EXFOLIATION PROCESS FOR REMOVAL OF DEPOSITED MATERIALS FROM MASKS CARRIERS, AND DEPOSITION TOOL COMPONENTS
20180216225 ยท 2018-08-02
Inventors
Cpc classification
C23C16/4412
CHEMISTRY; METALLURGY
B08B3/045
PERFORMING OPERATIONS; TRANSPORTING
B08B3/12
PERFORMING OPERATIONS; TRANSPORTING
C23C16/4407
CHEMISTRY; METALLURGY
C23C16/4404
CHEMISTRY; METALLURGY
International classification
C23C14/56
CHEMISTRY; METALLURGY
B08B3/04
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for exfoliation of deposited material off a work piece may comprise: immersing the work piece in an ultrasonic bath and applying ultrasonic energy, wherein the ultrasonic bath contains a fluid either held at a constant temperature within the range from greater than room temperature to less than the fluid boiling point, or the fluid is cycled over a T chosen within the range between room temperature and less than the fluid boiling point, wherein the temperature is chosen to provide a significant CTE mismatch between the layer and the work piece in order to promote exfoliation of the layer off the work piece, and wherein process time in the ultrasonic bath is within a range from several seconds up to 120 minutes for loosening the layer; cleaning the work piece by rinsing with liquids; and drying the work piece. A system is described for running the exfoliation process.
Claims
1. A method for exfoliation of deposited material off one or more work pieces such as masks, carriers, and other material deposition system components, comprising: providing a work piece with a layer of deposited material coating the surface of said work piece; immersing said work piece in an ultrasonic bath and applying ultrasonic energy to said work piece, wherein said ultrasonic bath contains a fluid and said fluid is held at a constant temperature within the range from greater than room temperature to less than the fluid boiling point, wherein said constant temperature is chosen to provide a significant CTE (coefficient of thermal expansion) mismatch between said layer of deposited material and said work piece in order to promote exfoliation of said layer of deposited material off said work piece, and wherein process time in said ultrasonic bath is within a range from several seconds up to 120 minutes for loosening said layer of deposited material; cleaning said work piece by rinsing with liquids; and drying said work piece.
2. The method of claim 1, further comprising mechanically abrading said layer of deposited material on said work piece.
3. The method of claim 1, wherein said fluid in said bath is held at a temperature in a range from 60 C. to 80 C.
4. A method for exfoliation of deposited material off one or more work pieces such as masks, carriers, and other material deposition system components, comprising: providing a work piece with a layer of deposited material coating the surface of said work piece; immersing said work piece in an ultrasonic bath and applying ultrasonic energy to said work piece, wherein said ultrasonic bath contains a fluid and said fluid is cycled over a T chosen within the range between room temperature and less than the fluid boiling point, wherein said work piece is subject to a multiplicity of cycles over T during immersion in said ultrasonic bath, wherein said T is chosen to provide excursions through temperatures at which there is a significant CTE (coefficient of thermal expansion) mismatch between said layer of deposited material and said work piece in order to promote exfoliation of said layer of deposited material off said work piece, and wherein process time in said ultrasonic bath is within a range from several seconds up to 120 minutes for loosening said layer of deposited material; cleaning said work piece by rinsing with liquids; and drying said work piece.
5. The method of claim 4, wherein said T is less than or equal to 80 C.
6. The method of claim 4, wherein T is between 30 C. and 50 C.
7. The method of claim 4, further comprising mechanically abrading said layer of deposited material on said work piece.
8. The method of claim 1, further comprising, after said applying ultrasonic energy, scrubbing said work piece with an abrasive material for removing a majority of any remaining deposited material off said surface of said work piece.
9. The method of claim 1, further comprising, after said applying ultrasonic energy, treating said work piece with a dilute acid for assisting in removing any remaining deposited material on said surface of said work piece.
