Device and method for bonding of substrates

Abstract

A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

Claims

1. A method for bonding substrates comprising: providing a first substrate having a contact face and a second substrate having a contact face; holding the first substrate to a first holding surface of a first holding device; holding the second substrate to a second holding surface of a second holding device, wherein the contact face of the first substrate faces the contact face of the second substrate; contacting the contact face of the first substrate with the contact face of the second substrate, wherein the contact faces of the first and/or second substrates have a respective curvature before the contacting of the contact faces; bonding the first substrate with the second substrate at the contact faces of the first and second substrates; and controlling during the bonding a change in the curvature of the contact face of the first substrate and/or controlling a change in the curvature of the contact face of the second substrate, wherein controlling includes implementing closed-loop control of at least one of the curvature of the contact face of the first substrate or the curvature of the contact face of the second substrate, wherein the curvatures of the contact faces and/or the changes in the curvatures of the contact faces are adjusted and/or controlled mirror-symmetrically and/or concentrically with respect to the contact faces before the contacting of the contact faces of the first and second substrates.

2. A method for bonding substrates comprising: providing a first substrate having a contact face and a second substrate having a contact face; holding the first substrate to a first holding surface of a first holding device; holding the second substrate to a second holding surface of a second holding device, wherein the contact face of the first substrate faces the contact face of the second substrate; contacting the contact face of the first substrate with the contact face of the second substrate, wherein the contact faces of the first and/or second substrates have a respective curvature before the contacting of the contact faces; bonding the first substrate with the second substrate at the contact faces of the first and second substrates; and controlling during the bonding a change in the curvature of the contact face of the first substrate and/or controlling a change in the curvature of the contact face of the second substrate, wherein controlling includes implementing closed-loop control of at least one of the curvature of the contact face of the first substrate or the curvature of the contact face of the second substrate, wherein the first substrate and/or the second substrate are fixed by a fixing device arranged in a ring-shaped manner, at the periphery of the first and second holding surfaces solely in the region of side edges of the first and second substrates.

3. The method according to claim 2, wherein the fixing device is arranged in a circular ring-shaped manner.

4. A device for bonding a first substrate with a second substrate at mutually facing contact faces of the first and second substrates, said device comprising: a first holding device for holding the first substrate to a first holding surface; a second holding device for holding the second substrate to a second holding surface; curvature measuring device configured to measure an actual curvature of at least one of the contact face of the first substrate or the contact face of the second substrate; at least one curvature changing element configured to change the curvature of the contact face of the first substrate and/or for changing the curvature of the contact face of the second substrate, said at least one curvature changing element controlling the change of the curvature of the contact face of the first substrate and/or of the contact face of the second substrate during bonding of the first substrate with the second substrate; and a controller operatively coupled to the at least one curvature changing element and to the curvature measuring device, the controller configured implement closed-loop control of at least one of the curvature of the contact face of the first substrate or the curvature of the contact face of the second substrate, wherein the first holding device and/or the second holding device comprise a fixing device arranged in a ring-shaped manner, at the periphery of the first and second holding surfaces solely in the region of side edges of the first and second substrates.

5. The device according to claim 4, wherein the fixing device is arranged in a circular ring-shaped manner.

6. A method for bonding substrates comprising: providing a first substrate having a contact face and a second substrate having a contact face; holding the first substrate to a first holding surface of a first holding device; holding the second substrate to a second holding surface of a second holding device, wherein the contact face of the first substrate faces the contact face of the second substrate; contacting the contact face of the first substrate with the contact face of the second substrate, wherein the contact faces of the first and/or second substrates have a respective curvature before the contacting of the contact faces; bonding the first substrate with the second substrate at the contact faces of the first and second substrates; and controlling during the bonding a change in the curvature of the contact face of the first substrate and/or controlling a change in the curvature of the contact face of the second substrate, wherein controlling includes implementing closed-loop control of at least one of the curvature of the contact face of the first substrate or the curvature of the contact face of the second substrate, wherein implementing closed-loop control comprises: providing a setpoint curvature corresponding a desired curvature of at least one of the contact face of the first substrate or the contact face of the second substrate; measuring an actual curvature of at least one of the contact face of the first substrate or the contact face of the second substrate; comparing the setpoint curvature to the actual curvature; and based on the comparison, adjusting a pressure applied by curvature elements to cause the actual curvature to correspond to the setpoint curvature.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1a shows a diagrammatic partial view (not true to scale) of a first embodiment of a holding device according to the invention,

