Phosphor-containing phenol formaldehyde resin compound and flame-retardant epoxy resin hardener made from thereof

Abstract

The present disclosure provides a phosphor-containing phenol formaldehyde resin compound having a general formula (I): ##STR00001##
The compound is formed of a phenol formaldehyde resin and an aromatic phosphate compound by performing a condensation reaction, which may be used as a curing agent of an epoxy resin. The phenol formaldehyde resin is formed of a phenolic compound, a bisphenol compound and formaldehyde. The present disclosure further provides a phosphor-containing phenol formaldehyde resin cured material which is formed of the phosphor-containing phenol formaldehyde resin compound and an epoxy resin under a high temperature. The phosphor-containing phenol formaldehyde resin compound is added separately or mixed with an epoxy resin curing agent.

Claims

1. A phosphor-containing flame retarding phenol-formaldehyde novolac, comprising a compound with the general formula represented by formula (I): ##STR00010## wherein Y is, CH.sub.2 or CH.sub.2OCH.sub.2, and Y in different units are the same or different; Z is ##STR00011## R is H, a C1-C10 alkyl group, a C6-C18 aromatic group, ##STR00012## wherein R.sub.1 is H, a C1-C10 alkyl group, a C6-C18 aromatic group and R.sub.1 in different units are the same or different, and R in different units are the same or different; p is 1-2; q is 0-3 ; a is an integer greater than or equal to 1; b is an integer greater than or equal to 1; m is 0-6; X is ##STR00013##

2. The phosphor-containing flame retarding phenol-formaldehyde novolac of claim 1, wherein during the preparation, a phenol compound, a bisphenol compound and a formaldehyde is used to synthesize a phenol-formaldehyde novolac, the phenol-formaldehyde novolac is then mixed with an aromatic phosphate ester to undergo condensation and polymerization to give the phosphor-containing flame retarding phenol-formaldehyde novolac.

3. The phosphor-containing flame retarding phenol-formaldehyde novolac of claim 2, wherein the phenol compound is phenol, o-cresol, m-cresol, p-cresol, o-phenylphenol, m-phenylphenol, p-phenylphenol, 2,6-dimethylphenol, 2,4-dimethylphenol or a combination thereof.

4. The phosphor-containing flame retarding phenol-formaldehyde novolac of claim 2, wherein the bisphenol compound is ##STR00014##

5. The phosphor-containing flame retarding phenol-formaldehyde novolac of claim 2, wherein the aromatic phosphate ester is DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide).

6. A cured flame retarding epoxy resin, comprising reacting the phosphorous-containing flame retarding phenol-formaldehyde novolac of claim 1 with an epoxy resin alone under a high temperature, or reacting a mixture comprising of an epoxy resin hardener and the phosphorous-containing flame retarding phenol-formaldehyde novolac of claim 1 with an epoxy resin under a high temperature.

7. The cured flame retarding epoxy resin of claim 6, wherein the weight percent of the phosphor is 0.5% to 10%.

8. The cured flame retarding epoxy resin of claim 6, wherein the epoxy resin hardener is selected from the group consisting of phenol-formaldehyde novolac, cresol-formaldehyde novolac, bisphenol A phenol-formaldehyde novolac, dicyandiamide, methylenedianiline, diaminodiphenyl sulfone, dicyclopentadiene-phenol resin and a combination thereof.

9. The cured flame retarding epoxy resin of claim 6, wherein the epoxy resin is selected from the group consisting of bisphenol A novolac epoxy resin, bisphenol F novolac epoxy resin, bisphenol S novolac epoxy resin, biphenol novolac epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, dicyclopentadiene-phenol epoxy resin and a combination thereof.

10. The cured flame retarding epoxy resin of claim 6, wherein the reaction is carried out in the presence of a curing accelerator.

11. The cured flame retarding epoxy resin of claim 10, wherein the curing accelerator is used in a range of 0.01 to 2.5 weight percent of the total weight of the epoxy resin and the epoxy resin hardener.

