Method and Apparatus for Defect Inspection of Transparent Substrate

Abstract

A method for defect inspection of a transparent substrate comprises (a) providing an optical system for performing a diffraction process of object wave passing through a transparent substrate, (b) interfering and wavefront recording for the diffracted object wave and a reference wave to reconstruct the defect complex images (including amplitude and phase) of the transparent substrate, (c) characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate, and (d) creating defect complex images database based-on the defect complex images for comparison and detection of the defect complex images of the transparent substrate.

Claims

1. A method for defect inspection of a transparent substrate, comprising: (a) providing an optical system for performing a diffraction process of object wave passing through a transparent substrate; (b) interfering and wavefront recording for said diffracted object wave and a reference wave to reconstruct defect complex images of said transparent substrate; (c) characteristics analyzing, features classifying and sieving for said defect complex images of said transparent substrate; and (d) creating defect complex images database based-on said defect complex images for comparison and detection of said defect complex images of said transparent substrate.

2. The method of claim 1, wherein said optical system includes at least one optical image reduction system to record at least one hologram in said step (b).

3. The method of claim 1, wherein said diffracted object wave and said reference wave are interfered to form at least one hologram, and wavefront recording said at least one hologram to reconstruct said defect complex images of said transparent substrate in said step (b).

4. The method of claim 1, wherein said defect complex images by numerical reconstruction include phase image and amplitude image in said step (b).

5. The method of claim 1, further comprising up-sampling said defect complex images to improve equivalent resolution of a photodetector array of said optical system.

6. The method of claim 5, further comprising a numerical propagation of Fourier transform approach, convolution approach, angular spectrum approach or Fresnel diffraction transform approach to reconstruct said defect complex images of said transparent substrate.

7. The method of claim 1, further comprising a numerical propagation and focusing for said defect complex images to reconstructed characteristic of said defect complex images in different planes, in said step (c).

8. The method of claim 1, wherein said defect complex images are stored a database, in said step (d).

9. The method of claim 1, wherein said defect complex images are identified and classified by at least one classification unit, in said step (c).

10. An apparatus for defect inspection of a transparent substrate, comprising: a light source; at least one mirror to redirect optical path of said light source; a beam expander to generate an expanded beam of said light source; a first beam splitter configured under said beam expander; a second beam splitter; a phase shifter for adjusting phase shift of a reference wave; a lenses set including plural lenses configured a side of said first beam splitter or said second beam splitter; and a photodetector array configured a side of said second beam splitter.

11. The apparatus of claim 10, wherein said lenses set includes a first lens and a second lens to form an optical image reduction system.

12. An apparatus for defect inspection of a transparent substrate, comprising: a light source; at least one mirror to redirect optical path of said light source; a beam expander to generate an expanded beam of said light source; an optical image reduction system for image reduction of an object wave passing through said transparent substrate; and a photodetector array configured a side of said transparent substrate.

13. The apparatus of claim 12, wherein said optical image reduction system includes a first lens and a second lens.

14. The apparatus of claim 13, further comprising a filter mask configured between said first lens and said second lens.

15. The apparatus of claim 12, further comprising an intermediate optics system, a filter mask and a grating.

16. The apparatus of claim 15, wherein said grating is configured between said intermediate optics system and said optical image reduction system.

17. The apparatus of claim 16, wherein said filter mask is configured between said first lens and said second lens of said intermediate optics system.

18. The apparatus of claim 12, further comprising an intermediate optics system, a filter mask and a beam splitter.

19. The apparatus of claim 18, wherein said filter mask is configured between a first lens and a second lens of said intermediate optics system.

