Component carrier and component carrier arrangement

Abstract

A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.

Claims

1. A multilayer carrier body comprising: a first three dimensional structure having six side faces; a second three dimensional structure covering five of the six side faces and leaving one side face exposed; and a layer structure covering the second three dimensional structure except for the one side face of the first three dimensional structure and a side face of the second three dimensional structure adjacent to the one side face, wherein the second three dimensional structure comprises stacked films with a metallic material, wherein the layer structure comprises a first ceramic, and wherein the first three dimensional structure comprises a material different than the first ceramic and the metallic material.

2. The multilayer carrier body according to claim 1, wherein the second three dimensional structure has an increased thermal conductivity compared to the layer structure.

3. The multilayer carrier body according to claim 1, wherein the layer structure comprises Al.sub.2O.sub.3 or Al.sub.2O.sub.3 and glasses.

4. A component carrier comprising: a multilayer carrier body according to claim 1; and a heat sink element located at an underside of the multilayer carrier body.

5. The component carrier according to claim 4, further comprising an insulation layer located at a surface of the multilayer carrier body.

6. The multilayer carrier body according to claim 1, wherein the second three dimensional structure comprises metallic layers.

7. The multilayer carrier body to claim 1, wherein the material is a second ceramic.

8. The multilayer carrier body according to claim 1, wherein the first three dimensional structure has a parallelepiped structure.

9. The multilayer carrier body according to claim 1, wherein the first three dimensional structure is directly adjacent to the second three dimensional structure.

10. The multilayer carrier body according to claim 9, wherein the second three dimensional structure is directly adjacent to the layer structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The invention is explained below on the basis of exemplary embodiments with reference to the drawing.

(2) In the figures:

(3) FIGS. 1 and 2 show sectional illustrations of one exemplary embodiment;

(4) FIGS. 3 and 4 show sectional illustrations of a further exemplary embodiment;

(5) FIGS. 5 and 6 show sectional illustrations of a further exemplary embodiment;

(6) FIG. 7 shows a sectional illustration of a further exemplary embodiment;

(7) FIGS. 8 and 9 show sectional illustrations of a further exemplary embodiment; and

(8) FIGS. 10, 11 and 12 show sectional illustrations of yet another exemplary embodiment.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(9) FIG. 1 shows one exemplary embodiment of a component carrier arrangement comprising a component carrier 10 comprising a component 1 arranged thereon, the component acting as a heat source. The illustration is a sectional view along the vertical axis 31 of the component carrier arrangement. FIG. 2 shows a sectional view along the line A-A through this component carrier arrangement. The section runs in a plane parallel to the plane spanned by a longitudinal and transverse axis 32, 33. The axes are illustrated in the system of coordinate axes 31, 32, 33.

(10) The component carrier 10 comprises a multilayer carrier body 15, which can serve as a carrier both for separate component parts or components 1 but also for conductor structures. The multilayer carrier body 15 is produced from stacked films and comprises a substrate 3 comprising a carrier material, for example, an Al.sub.2O.sub.3 ceramic. A structured functional region 2 is provided in the substrate 3. The functional region 2 is a region having a locally increased thermal conductivity which serves as an integrated heat sink for heat dissipation.

(11) A conductor structure 4 is provided on the top side of the multilayer carrier body 15, by means of which conductor structure the contacting of the component 1 and/or a redistribution wiring can be implemented. Such a conductor structure 4 can comprise soldering pads for contacting the component 1, conductor tracks for voltage and current supply and also for signal transmission. The conductor tracks can run to terminals on the top side or to through contacts in the substrate 3. Such a conductor structure 4 can be metallic, for example, composed of copper.

(12) A component 1 is fixed on the multilayer carrier body 15, the component emitting heat during operation. Such a component 1 can be an LED.

(13) An electrical insulation layer 5 is applied at the underside of the multilayer carrier body 15, which electrical insulation layer can be formed from the same material as the substrate 3 or from a different material. The material and the layer thickness of the insulation layer 5 can be chosen such that a dielectric strength of 3000 V is achieved. In this exemplary embodiment, the insulation layer 5 extends over the entire underside of the carrier body 15. A heat sink element 6 is applied on the insulation layer 5. The heat sink element is an element by means of which the heat of the component 1 conducted through the substrate 3 is dissipated or emitted, for example, a cooling body or a housing part. However, a contact-connection is also conceivable.

(14) In this exemplary embodiment, the functional region 2 runs from the top side of the multilayer carrier body 15 as far as the insulation layer 5. In the region adjacent to the component 1 and to the insulation layer 5, the structure 2 has a square cross section projecting slightly beyond the basic area of the component 1. In the region of the sectional plane A-A, the side regions of the structure 2 project as far as the edge of the multilayer carrier body 15, thus resulting in a cruciform cross section, as can be discerned in FIG. 2. The substrate 3 extends above and below the protruding structure regions.

