Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case

Abstract

A method of making leak tight electrical connections through the wall of a ceramic package, for example a ceramic package used on an image intensifier tube. The method comprises a hole metallisation step (500) to obtain vias, the metallisation step comprising the deposition of a bond layer (510), a diffusion barrier (520) acting as a metallic base layer and a wetting agent (530). For each via, a filler metal preform made of indium or a eutectic chosen from among InSn, AuSn, AuGe, AgSn is deposited (540) on each orifice and is heated to a temperature higher than its melting temperature (550) such that the molten filler metal closes off the via to make it leak tight.

Claims

1. Method of manufacturing a leak tight electrical connection through a wall of a ceramic package of an image intensifying tube, the ceramic package being provided with a hole opening up on an internal surface of the package through a first orifice and on an outside surface of the package through a second orifice, the method comprising: metallizing the hole to obtain a via, by successively depositing a metallic bond layer, a diffusion barrier and a wetting agent layer; depositing a portion of filler metal made of indium or a eutectic chosen from among AuSn, AuGe, AgSn, InSn on each of the first and second orifices; melting said portion of filler metal, the molten filler metal closing off the via so as to make the via leak tight.

2. The method of making a leak tight electrical connection though the wall of a ceramic package according to claim 1, wherein the bond layer is composed of a metal chosen from among tungsten, molybdenum, titanium and chromium.

3. The method of making a leak tight electrical connection though the wall of a ceramic package according to claim 1, wherein the diffusion layer is made from a metal chosen from among nickel, chromium, a nickel-chromium alloy and platinum.

4. The method of making a leak tight electrical connection though the wall of a ceramic package according to claim 1, wherein the wetting agent layer is made of gold or silver.

5. The method of making a leak tight electrical connection though the wall of a ceramic package according to claim 1, wherein the AuSn eutectic is composed of 80% gold and 20% tin, the AuGe eutectic is composed of 88% gold and 12% germanium, the AgSn eutectic is composed of 96.5% tin and 3.5% silver, the InSn eutectic is composed of 52% of indium and 48% tin, the percentages being by mass.

6. Image intensifier tube comprising a ceramic package forming the tube body, an entry window on the inside face of which is deposited a photocathode and closing the tube at a first end, an exit window on the internal face of which is deposited a phosphor screen, a micro-channel plate called MCP, located on a shoulder of the ceramic package, the ceramic package being provided with electrical connections passing through a wall of the ceramic package and connecting electrodes of the MCP with external contact pins, wherein the electrical connections are made using the method in claim 1.

7. The image intensifier tube according to claim 6, wherein the ceramic package comprises a vertical annular stop on a top part of the ceramic package, said stop being an integral part of the ceramic package, the inside face of the entry window resting on this stop when the entry window is bonded on the package, said stop fixing a predetermined distance between the photocathode and the top face of the MCP.

8. The image intensifier tube according to claim 6, wherein the entry window and the exit window are bonded on the ceramic package using seals made of indium or a eutectic material chosen from among InSn with 52% indium and 48% tin, AuSn with 80% gold and 20% tin, AuGe with 88% gold and 12% germanium and AgSn with 96.5% tin and 3.5% silver, the percentages being by mass.

9. The intensifier tube according to claim 6, wherein the ceramic package is made by injection moulding of ceramic particles followed by sintering.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other characteristics and advantages of the invention will become clear after reading a preferred embodiment of the invention, given with reference to the appended figures among which:

(2) FIG. 1, already described, is a vertical sectional view of the structure of an image intensifier tube known in prior art;

(3) FIG. 2, already described, is a vertical sectional view of the structure of an image intensifier tube according to one embodiment of the invention;

(4) FIG. 3 represents an exploded view of the structure of the image intensifier tube in FIG. 2;

(5) FIG. 4 represents a ceramic package used in the structure intensifier tube in FIG. 2;

(6) FIG. 5 diagrammatically illustrates a method of making leak tight electrical connections in a ceramic package according to one embodiment of the invention.

DETAILED PRESENTATION OF A PREFERRED EMBODIMENT

(7) FIG. 2 represents a sectional view of an image intensifier tube according to one embodiment of the invention.

(8) As in prior art described above, the image intensifier tube, 200, comprises a ceramic package 210 forming the body of the tube, an entry window 220 on the inside of which is deposited a photocathode, and an exit window, and an outlet window, 230 on the inside face of which a phosphor screen is deposited.

(9) The inlet and outlet windows are generally made in the form of glass bricks. The external face of the exit window can be connected to a bundle of optical fibres to transfer the intensified image.

(10) The tube 200 has an essentially cylindrical shape along a OZ optical axis. Alternatively, the tube 200 can have a shape whose cross-section is square, rectangular, hexagonal, or another shape. A coordinate system (R, Z) is represented in which R is the radial direction of the tube and Z is the axial direction du tube, parallel to the OZ optical axis, oriented in the inverse direction of propagation of photons and electrons inside the tube 200. With this convention, the upper part of the tube is composed of the entry window and the lower part of the tube is composed of the exit window.