20. The apparatus of claim 18, wherein said beam splitter is configured between optical path exit of said optical image reduction system and optical path entrance of said intermediate optics system.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The components, characteristics and advantages of the present invention may be understood by the detailed descriptions of the preferred embodiments outlined in the specification and the drawings attached:

[0026] FIG. 1A illustrates a schematic perspective view showing an off-axis optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0027] FIG. 1B illustrates a schematic perspective view showing an off-axis optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0028] FIG. 1C illustrates a schematic perspective view showing an on-axis optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0029] FIG. 1D illustrates a schematic perspective view showing an on-axis optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0030] FIG. 1E illustrates a schematic perspective view showing an in-line optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0031] FIG. 1F illustrates a schematic perspective view showing an in-line optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0032] FIG. 1G illustrates a schematic perspective view showing a common-path on-axis optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0033] FIG. 1H illustrates a schematic perspective view showing a common-path on-axis optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0034] FIG. 1I illustrates a schematic perspective view showing a common-path off-axis optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0035] FIG. 1J illustrates a schematic perspective view showing a common-path off-axis optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0036] FIG. 1K illustrates a schematic perspective view showing a common-path off-axis optical system by plane wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0037] FIG. 1L illustrates a schematic perspective view showing a common-path off-axis optical system by spherical wave illumination of a defect inspection apparatus of a transparent substrate according to an embodiment of the invention;

[0038] FIG. 2 illustrates a process flow of a method of defect inspection of a transparent substrate based on one embodiment of the present invention;

[0039] FIG. 3A illustrates an amplitude reconstruction images of Fresnel holograms, non-using up-sampling technique according to an embodiment of the invention;

[0040] FIG. 3B illustrates an amplitude reconstruction images of Fresnel holograms, using up-sampling technique according to an embodiment of the invention;

[0041] FIG. 3C and FIG. 3D illustrate one-dimensional profile information of black solid line of FIG. 3A and FIG. 3B respectively;

[0042] FIG. 4A and FIG. 4B illustrate amplitude reconstruction images of the Fresnel holograms of encoding spherical reference wave according to an embodiment of the invention;

[0043] FIG. 5A and FIG. 5B illustrate amplitude reconstruction images of the holograms before and after the optimization of the holograms according to an embodiment of the invention;

[0044] FIG. 5C and FIG. 5D illustrate the region of interest of black wide line of FIG. 5A and FIG. 5B respectively;

[0045] FIG. 6A to FIG. 6D illustrate amplitude image (left) and phase image (right) of the numerically reconstructed defect complex image according to an embodiment of the invention;

[0046] FIG. 7 illustrates defect phase image of bubble on the transparent substrate reconstructed by numerical propagation in different planes according to one embodiment of the invention;

[0047] FIG. 8 illustrates defect phase image of dust on the transparent substrate reconstructed by numerical propagation in different planes according to one embodiment of the invention;

[0048] FIG. 9A to FIG. 9D illustrate a defect complex image database of the transparent substrate according to an embodiment of the invention;

[0049] FIG. 10A illustrates defect complex images by using digital holograms to detect the defect complex images of the transparent substrate according to an embodiment of the invention;

[0050] FIG. 10B to FIG. 10E illustrate defect complex images determined by the defect complex images database according to an embodiment of the invention.

DETAILED DESCRIPTION

[0051] Some preferred embodiments of the present invention will now be described in greater detail. However, it should be recognized that the preferred embodiments of the present invention are provided for illustration rather than limiting the present invention. In addition, the present invention can be practiced in a wide range of other embodiments besides those explicitly described, and the scope of the present invention is not expressly limited except as specified in the accompanying claims.

[0052] The invention discloses a method and apparatus by utilizing interference and wavefront recording to reconstruct the defect complex images of a transparent substrate, and characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate as reference-based for defect detection. The embodiment indicates a database of defect complex images created by characteristics analysis, features classifying and sieving, to establish a classification unit of the defect complex images for all kinds of defects of the object to be tested, and a spherical reference wave irradiation and up-sampling technique are used to improve the equivalent resolution of photodetector array of an optical system, to achieve defect detection method of transparent substrate with high resolution of wide-field imaging effect and high fidelity of a large area.

[0053] The invention utilizes an apparatus of wavefront recording and reconstruction, and a classifying method of defect complex images in the defect complex images database for defect inspection of the transparent substrate of the, as well as utilizes the spherical reference wave irradiation and up-sampling technology to improve the equivalent resolution of photodetector array in the optical system. The defect detection apparatus is based on the defect complex image database as the basis for the defect inspection of various types of images to be tested.