12. The cured flame retarding epoxy resin of claim 10, wherein the curing accelerator is an imidazole-based compound comprising 2-methylimidazole, 2-phenylimidazole or 2-ethyl-4-methylimidazole.

Description

DETAILED DESCRIPTION

(1) Reference will now be made in detail to the present embodiments of the invention. Wherever possible, the same reference numbers are used in the description to refer to the same or like parts.

(2) 1. Preparation of the Phosphorous Containing Phenol-Formaldehyde Novolac Compound

(3) Embodiment 1

(4) 376 grams of biphenol, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 85 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(5) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-1 (phosphorous-containing phenol-formaldehyde novolac compound) is then obtained.

(6) Embodiment 2

(7) 37 grams of phenol, 337 grams of biphenol, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature then raised to 85 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(8) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-2 is then obtained.

(9) Embodiment 3

(10) 520 grams of bisphenol S, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 85 C, after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(11) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C., within a 2-hour period, when the temperature reached 130 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-3 is then obtained.

(12) Embodiment 4

(13) 59 grams of phenol, 461 grams of bisphenol S, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 85 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(14) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-4 is then obtained.

(15) Embodiment 5

(16) 490 grams of bisphenol F, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(17) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system as reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-5 is then obtained.

(18) Embodiment 6

(19) 49 grams of phenol, 441 grams of bisphenol F, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(20) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 175 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 175 C. for 2 hours, the reaction temperature is then lowered to 140 C. about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-6 is then obtained.

(21) Embodiment 7

(22) 640 grams of dicyclopentadiene-phenol resin, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(23) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C. the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 2 hours, the reaction temperature is then lowered to 130 C. about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-7 is then obtained.

(24) Embodiment 8

(25) 64 grams of phenol, 576 grams of dicyclopentadiene-phenol resin, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 50 C. and maintained for 3 hours. The temperature is then raised to 65 after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(26) 1080 grams of DOPO (,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 175 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 175 C. for 2 hours, the reaction temperature is then lowered to 140 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-8 is then obtained.

(27) Embodiment 9

(28) 257 grams of biphenol, 257 grams of bisphenol F, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 40 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(29) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 175 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 175 C. for 2 hours, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-9 is then obtained.

(30) Embodiment 10

(31) 267 grams of phenol S, 267 grams of bisphenal F, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 40 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(32) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system as reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 135 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-10 is then obtained.

(33) COMPARATIVE EXAMPLE 1

(34) 470 grams of phenol. 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 40 C. and maintained for 3 hours. The temperature is then raised to 65 C., after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(35) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-11 is then obtained.

(36) COMPARATIVE EXAMPLE 2

(37) 570 grams of bisphenol A, 648 grams of formaldehyde aqueous solution (37% mass concentration) and 24 grams of sodium hydroxide were added to a reactor, the mixing is then started and the temperature is heated to 40 C. and maintained for 3 hours. The temperature is then raised to 65 C. after maintaining the temperature for 3 hours, 1480 grams of n-butanol were added and refluxed for 12 hours. The reaction temperature is then lowered to 55-60 C., and distilled under a reduced pressure to remove about 1000 grams of n-butanol, and an intermediate product is obtained.

(38) 1080 grams of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) were added to the intermediate product, the reaction temperature was raised from 80 C. to 180 C. within a 2-hour period, when the temperature reached 120 C., the pressure of the reaction system was reduced to ensure that the n-butanol can be discharged out of the reaction system in time. The temperature is maintained at 180 C. for 1 hour, the reaction temperature is then lowered to 130 C., about 900 grams of propylene glycol methyl ether were added and mixed for another 0.5 hours, a phosphor-based hardener P-12 is then obtained.

(39) The method for preparing phosphor-containing flame retarding phenol-formaldehyde resin compound is making a novolac from a phenol compound, a bisphenol compound and formaldehyde, and then mixing the novolac with an aromatic phosphate ester, such as DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), to undergo condensation and polymerization.

