DYNAMIC EQUIVALENT CIRCUIT OF COMBINED HEAT AND POWER SYSTEM, AND WORKING METHOD THEREOF

Abstract

The present disclosure discloses a dynamic equivalent circuit of a combined heat and power system, and a working method thereof. Controlled sources are used to represent a thermoelectric coupling source; equivalent inductance is used to represent a delay of a heat transmission pipeline; equivalent resistance is used to represent a heat load and a heat loss of the heat transmission pipeline; and equivalent capacitance is used to represent a heat storage water tank. A circuit model is used to uniformly represent two thermoelectric heterogeneous energy sources, and a single power simulation tool may be used to simulate a combined heat and power system, so that the simulation system has a simple structure and is easy to develop and maintain.

Claims

1. A dynamic equivalent circuit of a combined heat and power system, wherein controlled sources are used to represent a thermoelectric coupling source; equivalent inductance is used to represent a delay of a heat transmission pipeline; equivalent resistance is used to represent a heat load and a heat loss of the heat transmission pipeline; and equivalent capacitance is used to represent a heat storage water tank.

2. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein the circuit comprises a first branch and a second branch, wherein the first branch comprises: an input terminal, a controlled voltage source U.sub.e, a resistor R.sub.e and an output terminal connected in sequence; the second branch comprises: an input terminal, a controlled current source I.sub.0.sup.h and a ground terminal connected in sequence; and the first branch and the second branch are used to represent the thermoelectric coupling source of the combined heat and power system.

3. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein the circuit further comprises: a third branch and a fourth branch, wherein the third branch is connected in parallel with the second branch; the third branch comprises: an input terminal, a virtual resistor R′.sub.l and a ground terminal connected in sequence; the fourth branch comprises: an input terminal, an inductor L.sup.h.sub.pd, a resistor R.sub.pg.sup.h and an output terminal connected in sequence; and the third branch and the fourth branch are used to represent the heat transmission pipeline of the combined heat and power system.

4. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein the circuit further comprises: a fifth branch; the fifth branch comprises: a resistor load R.sub.load.sup.h, a resistor R.sub.pr.sup.h, a resistor R.sup.h.sub.rest and a ground terminal connected in sequence, wherein the resistor load R.sub.load.sup.h also connected with an output terminal of the resistor R.sub.pg.sup.h; and the resistor R.sub.load.sup.h represents a heat load of the combined heat and power system, and the resistors R.sub.pr.sup.k and R.sub.rest.sup.h represent a water return side of the combined heat and power system.

5. The dynamic equivalent circuit of a combined heat and power system according to claim 1, further comprising: a sixth branch and a seventh branch, wherein the sixth branch comprises: a first switch, one end of the first switch is connected with the output terminal of the resistor R.sub.pg.sup.h through a node 2′, and the other end of the first switch is grounded through a resistor R′.sub.c; the seventh branch comprises: a controlled current source I.sub.2.sup.h, one end of the controlled current source I.sub.2.sup.h is connected with the output terminal, the other end of the controlled current source I.sub.2.sup.h grounded through a capacitor C.sub.s.sup.h, assuming that a connecting point between the controlled current source I.sub.2.sup.h and the output terminal is a node 2, and a second switch is arranged between the node 2′ and the node 2; and the sixth branch and the seventh branch are used to represent the heat storage water tank of the combined heat and power system.

6. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein a mathematical model of the thermoelectric coupling source of the combined heat and power system is: $\begin{array}{cc}{U}_h{I}_h=\frac{{\eta }_h{U}_e{I}_e}{{\eta }_e}+T_{cooling}{I}_h,& \left(10\right)\end{array}$ wherein U.sub.h represents an outlet temperature of cooling water; I.sub.h represents a heat capacity flow rate of the cooling water; η.sub.e represents a generating efficiency of a thermoelectric coupling source; U.sub.e represents an output voltage of a thermoelectric coupling source; I.sub.e represents an output current of the thermoelectric coupling source; T.sub.cooling represents an inlet temperature of the cooling water; and η.sub.h represents a thermal efficiency of the thermoelectric coupling source.

7. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein a mathematical model of the heat loss of the heat transmission pipeline of the combined heat and power system is: $\begin{array}{cc}{R}_{\mathrm{pipe}}^h=\frac{\left(T_{\mathrm{start}}-T_a\right)\left(1-e^{\frac{-\lambda L}{\mathrm{Cp}}}\right)}{\mathrm{Cp}},& \left(6\right)\end{array}$ wherein R.sup.h.sub.pipe represents resistance of the heat transmission pipeline, T.sub.start represents an inlet temperature of the heat transmission pipeline, T.sub.a represents an environmental temperature of the heat transmission pipeline, λ represents a heat dissipation coefficient of the pipeline, L represents a length of the pipeline, and Cp represents a heat capacity flow rate of heat flow.

8. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein a mathematical model of the heat load of the combined heat and power system is: due to the existence of its own heat capacity b, the heat load is heated to a temperature T.sub.e by the heat flow at a heat exchange rate a, and a dynamic process of T.sub.e temperature rise is expressed as: $\begin{array}{cc}{T}_e\stackrel{▯}{(}t)=\frac{a}{b}\left(T_{\mathrm{in}}\left(t\right)-T_e\left(t\right)\right),& \left(1\right)\end{array}$ wherein T.sub.in(t) represents an inlet temperature, T.sub.e(t) represents a heat load temperature at a time t, and T.sub.e represents a change rate of the heat load temperature at the time t; when the heat capacity flow rate of the heat flow is Cp(t) and a heat dissipation rate of the heat load is ϕ.sub.load, an outlet temperature T.sub.out(t) of the heat flowing through the heat load is expressed as: $\begin{array}{cc}{T}_{out}\left(t\right)=T_{\mathrm{in}}\left(t\right)-\frac{T_e\stackrel{▯}{(}t).Math.b+{\varphi }_{\mathrm{load}}}{\mathrm{Cp}\left(t\right)};& \left(2\right)\end{array}$ then, equivalent resistance R.sup.h(t) of the heat load is expressed as: $\begin{array}{cc}{R}^h\left(t\right)=\frac{T_{\mathrm{in}}\left(t\right)-T_{\mathrm{out}}\left(t\right)}{\mathrm{Cp}\left(t\right)}=\frac{T_e\stackrel{▯}{(}t)b+{\varphi }_{\mathrm{load}}}{{\left[\mathrm{Cp}\left(t\right)\right]}^2};& \left(3\right)\end{array}$ and a mathematical model of the water return side of the combined heat and power system is: $\begin{array}{cc}{R}_{\mathrm{rest}}^h=\frac{T_{\mathrm{in}}\left(t\right)}{\mathrm{Cp}\left(t\right)}-R^h.& \left(4\right)\end{array}$

9. The dynamic equivalent circuit of a combined heat and power system according to claim 1, wherein a mathematical model of the heat storage water tank of the combined heat and power system is: based on thermoelectric comparison rules, calculation formulas of heat storage C.sup.h(t) and total heat storage W.sub.c.sup.h are respectively: $\begin{array}{cc}{C}^h\left(t\right)=\frac{\underset{0}{\overset{t}{\int }}{\mathrm{Cp}}_{\mathrm{in}}\left(t\right)\mathrm{dt}}{T_{\tan k}},& \left(7\right)\end{array}$ $\begin{array}{cc}{W}_c^h=C_h{T}_{\tan k}^2,& \left(8\right)\end{array}$ wherein Cp.sub.in(t) represents a heat capacity flow rate at an inlet of the water tank, and T.sub.tank(t) represents a heat storage water temperature and is represented by Formula (9) without considering the heat dissipation of the water tank: $\begin{array}{cc}{T}_{\tan k}\left(t\right)=\frac{\underset{0}{\overset{t}{\int }}{V}_{\mathrm{in}}\left(t\right)T_{\mathrm{in}}\left(t\right)\mathrm{dt}}{\underset{0}{\overset{t}{\int }}{V}_{\mathrm{in}}\left(t\right)\mathrm{dt}},& \left(9\right)\end{array}$ wherein T.sub.in(t) represents an inlet temperature of the heat storage water tank at the time t, and V.sub.in(t) represents an inlet flow rate of the heat storage water tank at the time t.