(11) A micro-channel plate or MCP, 240, is supported on a shoulder, 211, of the ceramic package facing the photocathode, the entry window resting on a vertical stop, 219, forming an integral part of the ceramic package and overhanging this shoulder. The distance between the photoemissive layer of the photocathode and the entry surface of the MCP is entirely determined by the geometry of the ceramic package, and more precisely by the height of the stop relative to the shoulder and by the thickness of the MCP. Integration of a vertical stop into the ceramic package provides a means of forming a monolithic assembly and reducing the number of elements in the tube, and it improves its stiffness and also the extent to which geometric constraints are respected.

(12) Vertical electrical connections 215 are provided in the shoulder of the ceramic package so that electrodes of the MCP can be connected to the external contact pins (not shown).

(13) The entry window 220 is bonded so as to be leak tight on an annular surface 217 of the upper part of the ceramic package, for example by means of a bonding seal made of indium, in a manner known in itself. The exit window is sealed in the same way on the ceramic package.

(14) As an alternative to indium, the bonding seal can be composed of a eutectic material with a high melting point chosen from among InSn with 52% indium and 48% tin, AuSn with 80% gold and 20% tin, AuGe with 88% gold and 12% germanium and AgSn with 96.5% tin and 3.5% silver, the percentages being by mass.

(15) The ceramic package may be made using a Ceramic Injection Moulding (CIM) technique. This technique consists of injecting a raw material composed of organic materials with a high content of fine ceramic particles into a mould and creating a high temperature and high pressure in the mould. After moulding, the organic binders are eliminated by dissolution in a solvent, followed by heat treatment. The product thus obtained can then be sintered or co-sintered.

(16) This injection moulding followed by sintering can give complex geometric shapes with a significantly higher precision than that obtained by sintering layers. In other words, the ceramic package thus made is better defined geometrically and can respect stricter dimensional tolerances than is possible with a multilayer ceramic package according to prior art. Thus, parallelism and distance constraints between the photocathode and the MCP, dependent on the geometry of the ceramic package, are better respected.

(17) FIG. 3 represents an exploded view of the image intensifier tube in FIG. 2.

(18) The figure shows the ceramic package 210 on which the MCP 240 and the entry window 220 are supported, the other end of the package being closed by the exit window 230.

(19) The ceramic package 210 is annular in shape with a central recess 212 delimiting the active area of the intensifier tube. The profile of the upper part of the package comprises, working from the centre towards the periphery of the package, the annular shoulder on which the MCP is supported, the annular stop 219 on which the entry window is supported, and the annular peripheral surface 210 onto which the entry window is bonded.

(20) FIG. 4 represents the detail of the ceramic package, 210.

(21) The shoulder 211 supported by an annular base 216 can be seen in a bottom view, the shoulder and the annular base being connected by ribs 213 extending radially starting from the annular base. The inside of the annular base defines the central recess 212. Vias 215 pass through the shoulder 211 and open up on its lower surface 214. These vias are closed off at their two ends by a metal or a metallic eutectic as explained below.

(22) The vias thus closed off make the electrical connections between the electrodes of the MCP and the external contact pins, while guaranteeing that the tube is leak tight. There are at least two electrodes of the MCP, one electrode being connected to the upper face and one electrode being connected to the lower face, which requires the presence of at least two vias in the shoulder. Obviously, there may be more than two vias, particularly if the electrodes are segmented.

(23) The electrical connections are generally obtained as described below with reference to FIG. 5.

(24) The method of making electrical connections is applicable to the unfinished ceramic package, simply provided with holes. These holes pass through the shoulder and open up on its upper face and its lower face.

(25) The method comprises three steps 500, 540 and 550.

(26) The first step is a metallisation step done by physical vapour deposition (PVD), chemical vapour deposition (CVD), cathodic sputtering, or electrolytic deposit.

(27) This first step comprises a first sub-step 510 consisting of depositing a metallic bond layer on the inner surface of the hole. The function of the bond layer is to bond to the ceramic surface (formation of a ceramo-metallic bond) so that the upper layers can bond to this bond layer in turn. The metal of the bond layer will advantageously be chosen from among tungsten (W), molybdenum (Mo), titanium (Ti) and chromium (Cr).

(28) A second metallic layer called the diffusion barrier is then deposited directly, 520, on the bond layer. The function of this layer is to prevent migration of metal from upper layers to the ceramic such that the interface between the bond layer and the ceramic is not damaged. The metal in the diffusion barrier will advantageously be chosen from among nickel (Ni), chromium (Cr), a nickel chromium (NiCr) alloy, or platinum (Pt). This layer will also act as the base metallic layer.

(29) Finally, in 530, a thin Au or Ag layer providing protection against oxidation is deposited, that acts as wetting agent in the subsequent melting step.

(30) After deposition of the wetting agent layer, a filler metal is deposited in 540 on the wetting agent layer, for example in the form of a ball, a land, a portion of ribbon or more generally any preform. This preform is placed so as to close off the metallised hole of via.

(31) The filler metal can be indium or a eutectic chosen from among AuSn with 80% gold and 20% tin, AuGe with 88% gold and 12% germanium, AgSn with 96.5% tin and 3.5% of silver, InSn with 52% indium and 48% tin, the percentages all being by mass.

(32) The filler metal preform is then heated to melting temperature. The molten filler metal covers the metallic base layer due to the wetting agent deposited on the metallic base layer and migrates to the diffusion barrier. The molten metal obstructs the via and makes it leak tight as it solidifies.