[0054] The invention provides a method and an apparatus for defects inspection of a transparent substrate in order to meet the technical requirements of the above-mentioned. The invention use a light source to irradiate a transparent substrate to be measured, and diffracting by a distance to form optical diffraction field of the object. Then, the diffracted object wave is interfering with the spherical reference wave. Finally, the hologram is recorded by the photodetector array. The hologram is numerically reconstructed by the computer to obtain the defect complex images of the transparent substrate to be measured, including amplitude image and phase image, which are not restricted by pixels and pixel size of the photodetector array.

[0055] As shown in FIG. 1A to FIG. 1L, they show an optical system of a defect inspection apparatus of a transparent substrate according to some embodiments of the present invention. These embodiments are applicable for processing hologram associated with at least one resolution standard sample and a transparent substrate. The hologram can be generated by the optical system of these embodiments. In the embodiment of the FIG. 1A, it provides an off-axis optical system by plane wave illumination; the optical system includes a light source 100, a beam expander (BE) 110, two beam splitters 120 and 130, a photodetector array 140 (for example: Charge-coupled device (CCD), Complementary Metal-Oxide-Semiconductor (CMOS) image sensor, photodetector), and five lens L1L5 and three mirrors M1M3. The light source 100 includes a vertical-cavity surface-emitting laser (VCSEL), a semiconductor laser, a solid-state laser, a gas laser, a dye laser, a fiber laser or light emitting diodes (LED). The emission type of the light source 100 comprises a light source, a planar light source or a spherical light source. The light source 100 includes coherent light source, low coherent light source or incoherent light source. The optical system includes an optical image resizing/reduction system (Telescopic Imaging System) TL1, which includes a lens L4 with 0.5 magnification (M.sub.TL=0.5) and focal length of 100 mm (millimeter) and a lens L5 with focal length of 50 mm. The front and rear focal length of the lens L4 can be equal or substantially equal (with a slight difference), and the front and rear focal length of the lens L5 can be equal or substantially equal (with a slight difference). The lens L3 also has a focal length of 50 mm located at reference wave terminal for spherical reference wave passing through, the front and rear focal length of the lens L3 can be equal, or substantially equal (with a slight difference). The optical path of the optical system of the inspection apparatus of the transparent substrate includes: a diode laser 100 emits a laser beam with center wavelength of 405 nm (nanometer), the laser beam reflecting by the mirror M1 and passing through the beam expander 110 to generate an expanded beam, then incident into the beam splitter 120 to output two beams respectively, followed by passing through the lens L1 of diameter 2 inch and the lens L2 of diameter 1 inch respectively to form a collimated plane wave with beam diameter of 2 inch and beam diameter of 1 inch. One beam of the two beams is passing through the object on the transparent substrate 150 to be measured to form an object wave after reflecting by the mirror M3, and the object wave is passing through the Telescopic Imaging System (lens L4 and lens L5) TL1 for image reduction as wide field object wave, and passing through the beam splitter 130 and then projecting to (including imaging or non-imaging mode) the photodetector array 140. The other beam of the two beams is reflected by the mirror M2 as the reference wave, followed by passing through the lens L3 to form spherical reference wave of numerical amplification (M.sub.S=2), and passing through the beam splitter 130 and then incident to the photodetector array 140. And, the reference wave maintains off-axis angle with the object wave to perform Off-Axis digital holographic recording, in order to ensure that DC term and conjugation term of off-axis recording can be eliminated based-on the reference wave. The above three mirrors M1M3 are only used to redirect the optical path of the laser beam. The lens L2 can be regarded as the element which can generate the beam expanding wavefront (plane wave and spherical wave). The lens L3 can be regarded as the element which can generate a planar, a spherical and an arbitrary surface wavefront.

[0056] In another embodiment, as shown in FIG. 1B, it provides an off-axis optical system by spherical wave illumination. Comparison with FIG. 1A, the optical system omits the lens L3, and the lens L2 locates between the mirror M1 and the beam splitter 130.

