DRIVE SIGNAL MODULATION METHOD OF MODULAR MULTILEVEL CONVERTER AND FAULT ISOLATION METHOD

Abstract

Disclosed are a modulation method of a modular multilevel converter and a fault isolation method of a submodule unit. The modulation method comprises a first mode and a second mode, and the first mode and the second mode operate cyclically. In the first mode, a first power semiconductor switch and a second power semiconductor switch are turned on alternately, while a third power semiconductor switch is turned off normally and a fourth power semiconductor switch is turned on normally. In the second mode, the third power semiconductor switch and the fourth power semiconductor switch are turned on alternately, while the first power semiconductor switch is turned on normally and the second power semiconductor switch is turned off normally. The method enables junction temperatures of the power semiconductor switches used to be equalized, increases an operation safety margin of the converter, effectively increase the capacity of the converter without increasing engineering costs, and achieve better performance in both economic efficiency and technicality.

Claims

1. A drive signal modulation method of a modular multilevel converter, the modular multilevel converter comprising at least one bridge arm, the bridge arm comprising at least one full-bridge submodule unit, the full-bridge submodule unit comprising a first power semiconductor switch, a second power semiconductor switch, a third power semiconductor switch and a fourth power semiconductor switch, comprising: the full-bridge submodule unit operates in two alternate operation modes, designated a first mode and a second mode; firstly enters the first mode, then enters the second mode, re-enters the first mode and so on; or firstly enters the second mode, then enters the first mode, re-enters the second mode and so on; in the first mode, an alternate drive signal is applied to the first power semiconductor switch and the second power semiconductor switch, such that the first power semiconductor switch and the second power semiconductor switch are turned on alternately in the same time sequence, while a complementary drive signal is applied to the third power semiconductor switch and the fourth power semiconductor switch, such that the third power semiconductor switch remains in an off state and the fourth power semiconductor switch remains in an on state in the time sequence of the alternate turning-on of the first power semiconductor switch and the second power semiconductor switch; and in the second mode, an alternate drive signal is applied to the third power semiconductor switch and the fourth power semiconductor switch, such that the third power semiconductor switch and the fourth power semiconductor switch are turned on alternately in the same time sequence, while a complementary drive signal is applied to the first power semiconductor switch and the second power semiconductor switch, such that the first power semiconductor switch remains in an on state and the second power semiconductor switch remains in an off state in the time sequence of the alternate turning-on of the third power semiconductor switch and the fourth power semiconductor switch.

2. The drive signal modulation method of a modular multilevel converter of claim 1, wherein the first power semiconductor switch comprises a switching transistor T1 and a freewheel diode D1 in anti-parallel with the switching transistor T1; the second power semiconductor switch comprises a switching transistor T2 and a freewheel diode D2 in anti-parallel with the switching transistor T2; the third power semiconductor switch comprises a switching transistor T3 and a freewheel diode D3 in anti-parallel with the switching transistor T3; and the fourth power semiconductor switch comprises a switching transistor T4 and a freewheel diode D4 in anti-parallel with the switching transistor T4.

3. The drive signal modulation method of a modular multilevel converter of claim 1, wherein each of the switching transistors T1, T2, T3, and T4 assumes an IGBT, an IGCT, a GTO, or a MOSFET.

