Heater apparatus, circuit interrupter, and related method
10056214 ยท 2018-08-21
Assignee
Inventors
Cpc classification
H01H69/00
ELECTRICITY
H01H11/00
ELECTRICITY
Y10T29/49083
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H01H69/00
ELECTRICITY
H01H11/00
ELECTRICITY
Abstract
A heater apparatus is structured for use in a circuit interrupter having a thermal trip and includes a conductive device having a terminal and a heater that are co-formed with one another. The terminal includes a base and a support. The conductive device is formed from an individual metallic plate that is bent to form a number of plate elements. The base includes at least one plate element, and the heater includes at least another plate element, with the base and the heater being co-formed. A compression element is threadably receivable on the terminal and is structured to compressively retain an electrical conductor between the compression element and the base.
Claims
1. A method of forming a heater apparatus for use in a circuit interrupter having a thermal trip, the method comprising: bending an individual metallic plate to form a conductive device having a number of plate elements wherein: at least one plate element of the number of plate elements is a base of the conductive device, at least another plate element of the number of plate elements is a heater of the conductive device, the heater being thermally conductively connected with at least a portion of the thermal trip, the heater being structured to conduct electricity within the circuit interrupter and to generate resistance heat which is communicated at least in part to the thermal trip, and at least a further plate element of the number of plate elements is a support of the conductive device, the support extending from the base; receiving on the support a compression element that is movable toward and away from the base and to compressively retain an electrical conductor between the compression element and the base; and employing as the plate an individual and generally T-shaped plate-like conductive element having an elongated body and a pair of wings situated at an end of the body, the wings extending in opposite directions away from the end of the body.
2. The method of claim 1, further comprising forming threading on a pair of holes formed in the pair of wings.
3. The method of claim 2, further comprising deforming the wings to align the holes with one another, and performing the forming of threading subsequent to the deforming.
4. The method of claim 3, further comprising threadably receiving the compression element in the holes.
5. The method of claim 3, further comprising as a part of the deforming of the wings, causing a portion of a wing of the pair of wings having formed therein a hole of the pair of holes to overlie a portion of another wing of the pair of wings having formed therein another hole of the pair of holes.
6. The method of claim 5, further comprising as a part of the deforming of the wings, causing another portion of the wing to form a lug, and causing another portion of the another wing to form another lug, the lug and the another lug spacing away from the base the overlying portions of the wing and the another wing.
7. The method of claim 1, further comprising forming a bend between the base and the heater.
8. The method of claim 1, further comprising employing as the plate an individual plate-like conductive element having an elongated body and at least a first wing, the at least first wing being situated on the body and extending away from the body.
9. The method of claim 8 wherein the plate has at least a first hole formed therein, and further comprising forming threading on the at least first hole.
10. The method of claim 9, further comprising performing the forming of threading subsequent to at least a portion of the bending.
11. The method of claim 9, further comprising threadably receiving the compression element in the at least first hole.
12. The method of claim 9, further comprising as a part of the bending, causing a portion of the conductive element to form a lug that spaces the at least first hole away from the base.
13. The method of claim 8 wherein the plate has a pair of holes formed therein, and further comprising forming threading on at least a first hole of the pair of holes.
14. The method of claim 13, further comprising deforming the conductive element to align the holes of the pair of holes with one another.
15. The method of claim 14, further comprising performing the forming of threading subsequent to at least a portion of the deforming.
16. The method of claim 14 wherein the forming of threading comprises forming threading on both holes of the pair of holes.
17. The method of claim 16, further comprising threadably receiving the compression element in the pair of holes.
18. The method of claim 14 wherein the deforming comprises overlying a portion of the conductive element with another portion of the conductive element.
19. The method of claim 18, further comprising as a part of the deforming, forming in the conductive element a pair of lugs that space the pair of holes away from the base.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) A further understanding of the disclosed and claimed concept can be gained from the following Description when read in conjunction with the accompanying drawings in which:
(2)
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(8) Similar numerals refer to similar parts throughout the specification.
