High-frequency wire and high-frequency coil

Abstract

A high-frequency wire includes: a central conductor that is formed from aluminum or an aluminum alloy; and a magnetic layer that has a fibrous structure formed along a longitudinal direction of the central conductor and covers the central conductor.

Claims

1. A high-frequency wire, comprising: a central conductor that is formed from aluminum or an aluminum alloy; and a soft magnetic layer that has a fibrous structure including a crystal grain and formed along a longitudinal direction of the central conductor and covers the central conductor, the soft magnetic layer being formed from iron or an iron alloy.

2. The high-frequency wire according to claim 1, wherein the soft magnetic layer includes an insulation coating layer on an outer surface side.

3. A litz wire, comprising: a plurality of the twisted high-frequency wires according to claim 1.

4. A high-frequency coil, comprising: the high-frequency wire according to claim 1.

5. A method of manufacturing the high-frequency wire according to claim 1, comprising drawing a wire base material including a central conductor which is formed from aluminum or an aluminum alloy and a soft magnetic layer which covers the central conductor by using one or a plurality of dies, thereby obtaining the high-frequency wire in which the soft magnetic layer has a fibrous structure, the soft magnetic layer being formed from iron or an iron alloy.

6. The method of manufacturing a high-frequency wire according to claim 5, wherein a cumulative reduction rate of area when the wire base material is subjected to wire drawing is equal to or greater than 70%.

7. The method of manufacturing a high-frequency wire according to claim 5, wherein the wire base material is obtained by inserting the central conductor through a tubular soft magnetic layer body made of the soft magnetic layer.

8. The method of manufacturing a high-frequency wire according to claim 5, wherein the fibrous structure is formed by drawing the wire base material at a temperature lower than the recrystallization temperature of the soft magnetic layer.

9. The high-frequency wire according to claim 1, wherein the crystal grain has an aspect ratio greater than 5:1.

10. The high-frequency wire according to claim 1, wherein a cross-sectional area of the soft magnetic layer is equal to or less than 20% with respect to that of the entire high-frequency wire.

11. The high-frequency wire according to claim 1, wherein the fibrous structure is formed also in the central conductor along a longitudinal direction of the central conductor.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a cross-sectional view illustrating a high-frequency wire of an embodiment of the present invention.

(2) FIG. 2 is a schematic view illustrating an example of a wire-drawing die.

(3) FIG. 3 is a graph illustrating a relationship between a cumulative reduction rate of area and resistivity.

(4) FIG. 4 is a cross-sectional view illustrating the high-frequency wire having an insulation coating layer.

(5) FIG. 5A is a photograph captured by a scanning electron microscope (SEM) showing a soft magnetic layer in Example.

(6) FIG. 5B is an enlarged SEM photograph of FIG. 5A.

(7) FIG. 6A is a photograph captured by the scanning electron microscope (SEM) showing the soft magnetic layer in Comparative Example.

(8) FIG. 6B is an enlarged SEM photograph of FIG. 6A.

(9) FIG. 7A is a diagram describing a calculation method of an aspect ratio.

(10) FIG. 7B is another diagram describing the calculation method of the aspect ratio.

(11) FIG. 7C is further another diagram describing the calculation method of the aspect ratio.

(12) FIG. 8 is a photograph captured by the scanning electron microscope (SEM) showing the soft magnetic layer of the high-frequency wire in Example.

(13) FIG. 9 is another photograph captured by the scanning electron microscope (SEM) showing the soft magnetic layer of the high-frequency wire in Example.

(14) FIG. 10 is an optical photograph captured by an optical microscope showing the soft magnetic layer of the high-frequency wire in Comparative Example.

(15) FIG. 11 is a photograph captured by the scanning electron microscope (SEM) showing the soft magnetic layer of the high-frequency wire in Comparative Example.

(16) FIG. 12 is a prospective view illustrating an example of a litz wire.

(17) FIG. 13 is a prospective view illustrating an example of a high-frequency coil.

(18) FIG. 14 is another prospective view illustrating an example of the high-frequency coil.

(19) FIG. 15 is a view showing the appearance of an example of a coil.

(20) FIG. 16 is a graph illustrating a simulation result regarding a relationship between an AC frequency and AC resistance.

(21) FIG. 17A is a schematic view for describing a proximity effect.

(22) FIG. 17B is another schematic view for describing the proximity effect.

(23) FIG. 18A is a schematic view for describing a skin effect.

(24) FIG. 18B is another schematic view for describing the skin effect.