4. The drive signal modulation method of a modular multilevel converter of claim 2, comprising the following steps: 1) a capacitor discharge state in the first mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the switching transistors T1 and T4 are turned on and an energy storage element C1 is discharged, at a forward current; 2) a forward bypass state in the first mode: an on-signal is applied to the switching transistors T2 and T4, an off-signal is applied to the switching transistors T1 and T3, and the freewheel diode D2 and the switching transistor T4 are turned on and the full-bridge submodule unit is bypassed, at a forward current; 3) a capacitor discharge state in the first mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the freewheel diodes D1 and D4 are turned on and the energy storage element C1 is charged, at a reverse current; 4) a reverse bypass state in the first mode: an on-signal is applied to the switching transistors T2 and T4, an off-signal is applied to the switching transistors T1 and T3, and the switching transistor T2 and the freewheel diode D4 are turned on and the full-bridge submodule unit is bypassed, at a reverse current; 5) capacitor discharge state in the second mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the switching transistors T1 and T4 are turned on and the energy storage element C1 is discharged, at a forward current; 6) a forward bypass state in the second mode: an on-signal is applied to the switching transistors T1 and T3, an off-signal is applied to the switching transistors T2 and T4, and the switching transistor T1 and the freewheel diode D3 are turned on and the full-bridge submodule unit is bypassed, at a forward current; 7) a capacitor discharge state in the second mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the freewheel diodes D1 and D4 are turned on and the energy storage element C1 is charged, at a reverse current; and 8) a reverse bypass state in the second mode: an on-signal is applied to the switching transistors T1 and T3, an off-signal is applied to the switching transistors T2 and T4, and the freewheel diode D1 and the switching transistor T3 are turned on and the full-bridge submodule unit is bypassed, at a reverse current.

5. A fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit, comprising: when the drive signal modulation method of a modular multilevel converter of claim 1 is used to perform modulation, if a second power semiconductor switch or a third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch or the third power semiconductor switch breaks down, the broken-down power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stop running.

6. The drive signal modulation method of a modular multilevel converter of claim 2, wherein each of the switching transistors T1, T2, T3, and T4 assumes an IGBT, an IGCT, a GTO, or a MOSFET.

7. A fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit, comprising: when the drive signal modulation method of a modular multilevel converter of claim 2 is used to perform modulation, if a second power semiconductor switch or a third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch or the third power semiconductor switch breaks down, the broken-down power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stop running.

8. A fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit, comprising: when the drive signal modulation method of a modular multilevel converter of claim 3 is used to perform modulation, if a second power semiconductor switch or a third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch or the third power semiconductor switch breaks down, the broken-down power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stop running.

9. A fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit, comprising: when the drive signal modulation method of a modular multilevel converter of claim 4 is used to perform modulation, if a second power semiconductor switch or a third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch or the third power semiconductor switch breaks down, the broken-down power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stop running.

10. A fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit, comprising: when the drive signal modulation method of a modular multilevel converter of claim 6 is used to perform modulation, if a second power semiconductor switch or a third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch or the third power semiconductor switch breaks down, the broken-down power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stop running.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0026] FIG. 1 is a topology of a modular multilevel converter according to the present invention.

[0027] FIG. 2 is a schematic diagram of various operating conditions of a full-bridge submodule unit at a stage 1 according to the present invention: (a) forward current discharge loop; (b) forward current bypass loop; (c) reverse current charge loop; and (d) reverse current bypass loop.

[0028] FIG. 3 is a schematic diagram of various operating conditions of a full-bridge submodule unit at a stage 2 according to the present invention: (a) forward current discharge loop; (b) forward current bypass loop; (c) reverse current charge loop; and (d) reverse current bypass loop.

DESCRIPTION OF THE EMBODIMENTS

[0029] Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

Embodiment 1

[0030] Referring to FIGS. 1, 2 and 3, shown is a drive signal modulation method of a modular multilevel converter, the modular multilevel converter including at least one bridge arm, specifically six bridge arms in the present embodiment, the bridge arm including at least one full-bridge submodule unit, the full-bridge submodule unit including a first power semiconductor switch, a second power semiconductor switch, a third power semiconductor switch and a fourth power semiconductor switch, wherein the drive signal modulation method includes a first mode and a second mode; the full-bridge submodule unit firstly enters the first mode, then enters the second mode, re-enters the first mode and so on, or firstly enters the second mode, then enters the first mode, re-enters the second mode and so on;

[0031] in the first mode, an alternate drive signal is applied to the first power semiconductor switch and the second power semiconductor switch, such that the first power semiconductor switch and the second power semiconductor switch are turned on alternately in the same time sequence, while a complementary drive signal is applied to the third power semiconductor switch and the fourth power semiconductor switch, such that the third power semiconductor switch is turned off normally and the fourth power semiconductor switch is turned on normally; and

[0032] in the second mode, the alternate drive signal is applied to the third power semiconductor switch and the fourth power semiconductor switch, such that the third power semiconductor switch and the fourth power semiconductor switch are turned on alternately in the same time sequence, while the complementary drive signal is applied to the first power semiconductor switch and the second power semiconductor switch, such that the first power semiconductor switch is turned on normally and the fourth power semiconductor switch is turned off normally.