(2) FIG. 1b shows a diagrammatic partial view (not true to scale) of a second embodiment of the holding device according to the invention,

(3) FIG. 1c shows a diagrammatic partial view (not true to scale) of a third embodiment of the holding device according to the invention,

(4) FIG. 1d shows a diagrammatic partial view (not true to scale) of a fourth embodiment of the holding device according to the invention,

(5) FIG. 1e shows a diagrammatic partial view (not true to scale) of a first embodiment of a curvature (changing) means of the holding device according to the invention,

(6) FIG. 1f shows a diagrammatic partial view (not true to scale) of a second embodiment of a curvature (changing) means of the holding device according to the invention,

(7) FIG. 2a shows a diagrammatic view (not true to scale) of a fifth embodiment of a holding device according to the invention,

(8) FIG. 2b shows a diagrammatic view (not true to scale) of a sixth embodiment of a holding device according to the invention,

(9) FIG. 2c shows a diagrammatic view (not true to scale) of a seventh embodiment of a holding device according to the invention,

(10) FIG. 2d shows a diagrammatic view (not true to scale) of an eighth embodiment of a holding device according to the invention,

(11) FIG. 2e shows a diagrammatic view (not true to scale) of a ninth embodiment of a holding device according to the invention,

(12) FIG. 3a-3e show a diagrammatic side view (not true to scale) and a plan view of embodiments of an elevation according to the invention,

(13) FIG. 4a shows a diagrammatic cross-sectional view (not true to scale) of an embodiment of a bonder according to the invention with pressure and distance diagrams in a first process step of a process according to the invention,

(14) FIG. 4b shows a diagrammatic cross-sectional view (not true to scale) of the embodiment according to FIG. 4a in a further process step,

(15) FIG. 4c shows a diagrammatic cross-sectional view (not true to scale) of the embodiment according to FIG. 4a in a further process step,

(16) FIG. 4d shows a diagrammatic cross-sectional view (not true to scale) of the embodiment according to FIG. 4a in a further process step and

(17) FIG. 4e shows a diagrammatic cross-sectional view (not true to scale) of the embodiment according to FIG. 4a in a further process step.

(18) Identical components and components with the same function are marked with the same reference numbers in the figures.

DETAILED DESCRIPTION OF THE INVENTION

(19) FIG. 1a shows a diagrammatic partial view (not true to scale) of a cross-section of a first embodiment of a holding device 1 according to the invention (referred to alternatively as a substrate holder), wherein only an edge region R with fixing elements 2 (fixing means) is represented.

(20) Holding device 1 comprises a plurality of zones Zi, which are preferably located in edge region R. Each of zones Zi can comprise a plurality of fixing elements 2. By way of example, two zones Z1 and Z2 are represented in FIG. 1a. Four fixing elements 2 are shown in cross-section in first zone Z1, whereas two fixing elements 2 are shown in second zone Z2. In particular, the zones Zi can be limited to edge region R of substrate holder 1 or distributed over entire substrate holder 1.

(21) Fixing elements 2 are used for the fixing of a substrate holding surface 4a of a first, in particular upper, substrate 1o or a second, in particular lower, substrate 1u.

(22) A plurality of sensors 3, 3, in particular distance sensors, are preferably located in holding surface is. The sensors are used for the measurement of physical and/or chemical properties between fixed substrate 4 and holding surface is. Sensors 3, 3 are in particular distance sensors, with the aid of which a distance between holding surface is and substrate holding surface 4a is measured.

(23) Substrate holder 1 is preferably designed such that a curvature element 5, 5 (curvature means) is located in its centre C (see FIG. 1e and 1f), with the aid of which a substrate 4o, 4u fixed to substrate holder 1 can be curved. Particularly preferably, curvature element 5 is a fluid outlet opening, via which a gas, in particular compressed air, can be pumped between substrate holder 1 and substrate 4. Substrate 4 is curved by the excess pressure, while at the same time it is fixed by fixing elements 2 or released in a controlled manner.

(24) In the alternative embodiment according to the invention according to FIG. 1f, curvature element 5 is a pin, which extends through holding device 1 and which is constituted displaceable normal to the latter (curvature means or curvature changing means).

(25) The embodiments in respect of FIGS. 1e and 1f similarly apply to the embodiments according to FIGS. 1a to 1d.