(40) The phenol compound used in the preparation method of the present disclosure may be phenol, o-cresol, m-cresol, p-cresol, o-phenylphenol, m-phenylphenol, p-phenylphenol, 2,6-dimethylphenol, 2,4-dimethylphenol or a combination thereof. The bisphenol compound may be biphenol, bisphenol F, bisphenol A, p-thiobisphenol, bisphenol S, dicyclopentadiene-phenol resin or a combination thereof.

(41) The phenol-based compounds and/or the bisphenol-based compounds used in embodiments 1-10 and comparative examples 1-2 are listed in table 1:

(42) TABLE-US-00001 TABLE 1 phenol- based compound bisphenol-based compound product embodiment 1 biphenol phosphor-based hardener P-1 embodiment 2 phenol biphenol phosphor-based hardener P-2 embodiment 3 bisphenol S phosphor-based hardener P-3 embodiment 4 phenol bisphenol S phosphor-based hardener P-4 embodiment 5 bisphenol F phosphor-based hardener P-5 embodiment 6 phenol bisphenol F phosphor-based hardener P-6 embodiment 7 dicyclopentadiene-phenol phosphor-based resin hardener P-7 embodiment 8 phenol dicyclopentadiene-phenol phosphor-based resin hardener P-8 embodiment 9 biphenol + bisphenol F phosphor-based hardener P-9 embodiment bisphenol S + bisphenol F phosphor-based 10 hardener P-10 comparative phenol phosphor-based example 1 hardener P-11 comparative bisphenol A phosphor-based example 2 hardener P-12

(43) 2. Complete Curing of Epoxy Resin with Phosphor-Containing Hardener

(44) Embodiments 11-20

(45) Using different phosphor-containing hardeners (P-1 to P-10) as hardeners for bisphenol A novolac epoxy resin (BNE). The bisphenol A novolac epoxy resin (BNE) is mixed with the hardeners (P-1 to P-10) homogeneously, the equivalent ratio the epoxy group and the phenol group is 1:1, and 0.5 PHR of 2-phenylimidazole of the total weight of the hardener and epoxy resin was added as a curing accelerator, grounded into a powder in a mortar and mixed uniformly, and then the mold was filled with this powder, heated at a temperature of 150 C. and at a pressure of 50 kg/cm.sup.2 for 1 hour, then heated at 170 C. for 2 hours, and then heated at 200 C. for 3 hours to obtain the cured product.

(46) COMPARATIVE EXAMPLE 3

(47) Using the phosphorous-containing hardener in comparative example 1 (P-11) as the hardener for bisphenol A novolac epoxy resin (BNE). The bisphenol A novolac epoxy resin (BNE) is mixed with the hardener (P-11) homogeneously, the equivalent ratio the epoxy group and the phenol group is 1:1, and 0.5 PHR of 2-phenylimidazole of the total weight of the hardener and epoxy resin was added as a curing accelerator, grounded into a powder in a mortar and mixed uniformly, and then the mold was filled with this powder, heated at a temperature of 150 C. and at a pressure of 50 kg/cm.sup.2 for 1 hour, then heated at 170 C. for 2 hours, and then heated at 200 C. for 3 hours to obtain the cured product.

(48) COMPARATIVE EXAMPLE 4

(49) Using the phosphorous-containing hardener in comparative example 2 (P-12) as the hardener for bisphenol A novolac epoxy resin (BNE). The bisphenol A novolac epoxy resin (BNE) is mixed with the hardener (P-12) homogeneously, the equivalent ratio the epoxy group and the phenol group is 1:1, and 0.5 PHR of 2-phenylimidazole of the total weight of the hardener and epoxy resin was added as a curing accelerator, grounded into a powder in a mortar and mixed uniformly, and then the mold was filled with this powder, heated at a temperature of 150 C. and at a pressure of 50 kg/cm.sup.2 for 1 hour, then heated at 170 C. for 2 hours, and then heated at 200 C. for 3 hours to obtain the cured product.