[0057] In one embodiment, as shown in FIG. 1C, it provides an on-axis optical system by plane wave illumination. Comparison with FIG. 1A, the optical system omits the lens L3, and configured position of the lens L1 and the lens L2 is different from FIG. 1A and FIG. 1B. The mirror M3 is equipped with a piezoelectric transducers (PZT), spatial light modulator (SLM), or rotatable parallel plate, which may be as a phase shifter for adjusting phase shift of the reference wave.

[0058] In one embodiment, as shown in FIG. 1D, it provides an on-axis optical system by spherical wave illumination. Comparison with FIG. 1C, the optical system omits the lens L1. The mirror M3 is equipped with a piezoelectric transducers (PZT), which may be as a phase shifter for adjusting phase shift of the reference wave.

[0059] In another embodiment, as shown in FIG. 1E, it provides an in-line optical system by plane wave illumination. Comparison with FIG. 1A, the optical system omits the lens L2, the lens L3, the beam splitter 120 and 130, and the mirror M3 locates between the mirror M1 and the beam splitter 130. The object wave is interfered with the reference wave by in-line.

[0060] In one embodiment, as shown in FIG. 1F, it provides an in-line optical system by spherical wave illumination. Comparison with FIG. 1E, the optical system omits the lens L1.

[0061] In one embodiment, as shown in FIG. 1G, it provides a common-path on-axis optical system by plane wave illumination. Comparison with FIG. 1E, the optical system further comprises a filter mask 160 configured between the two lens of the Telescopic Imaging System TL1. The filter mask 160 comprises a first filter area 162 and a second filter area 164, wherein the first filter area 162 allows the object wave passing through and the second filter area 164 allows the reference wave passing through.

[0062] In one embodiment, as shown in FIG. 1H, it provides a common-path on-axis optical system by spherical wave illumination. Comparison with FIG. 1G, the optical system omits the lens L1.

[0063] In one embodiment, as shown in FIG. 1I, it provides a common-path off-axis optical system by plane wave illumination. Comparison with FIG. 1G, the optical system further comprises an intermediate optics system TL2 and a grating 170, wherein the grating 170 is configured between the TL1 and the TL2, and the filter mask 160 is configured between the two lens of the intermediate optics system TL2. In this embodiment, the TL1 is parallel to the TL2. In one embodiment, the intermediate optics system TL2 is an optical image resizing/reduction system (Telescopic Imaging System).

[0064] In one embodiment, as shown in FIG. 1J, it provides a common-path off-axis optical system by spherical wave illumination. Comparison with FIG. 1I, the optical system omits the lens L1.

[0065] In one embodiment, as shown in FIG. 1K, it provides a common-path off-axis optical system by plane wave illumination. Comparison with FIG. 1I, the TL1 is perpendicular to the TL2, and the optical system further comprises a beam splitter 130 configured between optical path exit of the TL1 and optical path entrance of the TL2, and mirrors M3 and M4. The beam splitter 130 is used for guiding light by the two sides mirrors M3 and M4.

[0066] In one embodiment, as shown in FIG. 1L, it provides a common-path off-axis optical system by spherical wave illumination. Comparison with FIG. 1K, the optical system omits the lens L1.

[0067] It should be noted that the optical system of FIG. 1A and FIG. 1B utilizes an improved Mach-Zehnder interferometer to implement off-axis digital hologram to generate wide field holograms. In another embodiment, the holograms may be utilized by mechanically moving photodetector array, the measured object and incident beam for expanding wide field to generate digital hologram of on-axis, off-axis, in-line or common-path optical scheme.

[0068] FIG. 2 illustrates shows a process flow of a method of defect inspection of a transparent substrate based on one embodiment of the present invention. The invention employs a defect inspection apparatus of the transparent substrate to deal with defect complex images of the transparent substrate, and characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate as reference-based for defect inspection. Method for defect inspection of the transparent substrate includes the steps 200250. First of all, in the step 200, object wave of the transparent substrate is diffracted by the defect inspection apparatus (such as optical apparatus of FIG. 1AFIG. 1L). For example, the diffraction of the object wave is geometric imaging, Fresnel diffraction or Fraunhofer diffraction. In the step 200, it can solve the problem that high frequency information of the object to be measured can't be effectively analyzed due to actual pixel size limit of the photodetector array. In this embodiment, when considering the optical field distribution of plane wave incident to the object to be measured, the diffraction information will be image reduction by the optical image reduction system to achieve wide field image output; and then imaging to the intermediate image plane of the object, and diffracting from a distance to Fresnel diffraction region to generate optical diffraction field, to solve the constrained issue of actual pixel size of the photodetector array.

