Method for Producing an Electrical Component

Abstract

A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.

Claims

1-15. (canceled)

16. A method for producing an electrical component, the method comprising: providing a carrier element; providing a material having a temperature-dependent resistance; applying the material on a surface of the carrier element for producing a resistance layer on the carrier element; and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.

17. The method according to claim 16, further comprising: applying electrodes for applying a voltage to the resistance layer, wherein at least one of the electrodes is arranged on a surface of the resistance layer or on a further surface of the carrier element.

18. The method according to claim 16, wherein the carrier element comprises a non-electrically conductive material having a thermal conductivity of at least 15 W/K.

19. The method according to claim 16, wherein the carrier element comprises a material composed of aluminum oxide, aluminum nitride or combinations thereof.

20. The method according to claim 16, wherein the material of the resistance layer is provided before the resistance layer on the carrier element is applied as a calcined metal oxide, which is not sintered.

21. The method according to claim 16, wherein the resistance layer comprises a material composed of nickel oxide, manganese oxide, copper oxide, zinc oxide or composed of combinations thereof.

22. The method according to claim 16, wherein the material of the resistance layer is provided as a screen-printable ceramic paste before the resistance layer is applied onto the carrier element, and wherein a structure of the resistance layer is printed onto the carrier element before the resistance layer is sintered by a screen printing method.

23. The method according to claim 17, wherein applying the electrodes comprises applying the electrodes by a screen printing or sputtering method onto the surface of the resistance layer or onto the further surface of the carrier element.

24. The method according to claim 16, wherein the resistance layer is applied onto a top side of the carrier element, and wherein an adhesive layer is applied onto an underside of the carrier element in order to adhesively bond the electrical component onto a support.

25. The method according to claim 16, wherein the resistance layer is applied onto a top side of the carrier element, wherein a silver layer is applied onto an underside of the carrier element in order to solder the electrical component onto a support.

26. An electrical component comprising: a carrier element; and a resistance layer comprising a material having a temperature-dependent resistance, wherein the resistance layer is arranged on a surface of the carrier element and is linked to the carrier element by a sintering process.

27. The electrical component according to claim 26, further comprising electrodes for applying a voltage to the resistance layer, wherein at least one of the electrodes is arranged on a surface of the resistance layer or on a further surface of the carrier element.

28. The electrical component according to claim 26, wherein the material of the carrier element is not electrically conductive and has a thermal conductivity of at least 15 W/K.

29. The electrical component according to claim 26, wherein the carrier element has a thickness between 100 ?m and 17 mm inclusive, and wherein the resistance layer has a layer thickness of between 5 ?m and 15 ?m inclusive.

30. The electrical component according to claim 26, wherein the carrier element contains a material composed of aluminum oxide or aluminum nitride or combinations thereof, and wherein the resistance layer comprises a calcined metal oxide.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The invention is explained in greater detail below with reference to figures showing exemplary embodiments of the method for producing the electrical component and embodiments of the electrical component. In the figures:

[0015] FIG. 1 shows one embodiment of a method for producing a temperature-sensitive electrical component;

[0016] FIG. 2A shows one embodiment of a temperature-sensitive electrical component;

[0017] FIG. 2B shows a further embodiment of a temperature-sensitive electrical component;

[0018] FIG. 3A shows a further embodiment of a temperature-sensitive electrical component; and

[0019] FIG. 3B shows a further embodiment of a temperature-sensitive electrical component.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0020] FIG. 1 shows one embodiment of a method for producing a temperature-sensitive electrical component 1. Various embodiments of the electrical component 1 are shown in the subsequent FIGS. 2A, 2B, 3A and 3B. The method is explained below with reference to FIG. 1, and in the process reference is also made to the embodiments of the method that are shown in FIGS. 2A to 3B.

[0021] In a method step A, firstly a carrier element 10 is provided. In a method step B, a material having a temperature-dependent resistance is furthermore provided. In a method step C, the material is applied on a surface O10 of the carrier element 10 for producing a resistance layer 20 on the carrier element. Afterward, in a method step D, the resistance layer 20 is sintered for linking the resistance layer 20 to the carrier element 10. In a method step E, electrodes 30a, 30b are applied to the electrical component produced until then, for applying a voltage to the resistance layer 20 of the component. At least one of the electrodes 30a and 30b can be arranged on a surface O20 of the resistance layer 20 or on a further surface U10 of the carrier element 10.

[0022] FIGS. 2A, 2B, 3A and 3B illustrate various embodiments of the electrical component 1 which has been produced by the method sequence depicted schematically in FIG. 1. The temperature-sensitive electrical component 1 comprises the carrier element 10 and also the resistance layer 20 composed of a material having a temperature-dependent resistance. The resistance layer 20 is arranged on the surface O10 of the carrier element 10 and is linked to the carrier element 10 by a sintering process.

[0023] For applying a voltage to the resistance layer 20, the temperature-sensitive electrical component in FIGS. 2A to 3B furthermore comprises the electrodes 30a and 30b. At least one of the electrodes 30a and 30b is arranged on the surface O20 of the resistance layer 20 or on a further surface U10 of the carrier element 10.

