Tape drive with metal oxide interface between tape and tape head
10056097 ยท 2018-08-21
Assignee
Inventors
Cpc classification
G11B15/67
PHYSICS
G11B15/00
PHYSICS
G11B5/3106
PHYSICS
International classification
G11B5/008
PHYSICS
G11B5/40
PHYSICS
G11B15/67
PHYSICS
Abstract
A tape head is provided for use with a tape drive that is configured to receive a length of tape. The tape head includes a head body including at least one head element for performing read and/or write operations on the tape, and a protective layer extending over at least a portion of the head body for inhibiting wear of the head body when the tape is moved with respect to the head body. Furthermore, the protective layer is made of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide.
Claims
1. A tape head for a tape drive receiving a tape, the tape head comprising: a head element for performing read and/or write operations on the tape; a tape-head interface for coupling the head element with the tape; and a metal oxide layer over the tape-head interface and configured to be in contact with both the tape-head interface and the tape when the tape is moved with respect to the head element.
2. The tape head of claim 1 wherein the metal oxide layer comprises titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide substantially through an entire thickness of the metal oxide layer.
3. The tape head of claim 1 wherein the metal oxide layer substantially comprises an electrically non-conductive metal oxide.
4. The tape head of claim 1 wherein the metal oxide layer is directly in contact with the tape-head interface without any intervening isolation layer between the metal oxide layer and the tape-head interface.
5. The tape head of claim 1, wherein a thickness of the metal oxide layer ranges from 4 nanometers to 25 nanometers.
6. The tape head of claim 1, wherein a thickness of the metal oxide layer is less than 20 nanometers.
7. The tape head of claim 1, wherein a thickness of the metal oxide layer is less than 15 nanometers.
8. The tape head of claim 1, wherein a thickness of the metal oxide layer is less than 10 nanometers.
9. A tape drive to perform read and/or write operations on a tape, the tape drive comprising: a tape head; wherein the tape head comprises: a head element for performing read and/or write operations on the tape; a tape-head interface for coupling the head element with the tape; and a metal oxide layer over the tape-head interface and configured to be in contact with both the tape-head interface and the tape when the tape is moved with respect to the head element.
10. The tape drive of claim 9 wherein the metal oxide layer comprises titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide substantially through an entire thickness of the metal oxide layer.
11. The tape drive of claim 9 wherein the metal oxide layer substantially comprises an electrically non-conductive metal oxide.
12. The tape drive of claim 9 wherein the metal oxide layer is directly in contact with the tape-head interface without any intervening isolation layer between the metal oxide layer and the tape-head interface.
13. The tape drive of claim 9, wherein a thickness of the metal oxide layer ranges from 4 nanometers to 25 nanometers.
14. The tape drive of claim 9, wherein a thickness of the metal oxide layer is less than 20 nanometers.
15. The tape drive of claim 9, wherein a thickness of the metal oxide layer is less than 15 nanometers.
16. The tape drive of claim 9, wherein a thickness of the metal oxide layer is less than 10 nanometers.
17. A tape head for a tape drive comprising: a head body including at least one head element for performing read and/or write operations on a tape; and a protective layer disposed directly on an exposed portion of the head body to inhibit wear of the head body when the tape is moved with respect to the head body, wherein the protective layer consists of metal oxide substantially throughout a thickness of the protective layer.
18. The tape head of claim 17 wherein the protective layer comprises a thickness substantially consisting of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide.
19. The tape head of claim 17 wherein the protective layer comprises a substantially electrically non-conductive metal oxide.
20. The tape head of claim 17 wherein the thickness of the protective layer ranges from 4 nanometers to 25 nanometers.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(6) As required, detailed embodiments are disclosed herein. It is to be understood, however, that the disclosed embodiments are merely exemplary and that various and alternative forms may be employed. The figures are not necessarily to scale. Some features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art.
