser-beam selectively heats the release features for sufficient time to cause melting and deformation, thereby initiating the controlled cracking.
Claims
1. A method for cutting and separating an item from a workpiece made of a brittle material using a first beam of pulsed laser-radiation and a second beam of laser-radiation, the method comprising: focusing the first beam onto the workpiece; making a cutting line and a plurality of release features by translating the focused first beam along the outline of the item and the paths of the release features, the release features located within the workpiece and outside the item, at least one release feature proximate to an inside curve in the cutting line, the focused first beam weakening the workpiece along the cutting line and along the release features; directing the second beam onto the cutting line; translating the directed second beam along the cutting line, the directed second beam further weakening the workpiece along the cutting line; directing the second beam to a location on the at least one release feature; and heating the workpiece at the location for a time, the heating time sufficient to cause the workpiece to deform and crack; wherein the at least one release feature is arranged to cause a crack to propagate between the at least one release feature and the inside curve during the heating step.
2. The cutting and separating method of claim 1, wherein the focusing creates an elongated focus of the first beam that at least partially overlaps the workpiece.
3. The cutting and separating method of claim 2, wherein the elongated focus is created by filling the clear aperture of a focusing lens having spherical aberration.
4. The cutting and separating method of claim 1, wherein the focused first beam creates filaments and thereby creates defects within the workpiece.
5. The cutting and separating method of claim 4, wherein the defects are in the form of voids.
6. The cutting and separating method of claim 1, wherein the first beam is generated by an ultrashort pulsed laser.
7. The cutting and separating method of claim 1, wherein the second beam is generated by a CO.sub.2 laser.
8. The cutting and separating method of claim 1, wherein the heating time is in a range 0.5 second to 1.0 second.
9. The cutting and separating method of claim 1, wherein at least one release feature has a straight form.
10. The cutting and separating method of claim 9, wherein the propagation of the crack is directed by the straight release feature.
11. The cutting and separating method of claim 9, wherein the straight release feature is tangential to the inside curve.
12. The cutting and separating method of claim 1, wherein at least one release feature has a circular form.
13. The cutting and separating method of claim 12, wherein the circular release feature has one of the group of forms comprising circles, semicircles, ovals, and ellipsoids.
14. The cutting and separating method of claim 12, wherein the propagation of the crack is somewhat directed by a complementary straight release feature located on an opposite side of the circular release feature from the crack.
15. The cutting and separating method of claim 12, wherein the circular release feature has a radius in a range of about 0.2 millimeter to about 1.0 millimeter.
16. The cutting and separating method of claim 1, wherein the release features are arranged to propagate the crack into the cutting line at a shallow angle.
17. The cutting and separating method of claim 1, wherein the brittle material is glass.
18. A method for cutting and separating an item from a workpiece made of a brittle material using a first beam of pulsed laser-radiation and a second beam of laser-radiation, the method comprising: focusing the first beam onto the workpiece; making a cutting line and a plurality of release features by translating the focused first beam along the outline of the item and the paths of the release features, the release features located within the workpiece and outside the item, at least one release feature having a circular form, at least one circular release feature located proximate to an inside curve in the cutting line, the focused first beam weakening the workpiece along the cutting line and along the release features; directing the second beam onto the cutting line; translating the directed second beam along the cutting line, the directed second beam further weakening the workpiece along the cutting line; directing the second beam to a location within the circular release feature; and heating the workpiece at the location for a time, the heating causing the workpiece to crack; wherein the circular release feature is proximate to at least one other release feature, the at least one other release feature being arranged to cause a crack to propagate between the circular release feature and the inside curve during the heating step.
19. The cutting and separating method of claim 18, wherein the focusing creates an elongated focus of the first beam that at least partially overlaps the workpiece.
20. The cutting and separating method of claim 19, wherein the elongated focus is created by filling the clear aperture of a focusing lens having spherical aberration.
21. The cutting and separating method of claim 18, wherein the focused first beam creates filaments and thereby creates defects within the workpiece.
22. The cutting and separating method of claim 21, wherein the defects are in the form of voids.
23. The cutting and separating method of claim 18, wherein the first beam is generated by an ultrashort pulsed laser.
24. The cutting and separating method of claim 18, wherein the second beam is generated by a CO.sub.2 laser.
25. The cutting and separating method of claim 18, wherein the heating time is in a range 0.5 second to 1.0 second.
26. The cutting and separating method of claim 18, wherein the at least one other release feature has a straight form.
27. The cutting and separating method of claim 26, wherein the propagation of the crack from the circular release feature is directed by the straight release feature.
28. The cutting and separating method of claim 26, wherein the straight release feature is tangential to the inside curve.
29. The cutting and separating method of claim 18, wherein the circular release feature has one of the group of forms comprising circles, semicircles, ovals, and ellipsoids.
30. The cutting and separating method of claim 18, wherein the circular release feature has a radius in a range of about 0.2 millimeter to about 1.0 millimeter.
31. The cutting and separating method of claim 18, wherein the release features are arranged to propagate the crack into the cutting line at a shallow angle.
32. The cutting and separating method of claim 18, wherein the brittle material is glass.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings, which are incorporated in and constitute a part of the specification, schematically illustrate a preferred embodiment of the present invention, and together with the general description given above and the detailed description of the preferred embodiment given below, serve to explain principles of the present invention.
