COMBINED WAFER PRODUCTION METHOD WITH A MULTI-COMPONENT RECEIVING LAYER

Abstract

The present invention relates to a method for producing solid body layers. The claimed method comprises at least the following steps: providing a solid body (2) for separating at least one solid body layer (4), arranging a receiving layer (10) on the solid body for holding the solid body layer (4), said receiving layer being made of at least one polymer and an additional material, said receiving layer, in terms of volume, be made mainly of polymer, the additional material having a greater conductivity than the polymer, and the receiving layer (10) is subjected to thermal stress, in particular, mechanical stress, for generating voltages in the solid body (2), wherein a crack in the solid body (2) along a separation plane (8) expands due to the voltages, the solid layer (4) being separated from the solid body (2) due to the crack.

Claims

1. Method for producing solid body layers, comprising at least the steps: providing a solid body (2) for separating at least one solid body layer (4), arranging a receiving layer (10) on the solid body (2) to hold the solid body layer (4), wherein the receiving layer consists of at least one polymer and one further material, wherein the further material has greater thermal conductivity than the polymer, subjecting the receiving layer (10) to thermal stress to generate stresses, particularly mechanically, in the solid body (2), w wherein a crack in the solid body (2) spreads along a separation plane (8) wherein solid body layer (4) is separated from the solid body (2) by a crack.

2. Method according to claim 1, characterised in that the further material is applied to the polymer as a coating, or the polymer is applied to the further material as a coating.

3. Method according to claim 1 or claim 2, characterised in that the coating has local weak points, in particular it is broken to follow a deformation that is created through the polymer when the stress is generated.

4. Method according to any one of the preceding claims, characterised in that the thermal conductivity (W/(m*K)) of the further material is more than 5 times greater, preferably more than 10 mal greater and particularly preferably more than 30, more than 100, more than 200 or more than 300 times greater than that of the polymer, wherein the further material is preferably a metal or an alloy.

5. Method according to any one of the preceding claims, characterised in that the further material is provided in the form of elongated shavings particularly splinter-like elements inside a layer structure defined by the polymer, wherein the elements, particularly the shavings are preferably aligned such that the longitudinal axes thereof extend orthogonally to the direction of the layer extension.

6. Method according to any one of the preceding claims, characterised in that the receiving layer has a plurality of holes, wherein the holes are filled or lined with the dem further material.

7. Method according to any one of the preceding claims, characterised in that the holes have a diameter of less than 1 mm, preferably less than 0.5 mm and particularly preferably less than 0.1 mm.

8. Method according to claim 7, characterised in that the receiving layer has more than 10 holes (36), preferably more than 100 holes (36) and particularly preferably more than 1000 holes (36).

9. Method according to any one of the preceding claims, characterised in that at least one further hole (36) is formed in a radius of less than 50 mm, preferably less than 25 mm and particularly preferably less than 5 mm about the centre of each hole (36).

10. Method according to any one of the preceding claims, characterised in that in order to separate the receiving layer (10) from the solid body (2) or from the solid body layer (4), a fluid, particularly a liquid can be passed through the holes (36) in a connecting layer (11), via which the receiving layer (10) is fixed on the solid body (2) or on the solid body layer (4), wherein the fluid has the effect of weakening or breaking down the fixing of the receiving layer (10) on the solid body (2) or on the solid body layer (4).

11. Method according to any one of the preceding claims, characterised in that faults are created in the inner structure of the solid body (2) to define the separation plane by means of at least one radiation source (18), particularly a laser, particularly a femtosecond laser, before or after the receiving layer (10) is positioned on the solid body (2).

12. Wafer, produced in accordance with a method according to any one of claims 1 to 11.

13. Film (10) for generating stresses in a solid body, wherein the film (10) is made from at least one polymer material, particularly PDMS, and from one further material, wherein most of the film measured by volume and/or by mass consists of the polymer material, wherein the further material has greater thermal conductivity than the polymer material, wherein the polymer material preferably undergoes glass transition at a temperature lower than 0 C., particularly at a temperature lower than 50 C.

14. Use of a film according to claim 13 as a receiving layer (10) in a method according to claim 1.

Description

[0034] In the drawing:

[0035] FIG. 1a is a schematic representation of an apparatus for generating local stresses in a solid body;

[0036] FIG. 1b is a schematic representation of a layer arrangement before a solid body layer is separated from a solid body;

[0037] FIG. 1c is a schematic representation of a layer arrangement after a solid body layer is separated from a solid body;

[0038] FIG. 2a is a receiving layer according to the invention;

[0039] FIG. 2b is a receiving layer according to the invention which is arranged on a solid body;

[0040] FIG. 2c is a second receiving layer according to the invention which is arranged on a solid body;

[0041] FIG. 2d is a third receiving layer according to the invention which is arranged on a solid body; and

[0042] FIG. 2e is a fourth receiving layer according to the invention which is arranged on a solid body.

