Combined laser drilling and the plasma etch method for the production of a micromechanical device and a micromechanical device

Abstract

A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.

Claims

1. A method for manufacturing a micromechanical device, comprising: (a) providing a micromechanical precursor product that includes a first substrate and at least one first cavity, the first cavity being delimited at least by the first substrate; (b) applying an additional layer to the first substrate; (c) laser drilling through the additional layer to produce a mask; (d) laser drilling a first subsection of the first substrate through the mask; (e) plasma etching a second subsection of the first substrate through the mask and through the first subsection in such a way that an inlet through the first substrate to the cavity is created; and (f) laser melting substrate material of the first subsection and sealing the inlet with molten mass.

2. The method as recited in claim 1, wherein the additional layer is removed after step (c).

3. The method as recited in claim 1, wherein an atmosphere having a certain composition and a certain pressure is set in the first cavity after step (e).

4. The method as recited in claim 1, further comprising: (f) laser melting material of the additional layer.

5. The method as recited in claim 1, wherein at least one of step (c) and step (d) is carried out at atmospheric pressure.

6. The method as recited in claim 1, wherein the laser drilling is carried out in step (c) with first laser operating parameters, the first operating parameters including at least one of: (i) a very short wavelength, (ii) a very sharp focus, and (iii) a very short pulse length, and the laser drilling is carried out in step (d) with second laser operating parameters that are different from the first laser operating parameters, the second laser operating parameters including at least one of: (i) a longer wavelength, (ii) a less sharp focus, and (iii) a longer pulse length.

7. The method as recited in claim 6, wherein the laser drilling is initially carried out in step (d) with the first laser operating parameters up to a certain depth, and the laser drilling is subsequently carried out with the second laser operating parameters.

8. A micromechanical device, comprising: a first substrate; at least one first cavity; and a sealed inlet to the first cavity, the inlet extending through the first substrate; wherein the inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate.

9. The micromechanical device as recited in claim 8, wherein the first substrate includes an additional layer, and the inlet is also sealed by molten mass of the additional layer.

10. A hybrid integrated micromechanical device; comprising: a first substrate; at least one first cavity; and a sealed inlet to the first cavity, the inlet extending through the first substrate; wherein the inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate; and wherein the device includes a second substrate with an ASIC circuit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a micromechanical device including a cavity with a sealed inlet from the related art.

(2) FIGS. 2A through 2G show one exemplary embodiment of the combined laser drilling and plasma etching method according to the present invention for manufacturing a micromechanical device.

(3) FIG. 3 schematically shows the laser drilling and plasma etching method according to the present invention for manufacturing a micromechanical device.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

(4) FIG. 1 shows a micromechanical device including a cavity with a sealed inlet from the related art. A micromechanical device that includes a MEMS wafer 4 and a cap wafer 3 is schematically illustrated. Cap wafer 3 has an access channel 1 that is sealed with a molten seal 5. Electrical contact surfaces 2 are situated in recesses of cap wafer 3. The micromechanical device includes a first cavity 100 that contains a rotation rate sensor, for example, and a second cavity 200 that contains an acceleration sensor, for example. Cavity 200 essentially contains an atmosphere with the pressure and composition of the process gas during bonding of MEMS wafer 4 to cap wafer 3. Good damping of the acceleration sensor is thus ensured. Cavity 100 has been evacuated through inlet 1, and inlet 1 has subsequently been sealed with the aid of a molten seal 5. High quality of the oscillator of the rotation rate sensor is thus ensured. The arrow denotes the effective direction of a laser sealing process for producing molten seal 5.

(5) In one specific configuration of a micromechanical sensor or some other micromechanical device in which only one MEMS element is implemented and the evaluation circuit or some other electrical control circuit is provided separately, access channel 1 may be provided at the same time that electrical contact surfaces 2 are exposed. In such a configuration, a relatively thin cap wafer 3 is generally used. After cap wafer 3 is bonded to sensor wafer 4, a narrow access opening 1 to first cavity 100 as well as a large access opening to contact surfaces 2 may be created in a single step via a photomask and a trenching process.