10. The method of claim 1, wherein said liquids comprise water.
11. The method of claim 1, wherein said liquids comprise an organic solvent.
12. A system for exfoliation of deposited material off one or more work pieces such as masks, carriers, and other material deposition system components, comprising: a first apparatus for automated mechanical abrading of a work piece coated with a layer of deposited material; a second apparatus for applying ultrasonic energy to said work piece in a temperature controlled fluid; a third apparatus for scrubbing said layer of deposited material on said work piece with abrasive materials; a fourth apparatus for acid treatment of any residual coating on said work piece; a fifth apparatus for cleaning said work piece using liquid rinses; and a sixth apparatus for drying said work piece.
13. The system of claim 12, wherein said system has a conveyor for moving said work piece from system to system.
14. The system of claim 12, wherein said second apparatus is configured for full immersion of said work piece in said temperature controlled fluid.
15. The system of claim 12, wherein said third apparatus is configured for scrubbing said layer of deposited material on said work piece with abrasive materials in a wet environment.
16. The method of claim 4, further comprising, after said applying ultrasonic energy, scrubbing said work piece with an abrasive material for removing a majority of any remaining deposited material off said surface of said work piece.
17. The method of claim 4, further comprising, after said applying ultrasonic energy, treating said work piece with a dilute acid for assisting in removing any remaining deposited material on said surface of said work piece.
18. The method of claim 4, wherein said liquids comprise water.
19. The method of claim 4, wherein said liquids comprise an organic solvent.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] These and other aspects and features of the present disclosure will become apparent to those ordinarily skilled in the art upon review of the following description of specific embodiments in conjunction with the accompanying figures, wherein:
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[0013]
DETAILED DESCRIPTION
[0014] Embodiments of the present disclosure will now be described in detail with reference to the drawings, which are provided as illustrative examples of the disclosure so as to enable those skilled in the art to practice the disclosure. Notably, the figures and examples below are not meant to limit the scope of the present disclosure to a single embodiment, but other embodiments are possible by way of interchange of some or all of the described or illustrated elements. Moreover, where certain elements of the present disclosure can be partially or fully implemented using known components, only those portions of such known components that are necessary for an understanding of the present disclosure will be described, and detailed descriptions of other portions of such known components will be omitted so as not to obscure the disclosure. In the present specification, an embodiment showing a singular component should not be considered limiting; rather, the disclosure is intended to encompass other embodiments including a plurality of the same component, and vice-versa, unless explicitly stated otherwise herein. Moreover, applicants do not intend for any term in the specification or claims to be ascribed an uncommon or special meaning unless explicitly set forth as such. Further, the present disclosure encompasses present and future known equivalents to the known components referred to herein by way of illustration.
[0015] Methods and equipment for removing deposited layers from deposition system work pieces, such as shadow masks, carriers, sub-carriers, other deposition system components, etc. are described herein. Work pieces from a wide variety of deposition systems, including PVD such as sputtering and evaporation, CVD such as PECVD and HWCVD, electroplating, sol-gel, ALD systems, etc., may benefit from the processes described herein. It is envisaged that a very wide range of deposited materials, including metals, semiconductors, insulators, electrolytes, organic capping layers, etc, may be removed using embodiments of the disclosed methods. The processes disclosed herein may be of benefit to a wide range of industries, including the semiconductor industry, thin film battery industry, electrochromics industry, flat panel display industry, etc. The inventors have found that the methods and equipment described herein are particularly effective for removing materials used in the TFB (thin film battery) industryfor example, LiPON and Li are readily removed from mask/subcarrier workpieces by an ultrasonic process, with the fluid in the ultrasonic bath at room temperature for Li and approximately 70 C. for UPON, as described herein, in some cases even without the need for temperature cycling of the fluid in the ultrasonic bath or mechanical processing, and LiCoO.sub.2 is readily removed by the hot ultrasonic process in combination with mechanical processing and temperature cycling of the fluid in the ultrasonic bath over a temperature range from room temperature to just below the boiling point of the fluid.
[0016] Embodiments of the processes described herein may include applying ultrasonic energy to work pieces coated with a deposited material in a temperature controlled liquid for removal of the built up deposited material from the work pieces. These processes are based on inducing interfacial stress due to CTE mismatch between the deposited layer(s) and the work piece to promote exfoliation of the deposited material during exposure to ultrasonic energy. As such, a temperature, or range of temperatures, within the operating range of the exfoliation equipment may be determined for assisting in developing bond breaking levels of interfacial stress and thus better exfoliation/delamination of the deposited layer(s)leaving very clean, dimension-unaffected work pieces for reuse.
