STICKER WITH IC TAG
20180197060 ยท 2018-07-12
Assignee
Inventors
Cpc classification
G06K19/0716
PHYSICS
G06K19/07726
PHYSICS
G06K19/0776
PHYSICS
G06K19/073
PHYSICS
B65D51/18
PERFORMING OPERATIONS; TRANSPORTING
G06K19/07798
PHYSICS
International classification
Abstract
A sticker with IC tag comprises: an antenna portion; and an IC chip coupled to the antenna portion and having a function of communicating through the antenna portion. The sticker with IC tag is installed on a covered container. The sticker with IC tag comprises a single-stroke line portion, which is coupled to the IC chip and adhered to an upper surface of a cover portion of the covered container. The IC chip detects disconnection of the single-stroke line portion.
Claims
1. A sticker with IC tag comprising: an antenna portion; and an IC chip coupled to the antenna portion and having the function of communicating through the antenna portion, the sticker with IC tag being installed on a covered container, wherein, the sticker with IC tag comprises a single-stroke line portion, which is coupled to the IC chip and is adhered to an upper surface of a cover portion of the covered container, and, the IC chip detects disconnection of the single-stroke line portion.
2. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by winding lines, and, the sum of the widths of two adjacent lines and the distance between the lines is within 0.225 mm to 3 mm.
3. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by spiral lines, and, the sum of the widths of two adjacent lines and the distance between the lines is within 0.225 mm to 3 mm.
4. The sticker with IC tag of claim 1, wherein the single-stroke line portion is formed by the following circuit pattern: bending one line into a zigzag shape.
5. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by the following circuit pattern: twisting two winding lines in parallel in the same direction and connecting ends of said two winding lines at one side of winding axis with a connection line.
6. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by connecting the following two circuit patterns: twisting two winding lines in parallel in the same direction and connecting ends of the two winding lines at the winding shaft side with a connection line.
7. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by the following circuit pattern: twisting one winding line into a spiral shape across the surface and the back of a two-side single-layer substrate.
8. The sticker with IC tag of claim 1, wherein the single-stroke line portion is formed by the following circuit pattern: twisting one winding line into a spiral shape across different layers of a multilayer substrate.
9. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is formed by the following circuit pattern: twisting one winding line into a spiral shape on a side of a single-side single layer substrate, and, disposing an insulating layer between an inner circumference lead of the winding line and the spiral portion, the inner circumference lead being drawn from an inner circumference end portion of the winding line.
10. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is adhered in a manner that at least a portion of an upper surface of the cover is covered, said portion corresponds to an inner side of the opening of the covered container.
11. The sticker with IC tag of claim 10, wherein, the single-stroke line portion is adhered in a manner that the whole upper surface of the cover is covered.
12. The sticker with IC tag of claim 1, wherein, the single-stroke line portion is a part of the antenna portion, and, the IC chip is to detect disconnection of the single-stroke line portion based on whether or not the IC chip can communicate through the antenna portion.
13. A covered container having the sticker with IC tag of claim 1 adhered thereto.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012]
[0013]
[0014]
[0015]
[0016]
[0017]
[0018]
[0019]
DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS
[0020] The present invention will be described by description of the following representative embodiments. It will be understood that the following embodiments are intended to be representative of the present invention and that the present invention is not necessarily limited to these representative embodiments.
[0021] In the following descriptions, the first embodiment of the present disclosure will be explained with reference to
First Embodiment
[0022]
[0023] In addition, the disconnection detection circuit 13 comprises a single-stroke line portion 20 constituted of a single-stroke line shaped conductor. As an example of the circuit pattern of the single-stroke line portion 20, a circuit pattern formed by winding lines can be enumerated. For example, as shown in
[0024] The IC chip 12 has a function of detecting on and off of the disconnection detection circuit 13 including the single-stroke line portion 20, especially, detecting disconnection of the single-stroke line portion 20. In addition, in the sticker with IC tag 400 in UHF band of the present embodiment, the IC chip 12 utilizes UCODE G2iL+ produced by NXP Semiconductors Corporation, but it is not limited to this. An IC chip such as UCODE G2iM+ produced by NXP Semiconductors Corporation that detects disconnection using resistance of the disconnection detection circuit other than antenna terminals may also be utilized, for example.
