PRINTED CIRCUIT BOARD ASSEMBLY

Abstract

A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.

Claims

1. A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, a potting compound being provided, which covers the printed circuit board and contacts the gap filler.

2. The printed circuit board assembly according to claim 1, wherein the electronic component is fastened to the bearing surface by means of the gap filler.

3. The printed circuit board assembly according to claim 1, wherein the gap filler is adhesive so that the printed circuit board is bonded onto the bearing surface via the electronic component by means of the gap filler.

4. The printed circuit board assembly according to claim 1, wherein the gap filler is thermally conductive and in that the electronic component is connected to the housing in a thermally conductive manner.

5. The printed circuit board assembly according to claim 1, wherein the gap filler is elastic so that the gap filler acts as a mechanical damper.

6. The printed circuit board assembly according to claim 1, wherein the gap filler is made of an elastomer.

7. The printed circuit board assembly according to claim 1, wherein the gap filler is made of a thermoset material.

8. The printed circuit board assembly according to claim 7, wherein the gap filler is made of a polyurethane or an epoxide.

9. The printed circuit board assembly according to claim 1, wherein the gap filler is provided with a thermally conductive additive.

10. The printed circuit board assembly according to claim 9, wherein the thermally conductive additive is a ceramic powder or a mineral material.

11. The printed circuit board assembly according to claim 1, wherein the potting compound completely covers an upper side of the printed circuit board, which is opposite to a lower side of the printed circuit board to which the electronic component is fastened.

12. The printed circuit board assembly according to claim 1, wherein the potting compound seals the electronic component to the outside.

13. The printed circuit board assembly according to claim 1, wherein the housing is formed in a pot shape and has a housing bottom and sidewalls.

14. The printed circuit board assembly according to claim 13, wherein the bearing surface is parallel to the housing bottom.

15. The printed circuit board assembly according to claim 13, wherein the housing has a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, the bearing surface being formed on the shoulder portion.

16. The printed circuit board assembly according to claim 1, wherein the printed circuit board is mounted in the housing spaced apart from the sidewalls.

17. A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, and wherein the gap filler is electrically non-conductive.

18. The printed circuit board assembly according to claim 17, wherein a potting compound is provided, which covers the printed circuit board and contacts the gap filler.

19. A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, wherein the housing is formed in a pot shape and has a housing bottom and sidewalls, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, wherein the housing has a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, the bearing surface being formed on the shoulder portion such that the bearing surface is parallel to the housing bottom.

20. The printed circuit board assembly according to claim 19, wherein a potting compound is provided, which covers the printed circuit board and contacts the gap filler.

Description

BRIEF DESCRIPTION OF THE DRAWING

[0040] Further advantages and features of the present disclosure will become apparent from the description below and from the FIGURE to which reference is made.

[0041] FIG. 1 shows a schematic sectional view of the printed circuit board assembly according to the present disclosure.

DETAILED DESCRIPTION

[0042] A printed circuit board assembly 10 is shown in FIG. 1, which can be used in a field bus device.

[0043] The printed circuit board assembly 10 comprises a pot-shaped housing 12 having a housing bottom 14 and sidewalls 16, i.e. four sidewalls 16, for example. In this respect, the pot-shaped housing 12 has one open side which is opposite to the housing bottom 14.

[0044] In the embodiment shown, the housing 12 has a shoulder portion 18 which is provided in a transition area from the housing bottom 14 to the sidewalls 16. In this respect, the cross-section of the housing 12 has a step-like side, as shown in FIG. 1.

[0045] Furthermore, the printed circuit board assembly 10 comprises a printed circuit board 20 having an upper side 22 and a lower side 24 which are opposite to each other. The lower side 24 of the printed circuit board 20 thus faces towards the housing bottom 14, whereas the upper side 22 of the printed circuit board 20 faces towards the open side of the pot-shaped housing 12.

[0046] In addition, the printed circuit board assembly 10 comprises at least one electronic component 26 which is mounted to the printed circuit board 20, in particular to the lower side 24.

[0047] The printed circuit board 20 is also mounted on the housing 12 in that the printed circuit board 20 is mounted on a bearing surface 30 of the housing 12 via the electronic component 26 and a gap filler 28.

[0048] The gap filler 28 can be adhesive, such that the printed circuit board 20 is bonded to the bearing surface 30 via the electronic component 26 by means of the gap filler 28. This results in a mechanical fastening of the printed circuit board 20 in the housing 12.

[0049] In the embodiment shown, the bearing surface 30 is formed on the shoulder portion 18, the bearing surface 30 extending parallel to the housing bottom 14.

[0050] Basically, the gap filler 28 can be elastic and be made of an elastomer, for example, the gap filler 28 thus simultaneously acting as a mechanical damper such that the printed circuit board 20 and the electronic component 26 fastened thereto are protected against shocks and/or vibrations.

[0051] If it is not necessary that the gap filler 28 simultaneously acts as a mechanical damper, the gap filler 28 can also be made of a thermoset material. This may be the case if the printed circuit board assembly 10 is used in a device which is not exposed to shocks or vibrations during operation.

[0052] The FIGURE further shows that the printed circuit board assembly 10 has a potting compound 32 which covers, in particular fully covers the upper side 22 of the printed circuit board 20, among others. The potting compound 32 can have a thickness such that a flat surface is formed, i.e. the potting compound 32 extends up to the edge of the housing 12. Alternatively, the sidewalls 16 can protrude beyond the upper side of the potting compound 32, thus forming a step, as shown in the FIGURE.

[0053] The printed circuit board 20 is in particular spaced apart from the sidewalls 16 of the housing 12, such that a gap is provided between the printed circuit board 20 and the sidewalls 16, which can be filled by the potting compound 32. The potting compound 32 thus extends along the slit between the sides of the printed circuit board 20 and the sidewalls 16 towards the housing bottom 14 and up to the gap filler 28. The potting compound 32 thus adjoins the gap filler 28, such that the latter is contacted by the potting compound 32.

[0054] The potting compound 32 entirely seals a space 34 to the outside, which at least partially accommodates the electronic component 26. This space 34 may also be referred to as cavity or receiving space. Basically, further electronic components (not shown here) can be arranged in the space 34.

[0055] The space 34 is delimited by the printed circuit board 20, in particular the lower side 24 thereof, the housing bottom 14, the sidewalls 16, the electronic component 26 and the gap filler 28.

[0056] This ensures that the space 34 in which the electronic component 26 is partially accommodated, is sealed to the outside, in particular via one side. The electronic component 26 is generally sealed to the outside as the electronic component 26 partially protrudes into the sealed space 34 and is partially limited by the gap filler 28 and the potting compound 32.

[0057] As the space 34 is a cavity, the mass of the entire printed circuit board assembly 10 is accordingly low, which has a positive effect on cases of application in which the printed circuit board assembly 10 is arranged on a component, a robot part, for example.

[0058] In addition, the gap filler 28 can be thermally conductive, for example due to a thermally conductive additive 36 such as a ceramic powder, in particular aluminum oxide, zinc oxide or boron nitride, or a mineral material, in particular quartz sand or quartz powder. The thermally conductive additive 36 can be particulates.

[0059] It is thus ensured that the gap filler 28 establishes a thermal connection of the electronic component 26 to the housing 12, as a result of which heat generated by the electronic component 26 during operation is transferred to the housing 12 via the gap filler 28. The heat can be released from the housing to the surroundings accordingly.

[0060] The gap filler 28 thus has at least two functions, as the gas filler 28 serves for the purposeful thermal connection of the electronic component 26 to the housing 12 and simultaneously seals the electronic component 26 to the outside.