LIGHT SENSOR LEAD FRAME SUBSTRATE AND MANUFACTURING METHOD THEREOF

Abstract

A light sensor lead frame substrate may comprise a plurality of lead frame substrates formed on a metal substrate through a series of processing including chemical etching, plasma etching and stamping. The lead frame substrates are connected through a plurality of connecting sections, and each of the lead frame substrates is connected to the metal substrate through the connecting section. Each of the connecting sections has two pre-cut sections respectively formed at two ends of the connecting section. After molding, the lead frame substrates are configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates to have a first insulating layer, a reflector cup and a second insulating layer, and with the pre-cut sections, the connecting sections are adapted to be easily washed down by a punch in the punching process.

Claims

1. A light sensor lead frame substrate comprising a plurality of lead frame substrates formed on a metal substrate through a series of processing including chemical etching, plasma etching and stamping; the lead frame substrates connected through a plurality of connecting sections, and each of the lead frame substrates connected to the metal substrate through the connecting section; each of the connecting sections between the lead frame substrates or between the lead frame substrate and the metal substrate having two pre-cut sections respectively formed at two ends of the connecting section; each of the lead frame substrates comprising a first edge, and at least a protruding edge upwardly protruding from a top end of the first edge; after molding, the lead frame substrates configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates to have a first insulating layer, a reflector cup and a second insulating layer, and the reflector cup adapted to cover the protruding edge through the second insulating layer, and the second insulating layer configured to extend outwardly to partially cover top surfaces of adjacent connecting sections; each of the second insulating layers having a third edge while each of the first insulating layers comprising a second edge; with the pre-cut sections, after the processing of electroplating, injection and desmear, the connecting sections adapted to be easily washed down by a punch in the punching process, and, for the single lead frame substrate, with the second insulating layer partially covering the top surfaces of the adjacent connecting sections, the third edge of the second insulating layer configured to be formed non-coplanar to the first edge of the lead frame substrate and the second edge of the first insulating layer which are in the same plane.

2. The light sensor lead frame substrate of claim 1, wherein the reflector cup and the second insulating layer of the lead frame substrate are formed integrally.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is a plan view of a light sensor lead frame substrate of the present invention.

[0009] FIG. 2 is a partial enlarged drawing of the light sensor lead frame substrate of the present invention.

[0010] FIG. 3 is a sectional view along line A-A of FIG. 2.

[0011] FIG. 4 is a sectional view along line B-B- of FIG. 2.

[0012] FIG. 5 is a schematic view illustrating a punch is used to wash down a connecting section of the light sensor lead frame substrate in the present invention.

[0013] FIG. 6 is a schematic view illustrating the connecting section of the light sensor lead frame substrate in FIG. 5 is washed down by the punch in the present invention.

[0014] FIG. 7 is a partial enlarged drawing of the light sensor lead frame substrate of the present invention when the connecting sections are washed down.

[0015] FIG. 8 is a sectional view of a lead frame substrate of the light sensor lead frame substrate which is taken down from a metal substrate in the present invention.

[0016] FIG. 9 is a sectional view illustrating moisture in the air has to pass through a protruding edge before infiltrating into a reflector cup of the lead frame substrate of the light sensor lead frame substrate in the present invention.

[0017] FIG. 10 is a plan view illustrating moisture in the air infiltrates into the reflector cup of the lead frame substrate of the light sensor lead frame substrate in the present invention.

[0018] FIG. 11 is a prior art.

[0019] FIG. 12 is a prior art.

[0020] FIG. 13 is a prior art.

[0021] FIG. 14 is a prior art.

[0022] FIG. 15 is a prior art.

[0023] FIG. 16 is a prior art.

[0024] FIG. 17 is a prior art.

[0025] FIG. 18 is a prior art.

DETAILED DESCRIPTION OF THE INVENTION

[0026] The detailed description set forth below is intended as a description of the presently exemplary device provided in accordance with aspects of the present invention and is not intended to represent the only forms in which the present invention may be prepared or utilized. It is to be understood, rather, that the same or equivalent functions and components may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention.

[0027] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood to one of ordinary skill in the art to which this invention belongs. Although any methods, devices and materials similar or equivalent to those described can be used in the practice or testing of the invention, the exemplary methods, devices and materials are now described.