[0033] As a preferred embodiment, the first power semiconductor switch includes a switching transistor T1 and a freewheel diode D1 in anti-parallel with the switching transistor T1, the second power semiconductor switch includes a switching transistor T2 and a freewheel diode D2 in anti-parallel with the switching transistor T2, the third power semiconductor switch includes a switching transistor T3 and a freewheel diode D3 in anti-parallel with the switching transistor T3, and the fourth power semiconductor switch includes a switching transistor T4 and a freewheel diode D4 in anti-parallel with the switching transistor T4; and each of the switching transistors T1-T4 assumes an IGBT, an IGCT, a GTO, or a MOSFET.

[0034] Further, the drive signal modulation method of a modular multilevel converter includes the following steps:

[0035] 1) a capacitor discharge state in the first mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the switching transistors T1 and T4 are turned on and an energy storage element C1 is discharged, at a forward current, as shown in FIG. 2a;

[0036] 2) a forward bypass state in the first mode: an on-signal is applied to the switching transistors T2 and T4, an off-signal is applied to the switching transistors T1 and T3, and the freewheel diode D2 and the switching transistor T4 are turned on and the full-bridge submodule unit is bypassed, at a forward current, as shown in FIG. 2b;

[0037] 3) a capacitor discharge state in the first mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the freewheel diodes D1 and D4 are turned on and the energy storage element C1 is charged, at a reverse current, as shown in FIG. 2c;

[0038] 4) a reverse bypass state in the first mode: an on-signal is applied to the switching transistors T2 and T4, an off-signal is applied to the switching transistors T1 and T3, and the switching transistor T2 and the freewheel diode D4 are turned on and the full-bridge submodule unit is bypassed, at a reverse current, as shown in FIG. 2d;

[0039] 5) a capacitor discharge state in the second mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the switching transistors T1 and T4 are turned on and the energy storage element C1 is discharged, at a forward current, as shown in FIG. 3a;

[0040] 6) a forward bypass state in the second mode: an on-signal is applied to the switching transistors T1 and T3, an off-signal is applied to the switching transistors T2 and T4, and the switching transistor T1 and the freewheel diode D3 are turned on and the full-bridge submodule unit is bypassed, at a forward current, as shown in FIG. 3b;

[0041] 7) a capacitor discharge state in the second mode: an on-signal is applied to the switching transistors T1 and T4, an off-signal is applied to the switching transistors T2 and T3, and the freewheel diodes D1 and D4 are turned on and the energy storage element C1 is charged, at a reverse current, as shown in FIG. 3c; and

[0042] 8) a reverse bypass state in the second mode: an on-signal is applied to the switching transistors T1 and T3, an off-signal is applied to the switching transistors T2 and T4, and the freewheel diode D1 and the switching transistor T3 are turned on and the full-bridge submodule unit is bypassed, at a reverse current, as shown in FIG. 3d.

Embodiment 2

[0043] The present embodiment provides a fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit. When the drive signal modulation method of a modular multilevel converter in the embodiment 1 is used to perform modulation, if the second power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the second power semiconductor switch breaks down, the broken-down second power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stopping running and operates in the second mode, as shown in FIG. 3.

Embodiment 3

[0044] The present embodiment provides a fault isolation method of a submodule unit, the submodule unit being a full-bridge submodule unit. When the drive signal modulation method of a modular multilevel converter described in the embodiment 1 is used to perform modulation, if the third power semiconductor switch in the full-bridge submodule unit breaks down or if a drive circuit of the third power semiconductor switch breaks down, the broken-down third power semiconductor switch is isolated by changing the mode of the drive signal modulation, while the full-bridge submodule unit does not stopping running and operates in the first mode, as shown in FIG. 2.

[0045] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.