Metal or ceramic component comprising at least one multi-dimensionally structured connection portion and method for the production thereof

Abstract

A metal or ceramic component includes at least one multi-dimensionally structured connection portion, wherein the connection portion is intended for forming an adhesive bond to fiber-reinforced polymer laminate, and wherein the metal or ceramic component has a milliscale structure, in particular formed by anchoring elements, and a microscale structure on the connection portion and the anchoring elements, over which microscale structure an additional nanoscale structure is formed.

Claims

1. A method for multi-dimensionally structuring at least one connection portion of a metal component, wherein the connection portion is intended for forming an adhesive bond to fiber-reinforced polymer laminate, and wherein the method comprises: producing a milliscale structure by forming anchoring elements on the connection portion which protrude from the connection portion substantially perpendicularly or at a predetermined angle by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements; producing a microscale structure on the connection portion and the anchoring elements by sandblasting or electromagnetic radiation; producing a nanoscale structure over the microscale structure on the connection portion and the anchoring elements.

2. The method of claim 1, wherein the electromagnetic radiation is laser irradiation.

3. The method of claim 2, wherein the laser irradiation is carried out by a short-pulse laser that is moved at a defined feed rate relative to the connection portion.

4. The method of claim 3, wherein the short-pulse laser comprises a femtosecond, picosecond or nanosecond laser having a high pulse repetition frequency.

5. The method of claim 1, wherein the laser for producing the microscale structure and the laser for producing the nanoscale structure are arranged one behind the other such that the microstructure over which the nanostructure is formed is produced in one feed flow path.

6. The method of claim 1, wherein the nanoscale structure is produced over the microscale structure on the connection portion and the anchoring elements by laser irradiation or anodization.

7. The method of claim 6, wherein the laser irradiation is carried out by a short-pulse laser that is moved at a defined feed rate relative to the connection portion.

8. The method of claim 7, wherein the short-pulse laser comprises a femtosecond, picosecond or nanosecond laser having a high pulse repetition frequency.

9. A metal component comprising: at least one multi-dimensionally structured connection portion for forming an adhesive bond to fiber-reinforced polymer laminate, the metal component having a milliscale structure formed by anchoring elements which are formed by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements, which anchoring elements protrude from the connection portion substantially perpendicularly or at a predetermined angle; and a microscale structure on the connection portion and the anchoring elements formed by sandblasting or electromagnetic radiation, over which microscale structure an additional nanoscale structure is formed.

10. The metal component of claim 9, wherein connection portions are provided on all sides.

11. The metal component of claim 9, wherein the component is produced from an alloy of titanium, aluminum, steel or magnesium, or from another metal alloy.

12. A method of using a metal component as a z-reinforcement of fiber-reinforced polymer laminates, wherein the metal component is completely surrounded by polymer laminate, the metal component comprising: at least one multi-dimensionally structured connection portion for forming an adhesive bond to fiber-reinforced polymer laminate, the metal or ceramic component having a milliscale structure formed by anchoring elements which are formed by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements, which anchoring elements protrude from the connection portion substantially perpendicularly or at a predetermined angle; and a microscale structure on the connection portion and the anchoring elements formed by sandblasting or electromagnetic radiation, over which microscale structure an additional nanoscale structure is formed.

13. The method of claim 12, wherein the metal component is used as a connection element in a co-bonding method.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Additional features that improve the disclosure herein will be described in more detail below on the basis of examples and the accompanying drawings, in which:

(2) FIG. 1 is a flow diagram showing the method steps according to an embodiment of the disclosure herein;

(3) FIG. 2a-2d show a metal component having a multi-dimensionally structured connection portion;

(4) FIG. 3 is an exploded view of a fiber composite structure having a reinforcing plate;

(5) FIG. 4 is a side view of the fiber composite structure from FIG. 3 in the adhered state.