[0025]
[0026] In addition, the disconnection detection circuit 13 comprises a single-stroke line portion 20 formed by a winding shaped conductor. The structure of the single-stroke line portion 20 is identical to that shown in
[0027] The IC chip 12 has the function of detecting on and off of the disconnection detection circuit 13 including the single-stroke line portion 20. In addition, in the sticker with IC tag 400 in HF band in the present embodiment, the IC chip 12 utilizes ICODE SLIX produced by NXP Semiconductors Corporation, but it is not limited to this.
[0028] In addition, while
[0029] Next, the adhering method of the sticker with IC tag of the present embodiment is illustrated.
[0030]
[0031] In addition,
[0032] According to the structure of the present embodiment, for example, inserting a tool such as a needle into an upper surface of cover such as the cork will make disconnection of the single-stroke line portion 20 happen. The IC chip 12 can detect disconnection of the single-stroke line portion 20 and detect malicious needle traces so as to reliably prevent the occurrence of inserting a needle into the cork for illegal replacement of the contents.
[0033] In addition, while in the present embodiment, a bottle having a cork such as a wine bottle is illustrated as an example of the covered container, the use of the sticker with IC tag of the present disclosure is not limited to this. The sticker with IC tag of the present disclosure may also be applied for example to a container having a thinner aluminum cover, a container having a upper surface into which a needle may be easily inserted, etc.
[0034] In the following description, a second embodiment of the present disclosure will be explained with reference to
Second Embodiment
[0035]
[0036] The single-stroke line portion 20 is formed by bending one line 50 into a zigzag shape. As shown in
[0037] According to the structure of the present embodiment, even if the insertion position of a needle with a smaller diameter slightly deviates, still it can reliably cause the line 50 to disconnect, so as to more reliably prevent the occurrence of illegal replacement of the contents with a finer needle.
[0038] In the following description, modifications of the present disclosure will be explained with reference to
Varied Embodiment
[0039] As an example of the circuit pattern of a single-stroke line portion formed by winding shaped lines, the first embodiment described above enumerates a circuit pattern formed by bending one line into a zigzag shape, but it is not limited to this. For example, the circuit patterns shown in
[0040]
[0041] In addition, as another example of the circuit pattern of the single-stroke line portion 20, as shown in
[0042] Besides, in addition to the winding lines, the spiral lines shown in
[0043]
[0044] In the situation where the circuit pattern 200 is formed on a double-sided single-layer substrate, for example, the inner circumference lead 320 is disposed on the back side of the substrate, and the outer circumference lead 330 and the spiral portion 310 are disposed on a surface of the substrate. In other words, the single-stroke line portion 20 is formed by the following circuit pattern 200: one winding line is twisted into a spiral shape across the surface and the back of the double-sided single layer substrate.
[0045] In addition, in the situation where the circuit pattern 200 is formed on a multilayer substrate, for example, the inner circumference lead 320 is disposed on one layer of the substrate, and the outer circumference lead 330 and the spiral portion 310 are disposed on another layer of the substrate. In addition, the outer circumference lead 330 and the spiral portion 310 can be further disposed on different layers of the substrate. In other words, the single-stroke line portion 20 is formed by the following circuit pattern 200: one winding line is twisted into a spiral shape across the different layers of the multilayer substrate.
[0046] In addition, as a further example of the circuit pattern of the single-stroke line portion 20 involved in a modification, as shown in
[0047] In addition, for the circuit patterns of these modifications, it is preferred to set the sum of the widths of the two adjacent lines and the distance between the two lines to be a value between 0.225 mm to 3 mm.
[0048] Further, while a wine bottle with a cork is illustrated as an example of the container of the present disclosure in the above descriptions, it is not limited to this. The present disclosure may also be applied to beverage bottles, liquid seasoning bottles, etc.
[0049] The embodiments and modifications of the present disclosure are illustrated above. However, various omissions, replacements, and modifications may be made within the scope of the idea of the present disclosure.
[0050] Reference Numerals: 10 Radiation element; 11 Slit (or loop circuit) for impedance matching adjustment; 12 IC chip; 13 Disconnection detection circuit; 14 Substrate; 15 Loop circuit for antenna; 20 Single-stroke line portion; 41 Tag paper; 50 Lines; 51 Gap; 62 Needle; 100, 100 IC tag insert; 200 Circuit pattern; 210, 220 Winding lines; 230 Connection line; 310 Spiral portion; 320 Inner circumference lead; 330 Outer circumference lead; 400, 400 sticker with IC tag; 600 Covered container; 610 Cover portion; 620 Container body