RFID DEVICES WITH CONTROLLED OPTICAL PROPERTIES
20220358339 · 2022-11-10
Inventors
- Ian J. FORSTER (Chelmsford, GB)
- Elizabeth SOWLE (Bellbrook, OH, US)
- Brad Cumby (Liberty Township, OH, US)
- Carol CALLAHAN (Greensboro, NC, US)
Cpc classification
G06K19/07705
PHYSICS
International classification
Abstract
An RFID device includes an antenna that is formed so as to control the optical properties of the RFID device, which may include minimizing the amount of light that will be transmitted through the RFID device or allowing for the passage of a predetermined amount of light therethrough. The RFID device includes a conductive material associated with a substrate. The conductive material includes an antenna and a periphery. An RFID chip is electrically coupled to the antenna, but not to the periphery. The antenna may be defined by a cutting or etching or printing process. A gap between the antenna and the periphery may be on the order of approximately 25 μm-200 μm (if the transmission of light through the RFID device is to be minimized) or greater in at least one section (if the passage of a predetermined amount of light through the RFID device would be desirable).
Claims
1. A method for manufacturing an RFID device with controlled optical properties, comprising: providing a conductive material on a substrate comprising one or more branding symbols; processing the conductive material to separate an antenna from a periphery wherein the periphery is retained on the substrate, and forming one or more gaps to allow for the passage of a predetermined amount of light.
2. The method of claim 1, wherein processing the conductive material comprises creating the one or more gaps along a perimeter of the one or more branding symbols.
3. The method of claim 1, wherein creating the one or more gaps along the perimeter of the one or more branding symbols enables enhancement of visibility of the one or more branding symbols.
4. The method of claim 1, wherein processing the conductive material comprises creating the one or more gaps between the antenna and the periphery having a width in the range of approximately 25 μm-200 μm.
5. The method of claim 1, wherein processing the conductive material comprises processing the conductive material using a process selected from the group consisting of cutting, laser-cutting, and etching.
6. The method of claim 1, wherein the antenna is completely surrounded by the periphery.
7. The method of claim 1, wherein processing the conductive material comprises separating the antenna from the periphery renders the antenna to be almost invisible.
8. The method of claim 1, wherein the antenna comprises first and second portions, and wherein an RFID chip is electrically coupled to the antenna.
9. The method of claim 8, wherein the RFID chip is associated with a strap substrate at least partially formed of an opaque material and configured to extend between the first and second portions of the antenna.
10. The method of claim 1, further comprising defining at least one gap in the periphery to separate a first portion of the periphery from a second portion of the periphery, and wherein the at least one gap is formed to allow for passage of a predetermined amount of light therethrough.
11. The method of claim 1, further comprising applying a masking material or member to the RFID device to reduce the visibility of the substrate through the one or more gaps defined between the antenna and the periphery.
12. The method of claim 11, wherein the masking material or member is co-planar with the conductive material.
13. The method of claim 11, wherein the masking material or member and the conductive material are positioned in different planes.
14. The method of claim 1, wherein processing the conductive material to separate the antenna from the periphery comprises creating the one or more gaps between the antenna and the periphery, and the one or more gaps is defined by at least one segment following a non-linear path.
15. A method for manufacturing an RFID device with controlled optical properties, comprising: printing a conductive material onto a substrate to define an antenna and a peripheral portion, wherein the substrate carries one or more branding symbols; and processing the conductive material to separate the antenna from the periphery, wherein the periphery is retained on the substrate, and forming one or more gaps to allow for passage of a predetermined amount of light therethrough.
16. The method of claim 15, wherein processing the conductive material comprises creating the one or more gaps along a perimeter of the one or more branding symbols formed on the substrate.
17. The method of claim 15, wherein creating the one or more gaps along the perimeter of the one or more branding symbols enables enhancement of visibility of the one or more branding symbols.
18. The method of claim 15, wherein printing the conductive material onto the substrate comprises creating one or more gaps between the antenna and the periphery having a width in the range of approximately 25 μm-200 μm.
19. The method of claim 15, further comprising applying a masking material or member to the RFID device to reduce the visibility of the substrate through the one or more gaps defined between the antenna and the periphery.