10. A simulation method of a dynamic equivalent circuit of a combined heat and power system, comprising: when an electrical load is R.sub.e, a supply voltage of a thermoelectric coupling source is U.sub.e; the heat flows out of a waste heat recovery system of the thermoelectric coupling source; the heat flows through a heating pipeline after a transmission delay time, and a heat loss is generated; if a first switch and a second switch are all turned on, the heat is completely used for heating of a heat load, and the heat completely flows through the heat load to heat the heat load and then passes through a water return pipeline to reach a water return side; and if the first switch and the second switch are turned off at the same time, part of the heat flows through the heat load to heat the heat load and then passes through the water return pipeline to reach the water return side, and the other part of the heat flows into a heat storage water tank and is stored for later use.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings which constitute a part of the description of the present disclosure are intended to provide further understanding of the present disclosure. The exemplary examples of the present disclosure and descriptions thereof are intended to explain the present disclosure and do not constitute an inappropriate limitation to the present disclosure.

[0021] FIG. 1 shows a simulation system of a dynamic equivalent circuit in a first embodiment.

[0022] FIG. 2(a) shows a heat load.

[0023] FIG. 2(b) shows an equivalent circuit representation of the heat load.

[0024] FIG. 3(a) shows a heat transmission pipeline.

[0025] FIG. 3(b) shows an equivalent circuit representation of the heat transmission pipeline.

[0026] FIG. 4(a) shows a heat storage water tank.

[0027] FIG. 4(b) shows an equivalent circuit representation of the heat storage water tank.

[0028] FIG. 4(c) shows an equivalent circuit representation of the heat storage water tank.

[0029] FIG. 5(a) shows a thermoelectric coupling source device.

[0030] FIG. 5(b) shows an equivalent circuit representation of the thermoelectric coupling source device.

[0031] FIG. 5(c) shows an equivalent circuit representation of the thermoelectric coupling source device.

[0032] FIG. 6 shows a structural diagram of a combined heat and power system.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] It should be pointed out that the following detailed description is illustrative and is intended to provide further explanation of the present disclosure. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those generally understood by those of ordinary skill in the art to which the present disclosure pertains.

[0034] It should be noted that the terms used herein are merely used for describing the specific implementations, but are not intended to limit exemplary implementations of the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms are intended to include the plural forms as well. Moreover, it should be understood that the terms “include”, “have” and any other variants mean to cover a non-exclusive inclusion, for example, a process, method, system, product, or device that includes a list of steps or units is not necessarily limited to those expressly listed steps or units, but may include other steps or units not expressly listed or inherent to such a process, method, system, product, or device.

[0035] In addition, the embodiments in the present disclosure and the features in the embodiments can be combined with each other in a non-conflicting situation.

Embodiment 1

[0036] This embodiment provides a dynamic equivalent circuit of a combined heat and power system.

[0037] As shown in FIG. 1, the dynamic equivalent circuit of the combined heat and power system includes:

[0038] controlled sources are used to represent a thermoelectric coupling source; equivalent inductance is used to represent a delay of a heat transmission pipeline; equivalent resistance is used to represent a heat load and a heat loss of the heat transmission pipeline; and equivalent capacitance is used to represent a heat storage water tank.