(7)
(8) Referring to
(9) The device region 30 shown in
(10) As further shown in
(11) The protective layer 38 may be made of a material selected from the group consisting of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide and zinc oxide. Furthermore, the protective layer 38 may be formed in any suitable manner (e.g., by any suitable method). For example, after the head body 28 has been fabricated in any suitable manner, a layer of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide may be applied directly on the head body 29 by any suitable application technique. As a more detailed example, a layer of any of the above materials may be applied by one or more of sputtering, atomic layer deposition (ALD), chemical vapor deposition (CVD), or pulsed laser deposition (PLD). Because each of the above materials is electrically non-conductive, no isolation layer is needed between the head body 29 and the protective layer 38.
(12) As another example, a layer of material selected from the group consisting of titanium, chromium, zirconium, aluminum and zinc may be applied directly on the head body 29 in any suitable manner, and then the layer of material may be oxidized in any suitable manner to form the protective layer 38, such that the protective layer 38 is made of a selected one of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide. As a more detailed example, a layer of titanium, chromium, zirconium, aluminum, or zinc may be applied by one or more of the above application techniques, and then the layer may be oxidized by exposing the layer to an oxygen environment (e.g., oxygen gas, or gas mixture including oxygen) at an elevated temperature (e.g., temperature in the range of 50 C. to 150 C.) so that the entire thickness of the layer is oxidized to form the protective layer 38. Exposing the layer to an oxygen environment may include positioning the tape head 28 in a container (e.g., chamber or oven), and then introducing oxygen gas or gas mixture including oxygen through a gas line into the container. Furthermore, if the oxygen environment includes a gas mixture, the percent of oxygen may be at least 20% of the gas mixture, or at least 50% of the gas mixture, for example.
(13) As another more detailed example, the layer of titanium, chromium, zirconium, aluminum, or zinc may be exposed to an oxygen plasma to form the layer of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide. Furthermore, such exposure may occur at any suitable temperature, such as a temperature in the range of 50 C. to 300 C., or a temperature in the range of 50 C. to 150 C. The oxygen plasma can be created or formed in any suitable manner, such as by heating oxygen gas or subjecting it to a strong electromagnetic field applied with a laser or microwave to create positive or negative charged particles (i.e., ions). As another example, the oxygen plasma may be created by exposing oxygen gas at a low pressure (e.g., under a vacuum) to high power radio waves.
(14) The protective layer 38 may also have any suitable thickness. For example, the protective layer 38 may have a thickness in the range of 4 to 25 nanometers (nm). In one embodiment, the protective layer 38 may have a thickness less than 20 nm. In another embodiment, the protective layer 38 may have a thickness less than 15 nm. In yet another embodiment, the protective layer 38 may have a thickness less than 10 nm.
(15) If the protective layer 38 is formed by first applying a layer of material selected from titanium, chromium, zirconium, aluminum, or zinc to the head body 29 and then oxidizing the layer of material, the thickness of the layer of material may be less than the above values, since the layer of material may expand during the oxidizing step. For example, the layer of material deposited on the head body 29 may have a thickness in the range of 2 to 20 nm. In one embodiment, the layer of material may have a thickness less than 15 nm. In another embodiment, the layer of material may have a thickness less than 10 nm. In yet another embodiment, the layer of material may have a thickness less than 6 nm. Thus, the steps of applying the layer of material and oxidizing the layer of material may be performed such that the resulting protective layer 38 (e.g., layer of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide) has a thickness in the range of 4 to 25 nm, or less than 20 nm, or less than 15 nm, or less than 10 nm.
(16) As mentioned above, the protective layer 38 may inhibit or prevent wear of the head body 29, and specifically the device region 30, when the tape 12 is moved over the tape head 28 and contacts the tape head 28. In the embodiment shown in
(17) Furthermore, because the protective layer 38 is electrically non-conductive, as mentioned above, the overall thickness of the protective layer 38 may be reduced compared to prior coatings that include a wear protection layer and an isolation layer positioned between a head body and the wear protection layer. As a result, magnetic spacing between the surface 40 of the device region 30 and the tape 12 may be reduced compared to prior tape heads. In addition, due to isolation improvement, yield loss may be reduced by about 6% compared to prior coatings that include a conductive layer.
