Inductor bridge and electronic device
11497114 ยท 2022-11-08
Assignee
Inventors
Cpc classification
H05K2201/10098
ELECTRICITY
H05K2201/0158
ELECTRICITY
H05K1/0278
ELECTRICITY
H05K1/189
ELECTRICITY
H05K1/147
ELECTRICITY
H05K1/028
ELECTRICITY
H05K1/117
ELECTRICITY
International classification
H05K1/18
ELECTRICITY
Abstract
An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.
Claims
1. An inductor bridge comprising: a flexible substrate; and a coil defined by a conductor pattern provided on or in the flexible substrate; wherein the flexible substrate includes a first rigid portion, a second rigid portion, and a flexible portion located between the first rigid portion and the second rigid portion; the inductor bridge connects a plurality of circuit portions; the coil includes a plurality of coil portions located at different positions in plan view; the inductor bridge includes a bending portion adjacent to the plurality of coil portions on one side of the plurality of coil portions; at least two of the plurality of coil portions include a first coil portion and a second coil portion located in the first rigid portion of the flexible substrate; the second coil portion is located nearer to the one side of the plurality of coil portions than the first coil portion; and an inductance of the second coil portion is substantially equal to or less than an inductance of the first coil portion.
2. The inductor bridge according to claim 1, further comprising a joining portion connected to another circuit on another side of the plurality of coil portions.
3. The inductor bridge according to claim 1, wherein the flexible substrate is a multilayer substrate including a plurality of laminated insulating base material layers; and the conductor pattern defining the coil is provided over the plurality of insulating base material layers.
4. An electronic device comprising: an inductor bridge; a first circuit portion; and a second circuit portion; wherein the first circuit portion and the second circuit portion are connected via the inductor bridge; the inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate; the flexible substrate includes a first rigid portion, a second rigid portion, and a flexible portion located between the first rigid portion and the second rigid portion; the coil includes a plurality of coil portions located at different positions in plan view; the inductor bridge includes a bending portion adjacent to the plurality of coil portions on one side of the plurality of coil portions; at least two of the plurality of coil portions include a first coil portion and a second coil portion located in the first rigid portion of the flexible substrate; the second coil portion is located nearer to the one side of the plurality of coil portions than the first coil portion; and an inductance of the second coil portion is substantially equal to or less than an inductance of the first coil portion.
5. The electronic device according to claim 4, wherein the inductor bridge further includes a joining portion connected to the first circuit portion on another side of the plurality of coil portions.
6. The electronic device according to claim 4, wherein the flexible substrate is a multilayer substrate including a plurality of laminated insulating base material layers; and the conductor pattern defining the coil is provided over the plurality of insulating base material layers.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(10) Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings by way of some specific examples. In the drawings, the same or similar elements and portions are denoted by the same reference numerals. Although preferred embodiments are separately indicated for the sake of convenience in consideration of description of points or the ease of understanding, partial replacement or combination of features in different preferred embodiments is possible. In the second and subsequent preferred embodiments, description of matters common to the first preferred embodiment will be omitted, and only different points will be described. In particular, the same or similar advantageous operations and effects of the same features will not be sequentially described for each preferred embodiment.
First Preferred Embodiment
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(12) The flexible substrate 10 includes wide rigid portions RP1 and RP2 and a narrow flexible portion FP. That is, the rigid portions RP1 and RP2 are wider than the flexible portion FP. In
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(14) The inner peripheral end of the first coil portion 21A and the inner peripheral end of the first coil portion 21B are electrically connected via an interlayer connection conductor. Similarly, the inner peripheral end of the second coil portion 22A and the inner peripheral end of the second coil portion 22B are electrically connected via an interlayer connection conductor.
(15) Openings AP that expose the first joining portion 11 and the second joining portion 12 are provided through the resist film 81.
(16) The insulating base material layers 91 and 92 are preferably flexible insulating base material layers, for example, liquid crystal polymer (LCP) and polyetheretherketone (PEEK). The resist film 81 is preferably a printable insulating resin material, for example. Each conductor pattern is preferably provided by patterning, for example, a Cu foil.
(17) Thus, a coil as an inductor is provided by the two coil portions located at different positions in plan view. The first coil portions 21A and 21B and the second coil portions 22A and 22B are magnetically coupled via a closed-loop magnetic flux that interlinks them. This magnetic field coupling couples the first coil portions 21A and 21B, and the second coil portions 22A and 22B by additive polarity. Therefore, the inductance of the entire coil is the sum of the self-inductance of the first coil portions 21A and 21B, the self-inductance of the second coil portions 22A and 22B, and the mutual inductance by the magnetic field coupling.
(18) As shown in
(19) According to the first preferred embodiment, since the wide rigid portion RP1 where the first joining portion 11 is provided has a long length from the first joining portion 11 to the flexible portion FP, the stress due to the bending of the flexible portion FP is hardly transmitted to the first joining portion 11. Further, the rigidity of the rigid portion RP1 is high due to the presence of the coil of the rigid portion RP1. In particular, since the first coil portions 21A and 21B and the second coil portions 22A and 22B have a spiral shape and high-density conductor patterns are provided substantially uniformly, the rigidity of the entire rigid portion RP1 is high. Therefore, poor connection at the first joining portion 11 is significantly reduced or prevented. Further, since the deformation of the entire coil is also significantly reduced or prevented, the deviation of the inductance of the coil is significantly reduced or prevented.