(15) The axially cruciform structure of the functional region 2 allows not only the dissipation of heat perpendicularly to the component 1, but also a dissipation of heat in a horizontal direction, which is effected by the cruciform cross-sectional widening.

(16) FIG. 3 shows a plan view of one exemplary embodiment of a multilayer carrier body and a sectional view (on the right) through the latter along the line A-A.

(17) In this exemplary embodiment, a trough-shaped metallic structure or functional region 2 is surrounded by a ceramic substrate 3 at the side surfaces and at the base. A further, parallelepipedal structure 33, that is to say a further region, composed of a further material, for example, a different ceramic material, is provided in the structure 3.

(18) This multilayer carrier body 15 is constructed from three different film types. In the upper region I, their area arrangement corresponds to the plan view. The rectangular third area 33 is surrounded by the frame-shaped second and first areas 2, 3. In the underlying region II, the films have a second area 1 without an inner contour. The second area 2 is rectangular. In the lower region III, the films are printed over the whole area with the paste for the first area 3.

(19) The stacking of such identical films in each of the regions I, II, III with identical contours produces a multilayer carrier body 15 in which the lateral surfaces of the structures in these regions which result from the contours lying one above another run parallel to the vertical axis of the carrier body, that is to say perpendicularly to the film layers. Adjacent films in which different areas lie one on top of another form the horizontal interfaces between the trough-shaped structures.

(20) In an alternative exemplary embodiment, a cavity can be provided instead of the further structure 33. The cavity is constructed from films having a cutout, that is to say an unprinted region, at a corresponding location.

(21) FIG. 5 shows a further exemplary embodiment of a component carrier arrangement comprising a component carrier 10 comprising a component 1 arranged thereon, the component acting as a heat source. The illustration is a sectional view along the vertical axis of the component carrier arrangement. FIG. 6 shows a sectional view along the line A-A through the component carrier arrangement. The section runs in a plane parallel to the plane spanned by a longitudinal and transverse axis.

(22) Essentially the differences with respect to the previous exemplary embodiments are described below.

(23) The exemplary embodiment of a component carrier arrangement as shown in FIGS. 5 and 6 additionally comprises, besides the component 1for example, an LEDarranged on the top side, a further discrete component 7, which is arranged in a cavity 8 in the underside of the carrier body 15.

(24) This exemplary embodiment comprises three structured functional regions 2. A first functional region 2 extends below the component 1 arranged on the top side and runs from the top side of the carrier body 15 as far as the insulation layer 5. This functional region 2 serving as a heat sink has a cylindrical basic shape having a cross section whose round basic shape has a jagged edge, as is evident in FIG. 6. Horizontally running regions 23 embodied as structured layers project into the substrate 3 from the perpendicular lateral surface. These regions 23 running into the substrate can be a cross-sectional enlargement of the main body whose contour is at an identical distance from the contour of the lateral surface of the main body. Alternatively, they can be embodied in strip- or web-shaped fashion. Owing to their shape, they can also be designated as electrode structure. They improve the mechanical matching between metal and ceramic in the transition from the substrate to the functional region by virtue of the fact that, for example, material stresses are avoided.

(25) Below the first functional region 2, an insulation layer 5 is provided between the first functional region and the heat sink. The insulation layer runs below the component 1, but in a manner projecting beyond the basic area thereof, but not in a large-area fashion over the entire underside of the multilayer carrier body 15.

(26) The component carrier arrangement additionally comprises second and third functional regions 20, which run between the conductor structure 4 on the top side of the multilayer carrier body 15 and a heat sink element 6 on the underside. These functional regions are cylindrical with a rectangular cross section. They can serve as through contact or heat sink for a further component (not illustrated).

(27) FIG. 7 shows a further exemplary embodiment of a component carrier arrangement comprising a component carrier 10 comprising a plurality of components 1 arranged thereon, which function as a heat source. The illustration is a sectional view along the vertical axis of the component carrier arrangement. The spatial arrangement of the LEDs can be as illustrated in FIG. 9.

(28) Essentially the differences with respect to the previous exemplary embodiments are described below.

(29) The component carrier arrangement comprises a plurality of components 1 arranged on the top side. The components can be LEDs which develop heat during operation. The structured functional region 2 extends below the region in which the components 1 are arranged, the structured functional region serving as a common heat sink for the components 1. The functional region 2 has a cylindrical main body extending from the top side of the multilayer carrier body 15 as far as the insulation layer 5. A common heat sink element 6 is provided on the insulation layer 5. Structured layers 23 extending horizontally into the substrate 3 are furthermore provided. The structured layers are arranged one above another in different planes. The substrate 3 extends above and below these regions.