(25) FIG. 19 is a cross-sectional view illustrating an example of the high-frequency wire in the related art.

(26) FIG. 20 is a cross-sectional view illustrating another example of the high-frequency wire in the related art.

(27) FIG. 21 is a schematic view illustrating distribution of a magnetic field with respect to the high-frequency wire in FIG. 20.

(28) FIG. 22 is a table showing results from Example 1 and Comparative Example 1.

EMBODIMENTS FOR CARRYING OUT THE INVENTION

(29) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(30) (High-Frequency Wire)

(31) FIG. 1 illustrates a high-frequency wire 10 of an embodiment of the present invention. The high-frequency wire 10 includes a central conductor 1 which is formed from aluminum (Al) or an aluminum alloy and a soft magnetic layer 2 (magnetic layer) which covers the central conductor 1.

(32) As the central conductor 1, for example, it is possible to use aluminum for electric use (EC aluminum), an AlMgSi-based alloy (within JIS 6000 to 6999), and the like.

(33) Generally, an aluminum alloy is suitably adopted due to volume resistivity greater than that of EC aluminum.

(34) As the soft magnetic layer 2, it is possible to use iron, an iron alloy, nickel, a nickel alloy, and the like.

(35) As the iron alloy, it is possible to exemplify a FeSi-based alloy (FeSiAl, FeSiAlCr, and the like), a FeAl-based alloy (FeAl, FeAlSi, FeAlSiCr. FeAlO, and the like), a FeCo based-alloy (FeCo, FeCoB, FeCoV, and the like), a FeNi-based alloy (FeNi, FeNiMo, FeNiCr, FeNiSi, and the like) (such as Permalloy (registered trademark)), a FeTa-based alloy (FeTa, FeTaC, FeTaN, and the like), a FeMg-based alloy (FeMgO and the like), a FeZr-based alloy (FeZrNb, FeZrN, and the like), a FeC-based alloy, a FeN-based alloy, a FeP-based alloy, a FeNb-based alloy, a FeHf-based alloy, a FeB-based alloy, and the like.

(36) The soft magnetic layer 2 prevents an eddy current by preventing a magnetic field from entering the central conductor 1 (refer to FIG. 21).

(37) For example, it is possible to set relative permeability of the soft magnetic layer 2 to equal to or greater than 10 (for example, 10 to 500).

(38) For example, it is possible to set the thickness of the soft magnetic layer 2 to a range from 1 m to 1000 m.

(39) The magnetic layer according to the present invention is not limited to a layer exhibiting so-called soft magnetism.

(40) It is desirable that the cross-sectional area of the soft magnetic layer 2 be equal to or less than 20% with respect to the cross-sectional area of the entire high-frequency wire 10 in which the central conductor 1 and the soft magnetic layer 2 are added together.

(41) The above-referenced cross-sectional area ratio (the cross-sectional area ratio of the soft magnetic layer 2 with respect to the entire high-frequency wire 10) desirably ranges from 3% to 15%, more desirably ranges from 3% to 10%, and still more desirably ranges from 3% to 5%. It is possible to reduce high-frequency resistance by setting the ratio of the cross-sectional area of the soft magnetic layer 2 with respect to the entire high-frequency wire to the aforementioned range.

(42) For example, the diameter of the entire high-frequency wire 10 can range from 0.05 mm to 0.6 mm.

(43) The soft magnetic layer 2 has a fibrous structure formed along the longitudinal direction of the central conductor 1.

(44) It is possible to determine whether or not the soft magnetic layer 2 has the fibrous structure as mentioned above based on the fact that a plurality of granular bodies (for example, crystal grains) each of which the aspect ratio is greater than 5:1 can be confirmed when the structure of the soft magnetic layer 2 is observed by using an electron microscope or the like.

(45) Measurement of the aspect ratio will be described with reference to FIGS. 7A to 11.

(46) As illustrated in FIG. 7B, an auxiliary line 11, which is the longest diameter, is drawn in a crystal grain C1 illustrated in FIG. 7A. Continuously, as illustrated in FIG. 7C, a rectangle 14 having a pair of long sides 12 parallel to the auxiliary line 11 and a pair of short sides 13 perpendicular to the auxiliary line 11 is depicted.

(47) One long side 12 (12a) comes into contact with a contour line 15 of the crystal grain C1 at a position farthest from the auxiliary line 11 toward the one side (top in FIG. 7C), and the other long side 12 (12b) comes into contact with the contour line 15 of the crystal grain C1 at a position farthest from the auxiliary line 11 toward the other side (bottom in FIG. 7C).