[0039] Further, the circuit includes: a first branch and a second branch,

[0040] where the first branch includes: an input terminal, a controlled voltage source U.sub.e, a resistor R.sub.e and an output terminal connected in sequence;

[0041] the second branch includes: an input terminal, a controlled current source I.sub.0.sup.h and a ground terminal connected in sequence; and

[0042] the first branch and the second branch are used to represent the thermoelectric coupling source of the combined heat and power system.

[0043] Exemplarily, the thermoelectric coupling source refers to a device that can convert a certain energy into electrical energy and thermal energy at the same time, such as a gas turbine that can convert the chemical energy of fuel gas into electrical energy and thermal energy at the same time, and a fuel cell that can convert the chemical energy of hydrogen into electrical energy and thermal energy at the same time.

[0044] Exemplarily, the thermoelectric coupling source: a controlled source of a circuit element is used to represent a generator set of a combined heat and power system, such as a gas generator set and a fuel cell. Taking the gas generator set as an object, an energy balance equation is shown in Formula (10), and an outlet temperature U.sub.h and a current I.sub.e of cooling water may be derived as Formula (11). FIG. 5(a) shows a thermoelectric coupling source device. FIG. 5(b) shows an equivalent circuit representation of the thermoelectric coupling source device. FIG. 5(c) shows an equivalent circuit representation of the thermoelectric coupling source device.

[0045] Further, a mathematical model of the thermoelectric coupling source of the combined heat and power system is:

[00001]$\begin{array}{cc}{U}_h{I}_h=\frac{{\eta }_h{U}_e{I}_e}{{\eta }_e}+T_{\mathrm{cooling}}{I}_h,& \left(10\right)\end{array}$

[0046] where U.sub.h represents an outlet temperature of cooling water; I.sub.h represents a heat capacity flow rate of the cooling water; η.sub.3 represents a generating efficiency of a thermoelectric coupling source; U.sub.e represents an output voltage of a thermoelectric coupling source; I.sub.e represents an output current of the thermoelectric coupling source; T.sub.cooling represents an inlet temperature of the cooling water; and η.sub.h represents a thermal efficiency of the thermoelectric coupling source.

[0047] Further, the circuit further includes: a third branch and a fourth branch,

[0048] where the third branch is connected in parallel with the second branch; the third branch includes: an input terminal, a virtual resistor R′.sub.l and a ground terminal connected in sequence;

[0049] the fourth branch includes: an input terminal, an inductor L.sup.h.sub.pd, a resistor R.sub.pg.sup.h and an output terminal connected in sequence;

[0050] the third branch and the fourth branch are used to represent the heat transmission pipeline of the combined heat and power system; and

[0051] the inductor L.sup.h.sub.pd is used to represent a delay of the heat transmission pipeline.

[0052] Exemplarily, a delay phenomenon of heat transmission in the heat transmission pipeline may be described by thermal inductance, which is similar to a hindering effect of an inductance element on a current in a circuit. Due to model requirements of optimization control of the combined heat and power system, time constant characteristics of thermal inductance are mainly researched. Combined with a circuit logic, a virtual resistor R′.sub.l is designed and connected in parallel with L.sup.h.sub.pd to form an RL circuit structure, but it has no actual physical meaning. A value of R′.sub.l needs to be so large that its shunting effect is small enough to be ignored. According to the knowledge of electronics, it is believed that after 5.sup.τ.sup.l (.sup.τ.sup.l is an inductance time constant), an inductance current is stable. Therefore, assuming that a transmission delay time of heat flow is t.sub.delay, L.sub.h is expressed as:

[00002]$\begin{array}{cc}{L}_h=R_l^{\prime }{\tau }_l=\frac{R_l^{\prime }{t}_{\mathrm{delay}}}{5}.& \left(5\right)\end{array}$

[0053] Generally, while there is a delay in pipeline heat transmission, the heat dissipation through a pipeline to an ambient environment is also inevitable, that is, there is equivalent resistance.