[0069] In one embodiment, the transparent substrate is for example glass substrate, sapphire substrate, transparent ceramic substrate, transparent polymer substrate, such as polycarbonate (PC) substrate, Polymethylmethacrylate (PMMA) substrate or high transmittance optical substrate.

[0070] Next, in the step 210, the object diffraction wave of the transparent substrate is interfered with the reference wave to obtain defect complex images of the transparent substrate to be measured. In one embodiment, the interference of the above two waves forms at least one hologram for wavefront recording and reconstructing of the wide field hologram to obtain the defect complex images of the transparent substrate to be measured. The reference wave includes: plane wave, spherical wave or arbitrary shape wave. In this embodiment, the spherical reference wave is magnified by encoding spherical factor to reduce spectrum bandwidth of the measured object in the Fourier plane, in order to avoid spectrum overlap between the object spectrum and DC term or conjugate term, and the effective number of pixels can retrieve and record high frequency information of the object to be measured. The magnification of the encoding spherical factor is shown as follows:

[00001]$M_s={\left(1-\frac{z_O}{z_R}\right)}^{-1}$

[0071] Among them, the object distance z.sub.O is the distance from the intermediate image plane of the object to the photodetector array, the distance z.sub.R is from focus point of the spherical reference wave to the photodetector array, and M.sub.S indicates numerical magnification. The spectrum bandwidth of the object in the Fourier plane can be modulated by means of the encoding spherical factor of the reference wave, in which the effective sampling bandwidth of the spectrum (a.sup.TL) is as follows:

[00002]${}^{\mathrm{TL}}=\frac{\mathrm{NA}}{.Math..Math.M_s}.Math.\frac{N.Math..Math..Math..Math.x}{M_{\mathrm{TL}}}$

[0072] NA is the numerical aperture, is the wavelength of incident light, N is the pixels number of the photodetector array, x is pixel size, and M.sub.TL is magnification of the optical image reduction system. However, the spatial frequency of the interference fringes formed by the object wave and the spherical reference wave will be limited by the actual pixel size of the photodetector array. The sampling condition of the interference fringes is as follows:

[00003]$C_p=\frac{f_{\max }}{1/2.Math..Math..Math.x}1$

[0073] C.sub.p is the sampling condition for the interference fringe, f.sub.max is upper value limit of allowable spatial frequency of the photodetector array. As considering C.sub.p>1, the spatial frequency of the interference fringes can't be resolved based-on pixel of the photodetector array. As considering C.sub.p1, the spatial frequency of the interference fringes can be resolved by pixel of the photodetector array. In the embodiment of the invention, the spherical reference wave is used for interfering, and upper value limit of spatial frequency follows the relation f.sub.max=Nx/2z.sub.O. Therefore, when interferes with the reference wave, the sampling condition of the interference fringes can be expressed as follows:

[00004]$\begin{array}{cc}{C}_p=\frac{N.Math..Math..Math..Math.x^2}{.Math..Math.z_O}1& \left(\mathrm{reference}.Math..Math.\mathrm{plane}.Math..Math.\mathrm{wave}\right)\\ C_p=\frac{N.Math..Math..Math..Math.x^2}{.Math.}.Math..Math.\frac{1}{z_O}-\frac{1}{z_R}.Math.=\frac{N.Math..Math..Math..Math.x^2}{.Math..Math.z_O.Math.M_s}1& \left(\mathrm{reference}.Math..Math.\mathrm{spherical}.Math..Math.\mathrm{wave}\right)\end{array}$