(48) One short side 13 (13a) comes into contact with the contour line 15 of the crystal grain C1 at a position farthest from the auxiliary line 11 toward the one side (left in FIG. 7C), and the other short side 13 (13b) comes into contact with the contour line 15 of the crystal grain C1 at a position farthest from the auxiliary line 11 toward the other side (right in FIG. 7C).

(49) The ratio of the long side 12 and the short side 13 (L1/L2) in the rectangle 14 is referred to as the aspect ratio. The aspect ratio of the crystal grain C1 in FIG. 7C is 8.32/1.

(50) FIGS. 8 and 9 illustrate photographs captured by a scanning electron microscope (SEM) showing the iron-made soft magnetic layer 2 of the high-frequency wire 10.

(51) In FIG. 8, regarding two crystal grains (examples 1 and 2), rectangles are depicted by the above-described technique (refer to the rectangle 14 in FIG. 7C). The aspect ratios of the examples 1 and 2 are respectively 6.1/1 and 9.0/1.

(52) In FIG. 9, regarding two crystal grains (examples 3 and 4), rectangles are depicted by the above-described technique, and the aspect ratios of the examples 3 and 4 are respectively 13.3/1 and 21.2/1.

(53) All the crystal grains of the examples 1 to 4 are formed along the longitudinal direction of the high-frequency wire 10.

(54) In FIGS. 8 and 9, it is possible to confirm a plurality of the crystal grains of iron of which the aspect ratio is greater than 5:1. Accordingly, it is possible to determine that the soft magnetic layer 2 has the fibrous structure formed along the longitudinal direction of the high-frequency wire 10.

(55) When determining whether or not the soft magnetic layer 2 has the fibrous structure, it is desirable that the number of granular bodies which can be confirmed within the visual field of a target photomicrograph be equal to or less than a predetermined number (for example, 100).

(56) As described below, it is preferable that the structure of the soft magnetic layer 2 be a processed structure formed through wire-drawing processing by using a die. For example, the processed structure is a structure after being subjected to cold working.

(57) The cold working denotes processing performed at a temperature lower than the recrystallization temperature.

(58) The fibrous structure may be a structure obtained by stretching the crystal grain in a wire-drawing direction through the wire-drawing processing.

(59) For comparison, FIG. 10 illustrates a photograph captured by an optical microscope showing the iron-made soft magnetic layer of the high-frequency wire which is subjected to heat treatment (annealing treatment) at a temperature equal to or higher than the recrystallization temperature and is recrystallized. In addition, FIG. 11 illustrates a photograph captured by the scanning electron microscope (SEM) showing a nickel layer on the iron-made soft magnetic layer formed by a plating method.

(60) The above-referenced high-frequency wires include the iron-made soft magnetic layer (refer to FIG. 1). However, the soft magnetic layer has a recrystallized structure obtained by performing heat treatment at a temperature equal to or higher than the recrystallization temperature and performing recrystallization, or a plated structure.

(61) For example, the recrystallized structure is a structure obtained by causing a crystal grain in which deformation has occurred due to cold working to be replaced with a crystal having no deformation by performing recrystallization.

(62) The plated structure is a metal structure formed through wet plating. The plated structure may be amorphous.

(63) In FIG. 10, the crystal grain of which the aspect ratio is greater than 5:1 is not observed. When the aspect ratio of the crystal grain (example 5) is measured, the result is 1.5/1.

(64) In FIG. 11 as well, the crystal grain of which the aspect ratio is greater than 5:1 is not observed.

(65) In FIGS. 10 and 11, the crystal grain of which the aspect ratio is greater than 5:1 cannot be confirmed. Therefore, it is possible to mention that the soft magnetic layers in FIGS. 10 and 11 do not have the fibrous structure.

(66) It is preferable that the volume resistivity of the soft magnetic layer 2 be higher than the volume resistivity of the central conductor 1. Accordingly, it is possible to prevent the AC resistance from increasing due to an eddy current loss.

(67) The fibrous structure formed along the longitudinal direction may be formed not only in the soft magnetic layer 2, but also in the central conductor 1.

(68) In the high-frequency wire 10, an intermetallic compound layer (not illustrated) in which the composition changes obliquely from the central conductor 1 to the soft magnetic layer 2 may be formed between the central conductor 1 and the soft magnetic layer 2. For example, the intermetallic compound layer is formed from an alloy including the constituent material of the central conductor 1 and the constituent material of the soft magnetic layer 2. The intermetallic compound layer may have the volume resistivity greater than that of the soft magnetic layer 2.