[0024] In method step A, the carrier element 10 is preferably provided from a non-electrically conductive material. The carrier layer 10 of the electrical component shown in FIGS. 2A to 3B therefore preferably comprises for the carrier element 10 a material which is not electrically conductive. Furthermore, in method step A, the carrier element 10 can preferably be provided from a material having thermally highly conductive properties. The carrier element 10 can be provided, for example, from a material having a thermal conductivity of at least 15 W/K. The electrical component 1 shown in FIGS. 2A to 3B therefore preferably comprises a thermally highly conductive material, for example, a material having a thermal conductivity of at least 15 W/K.

[0025] In method step A, the carrier element 10 can be provided, for example, from a material composed of aluminum oxide or aluminum nitride or combinations thereof. In a manner corresponding to method step A, the electrical component shown in FIGS. 2A to 3B can therefore comprise a material composed of aluminum oxide or aluminum nitride or composed of combinations thereof. The carrier element 10 can have a thickness of between 100 ?m and 2 mm.

[0026] In method step B, the material of the resistance layer 20 is provided before applying the resistance layer on the carrier element 10, for example, as a material which is not sintered. The material of the resistance layer 20 can be provided as a calcined metal oxide which is not sintered. In particular, in method step B, the resistance layer 20 can be provided from a material composed of nickel oxide, manganese oxide, copper oxide, zinc oxide or composed of combinations thereof.

[0027] In a manner corresponding to method step B, the temperature-sensitive electrical component 1 shown in FIGS. 2A to 3B preferably comprises a non-sintered material as material for the resistance layer 20. The resistance layer 20 can contain, for example, a calcined metal oxide which is not sintered. In particular, the resistance layer 20 can contain nickel oxide, manganese oxide, copper oxide, zinc oxide or combinations thereof. The resistance layer 20 can have a layer thickness of between 5 ?m and 15 ?m.

[0028] In accordance with one possible embodiment of the method, firstly, in method step B, before applying the resistance layer 20 onto the carrier element 10, the material of the resistance layer 20 can be provided as a screen-printable ceramic paste which is not yet sintered and therefore does not yet have its final properties. In the subsequent method step C, before the actual sintering of the resistance layer 20, a structure of the resistance layer 20 can be printed onto the carrier element 10. The structure of the resistance layer 20 can be printed onto the carrier element 10 by means of a screen printing method, in particular, before the resistance layer is sintered and thereby fixedly linked to the carrier element.

[0029] The printable paste can be embodied as a metal oxide-ceramic powder mixture having an NTC characteristic. Since the paste is not yet sintered when it is applied onto the carrier element, the material of the resistance layer 20 does not yet have its final properties at the time of printing, and it assumes said final properties only after the sintering process. The stability of the temperature-sensitive electrical component is therefore higher than if pastes were used which already had their final properties upon being applied onto the carrier element 10, for example, pastes containing a sintered material. The production of the screen-printable ceramic paste makes it possible to print arbitrary structures onto the material of the carrier element 10 and to link them thermally and mechanically to the material of the carrier element 10.

[0030] Owing to the use of the carrier element as a substrate onto which the temperature-dependent resistance layer is applied, the temperature-sensitive electrical component has a high mechanical stability. Furthermore, the electrical component has a high thermal conductivity and at the same time ensures an electrical insulation between the material of the resistance layer 20 and a support onto which the carrier element 10 is applied.

[0031] In the embodiment of the electrical component as shown in FIG. 2A, the electrodes 30a and 30b for applying a voltage to the resistance layer 20 are applied on the surface O20 of the resistance layer 20. The two electrodes 30a and 30b can be arranged, for example, on the top side of the resistance layer 20. In the embodiment of the electrical component 1 as shown in FIG. 2B, one of the electrodes 30a is arranged on the surface O20 of the resistance layer 20 and a further electrode 30b is arranged on a surface U10 of the carrier element 10. The electrode 30a can be applied, for example, on the top side of the resistance layer 20. The electrode 30b can be arranged on the underside of the carrier element 10. The electrode 30b can be connected to the resistance layer 20, for example, via a plated-through hole 60 through the carrier element 10. The electrodes 30a and 30b can be applied by means of a screen printing or sputtering method onto the surface O20 of the resistance layer 20 or onto the surface U10 of the carrier element 10.

[0032] FIG. 3A shows the embodiment of the temperature-sensitive electrical component 1 shown in FIG. 2A, wherein an adhesive layer 40 for adhesively bonding the electrical component 1 onto a support is additionally arranged on the underside U10 of the carrier element 10. The adhesive layer 40 can be a highly thermally conductive adhesive, for example, with which the underside U10 of the carrier element 10 is coated. When using the temperature-sensitive electrical component 1 in the embodiment shown in FIG. 3A, a user can adhesively bond the carrier element 10, by means of the adhesive layer 40 applied to the underside of the carrier element 10, directly onto the surface of a body whose temperature is to be measured. As an alternative thereto, a user can also himself/herself provide the underside U10 of the carrier element 10 with an adhesive layer 40.

[0033] FIG. 3B shows an embodiment of the temperature-sensitive electrical component 1 corresponding to the configuration shown in FIG. 2B, wherein the underside U10 of the carrier element 10 is coated with a silver layer 50. The silver layer 50 makes it possible to solder the carrier element 10 onto a support in order to determine the temperature of the support.