[0074] When the reference wave is plane wave, the spatial frequency of the interference fringe is a constant. However, when the reference wave is a spherical wave, the spatial frequency of the interference fringe will change with the phase profile of the spherical reference wave to generate a higher spatial frequency of the interference fringe. The spatial frequency of the interferometric fringes such changes is limited by the pixel size of the photodetector array, so that the numerical magnification of the reconstructed image is limited, and thereby incapable of obtaining effective sampling bandwidth of the object spectrum. The effective sampling bandwidth of the spectrum determines the lateral resolution of the optical system as follows:

[00005]$=0.77.Math.\frac{1}{{}^{\mathrm{TL}}.Math.M_s}.Math.\frac{N.Math..Math..Math..Math.x}{M_{\mathrm{TL}}}$

[0075] is the lateral resolution, a.sup.TL is the spectrum sampling bandwidth, and coherence coefficient is 0.77. In constraint of the pixel size of the photodetector array, the spherical reference wave can make numerical magnification restricted in C.sub.p=1 by the spatial frequency of the interference fringes. Therefore, this will create a new object z.sub.O, so that the spatial frequency of the interference fringes can be resolved by the photodetector array. The lateral resolution describes as follows:

[00006]$=0.77.Math.\frac{.Math..Math.z_O}{{}^{\mathrm{TL}}.Math.M_{\mathrm{TL}}.Math..Math..Math.x}.Math.C_p$

[0076] Accordingly, the optimal lateral resolution and field of view of the wide field digital holography is obtained by optimizing the object distance z.sub.O and the spherical reference wave (light) z.sub.R.

[0077] The above-mentioned wide field digital holography may be used to complete wavefront recording and reconstruction, in order to obtain the complex images of the object to be measured.

[0078] Subsequently, in the step 220, it utilizes digital holography for defects inspection on the transparent substrate, and the digital hologram is performed by an up-sampling technology to enhance the equivalent resolution of the photodetector array of the optical system, further to achieve high resolution wide field imaging effect. It utilizes numerical reconstruction method, such as Fourier transform approach, convolution approach, angular spectrum approach or Fresnel diffraction transform approach to reconstruct the object wave of the transparent substrate. In this embodiment, the diffraction wave of the object is reconstructed by numerical reconstruction method of Fourier transform approach. In the numerical reconstruction method of Fourier transform approach, the number of pixels will be changed with the reconstruction distance. This feature will make pixel size reduction of the reconstructed image, in order to avoid the actual pixel size of the photodetector array to be restricted, and at the same time to achieve the purpose of up sampling the reconstructed image.

[0079] As shown in FIG. 3A and FIG. 3B, they show amplitude reconstruction images of Fresnel holograms, experimental results of the measuring resolution of standard samples. FIG. 3A shows number of pixels 300300 without using up-sampling technology, FIG. 3B shows number of pixels 19001900 by using up-sampling technology. FIG. 3A and FIG. 3B illustrate comparison results by using up-sampling technique, and number of pixels can be increased from 300300 to 19001900. That is, the reconstruction approach by up-sampling technique combining with Fresnel hologram can improve six times of the pixel resolution. In addition, comparing one-dimensional profile information of black solid line 301, 302 of FIG. 3A and FIG. 3B, linewidth of reconstructed amplitude images of the resolution standard sample can be effectively improved by using the up-sampling technique, as shown in FIG. 3C and FIG. 3D.