(26) A substrate holder 1 in a second embodiment according to the invention is shown in FIG. 1b. Substrate holder 1 comprises a plurality of zones Zi which are preferably located in edge region R. Each of zones Zi can in general comprise a plurality of fixing elements 2. Fixing elements 2 are electrodes of an electrostatic fixing. Two zones Z1 and Z2 are represented by way of example in FIG. 1b. In first zone Z1, two fixing elements 2 can be seen in cross-section, whilst in second zone Z2 three fixing elements 2 can be seen in cross-section. In particular, zones Zi can be limited to the outer edge of substrate holder 1, or can be distributed over entire substrate holder 1.

(27) A plurality of sensors 3, 3, in particular distance sensors, are preferably located in holding surface 1s. Sensors 3, 3 are used for the measurement of physical and/or chemical properties between fixed substrate 4 and holding surface 1s. Sensors 3, 3 are in particular distance sensors, with the aid of which the distance between holding service 1s and substrate holding surface 4a is measured.

(28) A substrate holder 1 in a third embodiment according to the invention is disclosed in FIG. 1c. Substrate holder 1 comprises a plurality of zones Zi, which are preferably located solely in edge region R. Each of zones Zi can in particular comprise a plurality of fixing elements 2.

(29) Fixing elements 2 are spatial regions 9 between substrate holding surface 1a, adjacent webs 8 or an edge element 10 and webs 8 and a bottom penetrated by lines 6. A pressure is adjusted in lines 6 in order to engage substrate 4o, 4u by suction and thus to fix the latter.

(30) A plurality of studs 7, on which substrate 4o, 4u lies, are in particular located in spatial region 9. Studs 7 are used in particular to prevent excessive contamination. Studs 7 have been represented above average size in FIG. 1c in order to improve the view. In reality, studs 7 are much smaller compared to the thickness of substrate holder 1.

(31) Two zones Z1 and Z2 are represented by way of example in FIG. 1c. Three fixing elements 2 can be seen in cross-section in the first zone Z1, whilst three fixing elements 2 can likewise be seen in cross-section in second zone Z2. In particular, zones Zi can be limited to the outer edge of substrate holder 1 or be distributed over entire substrate holder 1.

(32) A plurality of sensors 3, 3, in particular distance sensors, are preferably located in studs 7, in particular at a stud surface 70 of studs 7 that contacts substrate holding surface 1a in the non-curved state. The sensors are used to measure physical and/or chemical properties between fixed substrate 4 and holding surface is defined by stud surface 7o and peripheral edge element 10. Sensors 3, 3 are in particular distance sensors, with the aid of which the distance between stud surface 7o and substrate surface 4o is measured.

(33) FIG. 1d shows a substrate holder 1 in a fourth embodiment according to the invention. Substrate holder 1 comprises in particular a plurality of zones Zi which are preferably located in edge region R. Each of zones Zi can comprise a plurality of fixing elements 2.

(34) Fixing elements 2 are spatial regions 9 between two adjacent lines 6, in which a pressure can be adjusted. A limitation of spatial regions 9 takes place only at the periphery of holding device 1 by a circumferential edge element 10, on which substrate 1o, 1u lies at the circumference and which together with stud surface 7o defines a holding surface 1s.

(35) A plurality of studs 7 is located in particular in spatial region 9, on stud surface 7o whereof a substrate 4o, 4u can be held. Studs 7 are used in particular to prevent excessive contamination. Studs 7 have been represented above average size in FIG. 1c in order to improve the view. In reality, the studs are much smaller compared to the thickness of substrate holder 1

(36) Two zones Z1 and Z2 are represented by way of example in FIG. 1d. A fixing element 2 can be seen in cross-section in first zone Z1, a fixing element 2 likewise being been present in cross-section in second zone Z2. In particular, zones Zi can be limited to the outer edge of substrate holder 1 or can be distributed over entire substrate holder 1.

(37) A plurality of sensors 3, 3, in particular distance sensors, is preferably located on a bottom of spatial regions 9 between studs 7. Sensors 3, 3 are used to measure physical and/or chemical properties between fixed substrate 4 and the bottom. Sensors 3, 3 are in particular distance sensors, with the aid of which the distance between the bottom and substrate holding surface 4a is measured. The distance of substrate holding surface 1a from stud surface 7o can be calculated therefrom via the known height of studs 7.