(18) In the embodiment shown in
(19) For comparison purposes,
(20) Aspects of the subject matter described herein are set out in the following numbered clauses:
(21) 1. A tape head for a tape drive that is configured to receive a length of tape, the tape head comprising:
(22) a head body including at least one head element for performing read and/or write operations on the tape; and
(23) a protective layer extending over at least a portion of the head body for inhibiting wear of the head body when the tape is moved with respect to the head body, the protective layer being made of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide.
(24) 2. The tape head of clauses 1 wherein the head body includes a device region positioned between two head bulk material regions, the device region comprises the at least one head element, and the protective layer extends at least partially over the device region.
(25) 3. The tape head of clause 2 wherein the protective layer is disposed directly on the device region.
(26) 4. The tape head of clause 2 or clause 3 wherein the protective layer is made of titanium oxide.
(27) 5. The tape head of any one of clauses 2 to 4 wherein the protective layer has a thickness less than 20 nanometers.
(28) 6. The tape head of clause wherein the protective layer is disposed directly on the device region.
(29) 7. A tape drive for use with tape, the tape drive comprising:
(30) a drive body; and
(31) a tape head according to clause 1 supported on the drive body.
(32) 8. The tape drive of clause 7 wherein the head body includes a device region positioned between two head bulk material regions, the device region comprises the at least one head element, and the protective layer extends at least partially over the device region.
(33) 9. The tape drive of clause 8 wherein the protective layer is disposed directly on the device region and comprises titanium oxide.
(34) 10. The tape drive of clause 9 wherein the protective layer has a thickness less than 20 nanometers.
(35) 11. A method for making a tape head for a tape drive that is configured to receive a length of tape, the method comprising:
(36) applying a layer of material directly onto at least a portion of a head body that includes at least one head element for performing read and/or write operations on the tape, the layer of material being one of titanium, chromium, zirconium, aluminum, or zinc; and
(37) oxidizing the layer of material to form a protective layer, the protective layer being one of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide.
(38) 12. The method of clause 11 wherein the applying and oxidizing steps are performed such that the protective layer has a thickness less than 20 nanometers.
(39) 13. The method of clause 11 or clause 12 wherein the applying is performed such that the protective layer has a thickness less than 15 nanometers.
(40) 14. The method of any one of clauses 11 to 13 wherein the oxidizing comprises exposing the layer of material to an oxygen plasma.
(41) 15. The method of any one of clauses 11 to 14 wherein the oxidizing comprises exposing the layer of material to an environment comprising oxygen.
(42) 16. The method of any one of clauses 11 to 15 wherein the oxidizing comprises exposing the layer of material to a temperature in the range of 50 to 300 C.
(43) 17. The method of any one of clauses 11 to 16 wherein the head body includes a device region positioned between two head bulk material regions, and the device region comprises the at least one head element, wherein the applying is performed such that the layer of material extends at least partially over the device region, and wherein the layer of material comprises titanium oxide.
(44) 18. A method for making a tape head for a tape drive that is configured to receive a length of tape, the method comprising:
(45) applying a protective layer onto at least a portion of a head body that includes at least one head element for performing read and/or write operations on the tape, the protective layer being made of titanium oxide, chromium oxide, zirconium oxide, aluminum oxide, or zinc oxide.
(46) 19. The method of clause 18 wherein the applying is performed by one or more of sputtering, atomic layer deposition, chemical vapor deposition, or pulsed laser deposition.
(47) 20. The method of clause 18 or clause 19 wherein the head body includes a device region positioned between two head bulk material regions, and the device region comprises the at least one head element, wherein the applying is performed such that the protective layer is applied directly on the device region, and wherein the protective layer is made of titanium oxide.
(48) While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention. Additionally, the features of various implementing embodiments may be combined to form further embodiments of the invention.