POWER MANAGEMENT FOR A MICRO- OR NANO- WIRE LED LIGHT SOURCE

20180255615 ยท 2018-09-06

Assignee

Inventors

Cpc classification

International classification

Abstract

A method of managing the power dissipated by an electroluminescence light source including electroluminescent rods having submillimeter dimensions protruding from a substrate and split into a plurality of identical groups. By using the measures of the invention, it becomes possible to manage the dissipation of power from the light source when faced with instantaneous variations in the strength of the electric current that powers the latter.

Claims

1. A method of managing the power dissipated by a light source having a semiconductor comprising a plurality of electroluminescent rods having submillimeter dimensions protruding from a substrate and split into a plurality of identical groups, wherein, from an electric current with a constant strength I.sub.LED, which current is provided to power the plurality of groups, management means choose, at each instant, the number of groups powered in series, in order to meet a predetermined constraint on the power dissipated by the set of the groups.

2. The method as claimed in claim 1, wherein, at a first instant, all of the groups are powered in parallel, such that the power dissipated by each of the groups is minimal, and at a second instant, following the first instant, all of the groups are powered in series, such that the power dissipated by each of the groups is maximal.

3. The method as claimed in claim 2, wherein, at least one intermediate instant between the first and the second instant, some of the groups are powered in series, such that the power dissipated by the groups powered in series has an intermediate value between said minimum and maximum values.

4. The method as claimed in claim 1, wherein the constraint is an increasing function varying from a minimum value to a maximum value over a time period of a predetermined duration.

5. The method as claimed in claim 4, wherein the predetermined duration is less than or equal to 250 ms.

6. A light source having a semiconductor, comprising: a substrate; a plurality of electroluminescent rods with submillimeter dimensions protruding from the substrate; wherein the rods are split into a plurality of identical groups, each group being configured to be selectively powered with electricity.

7. The light source as claimed in claim 6, wherein the source comprises management means configured to implement the method of managing the power dissipated by a light source.

8. The light source as claimed in claim 6, wherein the management means comprise an electronic circuit and/or a microcontroller element.

9. The light source as claimed in claim 6, wherein the substrate is made of silicon.

10. The light source as claimed in claim 9, wherein the management means are integrated into the substrate.

11. The light source as claimed in claim 6, wherein said light source includes a plurality of current injection means which can be connected in parallel to the groups, the management means being configured to choose the connection of the current injection means to the groups such that the variations in power dissipated by the set of the groups between each instant are continuous.

12. A light module comprising: at least one light source suitable for emitting light rays; an optical device suitable for receiving the light rays and for producing a light beam; wherein the light source or sources are in accordance with claim 6 and wherein the module comprises management means configured to implement the method of managing the power dissipated by a light source having a semiconductor comprising a plurality of electroluminescent rods having submillimeter dimensions protruding from a substrate and split into a plurality of identical groups, wherein, from an electric current with a constant strength I.sub.LED, which current is provided to power the plurality of groups, management means choose, at each instant, the number of groups powered in series, in order to meet a predetermined constraint on the power dissipated by the set of the groups.

13. The method as claimed in claim 2 wherein the constraint is an increasing function varying from a minimum value to a maximum value over a time period of a predetermined duration.

14. The light source wherein the source comprises management means configured to implement the method of managing the power dissipated by a light source as claimed in-claim 1.

15. The light source as claimed in claim 7, wherein the management means comprise an electronic circuit and/or a microcontroller element.

16. The light source as claimed in claim 7, wherein the substrate is made of silicon.

17. The light source as claimed in claim 7, wherein the light source includes a plurality of current injection means which can be connected in parallel to the groups, the management means being configured to choose the connection of the current injection means to the groups such that the variations in power dissipated by the set of the groups between each instant are continuous.

18. A light module comprising: at least one light source suitable for emitting light rays; an optical device suitable for receiving the light rays and for producing a light beam; wherein the light source or sources, having a semiconductor, comprising: a substrate a plurality of electroluminescent rods with submillimeter dimensions protruding from the substrate; wherein the rods are split into a plurality of identical groups, each group being configured to be selectively powered with electricity, and wherein the module comprises management means configured to implement the method of managing the power dissipated by a light source as claimed in claim 1.

