Form-in-place conductive and waterproof colloid

Abstract

The present invention discloses a form-in-place conductive and waterproof colloid, being composed of: dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dispersant; dimethyl, methylhydrogen siloxane crosslinking agent; adhesion promoter; Pt catalyst; forming agent; hydrocarbon solvent; Nickel Graphite; thickening agent; Trimethylated silica; and inhibitor. With the implementation of the present invention, no production mold or die cutter is required to simplify the process of applying the colloid and reduce the cost of applying, and with the characteristics of being providing waterproof and dustproof capability for enclosures, providing excellent adhesion capability, providing excellent compressibility and resilience, isolating EMI and providing EMI shielding capability at the same time. Besides, the space required is small when forming or applying making the colloid suitable for applications to small or mini devices and save the cost of material and cost of implementation.

Claims

1. A form-in-place conductive and waterproof colloid, being composed of: 9%-12% by weight of a siloxane selected from the group consisting of dimethyl siloxane, dimethylvinyl-terminated siloxane, vinyl terminated polydimethylsiloxane and mixtures thereof; 12%-15% by weight of hydroxy terminated polydimethylsiloxane; 0%-0.2% by weight of dispersant; 3%-5% by weight of dimethyl methylhydrogen siloxane crosslinking agent; 0%-0.2% by weight of adhesion promoter; 0%-0.2% by weight of Pt catalyst; 1%-3% by weight of forming agent; 0%-10% by weight of hydrocarbon solvent; 50%-70% by weight of Nickel Graphite; 0%-0.2% by weight of thickening agent; 5%-10% by weight of Trimethylated silica; and 0%-0.1% by weight of inhibitor.

2. The form-in-place conductive and waterproof colloid of claim 1, being dispensed on an enclosure.

3. The form-in-place conductive and waterproof colloid of claim 2, being dispensing applied on the enclosure by an automatic filling machine.

4. The form-in-place conductive and waterproof colloid of claim 1, having an adhesion strength larger than 80N/cm2.

5. The form-in-place conductive and waterproof colloid of claim 1, having a shielding capability larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz.

6. The form-in-place conductive and waterproof colloid of claim 1, is being electrically conductive.

7. The form-in-place conductive and waterproof colloid of claim 1, wherein the minimum width of it is 0.4 mm.

8. The form-in-place conductive and waterproof colloid of claim 2, wherein the minimum height of it on the enclosure is 0.3 mm.

9. The form-in-place conductive and waterproof colloid of claim 2, wherein at least one dispensing path formed on the enclosure, and wherein the width of any of the dispensing path is in between 0.4 mm to 2 mm.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

(1) The invention as well as a preferred mode of use, further objectives and advantages thereof will be best understood by reference to the following detailed description of illustrative embodiments when read in conjunction with the accompanying drawing, wherein:

(2) FIG. 1 is a structural perspective view of a form-in-place conductive and waterproof colloid formed or dispensed in an enclosure in an embodiment of the present invention.

(3) FIG. 2 is a structural perspective view of a form-in-place conductive and waterproof colloid formed or dispensed in a closed enclosure in an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(4) Please refer to FIG. 1, an embodiment of a form-in-place conductive and waterproof colloid 100 composed of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dispersant; dimethyl, methylhydrogen siloxane crosslinking agent; adhesion promoter; Pt catalyst; forming agent; hydrocarbon solvent; Nickel Graphite; thickening agent; Trimethylated silica; and inhibitor is being applied on an enclosure 200.

(5) The composing weight percentage of the form-in-place conductive and waterproof colloid 100 is 9%-12% of dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; 12%-15% of hydroxy terminated polydimethylsiloxane; 0%-0.2% of dispersant; 3%-5% of dimethyl, methylhydrogen siloxane crosslinking agent; 0%-0.2% of adhesion promoter; 0%-0.2% of Pt catalyst; 1%-3% of forming agent; 0%-10% of hydrocarbon solvent; 50%-70% of Nickel Graphite; 0%-0.2% of thickening agent; 5%-10% of Trimethylated silica; and 0%-0.1% of inhibitor.

(6) The said form-in-place conductive and waterproof colloid 100 possesses a special feature of being capable of being easily dispensed without having to use a production mold or a die cutter, which simplifies the process of applying the colloid and reduce the cost of applying.

(7) Further, the form-in-place conductive and waterproof colloid 100 itself, being electrically conductive, is excellent in adhesion capability, compressibility and resilience, and is an excellent EMI shielding or isolating colloid.

(8) The adhesion strength of the form-in-place conductive and waterproof colloid 100 can be made larger than 80N/cm2 in embodiments, and the EMI shielding capability is larger than 100 dB in the frequency spectrum range from 200 MHz to 20 GHz.

(9) As shown in FIG. 1, in embodiments, at least one dispensing path 210 is formed on the enclosure 200 for dispensing the form-in-place conductive and waterproof colloid 100, and wherein the width of any of the dispensing path can be made in between 0.4 mm to 2 mm and the disclosure 200 can be a CNC made structure.

(10) As for the length of each dispensing path 210, and thus the length of the form-in-place conductive and waterproof colloid 100, depends on the requirements of different applications.

(11) While in embodiments, the width of the form-in-place conductive and waterproof colloid 100 can be made to be 4 mm or larger than 4 mm with a height of 0.3 mm or higher than 0.3 mm.

(12) Moreover, the form-in-place conductive and waterproof colloid 100 can be dispensing applied on the enclosure 200 by an automatic filling machine.

(13) As can be seen in FIG. 2, with the filling or dispensing of the form-in-place conductive and waterproof colloid 100, especially in every joints of the enclosure 200, water drops or debris can be prevented from entering the enclosure 200, EMI (Electro Magnetic Interference) from inside or outside the enclosure 200 can be blocked or isolated without leaking or penetration to make the whole enclosure 200 being in compliance with EMI regulations.

(14) All in all, as shown in FIG. 1 and FIG. 2 and stated in the previous embodiments, with the form-in-place conductive and waterproof colloid 100 dispensed, the enclosure 200 can be with the characteristics of being providing waterproof and dustproof capability for enclosures, providing excellent adhesion capability, providing excellent compressibility and resilience, isolating EMI and providing EMI shielding capability at the same time.

(15) Further with no production mold or die cutter is required for applying the form-in-place conductive and waterproof colloid 100, the process of applying the colloid is simplified and the cost of applying is reduced to make more applications in a variety of electronic products or equipments possible.

(16) The embodiments described above are intended only to demonstrate the technical concept and features of the present invention so as to enable a person skilled in the art to understand and implement the contents disclosed herein. It is understood that the disclosed embodiments are not to limit the scope of the present invention. Therefore, all equivalent changes or modifications based on the concept of the present invention should be encompassed by the appended claims.