[0028] All publications mentioned are incorporated by reference for the purpose of describing and disclosing, for example, the designs and methodologies that are described in the publications that might be used in connection with the presently described invention. The publications listed or discussed above, below and throughout the text are provided solely for their disclosure prior to the filing date of the present application. Nothing herein is to be construed as an admission that the inventors are not entitled to antedate such disclosure by virtue of prior invention.

[0029] In order to further understand the goal, characteristics and effect of the present invention, a number of embodiments along with the drawings are illustrated as following:

[0030] Referring to FIGS. 1 to 4, the present invention provides a light sensor lead frame substrate which comprises a plurality of lead frame substrates (10) formed on a metal substrate (1) through a series of processing including chemical etching, plasma etching and stamping. The lead frame substrates (10) are connected through a plurality of connecting sections (11), and each of the lead frame substrates (10) is connected to the metal substrate (1) through the connecting section (11). Moreover, each of the connecting sections (11) between the lead frame substrates (10) or between the lead frame substrate (11) and the metal substrate (1) has two pre-cut sections (111) respectively formed at two ends of the connecting section (11). Each of the lead frame substrates (10) comprises a first edge (101), and at least a protruding edge (102) upwardly protrudes from a top end of the first edge (101) (as shown in FIG. 8). After molding, the lead frame substrates (10) are configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates (10) to have a first insulating layer (12), a reflector cup (13) and a second insulating layer (14), wherein the reflector cup (13) is adapted to cover the protruding edge (102) through the second insulating layer (14), and the second insulating layer (14) is configured to extend outwardly to partially cover top surfaces of adjacent connecting sections (11). Additionally, each of the second insulating layers (14) has a third edge (141) while each of the first insulating layers (12) comprises a second edge (121). Also, with the pre-cut sections (111), after the processing of electroplating, injection and desmear, the connecting sections (11) are adapted to be easily washed down by a punch (20) in the punching process (as shown in FIGS. 5 to 7). Furthermore, for the single lead frame substrate (10), with the second insulating layer (14) partially covering the top surfaces of the adjacent connecting sections (11), the third edge (141) of the second insulating layer (14) is configured to be formed non-coplanar to the first edge (101) of the lead frame substrate (10) and the second edge (121) of the first insulating layer (12) which are in the same plane (as shown in FIG. 8).

[0031] In one embodiment, the reflector cup (13) and the second insulating layer (14) of the lead frame substrate (10) are formed integrally.

[0032] In another embodiment, the first insulating layer (12), the reflector cup (13) and the second insulating layer (14) of the lead frame substrate (10) are made of engineering plastic.

[0033] In still another embodiment, the first insulating layer (12), the reflector cup (13) and the second insulating layer (14) of the lead frame substrate (10) are made of epoxy.

[0034] In a further embodiment, the first insulating layer (12), the reflector cup (13) and the second insulating layer (14) of the lead frame substrate (10) are made of silicone.

[0035] In still a further embodiment, the first insulating layer (12), the reflector cup (13) and the second insulating layer (14) of the lead frame substrate (10) are made of ceramic.

[0036] Comparing with conventional light sensor lead frame substrate, the present invention is advantageous because: (i) after the connecting sections (11) are washed down, each of the lead frame substrates (10) is weakly attached on the metal substrate (1) through the second insulating layer (14) thereof such that after the packaging, the lead frame substrates (10) are easily taken down from the metal substrate (1) through the punching processing or by fingers, which reduces the cost of production; (ii) after the connecting sections (11) are washed down, the lead frame substrates (10) are no longer connected, and each of the lead frame substrates (10) can be pre-tested before taken from the metal substrate (1), which increases the product yield; (iii) without clamping portions, the total number of the lead frame substrates (10) on the single metal substrate (1) is increased; (iv) the moisture in the air has to pass through the protruding edges (102) before infiltrating into the reflector cups (13) (as shown in FIG. 9), which prolongs the lifetime of the light sensor lead frame substrate; (v) each of the lead frame substrates (10) has no clamping portions and excess exposed metal portions (103), which effectively reduces the moisture in the air from infiltrating into the reflector cup (13), thereby prolonging the lifetime of the light sensor lead frame substrate (as shown in FIGS. 7 and 10); and (vi) without clamping portions, the packaging process of the light sensor lead frame substrate of the present invention can be completed by a common packaging equipment, which can be widely accepted by manufacturers.

[0037] Having described the invention by the description and illustrations above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Accordingly, the invention is not to be considered as limited by the foregoing description, but includes any equivalents.