[0054] Further, a mathematical model of the heat loss of the heat transmission pipeline of the combined heat and power system is:

[0055] The resistance R.sup.h.sub.pipe of the heat transmission pipeline is expressed as:

[00003]$\begin{array}{cc}{R}_{\mathrm{pipe}}^h=\frac{\left(T_{\mathrm{start}}-T_a\right)\left(1-e^{\frac{-\lambda L}{\mathrm{Cp}}}\right)}{\mathrm{Cp}},& \left(6\right)\end{array}$

[0056] where T.sub.start represents an inlet temperature of the heat transmission pipeline, T.sub.a represents an environmental temperature of the heat transmission pipeline, λ represents a heat dissipation coefficient of the pipeline, L represents a length of the pipeline, and Cp represents a heat capacity flow rate of heat flow in the pipeline.

[0057] In conclusion, the heat transmission pipeline is shown in FIG. 3(a), and the equivalent circuit representation of the heat transmission pipeline is shown in FIG. 3(b).

[0058] Further, the circuit further includes: a fifth branch.

[0059] The fifth branch includes: a resistor R.sub.load.sup.h, a resistor R.sub.pr.sup.h, a resistor R.sub.rest.sup.h and a ground terminal connected in sequence, where the resistor R.sub.load.sup.h is also connected with an output terminal of the resistor R.sub.pg.sup.h,

[0060] where the resistor R.sub.load.sup.h represents a heat load of the combined heat and power system, the resistors R.sub.pr.sup.h and R.sub.rest.sup.h represent a water return side of the combined heat and power system, and the resistors R.sub.pg.sup.h and R.sub.pr.sup.h are used to represent the heat loss of the heat transmission pipeline.

[0061] Exemplarily, heat load: all devices having heat dissipation in the combined heat and power system may be called heat loads, such as building heat loads and heat transmission pipelines with heat losses. Here, the heat load is compared to a resistor, and then an equivalent representation form of dynamic resistance R.sup.h is established.

[0062] Further, a mathematical model of the heat load of the combined heat and power system is:

[0063] due to the existence of its own heat capacity b, the heat load is heated to a temperature T.sub.e by the heat flow at a heat exchange rate a, and a dynamic process of T.sub.e temperature rise may be expressed as Formula (1):

[00004]$\begin{array}{cc}{T}_e\stackrel{▯}{(}t)=\frac{a}{b}\left(T_{\mathrm{in}}\left(t\right)-T_e\left(t\right)\right),& \left(1\right)\end{array}$

[0064] where T.sub.in(t) represents an inlet temperature, T.sub.e(t)represents a heat load temperature at a time t, and T.sub.e represents a change rate of the heat load temperature at the time t.

[0065] At the time t, the heat capacity flow rate of the heat flow is Cp(t), a temperature is T.sub.in(t), a heat dissipation rate of the heat load is ϕ.sub.load(t), and an outlet temperature T.sub.out(t) of the heat flowing through the heat load is expressed as:

[00005]$\begin{array}{cc}{T}_{\mathrm{out}}\left(t\right)=T_{\mathrm{in}}\left(t\right)-\frac{T_e\stackrel{▯}{(}t).Math.b+{\varphi }_{\mathrm{load}}\left(t\right)}{\mathrm{Cp}\left(t\right)}.& \left(2\right)\end{array}$

[0066] At this time, equivalent resistance R.sup.h(t) of the heat load may be expressed as:

[00006]$\begin{array}{cc}{R}^h\left(t\right)=\frac{T_{\mathrm{in}}\left(t\right)-T_{\mathrm{out}}\left(t\right)}{\mathrm{Cp}\left(t\right)}=\frac{T_e\stackrel{▯}{(}t)b+{\varphi }_{\mathrm{load}}}{{\left[\mathrm{Cp}\left(t\right)\right]}^2}.& \left(3\right)\end{array}$