[0080] Then, continuing the spherical reference wave of the step 210 will improve effective spectrum sampling bandwidth in the wide field digital holography, to retrieve complete high frequency information of the resolution standard samples. In Fourier transform approach, magnification of the reconstructed image is changed by adjusting the numerical spherical reference wave, and digital focusing is performed by adjusting propagating distance. As shown in FIG. 4A and FIG. 4B, they show amplitude reconstruction images of the Fresnel holograms of encoding spherical reference wave. As shown in FIG. 4A, it shows when the object distance Z.sub.0=7 mm, change Z.sub.R=35 mm, numerical magnification of Ms=1.26, the linewidth of element 3 of group 5 in black box 401 can be resolved, and up to linewidth 12.40 m of lateral resolution. As shown in FIG. 4B, it shows when the object distance Z.sub.0=7 mm, change Z.sub.R=20 mm, numerical magnification of Ms=1.51, the linewidth of Group 5 Element 5 in black box 402 can be resolved, and up to linewidth 9.84 m of lateral resolution. Finally, considering the constraint of pixel size of the photodetector array, distance of the object distance Z.sub.0 and the spherical reference wave Z.sub.R will be adjusted to optimize the spatial frequency of the interference fringes to the condition C.sub.p=1. As shown in FIG. 5A and FIG. 5B, they show amplitude reconstruction images before and after the optimization of the holograms, experimental results of spatial frequency of the interference fringe of the resolution standard samples. As shown in FIG. 5A, prior to the hologram optimization, the field of view will be limited by the spatial frequency of the spherical interference fringes and pixel size of the photodetector array. FIG. 5B shows amplitude reconstruction images after the optimization of the holograms, which field of view can be effectively promoted. In addition, FIG. 5C and FIG. 5D respectively show region of interest of black wide line of FIG. 5A and FIG. 5B, wherein black box 501, 502 indicates that element 5 of group 5 of FIG. 5D has better lateral resolution 9.84 m. The numerical reconstruction of the hologram contains the defect complex images information of the transparent substrate. Based-on modulation of the numerical spherical phase, the complex images by numerical reconstruction will include amplitude image and phase image.

[0081] Next, in the step 230, some kinds of objects to be measured are performed by wavefront recording and reconstruction of hologram, and characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate. The defect complex images contain amplitude images and phase images. In this embodiment, some kinds of the defect complex images of the transparent substrate are analyzed and classified. As shown in FIG. 6A to FIG. 6D, they show amplitude image (left) and phase image (right) of the defect complex image, respectively showing bubble of FIG. 6A, dust of FIG. 6B, scratch of FIG. 6C and watermark of FIG. 6D. According to the characteristics of the retrieved defect complex image, the characteristics classification of the defect complex images describes in the table 1.

TABLE-US-00001 TABLE 1 amplitude image phase image bubble 1. Transparent 1. Approximate micro lens properties 2. Boundary can be 2. The phase height is lower than the focused by numerical base level propagation dust 1. Black, non- 1. Ambiguous phase and no specific transparent shape 2. Without focusing 2. Phase broken discontinuity effect at different planes scratch 1. Transparent 1. Semi regular shape distribution 2. Irregular strip 2. Phase part discontinuity distribution watermark 1. Obvious boundary 1. The boundary of watemiark has step phase change

[0082] Then, in the step 240, it performs numerical propagation and focusing for each defect complex images by defect inspection apparatus of the transparent substrate, in order to observe characteristics of the amplitude image and phase image in different planes, and define (establish) image characteristics and spatial distribution of the defect complex images in the three-dimensional coordinate axis (X-Y-Z). That is, the image characteristics and spatial distribution of the defect complex images in different plane of reconstruction are then created. The characteristics of the object to be measured of the present invention is observed through the defect complex images, and the defect complex images can be recorded no matter imaging or non-imaging. In this embodiment, it depicts numerical propagation and focusing for bubble and dust, as shown in FIG. 7 and FIG. 8. As shown in FIG. 7, it shows defect phase image of bubble on the transparent substrate reconstructed by numerical propagation, following the direction of the arrow for representing the reconstructed phase images in different planes, and the last one is the numerical focusing image of the bubble. FIG. 8 shows defect phase image of dust on the transparent substrate reconstructed by numerical propagation, following the direction of the arrow for representing the reconstructed phase images in different planes, and the last one is the numerical focusing image of the dust, which can't fully focus due to light scattering effect. The experimental results indicate that the image change on boundary is quite obvious as the phase image of the bubble of FIG. 7 in different propagation distance, and the phase image of the dust of FIG. 8 shows a disorder and stray distribution in different propagation distance. This shows that the different defect complex images have different image characteristics and spatial distribution.