(69) FIG. 4 is Modification Example of the high-frequency wire 10. In a high-frequency wire 10A illustrated therein, an insulation coating layer 3 is provided on the outer surface side of the soft magnetic layer 2. The insulation coating layer 3 is the outermost layer of the high-frequency wire 10A.

(70) The insulation coating layer 3 can be formed by applying enamel coating such as polyester, polyurethane, polyimide, polyester imide, polyamide-imide, and the like.

(71) (Litz Wire)

(72) FIG. 12 is an example of a litz wire including the high-frequency wire 10A illustrated in FIG. 4. A litz wire 60 illustrated therein is configured to have a plurality of the high-frequency wires 10A which are bundled and twisted.

(73) (High-Frequency Coil)

(74) FIGS. 13 and 14 are examples of a high-frequency coil including the high-frequency wires 10A illustrated in FIG. 4. A high-frequency coil 70 illustrated therein adopts a support body 73 having a body portion 71 and flange portions 72 which are formed at both the ends of the body portion 71.

(75) The high-frequency wires 10A are wound around the body portion 71.

(76) (Manufacturing Method of High-Frequency Wire)

(77) <Manufacturing Process of Base Material>

(78) Subsequently, an example of a method of manufacturing the high-frequency wire 10 will be described. The below-described manufacturing method is an example and does not limit the scope of the present invention. The high-frequency wire according to the embodiments of the present invention can also be manufactured by a manufacturing method other than the method exemplified herein.

(79) A central conductor formed from aluminum or an aluminum alloy is prepared. The central conductor is inserted through a tubular soft magnetic layer body. Then, a wire base material having the central conductor and the soft magnetic layer body which surrounds the central conductor is obtained.

(80) The soft magnetic layer body used for manufacturing the wire base material may have a form other than the tubular body.

(81) <Wire-Drawing Process>

(82) Subsequently, the wire base material is subjected to wire drawing by passing through one or a plurality of wire-drawing dies.

(83) FIG. 2 illustrates a wire-drawing die 20 which can be applied to the manufacturing method of the present embodiment. The wire-drawing die 20 includes an entrance portion 21, an approach portion 22, a reduction portion 23, a bearing portion 24, and a back relief portion 25.

(84) The wire-drawing die 20 is a tubular body of which the inner diameter gradually decreases from the entrance portion 21 to the reduction portion 23.

(85) For example, a reduction angle 1 which is the inclination angle of the inner surface of the reduction portion 23 with respect to the central axis can be set to approximately 8.

(86) The reduction rate of area (the difference between the cross-sectional areas of the wire base material before and after wire drawing/the cross-sectional area of the wire base material before wire drawing) calculated by using the cross-sectional area of the wire base material and the cross-sectional area of the inner space of the bearing portion 24 can be set to equal to or greater than 20%, for example, can be set to a range from 20% to 29%. When the reduction rate of area after one turn of wire drawing is within the aforementioned range, it is possible to consistently generate significant shearing stress in the same direction.

(87) A wire base material 4 is introduced into the reduction portion 23 via the entrance portion 21 and the approach portion 22 and is processed at the reduction portion 23 so as to have a diameter d2 smaller than a diameter d1 before being subjected to wire drawing.

(88) The wire-drawing process may be performed only once. However, the wire-drawing process may be performed several times by using another wire-drawing die 20 having a different inner diameter measurement. In this manner, it is possible to raise the reduction rate of area. For example, it is possible to perform wire drawing in stages by using a plurality of the wire-drawing dies 20.

(89) For example, the cumulative reduction rate of area can be set to be equal to or greater than 70%.

(90) Accordingly, it is possible to reliably and easily form the soft magnetic layer 2 having a fibrous structure formed along the longitudinal direction of the central conductor 1.

(91) In the wire-drawing process in which the wire-drawing die 20 is used, the fibrous structure may be formed not only in the soft magnetic layer 2, but also in the central conductor 1.

(92) In the high-frequency wire 10, the soft magnetic layer 2 has the fibrous structure formed along the longitudinal direction of the central conductor 1, there are plenty of grain boundaries in the magnetic layer, and dislocation density is high. Therefore, resistivity in the soft magnetic layer 2 is high. Accordingly, it is possible to prevent the eddy current from occurring due to an external magnetic field and to reduce the proximity effect.