[0067] Further, a mathematical model of the water return side of the combined heat and power system is:

[00007]$\begin{array}{cc}{R}_{\mathrm{rest}}^h=\frac{T_{\mathrm{in}}\left(t\right)}{\mathrm{Cp}\left(t\right)}-R^h.& \left(4\right)\end{array}$

[0068] In order to solve the contradiction that voltages of parallel circuits are equal but outlet temperatures of the parallel circuits are not necessarily equal, a model R.sup.h.sub.rest on the water return side of the resistor is established, so as to represent the low-grade heat energy of the water return side of the resistor.

[0069] In conclusion, the heat load is shown in FIG. 2(a), and the equivalent circuit representation form of the heat load is shown in FIG. 2(b).

[0070] Further, the dynamic equivalent circuit of the combined heat and power system includes: a sixth branch and a seventh branch,

[0071] where the sixth branch includes: a first switch, one end of the first switch is connected with an output terminal of the resistor R.sup.h.sub.pg through a node 2′, and the other end of the first switch is grounded through a resistor R′.sub.c;

[0072] the seventh branch includes: a controlled current source I.sub.2.sup.h, one end of the controlled current source I.sub.2.sup.h is connected with the output terminal, the other end of the controlled current source I.sub.2.sup.h is grounded through a capacitor C.sub.s.sup.h, assuming that a connecting point between the controlled current source I.sub.2.sup.h and the output terminal is a node 2, and a second switch is arranged between the node 2′ and the node 2; and

[0073] the sixth branch and the seventh branch are used to represent the heat storage water tank of the combined heat and power system.

[0074] Exemplarily, heat storage water tank: since the existence of heat storage allows a mismatch between a heat demand and heat generation, the combination of heat storage and combined heat and power systems has become a standard scheme.

[0075] Further, a mathematical model of the heat storage water tank of the combined heat and power system is:

[0076] similar to a capacitance element C, a heat capacity C.sup.h(t) represents the heat storage at the time t.

[0077] Based on thermoelectric comparison rules, calculation formulas of C.sup.h(t) and total heat storage W.sub.c.sup.h(t) at the time t are respectively:

[00008]$\begin{array}{cc}{C}^h\left(t\right)=\frac{\underset{0}{\overset{t}{\int }}{\mathrm{Cp}}_{\mathrm{in}}\left(t\right)\mathrm{dt}}{T_{\tan k}},& \left(7\right)\end{array}$$\begin{array}{cc}{W}_c^h\left(t\right)={C_h\left(t\right)\left[T_{\tan k}\left(t\right)\right]}^2,& \left(8\right)\end{array}$

[0078] where Cp.sub.in(t) represents a heat capacity flow rate at an inlet of the water tank, and T.sub.tank(t) represents a heat storage water temperature at the time t. T.sub.tank(t) is represented by Formula (9) without considering the heat dissipation of the water tank:

[00009]$\begin{array}{cc}{T}_{\tan k}\left(t\right)=\frac{\underset{0}{\overset{t}{\int }}{V}_{\mathrm{in}}\left(t\right)T_{\mathrm{in}}\left(t\right)\mathrm{dt}}{\underset{0}{\overset{t}{\int }}{V}_{\mathrm{in}}\left(t\right)\mathrm{dt}},& \left(9\right)\end{array}$

[0079] where T.sub.in(t) and V.sub.in(t) respectively represent an inlet temperature and an inlet flow rate of the heat storage water tank at the time t.

[0080] Similar to thermal inductance, C.sub.h also needs a virtual resistor R′.sub.c, which is connected in parallel with a heat load branch, its value is 1/x times the total resistance value of the heat load branch, and its function is to share

[00010]$\frac{x}{1+x}$

times of the total current together with the heat load branch, and assign the current to a current source Ic. Specifically, FIG. 4(a) shows a heat storage water tank; FIG. 4(b) shows an equivalent circuit representation of the heat storage water tank; and FIG. 4(c) shows an equivalent circuit representation of the heat storage water tank.