(38) FIG. 2a shows a holding device 1.sup.IV, wherein fixing elements 2 are arranged in four concentric zones Z1-Z4. A curvature element 5, 5 is located at centre C of holding device 1.sup.IV (see FIG. 1e or 1f). Corresponding fixing elements 2 of a plurality of zones are each arranged along radially running lines L.

(39) FIG. 2b shows a holding device 1.sup.V, wherein fixing elements 2 are arranged in zones Z1-Z4. A curvature element 5, 5 is located in the centre of holding device 1.sup.V (see FIG. 1e or 1f). Corresponding fixing elements 2 of a plurality of zones are each arranged along a line L, which does not run through curvature element 5, in particular not through centre C. In particular, line L does not have to be a straight line. Corresponding fixing elements 2 lying opposite in each case are arranged point-mirrored with respect to centre C.

(40) FIG. 2c shows a holding device 1.sup.VI with a plurality of studs 7, surrounded by an edge element 10 similar to the embodiment according to FIG. 1c. Spatial regions 9 are located between studs 7, said spatial regions acting as fixing elements 2.sup.IV during an evacuation. The evacuation takes place via lines 6. Since no webs 8, which separate spatial regions 9 from one another, are present in this embodiment according to the invention, a fluid introduced via a curvature element 5 (see FIG. 1e) is removed again by suction directly via channels 6. This embodiment according to the invention is therefore an example of a substrate holder, wherein a stationary laminar flow is built up between substrate holder 1 v and substrate 4o, 4u.

(41) FIG. 2d shows an embodiment according to the invention, wherein a plurality of zones Z are provided in each case with three fixing elements 2. Zones Z are constituted as hexagons and at least predominantly occupy the holding surface. Centre Z and the peripheral edge are not occupied.

(42) FIG. 2e shows an embodiment according to the invention, wherein fixing elements 2 are arranged along a spiral. In this case, entire holding surface 1s represents the sole zone Z. The individual or grouped control of the fixing elements is conceivable. Curvature element 5, 5 is arranged at the end of the spiral and in centre C.

(43) All the embodiments according to FIGS. 2a-2e are holding devices wherein the fixings are constituted as underpressure or vacuum fixings. Corresponding substrate holders with electrostatic fixing can similarly be implemented. For the sake of a clearer view, sensors 3, 3 are not represented, but can be constituted corresponding to the embodiments according to FIGS. 1a to 1d.

(44) FIGS. 3a-3e show examples of embodiment of shapes of elevations 7, 7, 7, 7, 7. The shape according to FIG. 3a comprises a cylindrical base body with a round head. The shape according to FIG. 3b comprises a cylindrical base body with a flat head. The shape according to FIG. 3c comprises a hemispherical base body. The shape according to FIG. 3d comprises a three-sided pyramid. The shape according to FIG. 3e comprises a four-sided pyramid.

(45) FIG. 4a shows a bonder 13 according to the invention for the contacting and bonding of contact faces 4K of a first/upper substrate 4o and a second/lower substrate 4u arranged opposite one another. Bonder 13 comprises a lower substrate holder 1u and an upper substrate holder 1o. Substrate holders 1u, 1o can in particular be constituted as above-described holding devices 1, 1, 1, 1, 1.sup.IV, 1.sup.V, 1.sup.VI for holding a first/upper substrate 4o and a second/lower substrate 4u, wherein lower substrate holder 1u can be constituted or equipped differently from upper substrate holder 1o. Upper substrate holder 1o preferably comprises measurement holes 12, through which a measurement of substrate 4o can take place from a rear side of substrate holder 1o. Alternatively, sensors can be arranged in the measurement holes. Measurement holes 12 are arranged in particular between the curvature changing means and the fixing means. Alternatively or in addition, lower substrate holder 1u can comprise corresponding measurement holes 12. The measurement holes penetrate holding device 1 and run in particular orthogonal to holding surface 1s. Measurement holes 12 are arranged in particular at the same distance from the centre of holding surface 1s. Measurement holes 12 are preferably arranged at a distance of 1800 or 120 from one another.

(46) Substrate holders 1u, 1o comprise a holding surface 1s, with a plurality of fixing elements 2 and sensors 3, 3. Fixing elements 2 are evacuated via lines 6 and fix substrates 4u, 4o. Diagrams are shown above and below substrate holders 1u, 1o, which diagrams show in each case distances d between sensors 3 constituted as distance sensors and substrate 4u, 4o along the x-direction (substrate diameter) for the given x-positions. The distance sensors are arranged distributed directly at curvature changing means 5 up to the fixing means. They thus extend over a partial area of holding surface is.