(50) Embodiments 21-30

(51) The phosphorous-containing hardener (P-1 to P-10), bisphenol A novolac epoxy resin (BNE), cresol formaldehyde novolac epoxy resin (CNE), and phenol novolac epoxy (PNE) are in weight proportions shown in table 4, and aluminum hydroxide, silicon dioxide, and an imidazole-based curing accelerator are mixed homogeneously in a suitable solvent, impregnated with glass fiber cloth in a impregnation machine, after heating at 170 C. for 150 seconds, a small heat press was used to cut at 185 C., 25 kg/cm.sup.2 and cure for 2 hours to obtain a halogen free copper clad laminate.

(52) COMPARAYIVE EXAMPLE 5-6

(53) The phosphorous-containing hardener (P-11 to P-12), bisphenol A novolac epoxy resin (BNE), cresol formaldehyde novolac epoxy resin (CNE), and phenol novolac epoxy (PNE) are in weight proportions shown in table 4, and aluminum hydroxide, silicon dioxide, and an imidazole-based curing accelerator are mixed homogeneously in a suitable solvent, impregnated with glass fiber cloth in a impregnation machine, after heating at 170 C. for 150 seconds, a small heat press was used to cut at 185 C., 25 kg/cm.sup.2 and cure for 2 hours to obtain a halogen free copper clad laminate.

(54) Test Description:

(55) (1) Varnish gel time (sec)

(56) 0.3 ml of resin varnish was placed on a 170 C. hot plate, and the gel time was measured.

(57) (2) Glass Transition Temperature ( C.)

(58) A heating rate of 20 C./min was used in differential scanning calorimetry (DSC) tests.

(59) (3) Flame-Retarding:

(60) Test pieces were cut into 0.5 in4.7 in rectangles, a blue flame with a flame height of 2 cm was used to burn for 10 seconds and then removed, after burning twice, the flame is removed and the self-extinguishing time is recorded.

(61) (4) Water Absorption Rate (%):

(62) The sample was heated in a pressure boiler at 120 C. and 2 atm for 30 minutes.

(63) (5) Dielectric Loss (1 GHz):

(64) The test piece was cut into 55 squares, and the thickness were measured by measuring three points and then sandwiched into a dielectric analysis instrument for measurements, after completion, the mean value was recorded.

(65) (6) Dielectric Constant (1 GHz):

(66) The substrate after etching was cut into 5 cm.sup.2 square test pieces, after baking at 105 C. for 2 hours in the oven, the substrate was removed and the thickness were measured by measuring three points. Then the test piece was sandwiched into a dielectric analysis instrument, after measuring three points, the mean value was recorded.

(67) Although the present invention has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

(68) Table 2 is a comparison of the glass transition temperature (Tg) of the hardeners; Table 3 is an analysis of the thermal cracking of the hardeners; Table 4 gives the test results of the copper-clad laminate substrates.)

(69) TABLE-US-00002 TABLE 2 glass transition temperature of the cured products: Sample Hardener glass transition temperature (Tg, C.) embodiment 11 P-1 178 embodiment 12 P-2 176 embodiment 13 P-3 189 embodiment 14 P-4 186 embodiment 15 P-5 176 embodiment 16 P-6 174 embodiment 17 P-7 180 embodiment 18 P-8 178 embodiment 19 P-9 177 embodiment 20 P-10 180 comparative example 3 P-11 161 comparative example 4 P-12 176

(70) TABLE-US-00003 TABLE 3 analysis of the thermal cracking of the cured product: Thermal cracking (5% weight loss) Sample Hardener Temp. ( C.) embodiment 11 P-1 386 embodiment 12 P-2 381 embodiment 13 P-3 425 embodiment 14 P-4 425 embodiment 15 P-5 380 embodiment 16 P-6 375 embodiment 17 P-7 388 embodiment 18 P-8 385 embodiment 19 P-9 388 embodiment 20 P-10 398 comparative example 3 P-11 338 comparative example 4 P-12 353