20. The method of claim 19, wherein the masking material or member is co-planar with the conductive material.
21. The method of claim 19, wherein the masking material or member and the conductive material are positioned in different planes.
22. The method of claim 15, wherein printing the conductive material onto the substrate includes creating one or more gaps between the antenna and the periphery, and the one or more gaps is defined by at least one segment following a non-linear path.
23. An RFID device with controlled optical properties, comprising: a substrate carrying one or more branding symbols; a conductive material associated with the substrate and comprising an antenna separated from a periphery by one or more gaps formed therein to allow for passage of a predetermined amount of light therethrough; and an RFID chip electrically coupled to the antenna and away from the periphery.
24. The RFID device of claim 23, wherein the one or more gaps are formed along a perimeter of the one or more branding symbols formed on the substrate.
25. The RFID device of claim 23, wherein passage of the predetermined amount of light through the one or more gaps enhances visibility of the one or more branding symbols.
26. The RFID device of claim 23, wherein the one or more gaps formed between the antenna and the periphery have a width in the range of approximately 25 μm-200 μm.
27. The RFID device of claim 23, wherein the antenna is completely surrounded by the periphery.
28. The RFID device of claim 23, wherein the antenna includes first and second portions, and wherein the antenna is directly electrically coupled to an RFID chip.
29. The RFID device of claim 23, wherein the RFID chip is associated with a strap substrate at least partially formed of an opaque material and extending between the first and second portions of the antenna.
30. The RFID device of claim 23, further comprising at least one gap in the periphery separating a first portion of the periphery from a second portion of the periphery.
31. The RFID device of claim 23, further comprising a masking material or member configured to reduce the visibility of the substrate through a gap defined between the antenna and the periphery.
32. The RFID device of claim 31, wherein the masking material or member is co-planar with the conductive material.
33. The RFID device of claim 31, wherein the masking material or member and the conductive material are positioned in different planes.
34. The RFID device of claim 23, wherein the one more gaps between the antenna and the periphery is defined by at least one segment following a non-linear path.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015]
[0016]
[0017]
[0018]
[0019]
[0020]
[0021]
DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0022] The embodiments disclosed herein are for the purpose of providing a description of the present subject matter, and it is understood that the subject matter may be embodied in various other forms and combinations not shown in detail. Therefore, specific designs and features disclosed herein are not to be interpreted as limiting the subject matter as defined in the accompanying claims.
[0023]
[0024] The conductive material 12 may cover any portion of the substrate, but in one embodiment, is applied to an entire surface of the substrate. The portion of the substrate onto which the conductive material 12 is applied will have substantially uniform optical properties (i.e., that portion of the RFID device 10a will be substantially opaque, due to the presence of the conductive material 12). By applying the conductive material 12 to an entire surface of the substrate, the resulting RFID device 10a will have controlled, more uniform optical properties, as will be described in greater detail. Due to the conductive material 12 being applied in a manner that provides the RFID device 10a with more uniform optical properties, more flexibility is possible with the material composition of the conductive material 12 and the substrate, as described above. For example, the opacity of the substrate is not a consideration when the conductive material 12 is applied in a manner that is entirely controlling of the optical properties of the resulting RFID device 10a.
[0025] As also shown in
[0026] Regardless of how the antenna 14 and periphery 16 are defined, they may be provided in any suitable configuration without departing from the scope of the present disclosure. For example, in the embodiment of
[0027] In one embodiment, each gap 18 is narrow or has a small width, which may be in the range of approximately 25 μm to 200 μm. By providing a narrow gap or gaps 18, no appreciable amount of light will be transmitted through the gap(s) 18. This serves to maintain the uniformity of the optical properties of RFID device 10a, with the antenna 14 and periphery 16 (which is retained on the substrate) being opaque and with the gap(s) 18 therebetween being substantially non-transmissive of light, thus rendering the entire RFID device 10a (or at least the portion thereof in which the conductive material 12 is present) substantially, uniformly opaque. Another advantage of a gap or gaps 18 having a small width is that such a configuration allows for the conductive material 12 to present a substantially flat surface. A conventional RFID device will include larger spaces (e.g., on the order of approximately 10 mm) defined between portions of the antenna, which presents an uneven surface that may be difficult to print upon without significant distortion. Thus, by employing a narrow gap or gaps 18 to separate the antenna 14 from the periphery 16, the clarity of print applied to the RFID device 10a will be improved.