(6) Creating access opening 1 to first cavity 100 is difficult with thick cap wafers. Access opening 1 must not become too large, since otherwise sealing by localized melting and subsequent solidification is no longer possible. Trenching processes which create very narrow inlets and which at the same time extend very deeply, i.e., which have a high aspect ratio, are difficult, and become increasingly slower and more complex as the aspect ratio increases.

(7) If inlet 1 to first cavity 100 is not created at the same time that contact areas 2 are opened, a separate photomask must be provided for each of the two processes. This is laborious and costly, and sometimes is also technically difficult to implement.

(8) FIGS. 2A through 2G show one exemplary embodiment of the combined laser drilling and plasma etching method according to the present invention for manufacturing a micromechanical device. First of all, FIG. 2A shows a provided wafer composite that includes a MEMS wafer and a substrate with an ASIC evaluation circuit. For so-called hybrid integration applications, at the wafer level a second substrate 15 with an ASIC evaluation circuit 6 is directly combined with a MEMS wafer 7 with a first substrate 11. Alternatively, a MEMS element is applied to the ASIC evaluation circuit, and this wafer is encapsulated with a cap substrate. To obtain a preferably compact component, vias (through-silicon vias (TSVs)) 8 may be provided through ASIC substrate 15 or MEMS substrate 11 to establish an electrical connection between the ASIC circuit, in particular a MEMS sensor evaluation circuit, and the surroundings. FIG. 2B shows the application of an additional layer 9 to first substrate 11. According to FIG. 2C, a hole 10 is drilled into additional layer 9 with pulsed laser energy, using a laser drilling method. According to FIG. 2D, the hole is then deepened into the underlying material of first substrate 11, likewise with a pulsed laser, and is advanced into a first subsection 12 of first substrate 11. Before underlying first cavity 100 is reached, a switch is made to a plasma etching method, in particular a trenching method, as shown in FIG. 2E. Additional layer 9 is used as a mask for the plasma etching method. With this layer as a mask, the plasma etching method is used to etch access channel 1 through a second subsection 13 of first substrate 11 up to first cavity 100, in which a MEMS functional element, for example, is situated. The arrows here denote the effective direction of a trenching method. A stop layer 14 may optionally be provided in the cavity, in particular on a wall of the cavity opposite from access channel 1, so that there is no further etching into the MEMS functional element or the ASIC circuit, or into the second substrate, via the plasma etching method.

(9) The cavity is then flooded with the desired gas at the desired internal pressure via the access channel. FIG. 2F shows one variant of the method according to the present invention in which additional layer 9 is subsequently removed. Additional layer 9 may be made of oxide, for example, and may be removed by etching. The arrows here denote the effect of an etching process for removing additional layer 9. Alternatively, additional layer 9 may be removed in a subsequent method step, or may remain. Lastly, FIG. 2G shows an area of first substrate 11 around which access channel 1 is locally heated via a laser. The substrate material of first substrate 11 liquefies locally, and upon solidification hermetically seals access channel 1 in laser-drilled first subsection 12 with a molten seal 5. If additional layer 9 has not been removed, a portion of the additional layer may also be heated via the laser. Material of additional layer 9 liquefies locally, and likewise seals access channel 1 upon solidification.

(10) FIG. 3 schematically shows the laser drilling and plasma etching method according to the present invention for manufacturing a micromechanical device, including the method steps: a. providing a micromechanical precursor product that includes a first substrate 11 and at least one first cavity 100, first cavity 100 being delimited at least by first substrate 11, b. applying an additional layer 9 to first substrate 11, c. laser drilling through additional layer 9 and thus producing a mask, d. laser drilling of a first subsection 12 of first substrate 11 through the mask, e. plasma etching of a second subsection 13 of first substrate 11 through the mask and through first subsection 12 in such a way that an inlet 1 through first substrate 11 to cavity 100 is created, f. laser melting of substrate material of first subsection 12 and sealing inlet 1 with molten mass.