[0017] Work pieces may be made of materials such as: ferromagnetic materials like Invar (an FeNi alloy with a very low CTE, which is commonly used as a mask material), other metals like stainless steel, ceramics such as Al.sub.2O.sub.3 and AlN, etc.
[0018] For the specific example of work pieces used in the manufacture of electrochemical devices that may benefit from the processes and equipment of the present disclosure, some typical materials that may be deposited on the work pieces and examples of the specific types of deposition systems that may be used for these depositions are provided as follows. An example of a cathode layer is a LiCoO.sub.2 layer, of an anode layer is a Li metal layer, and of an electrolyte layer is a LiPON layer. However, it is expected that a wide range of cathode materials such as LiMn.sub.2O.sub.4 and LiNiCoAlO.sub.2, V.sub.2O.sub.5, LiMnO.sub.2, Li.sub.5FeO.sub.4, NMC (NiMnCo oxide), NCA (NiCoAl oxide), LMO (Li.sub.xMnO.sub.2), LFP (Li.sub.xFePO.sub.4), LiMn spinel, etc. may be used, a wide range of anode materials such as Si, C, silicon-lithium alloys, lithium silicon sulfide, Al, Sn, etc. may be used, and a wide range of lithium-conducting electrolyte materials such as solid polymer electrolytes, LiI/Al.sub.2O.sub.3 mixtures, LLZO (LiLaZr oxide), LiSiCON, etc. may be used. Various electrically conducting materials may also be deposited, for example as anode or cathode current collector layers, including one or more of Ag, Al, Au, Ca, Cu, Co, Sn, Pd, Zn and Pt which may be alloyed and/or present in multiple layers of different materials and/or include Ti adhesion layers, etc. These materials may be deposited using deposition systems such as: PVD systems such as sputtering and evaporation systems, CVD systems, electroplating systems, sol-gel systems, etc. Other examples of vacuum deposition systems include PECVD, reactive sputtering, non-reactive sputtering, RF (radio frequency) sputtering, multi-frequency sputtering, electron beam evaporation, ion beam evaporation, thermal evaporation, ALD, etc. Other examples of non-vacuum based deposition include plasma spray, spray pyrolysis, slot die coating, screen printing, etc.
[0019]
[0020] Note that typically the stress between a deposited layer of a first material on a substrate of a second material will depend on the thickness of the first layer, consequently the CTE mismatch that may be sufficient to promote exfoliation in the ultrasonic bath will also depend on the thickness of the first layerthe thicker the first layer, the smaller the CTE mismatch can be in order to be able to exfoliate the first layer using methods according to embodiments as disclosed herein.
[0021] Note that one or more of the mechanically abrading (102), scrubbing (104) and acid treatment (105) may not necessarily need to be used as part of the exfoliation process, but are available to assist in the exfoliation of deposited layers off the work piece that otherwise may not easily be removed. For example, Li or LiPON layers coating masks/sub-carriers will typically exfoliate easily and completely without any additional mechanical treatment. For masks/sub-carriers coated with metals or LiCoO.sub.2, sand paper may be used for further cleaning after ultrasonic treatment. In addition, for thick cathode TFBs, each cathode deposition typically generates more than a 10 M thick layer of LiCoO.sub.2 on masks/subcarriers, so cleaning of LiCoO.sub.2 masks/sub-carriers may be necessary after each deposition to ensure good particle performance (lack of particle generation during subsequent use of the work piece). Due to the high stress in thick cathode layers, LiCoO.sub.2 films may start to delaminate from masks/sub-carriers after the hot ultrasonic process at about 70 C., after which a light sand paper treatment is enough to remove any LiCoO.sub.2 residuals from the masks/sub-carriers.
[0022] Furthermore, with reference to
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[0026] Although embodiments of the present disclosure have been particularly described with reference to certain embodiments thereof, it should be readily apparent to those of ordinary skill in the art that changes and modifications in the form and details may be made without departing from the spirit and scope of the disclosure.