(47) Sensors 3 constituted as pressure sensors are arranged in the region of the fixing means, with which sensors pressures p.sub.1 are measured along the x-position of sensors 3 between substrates 4u, 4o and substrate holders 1u, 1o.

(48) Desired setpoint curvatures 15u, 15o, in particular set by means of software, as well as actual curvatures 14u, 14o measured by the distance sensors are entered in the distance diagrams. Upper substrate 4o has an actual curvature 14o, in particular present due to gravitation, while lower substrate 1u lies flat and therefore, in the sense of the present invention, does not have an actual curvature 14u (in reality, a vanishingly small curvature). It is however also conceivable that actual curvature 14o caused by gravitation is negligibly small. Both desired curvatures 15u, 15o are mirror-symmetrical in the stated example. Arbitrarily curvatures 15u, 15o can be specified. Pressure courses 16u and 16o show a pressure drop in the region of activated fixing elements 2. This shows that the fixing of substrates 4u, 4o is activated.

(49) A process step of the alignment of substrates 1u, 1o with respect to one another is not represented.

(50) FIG. 4b shows bonder 13 in a further process step. The two substrate 4u and 4o have been brought closer together by a relative movement of the two substrate holders 1u, 1o. Otherwise nothing has changed compared to the situation according to FIG. 4a.

(51) FIG. 4c shows bonder 13 in a further process step. The two substrate 1u, 1o are brought into the setpoint curvature by the use of curvature elements 5, in the case shown a gas outlet opening, through which a gas flows with a pressure p2, wherein a control of the pressure preferably takes place by means of the distance sensors. The pressures of fixing elements 2 can also be used for the control/regulation, so that the latter also take over the tasks of curvature means 5, 5 or curvature changing means 5, 5 and, within the meaning of the invention, can thus also be included in the latter.

(52) In the example shown, one of fixing elements 2 is reset for this purpose from pressure p1 to pressure p0 to achieve the desired curvature before contacting of substrates 4o, 4u. For the sake of simplicity, only three pressure values p0, p1 and p2 are shown in the shown representations. The pressure values can be controlled/regulated in particular continuously and/or constantly.

(53) FIG. 4d shows bonder 13 in a further process step. The two substrates 4u, 4o, as a result of the mutual approach of substrates 4u, 4o, form a bonding wave which propagates radially outwards, wherein the curvature of substrates 4u, 4o changes continuously (curvatures changing means). The change in curvature of lower substrate 1u and of upper substrate 1o is continuously monitored by means of the distance sensors and, if need be, corrected by curvature element 5 and/or fixing elements 2, in such a way that the setpoint curvature desired or set in each case is achieved (curvature changing means). Curvature radii R1 of upper substrate 4o and R2 of lower substrate 4u represent important parameters at the point of the bonding wave.

(54) The pressures of four inner peripheral rows of fixing elements 2 are simultaneously reduced to p0 in the case of upper holding device 1o and lower holding device 1u. Substrates 1u, 1o thus lose the fixing to holding surface 1o, in particular continuously from inside outwards, as a result whereof pressure p2 from curvature element 5 can spread further.

(55) As a result of the fact that the control takes account of the curvatures and changes in curvature of the substrates, run-out errors are minimised.

(56) FIG. 4 shows bonder 13 in a further process step. The two substrates 1u, 1o have been bonded together in a controlled manner, whereby the pressure of the outermost row of fixing elements 2 of upper holding device 1o has been reduced to p0.

REFERENCE LIST

(57) 1, 1 1, 1 holding device/substrate holder 1.sup.IV, 1.sup.V, 1.sup.VI holding device/substrate holder 1o first holding device/upper substrate holder 1u second holding device/lower substrate holder 1s, 1s, 1s, 1s holding surface 2, 2, 2, 2 fixing elements 2o fixing element surface 3, 3 sensors 4o first/upper substrate 4u second/lower substrate 4a substrate holding surface 5, 5 curvature element 6 line 7, 7, 7, 7, 7 elevations/studs 7o stud surface 8 web 9 spatial region 10 edge element 11 stud plane 12 measurement holes 13 bonder 14u, 14o actual curvature 15u, 150 setpoint curvature 16u, 16o pressure course L, L line x position d distance p pressure R1, R2 radius of curvature