DESCRIPTION
(9) An improved heater apparatus 2 in accordance with the disclosed and claimed concept is depicted in
(10) The heater apparatus 2 can be said to include a conductive device 8 and a compression element 10 which, in the depicted exemplary embodiments, is a conventional threaded set screw that cooperates threadably with the conductive device 8, as will be set forth in greater detail below. The conductive device 8 can be said to include a terminal 14 and a heater 16 that are co-formed with one another. As employed herein, the expression co-formed and variations thereof refers broadly to any type of formation or connection methodology which enables the terminal 14 and the heater 16 to remain connected together without the use of additional structures that rely upon the application of compressive forces to either or both of the terminal 14 and the heater 16 in order to maintain their connection, and thus would encompass formation out of an individual piece of material such as through bending of a piece of material or formation of a piece of material such as via casting, and could also encompass welding, brazing, soldering, and other such connection techniques, as well as other formation methodologies. As will be set forth in greater detail below, the conductive device 8 is formed from an individual and generally T-shaped metallic plate 70, as is indicated generally in
(11) As can be seen in
(12) As can further be seen in
(13) The circuit interrupter 4 additionally includes a thermal trip 38 having a bimetal 40, one end of which can be considered to be a fixed end 44 that is affixed via spot welding or other methodology to the end of the heater 16 opposite the terminal 14 and further includes a free end 46 opposite thereto. A woven shunt 50 is connected between the free end 44 of the bimetal 40 and the moving contact arm 34 via brazing or other appropriate connection methodology. For the sake of completeness, it is noted that the circuit interrupter 4 additionally includes a magnetic trip 52 that includes a generally U-shaped metallic core that is affixed to the heater 16 via spot welding or other appropriate connection methodology. The operation of the circuit interrupter 4 will be set forth below.
(14) As can be seen in
(15) As can be understood from
(16) As can be understood from
(17) A bend 88 is also formed in the plate 70 at the bend location 80A, such that the bend 88 is formed between the base 56 and the heater 16. It is nevertheless reiterated that despite the bend 88 between the heater 16 and the base 56, the heater 16 and the base 56 are co-formed by virtue of their formation out of the individual metallic plate 70 and the bend 88 applied at the bend location 80A.
(18) By causing the heater 16 and the base 56 to be co-formed as set forth above, the electrical connection between the heater 16 and the terminal 14 is highly reliable, and the electrical resistance properties of the heater apparatus 2 between the base 56 and the free end of the heater 16 opposite the base 56 are highly predictable. In order to cause the heater 16 to generate a predetermined amount of I.sup.2R heat during operation of the circuit interrupter 4 when current flows through the heater 16, the heater 16 can be configured to include a cut region 92 (
(19) Advantageously, since the heater 16 and the base 56 are co-formed with one another, the electrical resistance characteristics of the connection between the heater 16 and the base 56, i.e., the bend 88, are highly predictable. The electrical resistance characteristics of the heater 16 between the base 56 and its free end are similarly highly predictable, and the cut region 92 can be formed in the heater 16 with a likewise highly predictable resistance result. Such predictability advantageously avoids the need for individual calibration of each such heater apparatus 2, which reduces cost.
(20) In use, I.sup.2R heat generated at the cut region 92 and elsewhere in the heater 16 is thermally communicated to the bimetal 40, and such communicated I.sup.2R heat enhances deflection of the bimetal 40 in response to prolonged current flowing through the circuit interrupter 4. Once the deflection of the bimetal 40 reaches a predetermined amount, the thermal trip 38 causes the operating mechanism to move the moving contact arm 34 from its ON condition depicted schematically in
(21) While numerous formation methodologies can be employed to form the heater apparatus 2 depicted generally in
(22) A heater apparatus 102 in accordance with a second embodiment of the disclosed and claimed concept is depicted generally in
(23) As is understood from
(24) While specific embodiments of the invention have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of invention which is to be given the full breadth of the claims appended and any and all equivalents thereof.