ADSORBENT FOR A TEMPERATURE SWING ADSORPTION METHOD
20180214817 ยท 2018-08-02
Assignee
Inventors
Cpc classification
B01D2253/30
PERFORMING OPERATIONS; TRANSPORTING
B01D53/0407
PERFORMING OPERATIONS; TRANSPORTING
B01D53/0462
PERFORMING OPERATIONS; TRANSPORTING
B01J20/28004
PERFORMING OPERATIONS; TRANSPORTING
B01J20/28021
PERFORMING OPERATIONS; TRANSPORTING
B01D2253/25
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
The invention relates to a device for adsorbing at least one component from a gas mixture by temperature swing adsorption, comprising a through-flow chamber (7) and a cooling chamber (8) for accommodating a heat transfer fluid, wherein the through-flow chamber (7) is separated from the cooling chamber (8), wherein the through-flow chamber (7) has an adsorbent (1) which contains a plurality of (two or more) adsorbent bodies containing a porous and adsorptively additive first material (3) and a second material (4) having better thermal conductivity as compared to the first material (3) and wherein the first material (3) is at least partly surrounded by the second material (4).
Claims
1. Device for adsorbing at least one component from a gas mixture by temperature swing adsorption, comprising a through-flow chamber (7) and a cooling chamber (8) for accommodating a heat transfer fluid, wherein the through-flow chamber (7) is separated from the cooling chamber (8) by an impermeable, thermally conductive wall (9), wherein the through-flow chamber (7) is at least partially surrounded by the cooling chamber (8), wherein the through-flow chamber (7) contains an adsorbent (1) which includes a plurality of adsorbent bodies, wherein each adsorbent body contains a porous and adsorptively active first material (3) and a second material (4) which has better thermal conductivity than the first material (3), wherein the first material (3) is at least partially surrounded by the second material (4), characterised in that the first (3) and the second material (4) are permanently bonded.
2. Device according to claim 1, characterised in that the first material (3) is completely surrounded by the second material (4).
3. Device according to claim 1, characterised in that the first material and the second material are permanently bonded on the molecular level.
4. Device according to claim 1, characterised in that the second material (4) is physically coated on the surface of the first material (3).
5. Device according to claim 1, characterised in that the second material (4) is permeable for a substance that is to be adsorbed.
6. Device according to claim 1, characterised in that the impermeable, thermally conductive wall (9) delimits the through-flow chamber (7).
7. Device according to claim 1, characterised in that the adsorbent bodies (2) are arranged in the through-flow chamber (7) in such manner that the second materials (4) of adjacent adsorbent bodies (2) touch each other.
8. Device according to claim 1, characterised in that the adsorbent bodies (2) are arranged and/or fixed inside the through-flow chamber (7) so that they are at least partly or entirely regulated.
9. Device according to claim 1, characterised in that the adsorbent bodies (2) are constructed as one of the following body types: bead; extrusion body; and/or hollow body, particularly a tube or hollow fibre.
10. Device according to claim 1, characterised in that the equivalent diameter of the adsorbent bodies is larger than 0.5 mm and smaller than 30 mm, preferably larger than 1 mm and smaller than 20 mm.
11. Device according to claim 9, characterised in that the adsorbent body is conformed as a tube or hollow fibre, and that the cross-sectional diameter of the tubular or hollow fibre adsorbent bodies is larger than 0.5 mm and smaller than 30 mm, preferably larger than 1 mm and smaller than 20 mm.
12. Device according to claim 9, characterised in that the adsorbent body has the form or a tube or hollow fibre, and that a cavity is delimited by the first material inside the absorbent body, wherein the first material is located between the cavity and the second material.
13. Device for adsorbing at least one component from a gas mixture by temperature swing adsorption, comprising a through-flow chamber (7) and a cooling chamber (8) for accommodating a heat transfer fluid, wherein the through-flow chamber (7) is separated from the cooling chamber (8) by an impermeable, thermally conductive wall (9), wherein the through-flow chamber (7) is at least partially surrounded by the cooling chamber (8), wherein the through-flow chamber (7) contains an adsorbent (1) which includes a plurality of adsorbent bodies, wherein each adsorbent body contains a porous and adsorptively active first material (3) and a second material (4) which has better thermal conductivity than the first material (3), wherein the first material (3) is at least partially surrounded by the second material (4), wherein the first (3) and the second material (4) are permanently bonded, characterised in that the adsorbent body is used.
Description
[0031] In the following text the invention described above will be explained in detail in the context of the relevant technical background with reference to the associated drawings, which show preferred variants thereof. The invention is in no way limited by the purely schematic drawings, and it should be noted that the drawings are not based on a consistent scale and are not suitable for specifying size relationships. The drawings show, in
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[0039] It is noteworthy that direct contact between the adsorbent bodies 2 with each other forms a conductive structure via which a temperature swing of adsorbent 1 can be accelerated. The heat in adsorbent 1 is distributed more evenly by the touching outer surfaces of the beads, that is to say the second material.
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LIST OF REFERENCE SIGNS
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TABLE-US-00001 1 Adsorbent 2 Adsorbent body 3 First material 4 Second Material 5 Outer surface 6 Temperature swing adsorber 7 Through-flow chamber 8 Cooling chamber 9 Wall 10 Cavity