[0081] In the present disclosure, a simulation model of a dynamic equivalent circuit of a combined heat and power system, including four typical links of a thermoelectric coupling source, a heat transmission pipeline, a heat load and heat storage, will be established.

[0082] First, according to thermoelectric comparison rules, a heat dissipation process of the heat load including a building heat load and a pipeline heat load (pipeline heat energy loss), in the system is compared to a resistance element;

[0083] a heat transmission delay is compared to a thermal inductance element;

[0084] non-phase change heat storage, which is usually a heat storage water tank, is compared to a heat capacity element; and

[0085] a thermoelectric coupling source, which is usually a gas generator set, a fuel cell, etc., is represented in a form of a controlled source. Finally, in combination with a system structure, a model of the dynamic equivalent circuit of the combined heat and power system is constructed, and unified dynamic simulation of the heterogeneous energy flow of the system is realized.

[0086] In combination with a structural diagram of the combined heat and power system in FIG. 6, a complete simulation model of the equivalent circuit of the combined heat and power system, including a thermoelectric coupling source, a heat transmission pipeline, a heat load and a heat storage water tank, is shown in FIG. 1, where a controlled source CCCS indicates that when an outlet temperature U.sup.h.sub.0 of cooling water and an output voltage U.sub.e of a gas generator set are constant, the a flow rate I.sup.h.sub.0 of the cooling water is controlled by a current I.sub.e.

[0087] A node 0′ is a branch node of an auxiliary resistor .sup.R1 which has no physical meaning, and since R′.sub.l is large enough, I′.sub.0′ may be approximately regarded as 0.

[0088] L.sup.h.sub.pd represents a heat transmission delay, R.sub.pg.sup.h and R.sub.pr.sup.h on the water return side respectively represent heat dissipation of a heat transmission pipeline for heating and a heat transmission pipeline for water return, R.sub.rest .sup.h represents residual resistance, and R.sub.rest.sup.h represents lower-grade return water heat energy after passing through the heat load. I′.sub.2 is equal to I′.sub.2′, and I′.sub.2 represents an inlet flow rate of a heat storage water tank C.sub.h.sup.s. The simulation model may be flexibly arranged on power simulation software. A Simscope tool of an MATLAB/Simulink has been used to realize the simulation of the combined heat and power system, and simulation results verify that the simulation model is effective.

Embodiment 2

[0089] This embodiment provides a simulation method of a dynamic equivalent circuit of a combined heat and power system.

[0090] The simulation method of the dynamic equivalent circuit of the combined heat and power system includes:

[0091] controlled sources are used to represent a thermoelectric coupling source; equivalent inductance is used to represent a delay of a heat transmission pipeline; equivalent resistance is used to represent a heat load and a heat loss of the heat transmission pipeline; and equivalent capacitance is used to represent a heat storage water tank.

[0092] When an electrical load is R.sub.e, a supply voltage of a thermoelectric coupling source is U.sub.e.

[0093] The heat flows out of a waste heat recovery system of the thermoelectric coupling source; and the heat flows through a heating pipeline after a transmission delay time, and a heat loss is generated.

[0094] If a first switch and a second switch are all turned on, the heat is completely used for heating of a heat load, and the heat completely flows through the heat load to heat the heat load and then passes through a water return pipeline to reach a water return side.

[0095] If the first switch and the second switch are turned off at the same time, part of the heat flows through the heat load to heat the heat load and then passes through the water return pipeline to reach the water return side, and the other part of the heat flows into a heat storage water tank and is stored for later use.

[0096] The above description is merely preferred examples of the present disclosure and is not intended to limit the present disclosure, and various changes and modifications of the present disclosure may be made by those skilled in the art. Any modifications, equivalent substitutions, improvements, and the like made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.