DETAILED DESCRIPTION

(6) FIG. 1 shows the method steps in the process sequence of the method. In this case, a metal or ceramic component is first provided which can be a thin metal sheet or a solid metal or ceramic body. A milliscale structure is then produced on the component. In this way, anchoring elements are provided on the entire metal or ceramic component or on portions thereof. In this case, the at least one anchoring element can protrude from the connection portion substantially perpendicularly or at a predetermined angle. The anchoring elements can also be designed as pins, barbs, teeth, spikes or helical structures etc. Advantageously, the anchoring elements are formed integrally with the connection portion.

(7) In this case, the specific manner of producing the milliscale structure is significantly influenced by the material thickness and type of material of the metal or ceramic component. For a metal component, the connection portions can be produced by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding, welding on of anchoring elements, or other suitable methods. For a ceramic component, this step takes place for example by molding before sintering.

(8) The next step for producing the microscale structure on the metal or ceramic component, including the millistructure formed thereon, is carried out for example by sandblasting or electromagnetic radiation, in particular laser irradiation.

(9) Finally, as a further step, a nanoscale structure is produced over the microscale structure on the connection portion and the anchoring elements by laser irradiation orin the case of a metal componentby anodization.

(10) The method according to the disclosure herein will be described in more detail below on the basis of embodiments.

Example 1

(11) By way of example, a first method for multi-dimensionally structuring at least one connection portion of a metal or ceramic component can proceed as follows:

(12) 1. Consecutive stamping and deformation of a titanium sheet, for example Ti15V3Al3Cr3Sn having a sheet thickness of t=0.4 mm, in order to produce a milliscale structure;

(13) 2. Sandblasting the titanium sheet, for example with Al2O3 or SiO2 having a particle size of from 250 m-500 m and at a jet pressure of 7 bar, in order to produce a microscale structure;

(14) 3. Laser irradiation, for example at a wavelength of 1064 nm, a pulse length of less than 20 ns, a speed of 800 mm/s, a current of 43 A, a frequency of 10 kHz and frequent repetition, in order to produce a nanoscale structure.

Example 2

(15) By way of example, a second method for multi-dimensionally structuring at least one connection portion of a metal or ceramic component can proceed as follows:

(16) 1. Consecutive stamping and deformation of a titanium sheet, for example Ti15V3Al3Cr3Sn having a sheet thickness of t=0.4 mm, in order to produce a milliscale structure;

(17) 2. Laser microstructuring, for example at a wavelength of 1064 nm, a pulse length of less than 20 ns, a speed of 800 mm/s, a current of from 20-150 A, a frequency of 10 kHz and overlapping of more than 80%, in order to produce a microscale structure;

(18) 3. Laser irradiation, for example at a wavelength of 1064 nm, a speed of 800 mm/s, a current of 43 A, a frequency of 10 kHz and frequent repetition, in order to produce a nanoscale structure.

(19) In this second example, the second and third step can be carried out in one working cycle, i.e. using at least two lasers that are arranged one behind the other in a common feed apparatus or in two separate feed apparatuses and are advanced together over the workpiece, the titanium sheet in this case.

Example 3

(20) By way of example, a third method for multi-dimensionally structuring at least one connection portion of a metal component can proceed as follows:

(21) 1. Consecutive stamping and deformation of a titanium sheet, for example Ti15V3Al3Cr3Sn having a sheet thickness of t=0.4 mm, in order to produce a milliscale structure;

(22) 2. Laser microstructuring, for example at a wavelength of 1064 nm, a speed of 800 mm/s, a current of from 20-150 A, a frequency of 10 kHz and overlapping of more than 80%, in order to produce a microscale structure;

(23) 3. Anodizing in an electrolyte, for example of sodium hydroxide at a concentration between 100-300 g/l sodium, sodium tartrate at a concentration of 20-200 g/l, a complexing agent e.g. MGDA at a concentration of 1-200 g/l and additional constituents, in order to produce a nanoscale structure.