[0028] While it may be advantageous in many applications for the gap(s) 18 to be relatively narrow, it is within the scope of the present disclosure for all or a portion of a gap 18 to be wide enough to allow for an appreciable or predetermined amount of light to be transmitted therethrough. As described above, the gap(s) 18 may be provided in any configuration without departing from the scope of the present disclosure. As such, it may be desirable to provide a gap or gaps 18 (or one or more portions thereof) with a greater width and a configuration in the form of a logo or other desired pattern. In such an embodiment, an appreciable or predetermined amount of light will pass through the gap(s) 18 to display the logo or pattern, thereby acting as a visual enhancement for the RHD device 10a and an associated label or the like. For example, the gap(s) 18 are formed to be positioned along a perimeter of one or more branding symbols formed in the substrate. Forming gap(s) 18 along the perimeter of the one or more branding symbols including a logo or a pattern ensures that there is passage or transmission of sufficient light to enhance the visibility of the branding symbols, while ensuring that there is no or minimal light transmission through the antenna 14. Thus, the construction of the RFID device 10a enables achieving controlled optical properties. Therefore, the construction of the RHD device 10a ensures that there is no visual interference of parts of the RFID device such as the antenna 14 with the branding of the article to which the RFID device 10a is secured. Additionally, the design degrees of freedom associated with the RFID device 10a are also high since the gap(s) 18 can be customized to be formed according to the shape and size of the branding symbols and according to their relative positioning on the substrate. Alternatively, the gap(s) 18 can be formed along a portion of the substrate that carries additional information such as wash care or anti counterfeit details.
[0029] Regardless of the particular configuration of the antenna 14, it is electrically coupled to an RFID chip 24. On account of the antenna 14 being electrically isolated from the periphery 16, the periphery 16 is not electrically coupled to the RFID chip 24. The RFID chip 24 may be electrically coupled to the antenna 14 according to any suitable approach, which may include direct attachment of the RFID chip 24 to the antenna 14 (as in
[0030] When an RFID strap 26 is employed, a larger gap between two portions of the antenna 14 is required than what is needed for direct connection of an RFID chip 24. For example, while an approximately 500 μm slit may be sufficient for separating two portions of the antenna 14 for direct connection of an RFID chip 24 (as in
[0031] A comparison of
[0032] A comparison of
[0033]
[0034] As in the embodiments of
[0035]
[0036] According to yet another approach to reducing the visibility of a substrate through a gap defined in a conductive material, the RFID device may further include a masking member or material having optical properties (e.g., opacity) that are more similar to that of the conductive material than the substrate. In one embodiment, the masking member may be provided as a distinct layer, which overlays all or a portion of the gap, being positioned on the same side of the substrate as the conductive material or on the opposite side of the substrate. This is comparable to
[0037] Rather than being entirely uniform, the masking member may have varying optical properties. This may include the masking member including a plurality of regions or sections having optical properties that are similar to those of the conductive material, with the regions or sections being arranged in pattern, which may be random or non-random. For example,
[0038] The masking member 38 of
[0039] In yet another embodiment, rather than the masking member or material being provided as a separate layer, the masking member or material may be co-planar with and received by the gap 18. For example, paint or some other non-conductive masking member or material 42 may be at least partially positioned within the gap 18 to prevent light from passing through the gap 18 or at least reduce the amount of light that passes through the gap 18, as shown in
[0040] It will be understood that the aspects, embodiments and examples described herein are illustrative examples of some of the applications of the principles of the present subject matter. Numerous modifications may be made by those skilled in the art without departing from the spirit and scope of the claimed subject matter, including those combinations of features that are individually disclosed or claimed herein. For these reasons, the scope hereof is not limited to the above description but is as set forth in the following claims, and it is understood that claims may be directed to the features hereof, including as combinations of features that are individually disclosed or claimed herein.