(30) Furthermore, beyond the functional region 2, a further, discrete component 7 is arranged on the top side of the carrier body 15, which component can be, for example, an integrated NTC temperature sensor or an MLV element as ESD protection (ESD is an abbreviation of electrostatic discharge).

(31) FIG. 8 shows a further exemplary embodiment of a component carrier arrangement comprising a component carrier 10 comprising a component 1 arranged thereon, which function as a heat source. The illustration is a sectional view along the vertical axis of the component carrier arrangement. FIG. 9 shows a sectional view along the line A-A through the component carrier arrangement. The section runs in a plane parallel to the plane spanned by a longitudinal and transverse axis.

(32) Essentially the differences with respect to the previous exemplary embodiment are described below. This exemplary embodiment involves a component carrier arrangement comprising seven components 1, for example, LEDs. FIG. 9 shows the spatial arrangement of the components 1. One is arranged centrally, others are arranged in a ring-shaped manner around the component 1.

(33) FIG. 8 differs from the previous exemplary embodiment essentially in the structure of the functional region 2. In this exemplary embodiment, too, an extensive functional region 2 is provided as a heat sink for the components 1. In the central region of the carrier body 15, the structured functional region 2 extends in a wide-ranging manner, but is led to the top side and underside only below the components and heat sinks. Consequently, there are substrate regions 3 not only at the edge of the multilayer carrier body 15 but also at the carrier body top side between the components 1. Furthermore, separate heat sink elements 6 are also provided below the components 1. In the lower region, too, the functional region has substrate regions between regions of the functional region which run to the heat sink elements 6. The regions of the functional region which run in the upper and lower regions of the multilayer carrier body can be island-shaped, such that their cross section substantially corresponds to the basic area of the components 1, or circular or ring-shaped, such that the components 1 are arranged on the circle or ring, as depicted schematically in FIG. 9.

(34) In this exemplary embodiment, too, structured layers 23 project from the main body of the functional region into the substrate 3.

(35) FIG. 10 shows a sectional view through a further exemplary embodiment, similar to that shown in FIGS. 5 and 6.

(36) In this exemplary embodiment, an LED as component 1 that develops a large amount of heat and also an MLV element as exemplary further component 7 are arranged on a multilayer carrier body 15. The component 1 is positioned below a lens 9.

(37) The width D1 of such an LED can be 1000 m, for example. It is fixed by solder, for example, comprising SnAgCu, on solder pads 18 on the carrier body 15. The width D7 of the further component 7 can be 300 m. It is fixed on solder pads 17, for example, comprising Ag/Ni/Sn.

(38) Heat sink elements 6 are arranged on the underside of the multilayer carrier body 15. Such a multilayer carrier body 15 can have a thickness D10 of 500 m, wherein the substrate 3 has a thickness D15 of 400 m.

(39) There are arranged in the substrate 3 a first functional region 2, which serves as a thermal block or heat sink for the component 1, and also two further functional regions 22 as through contacts below the further component 7. The width D2 of the integrated heat sink is 1500 m in both the longitudinal direction and the transverse direction. The distance from the edge of the carrier body is 700 m (see FIG. 11). The width of the further functional regions corresponds to that of the further component 7. The width D2 of the main body of the integrated heat sink is 1500 m in both the longitudinal direction and the transverse direction. The distance D3 from the edge of the carrier body is 700 m (see FIG. 9). The width of the further functional regions corresponds to that of the further component 7 and is 300 m.

(40) The multilayer carrier body 15 has a stacked construction and comprises a multiplicity of films which were stacked and laminated in order to form the carrier body 15. The individual films comprise substrate areas whose configuration corresponds to the sectional view through the carrier body in the corresponding plane. Such films can be produced by printing with different pastes for the different areas, which are subsequently stacked and laminated. In this way, it is possible to produce arbitrary structures within the substrate 3. In this regard, for example, the regions 23 protruding from the main body of the functional region can be produced in a simple manner by means of the printed functional region of such a layer projecting beyond that of the underlying layer and of the overlying layer. In other words: structure regions of a film layer, or of a plurality of film layers, which project beyond the contours of the main body form the regions 23 projecting into the substrate 3.

(41) FIG. 11 and FIG. 12 show two further sectional views through the component along the lines I-I and II-II in FIG. 10. FIG. 11 shows the section I-I, in which it is clearly discernible that the LED is contacted by means of two contacts. In the section 2-2 it is discernible that the same also applies to the further component 7.

(42) The features of the exemplary embodiments can be combined.