[0012]
[0013]
[0014]
[0015]
[0016]
DETAILED DESCRIPTION OF THE INVENTION
[0017] Referring now to the drawings, wherein like components are designated by like numerals,
[0018] Apparatus 10 further includes an optional beam-steering optic 26, an optional beam-conditioning optic 28, and a focusing lens 30.
[0019] Focusing lens 30 could be a single-element lens as depicted or a multi-element lens assembly. Workpiece 12 is depicted being translated with respect to a stationary focused beam of pulsed laser-radiation 14. Alternatively, galvanometer-actuated mirrors could be included in beam-conditioning optic 28 and a flat-field objective lens used for focusing lens 30, thereby enabling focused beam of pulsed laser-radiation 14 to be translated with respect to a stationary workpiece 12.
[0020] Focused beam of pulsed laser-radiation 14 converges to an elongated focus 32. Rays emerging from near the center of focusing lens 28 converge further therefrom than boundary rays 16A and 16B. Workpiece 12 is located such that elongated focus 32 overlaps or at least partially overlaps with workpiece 12. An elongated focus has advantages in laser-cutting processes, particularly in processes that create filaments to form voids, because the focused laser-radiation is distributed to favor creation of long voids that extend through the thickness of the workpiece. By way of example, an elongated focus can be created by filling the clear aperture of a focusing lens having spherical aberration.
[0021] Both the prior-art method and the method of the present invention further include exposing workpiece 12 to a beam of laser-radiation 40 generated by a source of laser-radiation 42, which is depicted in
[0022] Apparatus 10 further includes laser-source 42, an optional beam-steering optic 46, an optional beam-forming optic 48, and an optional focusing lens 50. In some applications, beam-forming optic 48 transforms beam of laser-radiation 40 from a Gaussian to a top-hat transverse mode. In some applications, an unfocused beam of laser-radiation 40 may be sufficient to completely cut workpiece 12. Otherwise, beam of laser-radiation 40 would need to be focused to illuminate a smaller area on a surface of workpiece 12. Workpiece 12 may be translated with respect to a stationary beam of laser-radiation 40 as depicted. Equally, the beam of laser-radiation may be scanned across a stationary workpiece.
[0023]
[0024]
[0025]
[0026] In a next heating step, beam of laser-radiation 40 is directed to and heats each shaded circular release feature 112B for a time sufficient to melt and contract brittle material within each heated circular release feature. Stresses induced by the melting and contracting in turn cause controlled cracking of scrap material 104. Cracks propagate out along straight release features 112A that are connected to the heated circular release feature. Additional controlled crack propagation is directed by straight release features 112A that are aligned with the intended directions of additional cracks 114. Arrows on the drawing indicate the first separation of cracked pieces of scrap material 104 from item 102.
[0027]
[0028]
[0029] Each additional crack 114 is somewhat directed by a complementary straight release feature 112A located on an opposite side of the heated circular release feature. Somewhat directed means the additional crack propagates radially and haphazardly from the heated circular release feature, but within a predictable area 116 depicted on the drawing as bounded by two dashed lines. There is a minimum radius of the heated circular feature for predictable somewhat-directed crack propagation. For example, for a workpiece made of glass having thickness of about 2 mm, minimum radii are in a range of about 0.2 mm to about 1.0 mm, depending on the specific pattern of release features selected and the type of glass.
[0030]
[0031]
[0032] The release features of
[0033]
[0034] The release features of
[0035] In
[0036] The release features of
[0037] In a practical example of the present invention using apparatus 10 and method 110 to cut and separate soda lime glass, laser-source 18 is a StarPico ultra-short pulsed laser and laser-source 42 is a SR 25i CO.sub.2 laser, both supplied by Coherent-Rofin GmbH of Hamburg, Germany. The exemplary glass has a thickness of about 2 mm. Laser-source 18 produces pulses having a duration of about 10 ps and has a wavelength of 1064 nanometers (nm). Bursts of four individual pulses have a burst-energy of about 650 micro-Joule (J) at a burst-repetition-rate of about 5 kilohertz (kHz) are selected. These processing parameters create filaments and thereby defects in the form of voids. The preferred translation speed is about 20 mm/s during exposure of the workpiece to beam of pulsed laser-radiation 14.
[0038] Laser-source 42 produces pulses having a duration of about 10 s and has a wavelength of about 10,600 nm. The pulse repetition rate is about 14 kHz. Beam of laser-radiation 40 illuminates an area on workpiece 12 having a diameter in the range 2 mm to 12 mm, preferably about 5 mm. The preferred translation speed is in the range 100 mm/s to 250 mm/s during exposure of cutting line 24 and relief lines 108. The dwell time to heat release features 112A and 112B is in the range 0.5 to 1.0 s, which is sufficient to cause localized melting and to crack scrap material 104.
[0039] Although the examples and figures presented herein cut and separate an item having scrap material located along just part of the outline of the item, the present invention could be applied to cut and separate an item that is completely encapsulated by scrap material. The optimum number and arrangement of release features depends on the geometry of the workpiece and the items to be separated from it, as well as the type of brittle material and thickness of the workpiece. In most instances straight release features are preferred for guiding crack formation. However, curved release features often work as well for separating an item and may be preferred for an item having a complex outline. Similarly, circular release features may have different circular forms, including circles, semicircles, ovals, and ellipsoids.
[0040] The present invention is described above in terms of a preferred embodiment and other embodiments. The invention is not limited, however, to the embodiments described and depicted herein. Rather, the invention is limited only by the claims appended hereto.