Method of preparing metal pattern having 3D structure
10034385 ยท 2018-07-24
Assignee
Inventors
- Jin Mi Jung (Daejeon, KR)
- Jae Jin Kim (Daejeon, KR)
- Jeong Ho Park (Daejeon, KR)
- Bu Gon Shin (Daejeon, KR)
Cpc classification
H05K3/10
ELECTRICITY
H05K2203/1105
ELECTRICITY
B32B15/04
PERFORMING OPERATIONS; TRANSPORTING
International classification
B05D3/00
PERFORMING OPERATIONS; TRANSPORTING
H05K3/10
ELECTRICITY
G21H5/00
PHYSICS
Abstract
The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate. According to the method of preparing a metal pattern, the metal pattern having a 3D structure can be effectively formed on a receptor. Especially, the metal pattern having a 3D structure can also be effectively and rapidly transferred to a surface of the receptor, such as, a flexible substrate, to which the metal pattern is not easily transferred. The metal pattern laminate prepared using the method can, for example, be usefully used for metal layers of flexible electronic devices or metal interconnection lines.
Claims
1. A method of preparing a metal pattern having a three-dimensional (3D) structure, comprising: disposing a film to face a receptor, wherein the film is for transferring a metal pattern to the receptor, the film sequentially comprising: a photothermal conversion layer; an intermediate layer having a surface energy of 25 mN/m or less and comprising a film of organic monomolecular material having a fluorinated alkyl group in a basic structure of a silane; and a metal layer, wherein the film is positioned so that the metal layer faces the receptor; and transferring an entire continuous metal layer having an uneven structure to the receptor by irradiating the photothermal conversion layer with light of an IR laser in a continuous wave (CW) mode at a scanning rate of 0.5 to 0.6 m/s resulting in a volume expansion of the photothermal conversion layer, wherein the uneven structure is formed due to an effect of the volume expansion of the photothermal conversion layer.
2. The method of claim 1, wherein the receptor is a flexible substrate.
3. The method of claim 1, wherein the photothermal conversion layer comprises a dye, carbon black, a metal, a metal oxide, or a metal sulfide.
4. The method of claim 3, wherein the metal sulfide is sulfides of Al, Bi, Sn, In, Zn, Ti, Cr, Mo, W, Co, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zr or Te.
5. The method of claim 3, wherein the photothermal conversion layer is a resin composition layer comprising a dye, carbon black, a metal, a metal oxide, or a metal sulfide.
6. The method of claim 1, wherein the intermediate layer has a thickness of 5 nm to 100 nm.
7. The method of claim 1, wherein the metal layer comprises aluminum, copper, silver, gold, iron, platinum, tungsten, or alloys thereof.
8. The method of claim 1, wherein the film for transferring the metal pattern further comprises a blocking layer present between the photothermal conversion layer and the intermediate layer.
9. The method of claim 8, wherein the blocking layer comprises a thermoplastic material, or a thermosetting material.
10. The method of claim 8, wherein the blocking layer comprises an acryl-based, urethane-based, ester-based, or epoxy-based organic binder.
11. The method of claim 1, wherein the laser is passed through a homogenizer and a f-theta lens to form a square beam on a focal plane of the photothermal conversion layer.
12. The method of claim 11, wherein the laser is a 50 W fiber laser having a wavelength of 1070 nm.
13. The method of claim 11, wherein the square beam has a size of approximately 0.2 mm?0.2 mm.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1)
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BEST MODE
(8) Hereinafter, the present application will be described in detail with exemplary embodiments of the present application. However, the scope of the present application is not limited by the exemplary embodiments provided below.
Measurement Example 1: Measurement of Surface Energy
(9) The surface energy of a solid was determined from a contact angle formed between water (H.sub.2O) and a drop of diiodomethane (CH.sub.2I.sub.2) by an Owen-Wendt method using a contact angle analyzer (a drop shape analyzer DSA100, KRUSS GmbH).
Example 1
(10) Preparation of Film for Transferring Metal Pattern
(11) A film for transferring a metal pattern was prepared by sequentially forming a photothermal conversion layer, a blocking layer, an intermediate layer, and a metal layer on a PET film serving as a supporting substrate. The photothermal conversion layer was formed on a supporting substrate to a thickness of 2.5 ?m by preparing a composition for preparing a photothermal conversion layer including carbon black, followed by coating the supporting substrate with the composition by means of bar coating, the blocking layer was formed on the photothermal conversion layer to a thickness of 15 ?m by preparing a composition for preparing a blocking layer including a thermosetting urethane-based material, followed by coating the photothermal conversion layer with the composition by means of bar coating, the intermediate layer was formed on the blocking layer to a thickness of approximately 20 nm by spin-coating a solution of OPTOOL? (commercially available from DAIKIN INDUSTRIES, Ltd.) which was one of the fluorine-based organic silicon compounds (the intermediate layer having a surface energy of 23 mN/m), and the metal layer was formed on the intermediate layer to a thickness of approximately 100 nm by sputtering an aluminum metal.
(12) Transfer of Metal Pattern
(13) To carry out a transfer test using a laser, a 50 W fiber laser with a continuous wave (CW) of 1070 nm was used. To radiate a laser beam with uniform power, a square beam with a size of approximately 0.2 mm?0.2 mm was formed on a focal plane by passing a laser through a homogenizer and then through a f-theta lens. A metal layer of the film for transferring a metal pattern was arranged on a receptor substrate (i.e., a PET film) to face the receptor substrate, and the metal pattern was transferred onto the receptor substrate by scanning the supporting substrate of the film with the IR laser at a voltage of 1.6 W and a scanning rate of 0.5 to 0.6 m/s.
BRIEF DESCRIPTION OF MAIN PARTS IN THE DRAWINGS
(14) 101: photothermal conversion layer 102: intermediate layer 103: metal layer 201: receptor 202: metal pattern 301: blocking layer 401: supporting substrate