(11) The essential process steps of the method according to the present invention may be summarized as follows: 1. A MEMS wafer stack is provided with at least one additional layer. 2. A blind hole is drilled into the additional layer and the substrate material, using a laser drilling method. 3. The hole is etched farther into the cavity, using a plasma etching method, in particular a trenching method. 4. The additional layer may now optionally be removed (FIG. 2F). 5. The cavity is flooded with the desired gas at the desired internal pressure via the access channel. 6. The area around the access channel is locally heated via a laser, and the substrate material liquefies locally and hermetically seals the access channel upon solidification.

Further Example Embodiments of the Present Invention

(12) It is advantageous to carry out the laser drilling method using two different lasers or laser settings. The first laser drilling method is optimized to drill a hole into the additional layer. For example, a laser having a very short wavelength and with a very sharp focus and/or a very short pulse length may be deliberately used. A very small access hole may thus be created in the additional layer. The second laser drilling method may be optimized to drill a hole into the substrate. In particular, the additional layer and the second laser may be combined in such a way that a portion of the laser power is reflected. For example, a metal layer such as aluminum in particular may be used as the additional layer, and may be combined with a laser wavelength so that a large portion of the light is reflected. Alternatively, a partially transparent layer such as oxide, for example, is used, but is selected in a thickness such that a major portion of the laser light is reflected. Due to such a system, the laser light through the additional layer, in addition to the normal focusing, may be even further spatially localized, thus making it possible to drill very small access channels, also at a great depth. The advantage of this method is that a laser having a longer wavelength and/or a longer pulse length, which allows faster drilling rates, may be used as the second laser drilling method.

(13) Furthermore, with the first laser drilling method it may be advantageous to drill a hole not only into additional layer 9, but also into the upper part of first substrate 11, which is to be subsequently sealed via the melting method. A second laser drilling method, which drills a larger opening and thus operates more quickly, may then be used in the middle part of the substrate. A narrow access opening in the upper substrate area is advantageous for the subsequent sealing process. It is therefore advantageous to drill the first narrow borehole into the substrate as deep as or deeper than the depth of the melting area in the sealing process.

(14) It is also advantageous when the laser drilling method is initially carried out in air, i.e., at atmospheric pressure, to allow simple, cost-effective process control. The plasma etching method is subsequently carried out in a vacuum chamber. The wafer is then directly sealed, using the laser reseal process, without removing the wafer from the vacuum system. The advantage of this sequence is that contaminants cannot enter the cavity during the subsequent venting. In addition, it is not possible for moisture or other absorbent gases to enter the cavity. In some cases it might be possible to remove these gases only by bake-out. Since this process control requires no bake-out, the method according to the present invention may be carried out at any desired location, in particular also at the very end of the process chain for manufacturing a micromechanical device. This is even possible, for example, when solder balls have already been placed on the wafer, and heat treatment is therefore no longer possible.

(15) With the method according to the present invention, the MEMS substrate may also be selected to be much thicker than the ASIC substrate. This is advantageous in particular when the MEMS structures are mechanically coupled to the MEMS substrate.

(16) The method is particularly advantageous for hybrid integrated MEMS elements.

(17) It is advantageous in particular when a MEMS structure is provided on one substrate, and an ASIC evaluation circuit is provided on another substrate, and both substrates are bonded to one another. It is then advantageous to select the inlet through the substrate that includes the MEMS structure according to the described method. In this case, ASIC functional layers such as passivating layers (oxides) or wiring layers (Al or Cu) may be used as an etch stop layer for the plasma etching method without having to apply additional layers in the system.

(18) In particular, the method is advantageous for manufacturing hybrid integrated MEMS elements including at least two cavities with different internal pressures.

(19) Furthermore, the method is advantageous for manufacturing hybrid integrated MEMS elements that are designed as bare die structures, i.e., directly provided with solder balls and not cast into a plastic compound.

LIST OF REFERENCE NUMERALS

(20) 1 access channel 2 electrical contact surfaces 3 cap wafer 4 sensor wafer 5 molten seal 6 ASIC wafer 7 MEMS wafer 8 TSV 9 additional layer 10 laser-drilled hole into the additional layer 11 first substrate 12 laser-drilled first subsection of the access channel in the first substrate 13 plasma-etched second subsection of the access channel in the first substrate 14 stop layer 15 second substrate 20 solder ball 100 first cavity 200 second cavity