(93) FIG. 3 is a graph illustrating a relationship between the cumulative reduction rate of area and the resistivity of the soft magnetic layer 2. As illustrated in the diagram, when the cumulative reduction rate of area becomes high and a fibrous structure is formed in the soft magnetic layer 2, the resistivity increases.

(94) When the resistivity increases, the eddy current is unlikely to be generated. Therefore, it is considered that the proximity effect is reduced.

(95) In addition, according to the report of the below-referenced literature, as the resistivity of the magnetic layer becomes high, the AC resistance is prevented from increasing due to the eddy current loss.

(96) COMPEL-THE INTERNATIONAL JOURNAL FOR COMPUTATION AND MATHEMATICS IN ELECTRICAL AND ELECTRONIC ENGINEERING 28(1): 57-66 (2009), Mizuno et. al.

(97) In addition, when copper or the like is used for the central conductor in a coil used at high frequencies, the AC loss caused by the proximity effect becomes significant. Meanwhile, in the high-frequency wire 10 of the present embodiment, aluminum (or an aluminum alloy) is used for the central conductor 1. Therefore, compared to a case of using copper or the like for the central conductor 1, it is possible to prevent the influence of the proximity effect.

(98) In a high-frequency wire used in equipment such as a high-frequency transformer, a high-speed motor, a reactor, a dielectric heating device, a magnetic head device, a non-contact feeding device, and the like conducting high-frequency currents in a range approximately from several kHz to several hundred kHz, for the purpose of reducing the AC loss, reduction of the diameter of the winding is attempted, or the litz wire is employed.

(99) However, in soldering treatment performed for the connection, due to reasons such as time and effort taken in work of eliminating the insulation film, limitations of wire drawing, and the like, there is a limit to reduction of diameter.

(100) In contrast, according to the high-frequency wire 10 of the present embodiment, even though a litz wire which includes element wires having thick diameters and a small number of element wires is employed, it is possible to reduce the loss.

EXAMPLE 1

(101) The high-frequency wire 10 illustrated in FIG. 1 was manufactured as follows.

(102) A central conductor formed from aluminum having an outer diameter of 9 mm was inserted through a steel pipe (soft magnetic layer body) having an inner diameter of 10 mm and an outer diameter of 12 mm, and the wire base material 4 was obtained.

(103) As illustrated in FIG. 2, the wire base material 4 was subjected to wire drawing in stages by being caused to pass through the plurality of wire-drawing dies 20. Then, the high-frequency wire 10 which included the soft magnetic layer 2 having the outer diameter of 2.1 mm and the central conductor 1 having the outer diameter of 1.9 mm was obtained.

(104) FIG. 5A is a photograph captured by the SEM showing the soft magnetic layer 2, and FIG. 5B is an enlarged SEM photograph of FIG. 5A.

(105) With reference to the diagrams, it was possible to confirm a plurality of the crystal grains of which the aspect ratios exceeded 5/1. Therefore, it was confirmed that the soft magnetic layer 2 had the fibrous structure formed along the longitudinal direction of the central conductor 1.

(106) The specific resistance of the central conductor 1 and the soft magnetic layer 2 in the high-frequency wire 10 was calculated as follows.

(107) A central conductor in a single body made from the same material as that of the soft magnetic layer 2 of the high-frequency wire 10 was subjected to reduction of area through the wire-drawing process, and the specific resistance thereof was measured. FIG. 22 shows the value thereof as the specific resistance of the soft magnetic layer 2.

(108) Continuously, the specific resistance of the high-frequency wire 10 (composite material) was measured. 1FIG. 22 shows the value obtained by subtracting the above-referenced specific resistance of the soft magnetic layer 2 from the measured value, as the specific resistance of the central conductor 1.

COMPARATIVE EXAMPLE 1

(109) The high-frequency wire including the central conductor formed from aluminum and the iron-made soft magnetic layer was manufactured, and heat treatment was performed at a temperature equal to or higher than the recrystallization temperature of the soft magnetic layer.

(110) No fibrous structure formed along the longitudinal direction was confirmed in the soft magnetic layer.

(111) By applying a technique similar to that in Example 1, the specific resistance of the central conductor and the soft magnetic layer was measured. FIG. 22 shows the results thereof.

(112) According to FIG. 22 in Example 1, compared to Comparative Example 1, it was found that the specific resistance of the soft magnetic layer 2 can be made higher.