(24) FIG. 2a is a perspective view of an advantageous embodiment of a metal component 1 having a multi-dimensionally structured connection portion. In the present case, the connection portion is provided on the upper and lower side. The present embodiment is a consecutively stamped and deformed titanium sheet, for example Ti15V3Al3Cr3Sn having a sheet thickness of t=0.4 mm, on which a milliscale structure was first produced, i.e. a structure structured in the range of above 1 mm. Firstly, regularly distributed rectangles are stamped onto three side of the titanium sheet and then lower anchoring elements 2 are bent downwards, when viewed from the sheet plane or x-y plane, and upper anchoring elements 3 are bent upwards and out of the stamped regions perpendicularly to the plane of the titanium sheet, as shown in the side view in FIG. 2. In this way, rectangular notches 6 and anchoring elements protruding upwards and downwards in the z-axis direction are produced in the sheet. If only one side of the sheet is to be used as an anchor, corresponding anchoring elements 2, 3 can for example also be formed so as to protrude only downwards or only upwards in the z-axis direction, respectively.

(25) Furthermore, the metal component 1 is microscaled, i.e. structured in a range above 1 m, by sandblasting the lower side of the titanium sheet or the lower connection portion 4 and the upper side of the titanium sheet or the upper connection portion 5 and the upper and lower anchoring elements 2, 3 located thereon. In the present embodiment, Al2O3 having a particle size of from 250-500 m and at a jet pressure of 7 bar is used to sandblast. The microscale surface structure produced thereby is shown in an enlarged manner in FIG. 2c. A similar result can be achieved by microscaling by laser irradiation.

(26) A nanoscale structure, which was produced by an electrochemical process in the present embodiment, such as anodizing using an electrolyte, has been formed over the end of the microscale structure of the metal component 1. As a result, a surface structure in the range of less than 0.1 m has been produced over the microscale structure. The microscale surface structure produced in this way is shown in an enlarged manner in FIG. 2d. A similar result can be achieved for example by microscaling by laser irradiation.

(27) FIG. 3 is an exploded view of a fiber composite structure having a reinforcing plate. FIG. 4 is a side view of the fiber composite structure from FIG. 3 in the adhered state. In this case, an upper joining partner 7 is connected to the metal component according to the disclosure herein in such a way that the upper anchoring elements 3 engage in the fiber structure of the upper joining partner 7 in the z-axis direction and therefore make optimum adhesive anchoring possible. In the present embodiment, the fiber structure of the upper joining partner 7 is a carbon fiber structure that is connected to the metal component 1, used as reinforcing element, either in a wet adhesion method by epoxy resin or by a film adhesive. After appropriate curing in a vacuum in an autoclave, the joining to the lower joining partner 9 takes place, which joining partner is likewise a carbon fiber structure that is connected to the metal component 1, used as reinforcing element, either in a wet adhesion method by epoxy resin or by film adhesive to form a composite structure 9.

(28) The multi-dimensionally structured metal component 1 enables considerably better z-reinforcement of fiber-reinforced polymer laminates than in conventional reinforcements. In this way, the delamination resistance is increased to 2 kJ/m.sup.2.

(29) The disclosure herein is not restricted to the above-mentioned preferred embodiments in terms of its implementation. Rather, a number of variants are conceivable which make use of the described solution, even if the designs thereof are fundamentally different.

(30) While at least one exemplary embodiment of the present invention(s) is disclosed herein, it should be understood that modifications, substitutions and alternatives may be apparent to one of ordinary skill in the art and can be made without departing from the scope of this disclosure. This disclosure is intended to cover any adaptations or variations of the exemplary embodiment(s). In addition, in this disclosure, the terms comprise or comprising do not exclude other elements or steps, the terms a or one do not exclude a plural number, and the term or means either or both. Furthermore, characteristics or steps which have been described may also be used in combination with other characteristics or steps and in any order unless the disclosure or context suggests otherwise. This disclosure hereby incorporates by reference the complete disclosure of any patent or application from which it claims benefit or priority.