(71) TABLE-US-00004 TABLE 4 resin composition formulation and physical properties: Embodiments Comparative examples 21 22 23 24 25 26 27 28 29 30 5 6 BNE 35 35 20 20 30 30 30 30 25 20 35 35 PNE 10 10 10 10 0 0 0 0 5 10 10 10 CNE 55 55 70 70 70 70 70 70 70 70 55 55 P-1 18 P-2 18 P-3 16 P-4 16 P-5 P-6 17 17 P-7 22 22 P-8 P-9 19 P-10 17 P-11 17 P-12 17 Flame retardant 20 20 20 20 20 20 20 20 20 20 20 20 (Aluminum hydroxide) Filler (silicon dioxide) 10 10 10 10 10 10 10 10 10 10 10 10 Accelerator 2MI (PHR) 1.2 1.2 1.1 Accelerator 2PI (PHR) 0.2 0.2 0.6 0.6 0.5 0.5 0.7 0.2 0.2 Phosphorus content (%) 1.30 1.30 1.30 1.30 1.24 1.24 1.35 1.35 1.30 1.30 1.20 1.20 Gel Time (sec) 340 346 355 355 350 355 320 325 340 355 350 365 Glass transition temperature 182 178 193 192 176 174 183 181 179 183 155 176 ( C.) Flame resistance 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0 Thermal coefficient 35/208 38/213 30/198 31/201 42/233 43/235 35/222 38/229 39/223 35/221 42/238 52/255 of expansion (1/2) Water absorption rate (%) 0.12 0.15 0.16 0.16 0.17 0.17 0.10 0.10 0.14 0.16 0.12 0.12 Dielectric constant (1 GHz) 4.01 4.06 4.05 4.05 4.14 4.15 3.91 3.95 4.09 4.11 4.25 4.21 Dielectric loss (1 GHz) 0.008 0.009 0.009 0.009 0.012 0.012 0.008 0.008 0.010 0.011 0.011 0.011

CONCLUSION

(72) Comparing the Tg (Table 2) of the cured products obtained in embodiments 11-20 and comparative example 3-4, we can see that the cured phosphor-containing epoxy resin of the present disclosure, especially the cured phosphor-containing epoxy resin prepared by using a hardener obtained by using bisphenol S and phenol as the raw materials (embodiment 3; hardener P-3) and then reacting with epoxy resin, the Tg is higher than the cured phosphor-containing epoxy resin prepared by using phenol (comparative example 1; hardener P-11), and even 13 C. higher than the cured epoxy resin prepared by using bisphenol A based phosphorous-containing hardener (comparative example 2; hardener P-12) and the thermal stability is better than the other embodiments.

(73) From Table 3 we can see the differences in the degree of crosslinking of the phosphorus based hardener and the epoxy resin, wherein in the TGA tests of the bisphenol S based phosphorous-containing epoxy resin hardener (embodiment 3, hardener P-3; embodiment 4; hardener P-4), the thermal cracking (5% weight loss) temperature can exceed 425 C., and can be used as high-end electronic packaging materials.

(74) From Table 4, except embodiment 26 (hardener P-6; phenol+bisphenol F series), we can seen that the Tgs of the other cured phosphor-containing epoxy resins of the present disclosure are all higher than the phosphor-containing hardeners prepared by using only phenol (comparative example 5) or only bisphenol A (comparative example 6), and showed better electrical properties than comparative example 5 and comparative example 6. the cured phosphor-containing epoxy resin containing dicyclopentadiene-phenol resin (embodiment 27) showed that the DK of which can reach 3.91 and the Df can reach 0.008, so that it may be used in the field of high frequency copper-clad laminates, In terms of the performance of the coefficient of expansion, the 1 in embodiments 21-24 and 27-30 are all between 30 and 40, and 2 is between 198 and 229. In embodiment 41-62, as long as a phosphorus content of 1.1-1.4% is in the formulation, the copper-clad laminate can meet the requirement of flame-retarding effect, therefore making it ideal to be used in the field of manufacturing high-end phosphor-containing copper-clad laminate materials.

(75) Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

(76) It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the present disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of the present disclosure provided they fall within the scope of the following claims.