Description

[0035] Other features and advantages of the present invention will be better understood from the description and the drawings wherein;

[0036] FIG. 1 is a representation of a light source as is used in a preferential embodiment of the present invention;

[0037] FIG. 2 schematically shows the groups of semiconductor rods of a light source according to a preferential embodiment of the invention;

[0038] FIG. 3 represents the progression over time of the strength of the current I.sub.LED provided to a light source, of a power constraint P and of the power dissipated following the use of the method according to a preferential embodiment of the invention;

[0039] FIGS. 4A-4E schematically show possible configurations of the groups shown in FIG. 2, such as to produce the dissipated power profile shown in FIG. 3, according to a preferential embodiment of the invention.

[0040] Without specific indication to the contrary, technical features described in detail for a given embodiment can be combined with the technical features described in the context of other embodiments described as an example and in a nonlimiting manner.

[0041] FIG. 1 illustrates an electroluminescent light source 001 according to a first embodiment of the invention. FIG. 1 illustrates the basic principle of the light source. The light source 001 comprises a substrate 010 on which is placed a series of electroluminescence diodes in the form of wires 020, also called electroluminescent rods, protruding from the substrate. The core 022 of each diode 020 is made of n-type semiconductor material, i.e. doped with electrons, whereas the envelope 024 is made from p-type semiconductor material, i.e. doped with holes. A recombination region 026 is provided between the n-type and p-type semiconductor materials. However, it can be envisaged to reverse the semiconductor materials depending, in particular, on the chosen technology.

[0042] The substrate is advantageously made of silicon and the rods have a diameter of less than a micron. In an alternative, the substrate comprises a layer of semiconductor material doped with holes and the wires have a diameter between 100 and 500 nm. The semiconductor material doped with electrons and with holes forming the diodes can advantageously be gallium nitride (GaN) or indium gallium nitride (InGaN). The height of a rod is typically between 1 and 10 micrometers, whereas the largest dimension of the end face is less than 2 micrometers. According to a preferred embodiment, the rods are arranged in an array with a regular layout. The distance between two rods is constant and equal to at least 10 m. The rods can be placed in a staggered manner. The area of the illuminating surface of such a light source is 8 mm.sup.2 at most. The source can produced a luminance of at least 60 Cd/mm.sup.2.

[0043] With reference to FIG. 1, the substrate 010 comprises a main layer 030, advantageously made of silicon, a first electrode or cathode 040 placed on the face of the main layer which is opposite the diodes 020, and a second electrode or anode 050 placed on the face comprising the diodes 020. The anode 050 is in contact with the p-type semiconductor material forming the envelopes 024 of the diodes 020 and extending over the corresponding face of the substrate 010 such as to form a conductive layer between said envelopes 024 and the anode 050. The cores or hearts 022 of the rods are in contact with the semiconductor main layer 030 and thus in electrical contact with the cathode 040.

[0044] During the application of an electric voltage between the anode and the cathode, electrons of the n-type semiconductor material recombine with holes of the p-type semiconductor material and emit photons. The majority of the recombinations are radiative. The emitting face of the diodes or rods is the p-region since it is the most radiative.

[0045] In accordance with the invention, the light source 2 comprises several groups of rods connected to different anodes. Each group can therefore be electrically powered independently of the other or of the others. The rods of each group are advantageously all of the same type, i.e. emitting in the same spectrum. The groups are advantageously identical and represent a common forward voltage. Preferably, each group therefore comprises substantially the same number of semiconductor wires or rods.

[0046] FIG. 2 schematically shows a front view of a light source 101 comprising electroluminescent diodes in the form of electroluminescent wires 120 or rods protruding from a substrate 110. The rods are split into a plurality of identical groups 161-169. By way of example, the groups are shown as squares having identical dimensions. Other layouts and/or geometries of the groups can be produced without necessarily departing from the scope of the present invention. The large number of rods 120 present on a component particularly makes it possible to provide a plurality of groups which is more than the nine groups shown in this example.