[0083] Finally, in the step 250, the defect complex image database is established, and the database is used for defect comparison and detection of various kinds of images to be tested. The defect complex images database is established by the defect inspection apparatus of the transparent substrate based-on characteristics of the defect complex images, for features classifying and sieving defect complex images. That is, the defect complex images can be stored in a complex image database. The identification and classification of the defect complex images can be performed by a classification unit of the defect complex images. In this embodiment of the present invention, a defect complex image database of the transparent substrate, such as FIG. 9A to FIG. 9D, can be established based on the characteristics of the defect complex images obtained in the step 230 and the step 240. The types of the defect complex images can be classified as amplitude image (left) and phase image (right), and the defect complex images includes bubble complex images of FIG. 9A, dust complex images of FIG. 9B, scratch complex images of FIG. 9C, and watermark complex images of FIG. 9D. The inspection processes of the identification and classification of the defect complex images are finished in the step 240 and the step 250. Firstly, defect types of the defect complex images are defined, and then comparing by the defect complex images database, followed by using the numerical reconstruction to analyze and determine the spatial distribution and location and image characteristics of the defect complex images in the three-dimensional coordinate axis (X-Y-Z). The above steps can be executed by the computer. As shown in FIG. 10A to FIG. 10E, they show the defect complex images of the transparent substrate to be measured. That is, the digital holograms are used to detect the defect images on a transparent substrate. FIG. 10A shows the defect complex images by using digital holograms to detect the defect complex images of the transparent substrate, including amplitude image (left) and phase image (right). FIG. 10B to FIG. 10E indicate the defect complex images determined by the defect complex images database, the defect complex images respectively include bubble complex images of FIG. 10B, dust complex images of FIG. 10C, scratch complex images of FIG. 10D, and watermark complex images of FIG. 10E, and the amplitude image is on the left side and the phase image is on the right side.

[0084] In summary, defect inspection of the transparent substrate is performed by defect inspection apparatus of the transparent substrate, and the defect complex images reconstructed by the digital holograms are identified and classified based-on the defect complex images database to achieve the defect inspection in wide field of view, which can really reach the purpose of the invention.

[0085] As noted above, the features and advantages of the invention include:

[0086] (1) The digital holograms are used to obtain the defect complex images of the transparent substrate, and characteristics analyzing, features classifying and sieving for the amplitude and phase of the defect complex images of the transparent substrate as the reference basis for defect inspection.

[0087] (2) The apparatus of the present invention comprises: at least one wavefront recording and reconstruction unit of digital hologram; at least one defect complex images database; at least one classification unit of defect complex images.

[0088] (3) The digital holograms are used as the wavefront recording and reconstruction unit of the defect of the transparent substrate, and the obtained defect complex images may be formed as defect complex images database by characteristics analyzing and classifying.

[0089] (4) The classification unit of the defect complex images is used for characteristics classifying and screening of some kinds of images to be measured for defect inspection.

[0090] (5) In order to achieve defect inspection of a transparent substrate of large area and high fidelity, the wavefront recording and reconstruction unit of digital holograms of the invention is utilizing wavefront recording and reconstruction improve equivalent resolution of the photodetector array of the optical system to achieve high resolution imaging effect of wide-field.

[0091] (6) The magnification of the reconstructed image can be improved by using the spherical reference wave illumination to improve the lateral resolution, and thus make the photodetector array capable of capturing and recording defect complex images information of the transparent substrate in the effective number of pixels.

[0092] (7) Up-sampling technique is performed to record Fresnel diffraction of the object to resolve the issue that the high frequency information in the defect image can't be effectively analyzed due to the constraint of the actual pixel size of the photodetector array.

[0093] (8) The experimental results verify that high fidelity amplitude and phase images of the defect of the transparent substrate, obtained by the method and apparatus of wavefront recording and reconstruction of the digital hologram, can accurately reach the purpose of defect inspection of the transparent substrate of the present invention.

[0094] As will be understood by persons skilled in the art, the foregoing preferred embodiment of the present invention illustrates the present invention rather than limiting the present invention. Having described the invention in connection with a preferred embodiment, modifications will be suggested to those skilled in the art. Thus, the invention is not to be limited to this embodiment, but rather the invention is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation, thereby encompassing all such modifications and similar structures. While the preferred embodiment of the invention has been illustrated and described, it will be appreciated that various changes can be made without departing from the spirit and scope of the invention.