[0043] FIG. 1a shows a workpiece 2 and a substrate arranged in the area of a radiation source 18, particularly a laser, particularly a femtosecond laser (fs-laser). Workpiece 2 preferably has a first, particularly flat, surface portion and a second, particularly flat surface portion 16, wherein the first flat surface portion 14 is preferably aligned substantially or exactly parallel to the second flat surface portion 16. The first flat surface portion 14 and the second flat surface portion 16 preferably delimit workpiece 2 in a Y-direction, which is preferably aligned vertically or perpendicularly. The flat surface portions 14 and 16 preferably each extend in an X-Z plane, wherein the X-Z plane is preferably horizontal. In addition, it may be seen in this representation that radiation source 18 emits beams 6 at workpiece 2 at the same time or with a temporal offset. Beams 6 penetrate to a defined depth in workpiece 2 depending on the configuration, and create local stresses at the respective position or at a predetermined position.

[0044] FIG. 1b shows a multi-layer arrangement, wherein workpiece contains crack guide layer 8 and is provided with a holding layer 12 in the area of the first flat surface portion 14, which layer is itself preferably covered by another layer 20, wherein the further layer 20 is preferably a stabilisation device, particularly a metal plate. Preferably a polymer layer 10 is arranged on the second flat surface portion 16 of workpiece 2. The receiving layer and polymer layer 10 and/or the holding layer 12 are preferably at least partially and particularly preferable entirely made from PDMS, and particularly preferably are furnished with a plurality of holes, particularly blind holes and/or passthrough holes.

[0045] FIG. 1c shows a state after a crack has been initiated and subsequent crack guidance. Solid body layer 4 adheres to polymer layer 10 and is or can be separated from the remaining residue on the workpiece 2.

[0046] FIG. 2a shows a receiving layer 10 or film according to the invention for creating stress in a solid body 2. The film preferably includes at least one polymer material, particularly PDMS, wherein the polymer material preferably undergoes glass transition at a temperature below 20 C., particularly below 10 C., particularly below 0 C., particularly at a temperature below 50 C. The film is particularly preferably furnished with a plurality of holes 36 to allow liquid to pass, wherein the holes 36 each have a diameter smaller than 5 mm.

[0047] FIG. 2b shows a solid body layer 4 separated from a solid body 2. A receiving layer 10 or film 10 is still arranged on solid body layer 4, via which the stresses needed to create a crack for separating solid body layer 4 vom solid body 2 were generated. Receiving layer 10 is furnished with a plurality of holes to allow a liquid to pass, wherein receiving layer 10 is affixed on solid body layer 4 via a connecting layer 11.

[0048] FIG. 2c shows a further receiving layer 10 or film according to the invention, which also is or can be arranged on solid body 2 by means of a connecting layer 11. Receiving layer 10 or the multi-component receiving layer preferably has a first material component 39, particularly a polymer component, and a second material component 40, particularly a metal component. The second material component 40 preferably represents a coating of the first material component 39 is serves particularly preferably for accelerated cooling of the first material component 39. Receiving layer 10 is preferably exposed to cold, particularly liquid nitrogen from direction 38, which has the effect of cooling second material component 40 rapidly, and particularly due to its direct contact with first material component 39 this too is cooled very rapidly.

[0049] FIG. 2d shows a further variant of receiving layer 10 or film according to the invention, which in this case too is formed by first material component 39 and second material component 40. First material component 39 is preferably provided with holes 36, which are filled in by the second material component 40. Second material component 40 preferably coats the top of first material component 39 alternatively or additionally, that is to say parallel to connecting layer 11.

[0050] FIG. 2e shows still another variant of receiving layer 10 or film according to the invention, which is again formed by first material component 39 and second material component 40. First material component 39 is preferably furnished with holes 36, which are lined by second material component 40, that is to say the wall that delimits the respective hole 36 is coated with the second material component 40. Second material component 40 preferably coats the top of first material component 39 additionally or alternatively, that is to say parallel to connecting layer 11.

[0051] It is further preferably conceivable that the method for producing solid body layers comprises at least the following steps: providing a solid body 2 for separating at least one solid body layer 4, arranging a receiving layer 10 on the solid body 2 for holding the solid body layer 4, wherein the receiving layer consists of at least one polymer and one further material, wherein the receiving layer 10, preferably in terms of volume or mass preferably consists mainly of polymer, wherein the further material has greater thermal conductivity than the polymer, subjecting the receiving layer to thermal stress to generate stresses in the solid body 2, particularly mechanically, wherein a crack in the solid body 2 spreads along a separation plane 8 due to the stresses, wherein the solid body layer 4 is separated from the solid body 2 by the crack.

[0052] The film according to the invention for creating stress in a solid body preferably contains at least one polymer material, particularly PDMS, wherein the polymer material preferably undergoes glass transition at a temperature below 0 C., particularly bat a temperature below 50 C. The film particularly preferably has a plurality of holes for directing a liquid, wherein the holes each have a diameter smaller than 5 mm.

LIST OF REFERENCE SIGNS

[0053] 2 Workpiece [0054] 3 Substrate [0055] 4 Solid body layer [0056] 5 Sacrificial layer [0057] 6 Radiation [0058] 8 Crack guidance layer [0059] 10 Receiving layer/film [0060] 11 Connecting layer [0061] 12 Holding layer [0062] 14 First flat surface portion [0063] 16 Second flat surface portion [0064] 18 Radiation source/Fault generation device [0065] 20 Stabilisation device [0066] 36 Hole [0067] 38 Cold thermal load [0068] 39 First material portion [0069] 40 Second material portion [0070] X First direction [0071] Y Second direction [0072] Z Third direction