[0047] The management method is described with reference to the source 101 of FIG. 2 and to the illustration of FIG. 3. FIG. 3 firstly describes the progression over time of the current I.sub.LED provided by a current source, possibly via converter elements or via a non-illustrated circuit for controlling the power supply of the source 101. When the source 101 is switched on, the variation in strength of the current I.sub.LED is instantaneous. In order to prevent the semiconductor junctions of the source 101 from being damaged, means for managing the dissipated power are configured such that the power dissipated by the source 101 is, at any instant, less than the power constraint P, whereas at any instant, all of the groups are electrically powered. The dissipated power, and therefore the temperature of the semiconductor junctions, gradually increases between a first zero value and a second maximum value according to the steps A-E. The temperature variation over time observed at the source 101 is therefore limited, whereas the variation over time of the strength of the provided current is unlimited.

[0048] To achieve the progression of the dissipated power in steps as is shown in FIG. 3, the management means are suitable for dynamically reconfiguring the relative electrical connection of the various groups 161-169. In particular, the management means are configured to adjust the number of groups powered in series, which has a direct impact on the current crossing the corresponding groups, and therefore also on the power dissipated thereby and on the junction temperature thereof. By increasing, gradually and in stages, the number of groups connected and powered in series, dissipated power steps A-E are produced. The duration of each step preferably corresponds to at least 25 ms, which generally corresponds to the time necessary for obtaining a stable temperature following a change in current in a group of diodes. The managing means can particularly be established by a circuit involving switches, transistors or other electronic components, or by means of a programmable microcontroller element.

[0049] Exemplary configurations corresponding to the steps A-E shown in FIG. 3 are given by FIGS. 4A-4E, respectively. Each group of rods 161-169 is represented by the symbol of a single electroluminescent diode in order to ensure that the diagram is clear. A person skilled in the art will be able to adjust the configurations depending on the intended practical use, depending on the characteristics of the groups of electroluminescent sources that are available and depending on the number of steps to be produced. The adjustment of these parameters falls within the skills of a person skilled in the art without departing from the scope of the present invention.

[0050] The first exemplary power supply configuration for the groups 161-169 is shown in FIG. 4A. All of the groups are powered in parallel, such that the electric current that passes through each of the groups has a minimum strength. The junction temperature in each of the groups can be considered to be equal.

[0051] The configuration of FIG. 4B increases the number of groups connected in series in twos. In particular, the pairs formed by the groups 161 and 164, 162 and 165, 163 and 166, are crossed by a current having a first strength greater than the strength of the current which crosses them in the example 4A. The respective temperatures thereof are therefore substantially equal with one another, but greater than the respective temperatures thereof in the configuration 4A. The groups 167-169 are crossed by a current having a second strength. In the configuration of FIG. 4C, an additional pair of groups, 164 and 168, is connected in series, and therefore the dissipated power, and the overall temperature of the source 101, increase with respect to the previous examples.

[0052] In the configuration of FIG. 4D, the nine groups 161-169 are connected in three groups of three in series. Each group is therefore crossed by a current having a same strength, greater than the strength of the current that crossed them in the previous examples. Finally, in the final configuration shown in FIG. 4E, all of the groups of diodes 161-169 are powered in series and the current I.sub.LED crosses all of the diodes. Advantageously, current injection means 170 can be provided via parallel connection, which allows an almost continuous reconfiguration of the connections.

[0053] By considering a reconfiguration every 25 ms, moving from the configuration 4A through to the configuration 4E, via the intermediate configurations, is achieved in approximately 150 ms. This management of the power dissipated by the light source 101 therefore allows the source to be instantaneously switched on. Although the emitted luminous flux, which is dependent upon the current which crosses the diodes, is not constant among the configurations 4A-4E, the rapid variation cannot be seen by the human eye. At the same time, an instantaneous variation in the junction temperature of the diodes is prevented, which makes the source more robust and more durable.

[0054] The substrate of the source 101, from which the semiconductor wires or rods project, can advantageously be made of silicon. In this case, the electronic components that produce the means for managing the power which have just been described can advantageously be established directly in or on the substrate of the light source. The resulting source therefore automatically manages the dissipated power thereof in order to protect the semiconductor junctions thereof from an untimely temperature increase. Alternatively, the management means can be produced on a printed circuit offset with respect to the substrate of the light source.