EXAMPLE 2

(113) The wire base material 4 obtained in a similar manner as that in Example 1 was subjected to wire drawing in stages by being caused to pass through the plurality of wire-drawing dies 20. Then, the high-frequency wire 10 was obtained. The high-frequency wire 10A illustrated in FIG. 4 was obtained by forming the insulation coating layer 3 on the outer surface of the high-frequency wire 10. The thickness of the soft magnetic layer 2 was 3 m, the outer diameter of the soft magnetic layer 2 was 126 m, and the outer diameter of the central conductor 1 was 120 m.

(114) As illustrated in FIG. 12, the litz wire 60 adopting the high-frequency wires 10A as the element wires was manufactured.

(115) The litz wire 60 was configured to have 1,500 high-frequency wires 10A, and the length of the litz wire 60 was 21 m.

(116) As illustrated in FIG. 15, a coil 80 was manufactured by using the litz wire 60. The number of turns of the coil 80 was 16. Inductance was 1.1810.sup.4 H.

(117) For example, the AC resistance per unit length of the lead wire configuring the coil can be presented through the following expression (refer to Paragraphs [0041] and [0070] of PCT International Publication No. WO 2013/042671).
R.sub.ac=R.sub.s+R.sub.p
R.sub.s (/m) is the high-frequency resistance per unit length caused by a skin effect, and R.sub.p (/m) is the high-frequency resistance per unit length caused by the proximity effect. Moreover, R.sub.p is a value proportional to the square of the shape factor (1/m) indicating the strength of the external magnetic field.
R.sub.p=.sup.2D.sub.p
D.sub.p (.Math.m) indicates the high-frequency loss per unit length caused by the proximity effect.

(118) The shape factor of the coil 80 in this example is 90 mm.sup.1.

(119) Regarding the coil 80 in Example 2, FIG. 16 illustrates the simulated result of a relationship between the AC frequency (horizontal axis) and the AC resistance (vertical axis).

COMPARATIVE EXAMPLE 2

(120) The litz wire 60 illustrated in FIG. 12 was manufactured in a manner similar to that in Example 2 except that Cu wires (outer diameter of 120 m) were adopted in place of the high-frequency wires 10. Then, the coil 80 illustrated in FIG. 15 was manufactured by using this litz wire 60. Other specifications were similar to those in Example 2.

(121) Regarding the coil 80 in Comparative Example 2, FIG. 16 illustrates the simulated result of a relationship between the AC frequency and the AC resistance.

COMPARATIVE EXAMPLE 3

(122) The litz wire 60 illustrated in FIG. 12 was manufactured in a manner similar to that in Example 2 except that Al wires (outer diameter of 120 m) were adopted in place of the high-frequency wires 10. Then, the coil 80 illustrated in FIG. 15 was manufactured by using this litz wire 60. Other specifications were similar to those in Example 2.

(123) Regarding the coil 80 in Comparative Example 3, FIG. 16 illustrates the simulated result of a relationship between the AC frequency and the AC resistance.

(124) As illustrated in FIG. 16, in Example 2 in which the high-frequency wire 10 having the central conductor 1 formed from Al and the soft magnetic layer 2 including Fe was adopted, compared to Comparative Examples 2 and 3 in which Cu wires and Al wires were adopted, it was possible to obtain a result in which the AC resistance was reduced in the frequency band equal to or higher than 70 kHz.

(125) The above-described embodiments have exemplified a device and a method in order to realize the technical ideas of the invention. Therefore, in the technical ideas of the invention, the material properties, the shapes, the structures, the arrangements, and the like of the configurational components are not specified.

INDUSTRIAL APPLICABILITY

(126) A high-frequency wire and a high-frequency coil of the present invention can be utilized in the electronic equipment industry including the industry of manufacturing various devices such as a non-contact feeding device, a high-frequency current generation device, and the like including a high-frequency transformer, a motor, a reactor, a choke coil, an induction heating device, a magnetic head, a high-frequency feeding cable, a DC power unit, a switching power source, an AC adapter, eddy current detection-type displacement sensor/flaw sensor, an 1I cooking heater, a coil, a feeding cable, and the like.

DESCRIPTION OF THE REFERENCE NUMERALS

(127) 1 CENTRAL CONDUCTOR, 2 SOFT MAGNETIC LAYER (MAGNETIC LAYER), 10 HIGH-FREQUENCY WIRE, 60 LITZ WIRE, AND 70 HIGH-FREQUENCY COIL