Second Preferred Embodiment
(20) In a second preferred embodiment of the present invention, an example of an inductor bridge including a coil different from that of the first preferred embodiment will be described.
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(23) The inner peripheral end of the first coil portion 21A and the inner peripheral end of the first coil portion 21B are electrically connected via an interlayer connection conductor. Similarly, the inner peripheral end of the second coil portion 22A and the inner peripheral end of the second coil portion 22B are electrically connected via an interlayer connection conductor. Further, the internal electrode 12S of the second joining portion and the second joining portion 12 are electrically connected via an interlayer connection conductor.
(24) An opening AP that exposes the first joining portion 11 is provided through the resist film 81. Further, an opening AP that exposes the second joining portion 12 is provided through the resist film 82.
(25) A connector 51 is joined to the first joining portion 11, and a connector 52 is joined to the second joining portion 12.
(26) In the second preferred embodiment, the numbers of coil turns of the second coil portions 22A and 22B are smaller than the numbers of coil turns of the first coil portions 21A and 21B. In other words, the inductance of the second coil portions 22A and 22B is smaller than the inductance of the first coil portions 21A and 21B.
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(28) An antenna element pattern is provided on the antenna board 301. A first connector 51 of the inductor bridge 102 is connected to a predetermined portion of the antenna element pattern. A second connector 52 of the inductor bridge 102 is connected to a connection provided on the upper surface of the circuit board 201. In
(29) As shown in
(30) As described above, since the wide rigid portion RP1 where the first joining portion 11 (connector 51) is provided has a long length from the first joining portion 11 to the flexible portion FP, the stress due to the bending of the flexible portion FP is hardly transmitted to the first joining portion 11. Further, due to the presence of the two coil portions (21A and 21B) and (22A and 22B) of the rigid portion RP1, the rigidity of the rigid portion RP1 is high, and poor connection at the first joining portion 11 is significantly reduced or prevented. Further, since the first coil portions 21A and 21B having a relatively larger number of turns are farther from the flexible portion FP than the second coil portions 22A and 22B having a smaller number of turns, the deformation of the first coil portions 21A and 21B is small. Therefore, the deviation of the inductance of the coil is significantly reduced or prevented.
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Third Preferred Embodiment
(32) In a third preferred embodiment of the present invention, an example of an inductor bridge including a coil that is different from that of the first and second preferred embodiments will be described.
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(34) In the rigid portion RP of the insulating base material layer 93, a wiring conductor that electrically connects the first joining portion 11 and the internal electrode 11S of the first joining portion to the inner peripheral ends of the first coil portions 21A, 21B, and 21C is provided.
(35) The flexible portion FP includes a wiring portion 30 extracting from the inner peripheral ends of the second coil portions 22A, 22B, and 22C.
(36) The coil of the inductor bridge 103 of the third preferred embodiment includes a series circuit of the first coil portion 21A and the second coil portion 22A, a series circuit of the first coil portion 21B and the second coil portion 22B, and a series circuit of the first coil portion 21C and the second coil portion 22C, which are electrically connected in parallel.
(37) As described above, the flexible substrate is a multilayer substrate including a plurality of laminated insulating base material layers, and the conductor pattern providing the coil is provided over the plurality of insulating base material layers.
(38) With the above configuration, the uniformity of the layer thickness of the insulating base material is so high that stable characteristics are provided as compared, for example, with a structure in which a coil is defined by a single-layer conductor pattern. Further, even if the thickness of the conductor pattern of each layer is thin, a direct current resistance component of the coil is able to be significantly reduced by electrically connecting the plurality of coil portions in parallel.
(39) Further, according to the third preferred embodiment, since the internal electrode 11S of the first joining portion is laminated on the first joining portion 11, the rigidity of the first joining portion is able to be further increased.
(40) Note that, as shown in
(41) Note that a resist film may be provided on the outer surfaces of the insulating base material layers 91 and 94.
Other Preferred Embodiments
(42) The descriptions of the preferred embodiments of the present invention are provided as examples, and do not limit the scope of the present invention. Modifications and changes may be made by those skilled in the art as appropriate. The scope of the present invention is defined by the claims, not by the aforementioned preferred embodiments. Further, the scope of the present invention includes changes from the preferred embodiments within the scope equivalent to the scope of the claims.
(43) For example, the coil portion provided in the rigid portion is not limited to being defined by two coil portions, but may include two or more coil portions, and two of the coil portions may be located on one side (X-axis direction side) when viewed from the first joining portion 11.
(44) Further, the number of laminated insulating base material layers may be different between the rigid portion and the flexible portion. In particular, increasing the number of laminations of the rigid portion is effective in increasing the rigidity.
(45) Further, the bending direction of the flexible portion is not limited to the direction in which the surface of the flexible substrate is bent, but may include a component that provides bending in a direction along the surface. Further, there may be a torsion component.
(46) Further, the coil may be defined by a single-layer conductor pattern. Further, the coil is not limited to a spiral shape, and the coil portion of each layer may have a substantially one-turn coil pattern.
(47) While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.